CN101707854B - Circuit board processing method and circuit board - Google Patents
Circuit board processing method and circuit board Download PDFInfo
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- CN101707854B CN101707854B CN2009102212136A CN200910221213A CN101707854B CN 101707854 B CN101707854 B CN 101707854B CN 2009102212136 A CN2009102212136 A CN 2009102212136A CN 200910221213 A CN200910221213 A CN 200910221213A CN 101707854 B CN101707854 B CN 101707854B
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Abstract
The embodiment of the invention relates to a circuit board processing method, wherein at least two subboards provided with via holes are adhered through a bonding structure provided with conducting material and a cavity; the conducting material is used for connecting the via holes; the cavity is used for the diffusion filling of the conducting material; and the positions of the via holes, the conducting material and the cavity are arranged correspondingly. The embodiment of the invention also provides a circuit board. The adoption of the circuit board processing method and the circuit board can avoid short circuit problem caused by the easy diffusion of overmuch conducting material along the gap between a bonding sheet and subboards, extends the using range of Z-direction connecting and processing method of the circuit board, reduces the hole pitch among the subboards, is beneficial to improving the overall density of the circuit board, and has high yield, low rejection rate and low cost; and the invention is also well applicable to high-density boards.
Description
Technical field
The present invention relates to a kind of processing method and wiring board of wiring board.
Background technology
At present, wiring board (Printed Circuit Board, PCB) Z mainly is to use a bonding sheet as bonding use between with the daughter board that two are provided with via up and down to connecting processing method, this bonding sheet is provided with conductive materials (as conducting resinl) between the via of two daughter boards up and down, conductive materials is used for the connection between the via.
But, the Z that uses this wiring board is to connecting processing method, too much conductive materials is easily along the interstitial diffusion between bonding sheet and the daughter board, cause short circuit, especially, when two daughter board copper up and down thick when too high, a bonding sheet therebetween is not enough to fill its no copper zone, can cause occurring pressing cavity or starved phenomenon, easier gap of causing between bonding sheet and the daughter board, the more frequent appearance of short circuit phenomenon is because the existence of above-mentioned short circuit problem, make the Z of wiring board be very limited to the scope of application that connects processing method, pitch of holes design is bigger between the daughter board, and high-density plate is difficult to be suitable for, and further causes yields low, the scrappage height, the problem that cost is high.
Summary of the invention
Embodiment of the invention technical problem to be solved is, a kind of processing method and wiring board of wiring board are provided, can avoid too much conductive materials easily along the interstitial diffusion between bonding sheet and the daughter board, thus the short circuit problem that occurs, and the Z that has enlarged wiring board is to the scope of application that connects processing method, dwindle pitch of holes design between the daughter board, help promoting the global density of wiring board, high-density plate can be suitable for equally well, the yields height, scrappage is low, and cost is low.
For solving the problems of the technologies described above, the embodiment of the invention adopts following technical scheme:
A kind of processing method of wiring board comprises:
Obtain at least two daughter boards that are provided with via;
Undertaken described daughter board bonding by adhesive structure with conductive materials and cavity, described conductive materials is used for the connection between the described via, described cavity is filled for the diffusion of described conductive materials, and the position of described via, described conductive materials and described cavity is corresponding to be provided with; Described adhesive structure comprises at least one first bonding sheet that has described conductive materials, and at least one second bonding sheet that has described cavity, described first bonding sheet and the described second bonding sheet stacked on top of one another.
A kind of wiring board, be bonded by adhesive structure by at least two daughter boards that are provided with via, described adhesive structure has and is used for the conductive materials that connects between the described via, and the cavity that supplies described conductive materials diffusion to fill, the position of described via, described conductive materials and described cavity is corresponding to be provided with; Described adhesive structure comprises at least one first bonding sheet that has described conductive materials, and at least one second bonding sheet that has described cavity, described first bonding sheet and the described second bonding sheet stacked on top of one another.
The beneficial effect of the embodiment of the invention is:
By processing method and the wiring board that a kind of wiring board is provided, at least two daughter boards that will be provided with via by the adhesive structure with conductive materials and cavity carry out bonding, described conductive materials is used for the connection between the described via, described cavity is filled for the diffusion of described conductive materials, described via, the position of described conductive materials and described cavity is corresponding to be provided with, can avoid too much conductive materials easily along the interstitial diffusion between bonding sheet and the daughter board, thereby the short circuit problem that occurs, the Z that has enlarged wiring board is to the scope of application that connects processing method, dwindle pitch of holes design between the daughter board, help promoting the global density of wiring board, high-density plate can be suitable for equally well, the yields height, scrappage is low, and cost is low.
Below in conjunction with accompanying drawing the embodiment of the invention is described in further detail.
Description of drawings
Fig. 1 is the primary stage gained primary wire plate schematic diagram of processing method of the wiring board of the embodiment of the invention;
Fig. 2 is the secondary stage gained secondary wire plate schematic diagram of processing method of the wiring board of the embodiment of the invention.
Embodiment
The embodiment of the invention is by processing method that a kind of wiring board is provided and the wiring board that is obtained by this method processing, at least two daughter boards that will be provided with via by the adhesive structure with conductive materials and cavity carry out bonding, described conductive materials is used for the connection between the described via, described cavity is filled for the diffusion of described conductive materials, described via, the position of described conductive materials and described cavity is corresponding to be provided with, can avoid too much conductive materials easily along the interstitial diffusion between bonding sheet and the daughter board, thereby the short circuit problem that occurs, the Z that has enlarged wiring board is to the scope of application that connects processing method, dwindle pitch of holes design between the daughter board, help promoting the global density of wiring board, high-density plate can be suitable for equally well, the yields height, scrappage is low, and cost is low.
Below by a specific embodiment processing method of wiring board of the present invention is described, simultaneously, the wiring board of the embodiment of the invention is described.
The specific embodiment of the processing method of wiring board of the present invention mainly comprises the steps:
The primary stage of the processing method of wiring board mainly comprises the steps, with the primary stage gained primary wire plate of the processing method of the wiring board that forms the embodiment of the invention as shown in Figure 1:
At first, according to the multiple-plate normal process flow process of PCB two daughter boards 1 are processed, formation comprises base material 2, is coated with the common multi-layer sheet structure of Copper Foil 3, and plating is flat behind the stopple hole that will need to connect, on each daughter board, to form via 4, be filled with resin 5 in the via 4, in addition, daughter board carried out blind hole 6 offer;
Secondly, between two daughter boards 1 adhesive structure 7 that daughter board 1 is bondd is being set up and down, this adhesive structure 7 comprises two first bonding sheets 9 that have conductive materials 8, and second bonding sheet 11 that has cavity 10, first bonding sheet 9 and second bonding sheet, 11 stacked on top of one another, second bonding sheet 11 is arranged between two first bonding sheets 9, conductive materials 8 is used for the connection between the via 4, cavity 10 is filled for the diffusion of conductive materials 8, and the position of via 4, conductive materials 8 and cavity 10 is corresponding to be provided with;
The secondary stage of the processing method of wiring board mainly comprises the steps, with the primary stage gained secondary wire plate of the processing method of the wiring board that forms the embodiment of the invention as shown in Figure 2:
At last, the wiring board that forms is bonded by adhesive structure 7 by at least two daughter boards that are provided with via 4, adhesive structure 7 has the conductive materials 8 that is used for connection between the via 4, and the cavity 10 (filling) that spreads filling for conductive materials 8, via 4, the position of conductive materials 8 and cavity 10 is corresponding to be provided with, particularly, adhesive structure 7 comprises two first bonding sheets 9 that have conductive materials 8, and second bonding sheet 11 that has cavity 10, first bonding sheet 9 and second bonding sheet, 11 stacked on top of one another are also opened on the wiring board and can be provided with blind hole 6 and (if having, then can form mechanical blind hole, if do not have, then be that common through hole connects).
Need to prove that above-mentioned adhesive structure not only can adopt the stacked structure of above-mentioned bonding sheet, also can adopt other adhesive structure, as long as make conductive materials 8 have sufficient space expanding to fill; The quantity of bonding sheet, thickness etc. can be selected to adopt by actual conditions; Certainly, also can adopt said method to process for the thick product of copper (as power supply with thick copper PCB) obtains.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (4)
1. the processing method of a wiring board is characterized in that, comprising:
Obtain at least two daughter boards that are provided with via;
Undertaken described daughter board bonding by adhesive structure with conductive materials and cavity, described conductive materials is used for the connection between the described via, described cavity is filled for the diffusion of described conductive materials, and the position of described via, described conductive materials and described cavity is corresponding to be provided with;
Described adhesive structure comprises at least one first bonding sheet that has described conductive materials, and at least one second bonding sheet that has described cavity, described first bonding sheet and the described second bonding sheet stacked on top of one another.
2. the method for claim 1 is characterized in that, described method also comprises:
Described wiring board is carried out blind hole to be offered.
3. wiring board, be bonded by adhesive structure by at least two daughter boards that are provided with via, it is characterized in that, described adhesive structure has and is used for the conductive materials that connects between the described via, and the cavity that supplies described conductive materials diffusion to fill, the position of described via, described conductive materials and described cavity is corresponding to be provided with;
Described adhesive structure comprises at least one first bonding sheet that has described conductive materials, and at least one second bonding sheet that has described cavity, described first bonding sheet and the described second bonding sheet stacked on top of one another.
4. wiring board as claimed in claim 3 is characterized in that, also offers blind hole on the described wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102212136A CN101707854B (en) | 2009-10-29 | 2009-10-29 | Circuit board processing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102212136A CN101707854B (en) | 2009-10-29 | 2009-10-29 | Circuit board processing method and circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101707854A CN101707854A (en) | 2010-05-12 |
| CN101707854B true CN101707854B (en) | 2011-08-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102212136A Active CN101707854B (en) | 2009-10-29 | 2009-10-29 | Circuit board processing method and circuit board |
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| Country | Link |
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| CN (1) | CN101707854B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068187A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Blind hole plate device capable of preventing the blind hole from lacking glue |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5593863B2 (en) | 2010-06-09 | 2014-09-24 | 富士通株式会社 | Multilayer circuit board and substrate manufacturing method |
| JP2011258838A (en) * | 2010-06-10 | 2011-12-22 | Fujitsu Ltd | Laminated circuit board, method of manufacturing the same, adhesive sheet, and method of manufacturing the same |
| JP5533596B2 (en) * | 2010-11-25 | 2014-06-25 | 富士通株式会社 | Printed wiring board manufacturing method, printed wiring board, and electronic device |
| CN102883519A (en) * | 2011-07-15 | 2013-01-16 | 昆山雅森电子材料科技有限公司 | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof |
| CN107257603B (en) * | 2017-06-20 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | The production method of hole articulamentum, the production method of wiring board and wiring board |
| CN107155266B (en) * | 2017-06-20 | 2020-10-23 | 广州兴森快捷电路科技有限公司 | Z-direction interconnection circuit board and manufacturing method thereof |
| CN107734843A (en) * | 2017-09-28 | 2018-02-23 | 杭州华为数字技术有限公司 | circuit board and terminal device |
| CN108617112A (en) * | 2018-05-11 | 2018-10-02 | 广州兴森快捷电路科技有限公司 | The production method and printed circuit board of printed circuit board |
| CN111010798B (en) * | 2019-12-31 | 2021-05-11 | 华为技术有限公司 | Circuit board and electronic device |
| CN112638064A (en) * | 2021-02-08 | 2021-04-09 | 四川英创力电子科技股份有限公司 | Printed circuit board with second-order blind hole and processing method |
| CN113203942B (en) * | 2021-05-06 | 2023-08-01 | 金禄电子科技股份有限公司 | Circuit board and defective product identification method thereof |
-
2009
- 2009-10-29 CN CN2009102212136A patent/CN101707854B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068187A (en) * | 2011-10-19 | 2013-04-24 | 上海嘉捷通信息科技有限公司 | Blind hole plate device capable of preventing the blind hole from lacking glue |
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| Publication number | Publication date |
|---|---|
| CN101707854A (en) | 2010-05-12 |
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Owner name: SHENNAN CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN SHENNAN CIRCUITS CO., LTD. |
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Address after: 518053 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000, Nanshan District, Guangdong, Shenzhen, China bridge, South Shahe City Industrial Zone Patentee before: Shenzhen Shennan Circuits Co., Ltd. |