JPH0555720A - Connecting structure for printed wiring board - Google Patents

Connecting structure for printed wiring board

Info

Publication number
JPH0555720A
JPH0555720A JP24233891A JP24233891A JPH0555720A JP H0555720 A JPH0555720 A JP H0555720A JP 24233891 A JP24233891 A JP 24233891A JP 24233891 A JP24233891 A JP 24233891A JP H0555720 A JPH0555720 A JP H0555720A
Authority
JP
Japan
Prior art keywords
connection
substrates
printed circuit
substrate
patterns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24233891A
Other languages
Japanese (ja)
Inventor
Yasuhiro Toyoda
育弘 豊田
Yoshiyuki Mizumo
義之 水藻
Akiyoshi Mori
明美 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to JP24233891A priority Critical patent/JPH0555720A/en
Publication of JPH0555720A publication Critical patent/JPH0555720A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To obtain a structure for connecting a plurality of flexible printed boards in a press-contacted state with a common press contacting member. CONSTITUTION:After cylindrical rubber pieces 17a and 17b are arranged in grooves 16a and 16b provided at the connecting part of a camera body, connection patterns of substrates 11 and 12 and substrates 13 and 14 are formed in a faced state on the pieces 17a and 17b and the substrates are pressed with a pressure plate 19. The press-contacting force between the connection patterns are corrected by changing the diameters of the rubber pieces 17a and 17b so that the pressure contact force can become uniform even when a level difference exists between the substrates 11 and 12 and substrates 13 and 14 due to the short dimensions of the substrates 13 and 14.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、複数のプリント基板
相互を圧接して接続する接続構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting structure for connecting a plurality of printed circuit boards by pressing them against each other.

【0002】[0002]

【従来の技術】カメラの性能の向上・多機能化に伴い、
カメラの制御回路等に組み込まれる回路部品の数や、ス
イツチ類の数は初期の制御回路からみて著しく増加して
いる。このため、プリント基板の面積を増加するばかり
でなく、プリント基板を適宜に分割し、カメラ内部の狭
い空間に分散配置して対応している。この場合、分割さ
れた複数のプリント基板相互を接続する構成が必要とな
るが、最近は接続を容易に且つ確実に行うことのできる
圧接による接続構造が提案されている。
2. Description of the Related Art With the improvement of camera performance and multi-functionality,
The number of circuit components incorporated in the control circuit of the camera and the number of switches are significantly increased from the initial control circuit. Therefore, not only is the area of the printed circuit board increased, but the printed circuit board is appropriately divided and distributed in a narrow space inside the camera. In this case, a structure for connecting a plurality of divided printed circuit boards to each other is required, but recently, a connection structure by pressure contact has been proposed which enables easy and reliable connection.

【0003】図7及び図8は従来のプリント基板の圧接
による接続構造の一例を示すもので、図7は接続構造を
説明する斜視図、図8は接続構造部分の断面図である。
図7及び図8において、1及び2はフレキシブルプリン
ト基板で、各基板には接続パタ−ン1a、2aが形成さ
れているほか、位置決め穴1b、2b、ねじ穴1c、2
cがそれぞれ設けられている。3はカメラボデイで、接
続部位には円柱状ゴム片5を受ける溝4が形成されてい
るほか、位置決めピン6、ねじ穴7が設けられている。
なお、溝4は円柱状ゴム片5の直径よりも浅い溝であ
る。また、8cは押圧板で、プリント基板1、2と同様
に位置決め穴1b、2b、ねじ穴1c、2cが設けられ
ている。
FIG. 7 and FIG. 8 show an example of a conventional connecting structure by pressure contact of a printed circuit board. FIG. 7 is a perspective view for explaining the connecting structure and FIG. 8 is a sectional view of the connecting structure portion.
In FIGS. 7 and 8, 1 and 2 are flexible printed circuit boards, in which connection patterns 1a and 2a are formed on the respective boards, positioning holes 1b and 2b, screw holes 1c and 2
c are provided respectively. Reference numeral 3 denotes a camera body, which has a groove 4 for receiving a cylindrical rubber piece 5 at a connecting portion, a positioning pin 6 and a screw hole 7.
The groove 4 is a groove shallower than the diameter of the cylindrical rubber piece 5. A pressing plate 8c has positioning holes 1b and 2b and screw holes 1c and 2c, like the printed boards 1 and 2.

【0004】プリント基板1、2の接続パタ−ン1a、
2aを圧接接続するには、まず、カメラボデイ3の溝4
にゴム片5を配置する。接続パタ−ン1a、2aが相互
に対向するようよう配置し、位置決めピン6にプリント
基板1、2の位置決め穴1b、2bを挿入する。プリン
ト基板2の上に押圧板8を配置し、位置決めピン6に押
圧板8位置決め穴8bを挿入し、ビス9を穴8cに挿通
し、カメラボデイのねじ穴7に締め付けると、ゴム片5
の弾性によりプリント基板の接続パタ−ン1a、2a相
互が圧接されて接続される。
A connection pattern 1a for the printed circuit boards 1 and 2,
To press-connect 2a, firstly insert the groove 4 of the camera body 3
The rubber piece 5 is placed on the. The connection patterns 1a and 2a are arranged so as to face each other, and the positioning holes 1b and 2b of the printed circuit boards 1 and 2 are inserted into the positioning pins 6. When the pressing plate 8 is arranged on the printed board 2, the pressing plate 8 positioning hole 8b is inserted into the positioning pin 6, the screw 9 is inserted into the hole 8c, and the screw hole 7 of the camera body is tightened.
Due to the elasticity of, the connection patterns 1a and 2a of the printed circuit boards are pressed against each other and connected.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記し
たプリント基板の圧接による接続構造は、基板1枚に対
し他の基板1枚を接続するものである。複数枚のプリン
ト基板を接続する場合、カメラボデイに設けた1つの接
続部位において、複数枚のプリント基板を多層に配置し
て基板相互を接続すれば、カメラボデイに設ける接続部
位の数を減らすことができるほか、基板相互の接続のた
めに使用される基板上の面積を減らすことができる。し
かし、接続すべき複数枚のプリント基板の接続パタ−ン
が同一の寸法であるとは限らないし、また、プリント基
板の設計の際に全ての接続パタンを同一の寸法とするこ
とは、使用しない無駄な接続パタ−ンが生じてプリント
基板の面積を不必要に増大させる結果ともなり、狭いカ
メラボデイ内の空間を有効利用することができないとい
う問題があつた。この発明は上記課題を解決することを
目的とするものである。
However, the above-mentioned connection structure by pressure contact of the printed circuit board is for connecting one board to another board. When connecting multiple printed circuit boards, reduce the number of connection sites provided on the camera body by arranging multiple printed circuit boards in multiple layers and connecting the boards at one connection site provided on the camera body. In addition, it is possible to reduce the area on the board used for connecting the boards to each other. However, the connecting patterns of a plurality of printed circuit boards to be connected are not always the same size, and it is not used to design all the connecting patterns to have the same size. There is a problem that the space in the narrow camera body cannot be effectively used because the useless connection pattern is generated and the area of the printed circuit board is unnecessarily increased. The present invention is intended to solve the above problems.

【0006】[0006]

【課題を解決するための手段】この発明は上記課題を解
決するもので、接続パタ−ン相互を接続するべく対向し
て配置した複数のプリント基板の接続パタ−ン部分を加
圧部材を備えた接続部位に配置し、接続部位の加圧部材
を介して接続パタ−ン相互を圧接して接続するプリント
基板の接続構造において、前記接続部位に所要の複数組
のプリント基板の接続パタ−ン部分を多層に配置すると
ともに、前記多層に配置された各接続パタ−ン相互の圧
接力を接続部位全面で均等にする加圧部材を介して圧接
して接続することを特徴とするものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems and is provided with a pressing member at the connecting pattern portions of a plurality of printed circuit boards arranged to face each other so as to connect the connecting patterns. In a connection structure of a printed circuit board, which is disposed at a connection site and is pressed to connect the connection patterns to each other via a pressure member at the connection site, a plurality of sets of connection patterns of the printed circuit boards required for the connection site are provided. The parts are arranged in multiple layers, and the connection patterns are connected by pressing through a pressing member that equalizes the pressure contact force between the connection patterns arranged in the multiple layers over the entire connection site. ..

【0007】[0007]

【作用】一つの接続部位に複数のプリント基板の接続パ
タ−ンを多層に配置することにより、一つの接続部位で
複数のプリント基板の接続ができる。加圧部材は多層に
配置されたプリント基板の接続パタ−ン部分の厚みを考
慮した構造で、接続パタ−ン相互の圧接力を接続部位全
面で均等にする。
By arranging a plurality of connection patterns for a plurality of printed circuit boards at one connection site, a plurality of printed circuit boards can be connected at one connection site. The pressure member has a structure in consideration of the thickness of the connection pattern portion of the printed circuit boards arranged in multiple layers, and makes the pressure contact forces between the connection patterns uniform over the entire connection portion.

【0008】[0008]

【実施例】以下、この発明の実施例について説明する。
ここでは、接続部位に多層に配置されたフレキシブルプ
リント基板(以下単に基板という)上の接続パタ−ンの
寸法が異なり、このため接続部位に多層に配置された基
板全体の厚みが均一でないものの接続構造について説明
する。
Embodiments of the present invention will be described below.
Here, the dimensions of the connection patterns on the flexible printed circuit boards (hereinafter simply referred to as "boards") arranged in multiple layers at the connection site are different, and therefore the connection of the multilayer substrates arranged at the connection site is not uniform in thickness. The structure will be described.

【0009】図1及び図2は、この発明による複数の基
板の圧接による接続構造の第1の実施例を示すものであ
る。図1は接続構造を説明する斜視図で、図2は接続構
造部分を拡大した断面を示す。なお、図2では位置決め
ピン、締め付け用のビスは省略した。
FIG. 1 and FIG. 2 show a first embodiment of a connection structure by pressure-welding a plurality of substrates according to the present invention. FIG. 1 is a perspective view for explaining the connection structure, and FIG. 2 shows an enlarged cross section of the connection structure portion. In FIG. 2, the positioning pin and the tightening screw are omitted.

【0010】図1において、11、12は基板で、基板
11には接続パタ−ン21a、21bが形成されている
ほか、位置決め穴11a、11b、11cとねじ穴11
d、11e、11fが設けられ、基板12には接続パタ
−ン22a、22bが形成されているほか、位置決め穴
12a、12b、12cとねじ穴12d、12e、12
fが設けられている。
In FIG. 1, reference numerals 11 and 12 denote substrates. Connection patterns 21a and 21b are formed on the substrate 11, and positioning holes 11a, 11b and 11c and screw holes 11 are provided.
d, 11e, 11f are provided, the connection patterns 22a, 22b are formed on the substrate 12, and positioning holes 12a, 12b, 12c and screw holes 12d, 12e, 12 are provided.
f is provided.

【0011】13、14も基板で、基板13には接続パ
タ−ン23が形成されているほか、位置決め穴13a、
13bとねじ穴13d、13eが設けられ、基板14に
は接続パタ−ン24が形成されているほか、位置決め穴
14a、14bとねじ穴14d、14eが設けられてい
る。基板13、14は接続パタ−ンが1つで、基板1
1、12よりも接続部の幅が狭く構成されている。
Reference numerals 13 and 14 are also substrates. A connection pattern 23 is formed on the substrate 13, and positioning holes 13a,
13b and screw holes 13d and 13e are provided, a connection pattern 24 is formed on the substrate 14, and positioning holes 14a and 14b and screw holes 14d and 14e are provided. The boards 13 and 14 have one connection pattern, and the board 1
The width of the connecting portion is configured to be narrower than that of the wirings 1 and 12.

【0012】15はカメラボデイで、基板の接続パタ−
ン部分を圧接して接続するため、円柱状ゴム片17aを
受ける溝16aと円柱状ゴム片17bを受ける溝16b
とが形成されているほか、位置決めピン15a、15
b、15cとねじ穴18a、b、cが設けられている。
円柱状ゴム片17bは円柱状ゴム片17aよりも大径の
もので、これはカメラボデイ15に基板11と12、及
び13と14を圧接して接続するとき、基板13と14
が配置される側が厚くなるので、この厚みを補正して圧
接力を均等にするためである。また、19は基板の接続
パタ−ン部分を圧接する押圧板、20は締め付け用のビ
スである。
Reference numeral 15 is a camera body, which is a connection pattern for the substrate.
Groove portion 16a for receiving the cylindrical rubber piece 17a and groove 16b for receiving the cylindrical rubber piece 17b in order to press and connect the cylindrical portion.
And the positioning pins 15a, 15
b, 15c and screw holes 18a, b, c are provided.
The cylindrical rubber piece 17b has a diameter larger than that of the cylindrical rubber piece 17a. This means that when the substrates 11 and 12 and 13 and 14 are connected to the camera body 15 under pressure, the substrates 13 and 14 are connected.
This is because the side on which is arranged becomes thicker, so that this thickness is corrected to equalize the pressure contact force. Further, 19 is a pressing plate for pressing the connection pattern portion of the substrate, and 20 is a screw for tightening.

【0013】基板11と12、及び13と14を圧接し
て接続するには、まず、カメラボデイ15の溝16a、
16bにそれぞれ円柱状ゴム片17a、17bを配置
し、この上に基板11の接続パタ−ン21a、21bと
基板12の接続パタ−ン22a、22bを対向させ、基
板11の位置決め穴11a、11b、11cと基板12
のの位置決め穴12a、12b、12cを、それぞれカ
メラボデイ15の位置決めピン15a、15b、15c
に挿入する。
To connect the substrates 11 and 12 and 13 and 14 by pressure contact, first, the groove 16a of the camera body 15
Cylindrical rubber pieces 17a and 17b are arranged on 16b, respectively, and the connection patterns 21a and 21b of the substrate 11 and the connection patterns 22a and 22b of the substrate 12 are made to face each other, and the positioning holes 11a and 11b of the substrate 11 are arranged. , 11c and substrate 12
Positioning holes 12a, 12b, 12c of the camera body 15 are respectively positioned by positioning pins 15a, 15b, 15c of the camera body 15.
To insert.

【0014】さらに、この上に基板13の接続パタ−ン
23と基板14の接続パタ−ン24を対向させ、基板1
3の位置決め穴13a、13bと基板14の位置決め穴
14a、14bを、それぞれカメラボデイ15の位置決
めピン15a、15bに挿入する。
Further, the connection pattern 23 of the substrate 13 and the connection pattern 24 of the substrate 14 are opposed to each other on this, and the substrate 1
The positioning holes 13a and 13b of No. 3 and the positioning holes 14a and 14b of the substrate 14 are inserted into the positioning pins 15a and 15b of the camera body 15, respectively.

【0015】基板14の上に押圧板19を配置し、ビス
20でカメラボデイに締め付けると、ゴム片17a、1
7bの弾性により基板11と12上の接続パタ−ン21
aと22a及び21bと22b、基板13と14上の接
続パタ−ン23と24相互が圧接されて接続される。
When the pressing plate 19 is placed on the substrate 14 and tightened to the camera body with the screw 20, the rubber pieces 17a, 1
The connection pattern 21 on the substrates 11 and 12 due to the elasticity of 7b.
a and 22a and 21b and 22b, and the connection patterns 23 and 24 on the substrates 13 and 14 are pressed against each other and connected.

【0016】このとき、ゴム片17bはゴム片17aよ
りも大径であるから、基板11、12は図2に示すよう
に略中央部で屈曲し、ゴム片17bの上に乗る部分がゴ
ム片17aの上に乗る部分よりも上方に押上げられ、基
板12の上面は基板14の上面と一致する。基板11、
12、13、14全部を重畳した厚みと、基板11、1
2のみを重畳した厚みとの差を補正するようにゴム片1
7bの径を選択することで、基板11と12の接続パタ
−ン相互の圧接力と、基板13と14の接続パタ−ン相
互の圧接力を等しくすることができる。なお、ゴム片1
7a、ゴム片17bの径は多層に配置される基板の枚数
に応じて適宜選択する。
At this time, since the rubber piece 17b has a larger diameter than the rubber piece 17a, the substrates 11 and 12 are bent at the substantially central portion as shown in FIG. The upper surface of the substrate 12 coincides with the upper surface of the substrate 14 because the upper surface of the substrate 12 is pushed upward from a portion on which the board 17a rides. Substrate 11,
The total thickness of 12, 13, 14 and the substrate 11, 1
Rubber piece 1 so as to correct the difference with the thickness where only 2 is superimposed
By selecting the diameter of 7b, the pressure contact force between the connection patterns of the substrates 11 and 12 and the pressure contact force between the connection patterns of the substrates 13 and 14 can be made equal to each other. In addition, rubber piece 1
The diameters of the rubber pieces 7a and the rubber pieces 17b are appropriately selected according to the number of substrates arranged in multiple layers.

【0017】さきに説明したとおりゴム片17aとゴム
片17bとの直径は異なるが、直径の差が目で識別困難
なため、ゴム片17a、17bを溝16a、16bに挿
入するとき、誤って逆に入れてしまう可能性がある。こ
れを回避するため、ゴム片17aとゴム片17bとの長
さを変えるとともに、溝16a、16bもゴム片に対応
した長さとして、逆に入れてしまう作業ミスを防止する
ことができる。また、ゴム片17aとゴム片17bと色
を変えることにより、直径の違いを識別するようにして
もよい。
As described above, the rubber pieces 17a and the rubber pieces 17b have different diameters, but since the difference in the diameters is difficult to identify by eye, when the rubber pieces 17a, 17b are inserted into the grooves 16a, 16b, they are erroneously inserted. There is a possibility to put it in reverse. In order to avoid this, the lengths of the rubber pieces 17a and 17b are changed, and the grooves 16a and 16b have lengths corresponding to the rubber pieces, thereby making it possible to prevent a mistake in inserting the grooves in reverse. Further, the difference in diameter may be identified by changing the colors of the rubber pieces 17a and 17b.

【0018】図3はこの発明による複数の基板の圧接に
よる接続構造の第2の実施例で、図3は接続構造部分を
拡大した断面を示す。接続パタ−ンの形状、位置決め
穴、ねじ穴の配置など、基板の構造は第1実施例と変わ
らない。
FIG. 3 shows a second embodiment of a connection structure by press-contacting a plurality of substrates according to the present invention, and FIG. 3 shows an enlarged cross section of the connection structure portion. The structure of the substrate, such as the shape of the connection pattern, the positioning holes and the arrangement of the screw holes, is the same as that of the first embodiment.

【0019】この実施例では、カメラボデイ15の基板
接続部位は平面に形成されるが、基板14の上に配置す
る押圧板31には、基板14に接する面に図3に示され
るような段部32aを有するゴム片32が取り付けられ
ている。段部32aの高さは、基板11、12、13、
14全部を重畳した厚みと、基板11、12のみを重畳
した厚みとの差を補正する高さとする。これにより基板
11と12の接続パタ−ン相互の圧接力と、基板13と
14の接続パタ−ン相互の圧接力を等しくすることがで
きる。
In this embodiment, the substrate connecting portion of the camera body 15 is formed on a flat surface, but the pressing plate 31 arranged on the substrate 14 has a step as shown in FIG. A rubber piece 32 having a portion 32a is attached. The height of the step portion 32a is equal to that of the substrates 11, 12, 13,
The height is set to correct the difference between the total thickness of 14 and the total thickness of the substrates 11 and 12. As a result, the pressure contact force between the connection patterns of the substrates 11 and 12 and the pressure contact force between the connection patterns of the substrates 13 and 14 can be equalized.

【0020】図4はこの発明による複数の基板の圧接に
よる接続構造の第3の実施例で、図4は接続構造部分を
拡大した断面を示す。接続パタ−ンの形状、位置決め
穴、ねじ穴の配置など、基板の構造は第1実施例と変わ
らない。
FIG. 4 shows a third embodiment of a connection structure by pressure welding of a plurality of substrates according to the present invention, and FIG. 4 shows an enlarged cross section of the connection structure portion. The structure of the substrate, such as the shape of the connection pattern, the positioning holes and the arrangement of the screw holes, is the same as that of the first embodiment.

【0021】この実施例では、カメラボデイ15の基板
接続部位は第1実施例と同様に2つの溝とこれらの溝に
配置された円柱状ゴム片を備えているが、2つの溝41
aと41bは同一の深さに構成し、円柱状ゴム片42a
と42bの径も同一のものを使用する。一方、基板14
の上に配置する押圧板43は、基板14に接する面が図
4に示されるような段部43aが形成されている。段部
43aの高さは、基板11、12、13、14全部を重
畳した厚みと、基板11、12のみを重畳した厚みとの
差を補正する高さとする。
In this embodiment, the substrate connecting portion of the camera body 15 is provided with two grooves and cylindrical rubber pieces arranged in these grooves as in the first embodiment, but two grooves 41 are provided.
a and 41b are configured to have the same depth, and a cylindrical rubber piece 42a
The same diameter is used for 42 and 42b. On the other hand, the substrate 14
The pressing plate 43 arranged on the upper part of the upper surface has a step portion 43a as shown in FIG. The height of the stepped portion 43a is set to a height that corrects the difference between the thickness of the substrates 11, 12, 13, and 14 that are superimposed and the thickness of the substrates 11 and 12 that are superimposed.

【0022】これにより、基板14の上から押圧板43
で基板を押圧すると、基板11と12上の接続パタ−ン
21aと22a及び21bと22b、基板13と14上
の接続パタ−ン23と24相互が円柱状ゴム片42aと
42bの弾性により圧接され圧接されて接続されるが、
このとき基板11と12の接続パタ−ン相互の圧接力
と、基板13と14の接続パタ−ン相互の圧接力を等し
くすることができる。
As a result, the pressing plate 43 is pressed from above the substrate 14.
When the substrate is pressed with, the connection patterns 21a and 22a and 21b and 22b on the substrates 11 and 12, and the connection patterns 23 and 24 on the substrates 13 and 14 are pressed against each other by the elasticity of the cylindrical rubber pieces 42a and 42b. It is pressed and connected, but
At this time, the pressure contact force between the connection patterns of the substrates 11 and 12 and the pressure contact force between the connection patterns of the substrates 13 and 14 can be equalized.

【0023】図5はこの発明による複数の基板の圧接に
よる接続構造の第4の実施例で、図5は接続構造部分を
拡大した断面を示す。この実施例は第3の実施例の押圧
板43の形状を変形したものであり、その他は第3の実
施例のものと変わらない。
FIG. 5 shows a fourth embodiment of a connection structure by pressure welding of a plurality of substrates according to the present invention, and FIG. 5 shows an enlarged cross section of the connection structure portion. This embodiment is a modification of the shape of the pressing plate 43 of the third embodiment, and the rest is the same as that of the third embodiment.

【0024】この実施例では、基板14の上に配置する
押圧板53を、基板11、12、13、14全部を押圧
する部分と基板11、12のみを押圧する部分とで基板
13、14の厚みに相当する寸法だけ段差53aをつけ
て形成し、第3の実施例の押圧板43と同一の機能をも
たせたものである。
In this embodiment, the pressing plate 53 arranged on the substrate 14 is divided into a part that presses all the substrates 11, 12, 13, and 14 and a part that presses only the substrates 11, 12 so that the substrates 13, 14 are not pressed. The step 53a is formed by a dimension corresponding to the thickness, and has the same function as the pressing plate 43 of the third embodiment.

【0025】図6はこの発明による複数の基板の圧接に
よる接続構造の第5の実施例で、図6は接続構造部分を
拡大した断面を示す。この実施例は第1の実施例に類似
しているが、カメラボデイ15の基板接続部分を、基板
11、12、13、14全部を押圧する部分と基板1
1、12のみを押圧する部分とで基板13、14の厚み
に相当する寸法だけ段差63aをつけて形成するととも
に、段差63a部分の左右に同一の深さの2つの溝61
aと61bを設け、これらの溝に同一径の円柱状ゴム片
62aと62bを配置したものである。
FIG. 6 shows a fifth embodiment of a connection structure by pressure welding of a plurality of substrates according to the present invention, and FIG. 6 shows an enlarged cross section of the connection structure portion. This embodiment is similar to the first embodiment, except that the substrate connecting portion of the camera body 15 is a portion for pressing all of the substrates 11, 12, 13, 14 and the substrate 1.
The step portions 63a are formed to have a size corresponding to the thickness of the substrates 13 and 14 and the portions that press only 1 and 12, and two grooves 61 of the same depth are formed on the left and right sides of the step portion 63a.
a and 61b are provided, and cylindrical rubber pieces 62a and 62b having the same diameter are arranged in these grooves.

【0026】これにより、基板14の上から押圧板64
で押圧すると、基板11と12上の接続パタ−ン21a
と22a及び21bと22b、基板13と14上の接続
パタ−ン23と24相互が円柱状ゴム片62aと62b
の弾性により圧接され圧接されて接続されるが、このと
き基板11と12の接続パタ−ン相互の圧接力と、基板
13と14の接続パタ−ン相互の圧接力を等しくするこ
とができる。
As a result, the pressing plate 64 is pressed from above the substrate 14.
When pressed with, the connection pattern 21a on the substrates 11 and 12
And 22a and 21b and 22b, and the connection patterns 23 and 24 on the substrates 13 and 14 are cylindrical rubber pieces 62a and 62b.
Of the substrates 11 and 12 and the connection patterns of the substrates 11 and 12 and the connection patterns of the substrates 13 and 14 can be made equal to each other.

【0027】なお、図3乃至図7に示すは接続構造部分
を拡大した断面図では、位置決めピン、締め付け用のビ
スは省略した。
3 to 7, the positioning pin and the screw for tightening are omitted in the enlarged sectional views of the connecting structure.

【0028】[0028]

【発明の効果】以上説明したように、この発明によれ
ば、カメラボデイ等に設けた接続部位に複数のプリント
基板の接続パタ−ン部分を多層に重畳して配置し、全体
を圧接して接続するから、1つの接続部位で多数のプリ
ント基板の接続ができ、カメラボデイ等に設ける接続部
位の数や接続部材の数を減少させることができる。そし
て、接続部位における重畳したプリント基板の厚みが部
分的に異なるとき、加圧部材でこれを補正するから、簡
単な構造で複数のプリント基板を確実に接続することが
できる。
As described above, according to the present invention, the connecting pattern portions of a plurality of printed circuit boards are arranged in a multi-layered manner at the connecting portion provided on the camera body or the like, and the whole is pressure-welded. Since connection is made, a large number of printed circuit boards can be connected at one connection site, and the number of connection sites and the number of connection members provided on the camera body or the like can be reduced. Then, when the thicknesses of the overlapping printed circuit boards at the connecting portions are partially different, this is corrected by the pressing member, so that a plurality of printed circuit boards can be reliably connected with a simple structure.

【図面の簡単な説明】[Brief description of drawings]

【図1】プリント基板の接続構造の第1実施例の斜視説
明図。
FIG. 1 is an explanatory perspective view of a first embodiment of a printed circuit board connection structure.

【図2】図1に示す第1の実施例の接続構造部分の断面
図。
FIG. 2 is a sectional view of a connection structure portion of the first embodiment shown in FIG.

【図3】プリント基板の接続構造の第2実施例の接続構
造部分の断面図。
FIG. 3 is a sectional view of a connecting structure portion of a second embodiment of the connecting structure of a printed circuit board.

【図4】プリント基板の接続構造の第3実施例の接続構
造部分の断面図。
FIG. 4 is a sectional view of a connecting structure portion of a third embodiment of the connecting structure of a printed circuit board.

【図5】プリント基板の接続構造の第4実施例の接続構
造部分の断面図。
FIG. 5 is a sectional view of a connection structure portion of a fourth embodiment of the connection structure for a printed circuit board.

【図6】プリント基板の接続構造の第5実施例の接続構
造部分の断面図。
FIG. 6 is a sectional view of a connection structure portion of a fifth embodiment of the connection structure for a printed circuit board.

【図7】従来のプリント基板の接続構造の斜視説明図。FIG. 7 is a perspective explanatory view of a conventional printed circuit board connection structure.

【図8】図7に示す従来のプリント基板の接続構造部分
の断面図。
8 is a cross-sectional view of the connection structure portion of the conventional printed circuit board shown in FIG.

【符号の説明】[Explanation of symbols]

1、2、11、12、13、14:フレキシブルプリン
ト基板 1a、2a、21a、21b、22a、22b、23、
24:接続用パタ−ン 3、15:カメラボデイ 4、16a、16b、41a、41b、61a、61
b:溝 5、17a、17b、42a、42b、62a、62
b:円柱状ゴム片 32:ゴム片 8、19、31、43、53、64:押圧板
1, 2, 11, 12, 13, 14: Flexible printed circuit boards 1a, 2a, 21a, 21b, 22a, 22b, 23,
24: Connection pattern 3, 15: Camera body 4, 16a, 16b, 41a, 41b, 61a, 61
b: grooves 5, 17a, 17b, 42a, 42b, 62a, 62
b: cylindrical rubber piece 32: rubber piece 8, 19, 31, 43, 53, 64: pressing plate

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 接続パタ−ン相互を接続するべく対向し
て配置した複数のプリント基板の接続パタ−ン部分を加
圧部材を備えた接続部位に配置し、接続部位の加圧部材
を介して接続パタ−ン相互を圧接して接続するプリント
基板の接続構造において、前記接続部位に所要の複数組
のプリント基板の接続パタ−ン部分を多層に配置すると
ともに、前記多層に配置された各接続パタ−ン相互の圧
接力を接続部位全面で均等にする加圧部材を介して圧接
して接続することを特徴とするプリント基板の接続構
造。
1. A connection pattern portion of a plurality of printed circuit boards arranged to face each other so as to connect the connection patterns to each other, is arranged at a connection portion provided with a pressure member, and the pressure member at the connection portion is interposed therebetween. In a connection structure of a printed circuit board in which the connection patterns are pressed together to be connected, a plurality of sets of connection pattern parts of a required number of the printed circuit boards are arranged in multiple layers at the connection site, and A connection structure for a printed circuit board, characterized in that the connection patterns are connected by pressure contact through a pressure member that makes the pressure contact forces between the connection patterns uniform over the entire connection site.
JP24233891A 1991-08-29 1991-08-29 Connecting structure for printed wiring board Pending JPH0555720A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24233891A JPH0555720A (en) 1991-08-29 1991-08-29 Connecting structure for printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24233891A JPH0555720A (en) 1991-08-29 1991-08-29 Connecting structure for printed wiring board

Publications (1)

Publication Number Publication Date
JPH0555720A true JPH0555720A (en) 1993-03-05

Family

ID=17087712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24233891A Pending JPH0555720A (en) 1991-08-29 1991-08-29 Connecting structure for printed wiring board

Country Status (1)

Country Link
JP (1) JPH0555720A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111432552A (en) * 2020-03-25 2020-07-17 西安易朴通讯技术有限公司 Circuit board assembly and electronic equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111432552A (en) * 2020-03-25 2020-07-17 西安易朴通讯技术有限公司 Circuit board assembly and electronic equipment

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