CN201718114U

CN201718114U - Z-direction connecting structure of printed circuit board

Info

Publication number: CN201718114U
Application number: CN2009203191518U
Authority: CN
Inventors: 刘逸超; 孔令文; 彭勤卫; 史庚才; 高文帅
Original assignee: Shennan Circuit Co Ltd
Current assignee: Shennan Circuit Co Ltd
Priority date: 2009-12-30
Filing date: 2009-12-30
Publication date: 2011-01-19
Anticipated expiration: 2019-12-30

Abstract

The utility model discloses a Z-direction connecting structure of a printed circuit board, which comprises an upper layer of daughter board and a lower layer of daughter board which are mutually bonded through a bonding sheet. The upper layer of the daughter board and the lower layer of the daughter board are respectively provided with a plurality of through holes which longitudinally correspond to each other; a copper conducting layer is plated on the surface of each through hole; through holes are also formed on the bonding sheet in the positions corresponding to the through holes; conduction regions corresponding to upper surfaces/lower surfaces of the copper conducting layers are arranged on the edges of the through holes of the bonding sheet; and the copper conducting layers which longitudinally correspond to each other are electrically connected through the conduction regions.

Description

The Z of printed circuit board (PCB) is to syndeton

Technical field

The utility model relates to the PCB manufacturing technology, and the Z that relates in particular to a kind of printed circuit board (PCB) is to syndeton.

Background technology

The Z of printed circuit board (PCB) is with after two-

layer daughter board

21,22 is processed by the form of consent plating respectively up and down to syndeton at present, use bonding sheet 23 with it bonding after, the corresponding pad locations laser drill in the hole that is needing conducting, and fill in conductive materials 25 and process.

This structure work flow is longer, and daughter board need pass through boring copper facing 24, plug resin 20, even, sinks flow processs such as copper, plating, scrappage height out;

In this structure,, can't carry out device and peg graft function singleness because intercommunicating pore is clogged by resin 20;

In addition, because the restriction of consent ability, two sub-plate thickness are limited, if make high multi-layer sheet, then need repeatedly Z to connecting the accumulation lamination, influence efficient, increase cost;

In addition, because twice plating, the conventional plate copper of daughter board copper thickness rate is thick thick, influences Z to connecting processing, makes its yields low.

The utility model content

Technical problem to be solved in the utility model is: the Z that a kind of printed circuit board (PCB) is provided is to syndeton, this structure can be pegged graft with other devices, effectively shorten Z to connecting work flow, the restriction that reduces the antithetical phrase plate thickness and the thickness of surperficial Copper Foil, reduce Z, reduce difficulty of processing to connecting number of times.

For solving the problems of the technologies described above, the utility model adopts following technical scheme:

A kind of Z of printed circuit board (PCB) is to syndeton, include two-layer daughter board up and down by the bonding sheet bonding, be respectively arranged with some corresponding up and down through holes on upper strata daughter board and the lower floor's daughter board, each through-hole surfaces is electroplate with the copper conductive layer, and also offer corresponding through hole at the corresponding described lead to the hole site of described bonding sheet, and the through hole edge of described bonding sheet be provided with described copper conductive layer on/conduction region that lower surface is corresponding, be electrically connected by described conduction region between the described corresponding up and down copper conductive layer.

The beneficial effects of the utility model are:

Embodiment of the present utility model is by being arranged to through hole with Z to the connecting hole of syndeton, thereby make its can with other device plug-in units, and effectively shortened Z to connecting work flow, the restriction that has reduced the antithetical phrase plate thickness and the thickness of surperficial Copper Foil, reduce Z to connecting number of times, reduced difficulty of processing.

Below in conjunction with accompanying drawing the utility model is described in further detail.

Description of drawings

Fig. 1 is the cutaway view of the Z of prior art to syndeton.

Fig. 2 is the cutaway view of the Z that provides of the utility model to an embodiment of syndeton.

Fig. 3 is the layer view sub-anatomy of the Z that provides of the utility model to an embodiment of syndeton.

Fig. 4 is the cutaway view in Z a kind of electronic conduction of bonding sheet district in embodiment of syndeton of providing of the utility model.

Fig. 5 is the cutaway view in Z a kind of electronic conduction of bonding sheet district in embodiment of syndeton of providing of the utility model.

Embodiment

Describe Z that the utility model provides a embodiment in detail below with reference to Fig. 2-Fig. 5 to syndeton.

As shown in the figure, present embodiment mainly includes the two-

layer daughter board

11,12 up and down by bonding sheet 13 bondings, 12 are respectively arranged with some corresponding up and down through holes 10 on upper strata daughter board 11 and the lower floor's daughter board, each through-hole surfaces is electroplate with copper conductive layer 14, and also offer corresponding through hole in the position of bonding sheet 13 corresponding described through holes, and the through hole edge of bonding sheet be provided with described copper conductive layer on/conduction region 15 that lower surface is corresponding, be electrically connected by conduction region 15 between the Dui Ying copper conductive layer 14 up and down.

During specific implementation, conduction region 15 can be with copper conductive layer 14 on/annular 151 that lower surface is corresponding, or be arranged on plurality of sub conduction region 152 in the annular region 151.

During specific implementation, electronic conduction district 152 cross sections can be segmental arc face or circle as shown in Figure 5, perhaps other geometries as shown in Figure 4.

Describe the work flow of present embodiment below in detail.

According to PCB multi-layer sheet normal flow processing daughter board, form common multi-layer sheet after, as shown in Figure 4 and Figure 5, the bonding sheet corresponding position perforate of conduction region is set, and in the hole, fills in conductive materials at needs.

After daughter board and bonding sheet pressing, the conducting resinl between daughter board can be filled to the orifice ring place and make it conducting;

Remove the middle bonding sheet of orifice ring with the bradawl head, make it to become conventional via and get final product.

Compare to syndeton with the Z of prior art, the utlity model has following advantage:

Through hole is arranged in the connecting hole opening, is made it have the grafting function, can be from the front or the back side carry out device and peg graft;

Effectively shortened the daughter board work flow, reduced its supplies consumption, reduced scrappage, cost effectively reduces;

Owing to cancelled the filling holes with resin flow process, effectively reduce thickness limits to daughter board, can make connected daughter board thickness obtain increasing, reduce Z to connecting number of times, improved yields;

Because plating advection journey has lowered surperficial copper thickness behind the cancellation consent, Z is reduced to connecting difficulty of processing, reduced and scrapped.

The above is a preferred implementation of the present utility model; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; can also make some improvements and modifications, these improvements and modifications also are considered as protection range of the present utility model.

Claims

1. the Z of a printed circuit board (PCB) is to syndeton, include two-layer daughter board up and down by the bonding sheet bonding, it is characterized in that: be respectively arranged with some corresponding up and down through holes on upper strata daughter board and the lower floor's daughter board, each through-hole surfaces is electroplate with the copper conductive layer, and also offer corresponding through hole at the corresponding described lead to the hole site of described bonding sheet, and the through hole edge of described bonding sheet be provided with described copper conductive layer on/conduction region that lower surface is corresponding, be electrically connected by described conduction region between the described corresponding up and down copper conductive layer.

2. the Z of printed circuit board (PCB) as claimed in claim 1 is characterized in that to syndeton: described conduction region for described copper conductive layer on/annular that lower surface is corresponding, or be arranged on plurality of sub conduction region in the described annular region.

3. the Z of printed circuit board (PCB) as claimed in claim 2 is characterized in that to syndeton: described electronic conduction district cross section is circle or segmental arc face.