CN111432552A - Circuit board assembly and electronic equipment - Google Patents
Circuit board assembly and electronic equipment Download PDFInfo
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- CN111432552A CN111432552A CN202010217245.5A CN202010217245A CN111432552A CN 111432552 A CN111432552 A CN 111432552A CN 202010217245 A CN202010217245 A CN 202010217245A CN 111432552 A CN111432552 A CN 111432552A
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- circuit board
- conductive
- circuit
- board assembly
- piece
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention provides a circuit board assembly and electronic equipment, the circuit board assembly includes the first circuit board and at least part superposes the second circuit board above the first circuit board, through setting up the conductive piece between first circuit board and second circuit board, make the first circuit board have with the first conductive part that the circuit in the first circuit board is electric-conductive, the second circuit board has with the second conductive part that the circuit in the second circuit board is electric-conductive in the position that corresponds to conductive piece on the second circuit board, both ends of the conductive piece are connected with first conductive part and second conductive part electrically separately, can promote circuit conductivity and operational reliability between the circuit boards effectively, and through filling the glue film around the conductive piece and between first circuit board and second circuit board, can raise production efficiency effectively and reduce cost low.
Description
Technical Field
The invention relates to the technical field of circuit board connection, in particular to a circuit board assembly and electronic equipment.
Background
With the progress of electronic technology, electronic equipment develops toward diversification, intellectualization and flexibility, more and more integrated functions are provided, for example, a mobile phone is taken as an electronic equipment, the mobile phone generally comprises a display screen, a middle frame and a rear cover, the display screen and the rear cover are respectively positioned at two sides of the middle frame, at present, the mobile phone has functions of camera shooting, fingerprint identification and the like besides basic functions of displaying images, voice communication and the like, therefore, electronic components with the functions corresponding to the mobile phone need to be added in the mobile phone, and a main carrier of each electronic component in the electronic equipment is a main circuit board.
At present, in order to transmit a signal sent by a main circuit board to a display screen, a camera, a fingerprint identification structure and other structures in a mobile phone, a flexible circuit board is usually arranged in the mobile phone, at least part of one end of the flexible circuit board is stacked and connected with the main circuit board and is electrically connected with the display screen, the camera, the fingerprint identification structure and other structures, so that the signal of the main circuit board is transmitted to the display screen, the camera, the fingerprint identification structure and other structures through the flexible circuit board, the flexible circuit board is usually connected with the main circuit board by welding, namely, a first bonding pad which is communicated with a circuit in the flexible circuit board is arranged at one end of the stack of the flexible circuit board and the main circuit board, a soldering tin hole is arranged in the bonding pad, a second bonding pad which is communicated with the circuit in the main circuit board is arranged at a position corresponding to the soldering tin hole on the main circuit board, and the first bonding pad on the flexible circuit board is, the flexible circuit board and the main circuit board are pressed by the pressure head, the soldering tin melted by heating flows from the first bonding pad on the flexible circuit board to the other side of the flexible circuit board through the soldering tin hole and is welded with the second bonding pad on the main circuit board by the soldering tin jig, and the circuit of the flexible circuit board can be conducted with the circuit of the main circuit board due to the fact that the soldering tin has conductivity, so that signals of the main circuit board are transmitted to a display screen, a camera, a fingerprint identification device and the like through the flexible circuit board.
However, when the flexible circuit board and the main circuit board are welded by the soldering tin, the flowing of the soldering tin is uncontrollable, so that the welding quality is not guaranteed, microcracks are easy to appear or the welding is not in place, and therefore the conductivity between the flexible circuit board and the main circuit board is poor, the working reliability is low, the production efficiency is low, and the cost is high.
Disclosure of Invention
The invention provides a circuit board assembly and electronic equipment, which have the advantages of good conductivity among circuit boards, high working reliability, high production efficiency and low cost.
In order to achieve the above object, in a first aspect, the present invention provides a circuit board assembly comprising: a first circuit board and a second circuit board at least partially superposed over the first circuit board;
a conductive piece is arranged between the first circuit board and the second circuit board, a first conductive part which is electrically conducted with a circuit in the first circuit board is arranged at a position on the first circuit board corresponding to the conductive piece, a second conductive part which is electrically conducted with the circuit in the second circuit board is arranged at a position on the second circuit board corresponding to the conductive piece, one end of the conductive piece is electrically connected with the first conductive part, and the other end of the conductive piece is electrically connected with the second conductive part;
glue layers are filled around the conductive pieces and between the first circuit board and the second circuit board.
As an alternative embodiment, the present invention provides the circuit board assembly, wherein the glue layer is formed as an adhesive sheet;
the surface formed by the combination of the upper surface of the conductive piece and the upper surface of the bonding plate is attached to the lower surface of the first circuit board, and the surface formed by the combination of the lower surface of the conductive piece and the lower surface of the bonding plate is attached to the upper surface of the second circuit board.
In an alternative embodiment, the circuit board assembly provided by the present invention, the adhesive board is a rectangular adhesive board.
In an alternative embodiment, the present invention provides the circuit board assembly, wherein the rectangular adhesive sheet covers an overlapping area of the first circuit board and the second circuit board.
As an alternative embodiment, the present invention provides the circuit board assembly, wherein the conductive member is a columnar conductive member;
the bonding plate is provided with a columnar hole matched with the columnar conductive piece, and the columnar conductive piece is embedded in the columnar hole.
As an alternative embodiment, the present invention provides the circuit board assembly, wherein the columnar conductive member is a cylindrical conductive member.
As an alternative embodiment, the present invention provides a circuit board assembly, wherein the extension of the cylindrical conductive member along the axial direction is smaller than the radial dimension of the cylindrical conductive member.
As an alternative embodiment, the invention provides a circuit board assembly, where the number of the conductive members is at least two, and at least two of the conductive members are arranged at intervals on the adhesive board.
As an alternative embodiment, the present invention provides the circuit board assembly, wherein the conductive member and the adhesive plate are integrally formed.
In a second aspect, the present invention also provides an electronic device, comprising: the circuit board assembly comprises a shell and a circuit board assembly positioned in the shell, wherein the circuit board assembly is the circuit board assembly.
The invention provides a circuit board assembly and electronic equipment, the circuit board assembly comprises a first circuit board and a second circuit board at least partially superposed above the first circuit board, a conductive piece is arranged between the first circuit board and the second circuit board, a first conductive part electrically conducted with the circuit in the first circuit board is arranged at the position on the first circuit board corresponding to the conductive piece, a second conductive part electrically conducted with the circuit in the second circuit board is arranged at the position on the second circuit board corresponding to the conductive piece, one end of the conductive piece is electrically connected with the first conductive part, the other end of the conductive piece is electrically connected with the second conductive part, thus, the circuit in the first circuit board is electrically conducted with the circuit in the second circuit board through the conductive piece, the conductivity is good, the working reliability between the circuit boards can be effectively improved, and a glue layer is filled around the conductive piece and between the first circuit board and the second, the first circuit board and the second circuit board at least partially superposed above the first circuit board are connected through the glue layer, so that the production efficiency is high, and the cost is low.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
fig. 2 is an exploded view of a circuit board assembly according to an embodiment of the present invention;
fig. 3 is an exploded view of a bonding board and a conductive device in a circuit board assembly according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present invention, wherein a conductive member is embedded in an adhesive plate and then cut along a horizontal direction;
fig. 5 is a schematic cross-sectional structure view, taken along a vertical direction, of the circuit board assembly according to an embodiment of the present invention, where the conductive member is embedded in the adhesive board.
Description of reference numerals:
10-a first circuit board;
101-a first conductive portion;
20-bonding a plate;
201-columnar pores;
30-a second circuit board;
301-a second conductive portion;
40-conductive member.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present invention. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are only some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the description of the present invention, it should be noted that unless otherwise specifically stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning a fixed connection, an indirect connection through intervening media, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.
With the progress of electronic technology, electronic devices are developed in a diversified, intelligent and flexible manner, and more integrated functions are provided, for example, a mobile phone in the electronic devices has functions of basic image display, voice call and the like, and also has functions of camera shooting, fingerprint identification and the like, so that electronic components corresponding to the mobile phone need to be added in the mobile phone, and main carriers of the electronic components in the electronic devices are main circuit boards.
Because a signal sent by the main circuit board is transmitted to a display screen, a camera or a fingerprint identification structure in the mobile phone, a flexible circuit board with certain flexibility is usually arranged in the mobile phone, one end of the flexible circuit board is electrically connected with the display screen, the camera or the fingerprint identification structure of the mobile phone, at least part of the other end of the flexible circuit board is stacked with the main circuit board and is electrically and physically and fixedly connected, at present, when at least part of one end of the flexible circuit board is stacked with the main circuit board, the flexible circuit board and the main circuit board are mainly welded in a brazing mode, the flexible circuit board and the main circuit board are electrically and physically and fixedly connected through soldering tin, however, because the flowing of the soldering tin is uncontrollable, the welding quality is not guaranteed, and microcracks or places where the welding is not in place easily occur, therefore, the flexible circuit board and the main circuit board have poor conductivity, low working reliability, low production efficiency and high cost.
For this reason, this application is through setting up electrically conductive between two circuit boards, realize the electric connection between two circuit boards through electrically conductive, make the circuit between two circuit boards switch on, and fill the glue film around electrically conductive and between two circuit boards, realize the physics fixed connection between two circuit boards through the glue film, thereby satisfy and carry out physics fixed connection when guaranteeing circuit conductivity between two circuit boards, circuit conductivity is good, the operational reliability is high, and easy operation, high effect, and is with low costs.
The circuit board assembly and the electronic device provided by the present application are described in detail with specific embodiments below.
Example one
Fig. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention; fig. 2 is an exploded view of a circuit board assembly according to an embodiment of the present invention; fig. 3 is an exploded view of a bonding board and a conductive device in a circuit board assembly according to an embodiment of the present invention; fig. 4 is a schematic cross-sectional view of a circuit board assembly according to an embodiment of the present invention, wherein a conductive member is embedded in an adhesive plate and then cut along a horizontal direction; fig. 5 is a schematic cross-sectional structure view, taken along a vertical direction, of the circuit board assembly according to an embodiment of the present invention, where the conductive member is embedded in the adhesive board.
Referring to fig. 1 to 5, an embodiment of the present invention provides a circuit board assembly, including a first circuit board 10 and a second circuit board 30 at least partially stacked on the first circuit board 10;
a conductive element 40 is arranged between the first circuit board 10 and the second circuit board 30, a first conductive part 101 which is electrically conducted with the circuit in the first circuit board 10 is arranged at the position corresponding to the conductive element 40 on the first circuit board 10, a second conductive part 301 which is electrically conducted with the circuit in the second circuit board 30 is arranged at the position corresponding to the conductive element 40 on the second circuit board 30, one end of the conductive element 40 is electrically connected with the first conductive part 101, the other end of the conductive element 40 is electrically connected with the second conductive part 301, and the circuit in the first circuit board 10 is electrically conducted with the circuit in the second circuit board 30 through the conductive element 40, so that the signal transmission between the first circuit board 10 and the second circuit board 30 is realized.
Wherein, the first conductive part 101 may be a structure which is disposed at a local position of the first circuit board 10 and can be connected and electrically conducted with the internal circuit of the first circuit board 10, the second conductive part 301 may be a structure which is disposed at a local position of the second circuit board 30 and can be connected and electrically conducted with the internal circuit of the second circuit board 30, for example, a notch or a groove is cut on the first circuit board 10 and the second circuit board 30, so that a conductive coating which is connected and electrically conducted with the internal circuit of the first circuit board 10 is exposed at the notch or the groove, the conductive coating may be made of conductive material such as copper, aluminum, etc., the notch or the groove having the conductive coating on the first circuit board 10 and the second conductive part 301 forms the first conductive part 101 and the second conductive part 301, so that, when two ends of the conductive part 40 are respectively connected with the first conductive part 101 and the second conductive part 301, the first conductive part 101 is electrically conducted with the second conductive part 301 through the 40, so that the wires in the first circuit board 10 and the wires in the second circuit board 30 are electrically conducted, and thus the electric circuit between the first circuit board 10 and the second circuit board 30 can be conducted through the conductive member 40, so that signals can be transmitted between the first circuit board 10 and the second circuit board 30.
Illustratively, the first circuit board 10 may be a main circuit board in an electronic device such as a mobile phone, and the second circuit board 30 may be a flexible circuit board that connects the main circuit board and a display, a camera, etc. structure in the electronic device, wherein at least a portion of one end of the flexible circuit board is overlapped and connected with the main circuit board, and the other end of the flexible circuit board is electrically connected with the display, etc. structure of the electronic device.
Further, in order to improve the conductivity of the circuit between the first circuit board 10 and the second circuit board 30, the first circuit board 10 and the second circuit board 30 need to be physically and fixedly connected, in this embodiment, an adhesive layer may be filled around the conductive member 40 and between the first circuit board 10 and the second circuit board 30, and the first circuit board 10 and the second circuit board 30 are fixedly connected through the adhesive layer.
Wherein, the glue film can include the first piece that bonds with the upper surface of first circuit board 10 respectively, the second piece that bonds with the lower surface of second circuit board 30 and the articulamentum of connecting first piece and the second piece that bonds, bond in first circuit board 10 and second circuit board 30 respectively through first piece and the second piece that bonds to realize the fixed connection of first circuit board 10 and second circuit board 30, and like this, easy operation is convenient, high in production efficiency, with low costs.
It should be noted that, when the first circuit board 10 and the second circuit board 30 are bonded by the adhesive layer, the first circuit board 10 and the second circuit board 30 can be pressed by the pressing device, so as to improve the connection tightness between the first circuit board 10 and the adhesive layer and the second circuit board 30, thereby improving the operational reliability of the circuit board assembly.
Illustratively, the adhesive layer is made of an insulating material, for example, an insulating compound adhesive.
Furthermore, in order to improve the conductivity between the conductive member 40 and the first conductive portion 101 and the second conductive portion 301 and to have the adhesion property, the conductive member 40 may be formed by processing a conductive adhesive material.
In one embodiment, the glue layer is formed as the adhesive board 20, and the surface formed by the upper surface of the conductive member 40 and the upper surface of the adhesive board 20 being combined is attached to the lower surface of the first circuit board 10, and the surface formed by the lower surface of the conductive member 40 and the lower surface of the adhesive board 20 being combined is attached to the upper surface of the second circuit board 30. Thus, the first circuit board 10 and the second circuit board 30 can be bonded by the thinner bonding board 20, and the thickness space for bonding between the first circuit board 10 and the second circuit board 30 can be effectively reduced, so that the internal space of the electronic device can be effectively saved.
Further, the bonding board 20 and the conductive member 40 may be separately formed, and then the conductive member 40 is embedded in the bonding board 20; the bonding plate 20 and the conductive member 40 may be integrally formed by two-color injection molding, the conductive member 40 is made of a conductive material, and the bonding plate 20 is made of an insulating material, which is not limited in this embodiment.
Optionally, the adhesive sheet 20 may be a rectangular adhesive sheet 20, and of course, the adhesive sheet 20 may also be an adhesive sheet 20 with other shapes, which is not limited in this embodiment.
Further, the rectangular adhesive sheet 20 covers an overlapped area of the first circuit board 10 and the second circuit board 30. Thus, the connection tightness between the first circuit board 10 and the second circuit board 30 can be improved, thereby improving the continuity of the circuit between the first circuit board 10 and the second circuit board 30 and further improving the operational reliability of the circuit board assembly.
In some embodiments, the conductive member 40 is a cylindrical conductive member 40, and the adhesive board 20 has a cylindrical hole 201 matching the cylindrical conductive member 40, and the cylindrical conductive member 40 is embedded in the cylindrical hole 201.
For example, the conductive member 40 may have a cylindrical structure, such as a cylinder, a quadrangular prism, a pentagonal prism, and a hexagonal prism.
Further, when the conductive member 40 has a cylindrical structure, the cylindrical conductive member 40 has an axial extension smaller than a radial dimension of the cylindrical conductive member 40. That is, the height of the cylindrical conductive member 40 is smaller than the diameter of the cylindrical conductive member 40, so that the thickness of the space occupied by the connector when the first circuit board 10 and the second circuit board 30 are connected can be effectively reduced, thereby saving the internal space of the electronic device.
In some embodiments, there are at least two conductive members 40, and at least two conductive members 40 are spaced apart on the adhesive board 20.
Specifically, in order to improve the electrical conductivity between the circuit in the first circuit board 10 and the circuit in the second circuit board 30, a plurality of conductive members 40 may be embedded in the adhesive board 20, and the plurality of conductive members 40 may be arranged on the adhesive board 20 at intervals.
Further, at least two conductive members 40 are arranged in a matrix on the adhesive sheet 20.
That is, the conductive members 40 have a plurality of rows and a plurality of columns on the adhesive sheet 20, and the conductive members 40 are uniformly spaced in the rows and the columns and arranged in a matrix. Thus, the reliability of electrical conduction between the wiring in the first circuit board 10 and the wiring in the second circuit board 30 can be improved.
Furthermore, in order to improve the alignment between conductive member 40 and first conductive portion 101 and second conductive portion 301, a guiding structure may be further disposed in the circuit board assembly, wherein the guiding structure may be a guiding hole and a guiding post matched with the guiding hole, for example, a guiding hole may be disposed on adhesive board 20, a first guiding post may be disposed on first circuit board 10, a second guiding post may be disposed on second circuit board 30, and the guiding post and the guiding hole are matched, so that the conductive member 40 can be aligned and conducted with first conductive portion 101 and second conductive portion 301, and further the electrical conductivity between the circuit in first circuit board 10 and the circuit in second circuit board 30 is improved.
The invention provides a circuit board assembly, which comprises a first circuit board and a second circuit board at least partially superposed above the first circuit board, wherein a conductive piece is arranged between the first circuit board and the second circuit board, a first conductive part electrically communicated with a circuit in the first circuit board is arranged at a position on the first circuit board corresponding to the conductive piece, a second conductive part electrically communicated with the circuit in the second circuit board is arranged at a position on the second circuit board corresponding to the conductive piece, one end of the conductive piece is electrically connected with the first conductive part, the other end of the conductive piece is electrically connected with the second conductive part, and the other end of the conductive piece is electrically connected with the second conductive part, so that the circuit in the first circuit board is electrically communicated with the circuit in the second circuit board through the conductive piece, the conductivity is good, the working reliability between the circuit boards can be effectively improved, and a glue layer is filled around the conductive piece and between the first circuit board and the second circuit board, the first circuit board and the second circuit board at least partially superposed above the first circuit board are connected through the glue layer, so that the production efficiency is high, and the cost is low.
Example two
The embodiment of the invention also provides electronic equipment which comprises a shell and a circuit board assembly positioned in the shell, wherein the circuit board assembly is the circuit board assembly provided by the embodiment.
The electronic equipment can further comprise a display screen, a camera, fingerprint identification and the like, the first circuit board can be a main circuit board, the second circuit board can be a flexible circuit board, at least part of one end of the flexible circuit board is overlapped and connected with the main circuit board, and the other end of the flexible circuit board is electrically connected with the display screen, the camera or the fingerprint identification and other structures of the electronic equipment, so that the corresponding functions of the electronic equipment are realized.
The specific structure and operation principle of the circuit board assembly are set forth in detail in the above embodiments, and are not repeated herein.
The electronic equipment provided by the invention comprises a shell and a circuit board assembly arranged in the shell, wherein the circuit board assembly comprises a first circuit board and a second circuit board at least partially superposed above the first circuit board, a conductive piece is arranged between the first circuit board and the second circuit board, a first conductive part which is electrically conducted with a circuit in the first circuit board is arranged at a position on the first circuit board corresponding to the conductive piece, a second conductive part which is electrically conducted with a circuit in the second circuit board is arranged at a position on the second circuit board corresponding to the conductive piece, one end of the conductive piece is electrically connected with the first conductive part, the other end of the conductive piece is electrically connected with the second conductive part, and the other end of the conductive piece is electrically connected with the second conductive part, so that the circuit in the first circuit board is electrically conducted with the circuit in the second circuit board through the conductive piece, the conductivity is good, and the working reliability between the circuit boards can be effectively improved, and glue layers are filled around the conductive parts and between the first circuit board and the second circuit board, and the first circuit board and the second circuit board which is at least partially overlapped above the first circuit board are connected through the glue layers, so that the production efficiency is high and the cost is low.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
In the description herein, references to the description of "one embodiment," "some embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Claims (10)
1. A circuit board assembly, comprising: a first circuit board and a second circuit board at least partially superimposed over the first circuit board;
a conductive piece is arranged between the first circuit board and the second circuit board, a first conductive part which is electrically conducted with a circuit in the first circuit board is arranged at a position on the first circuit board corresponding to the conductive piece, a second conductive part which is electrically conducted with the circuit in the second circuit board is arranged at a position on the second circuit board corresponding to the conductive piece, one end of the conductive piece is electrically connected with the first conductive part, and the other end of the conductive piece is electrically connected with the second conductive part;
glue layers are filled around the conductive pieces and between the first circuit board and the second circuit board.
2. The circuit board assembly of claim 1, wherein the glue layer is formed as a glue board;
the surface formed by the combination of the upper surface of the conductive piece and the upper surface of the bonding plate is attached to the lower surface of the first circuit board, and the surface formed by the combination of the lower surface of the conductive piece and the lower surface of the bonding plate is attached to the upper surface of the second circuit board.
3. The circuit board assembly of claim 2, wherein the bond plate is a rectangular bond plate.
4. The circuit board assembly of claim 3, wherein the rectangular adhesive sheet covers an overlapping area of the first circuit board and the second circuit board.
5. The circuit board assembly of any of claims 2-4, wherein the conductive member is a cylindrical conductive member;
the bonding plate is provided with a columnar hole matched with the columnar conductive piece, and the columnar conductive piece is embedded in the columnar hole.
6. The circuit board assembly of claim 5, wherein the cylindrical conductive member is a cylindrical conductive member.
7. The circuit board assembly of claim 6, wherein the cylindrical conductive member has an axial extension dimension that is less than a radial dimension of the cylindrical conductive member.
8. The circuit board assembly of any of claims 2-4, wherein there are at least two of the conductive members, and at least two of the conductive members are spaced apart on the bond board.
9. The circuit board assembly of claim 2, wherein the conductive member and the adhesive plate are integrally formed.
10. An electronic device, comprising: a housing and a circuit board assembly within the housing, the circuit board assembly being as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010217245.5A CN111432552A (en) | 2020-03-25 | 2020-03-25 | Circuit board assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010217245.5A CN111432552A (en) | 2020-03-25 | 2020-03-25 | Circuit board assembly and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN111432552A true CN111432552A (en) | 2020-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010217245.5A Pending CN111432552A (en) | 2020-03-25 | 2020-03-25 | Circuit board assembly and electronic equipment |
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| CN (1) | CN111432552A (en) |
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