TWI696317B - Expansion circuit board - Google Patents

Abstract

An expansion circuit board configured to be electrically connected to a base circuit board includes a plate and an electrically conductive part. The plate has a top surface, a bottom surface, a side surface, an opening and a through hole. The top surface is opposite to the bottom surface. The side surface is connected to the top surface and the bottom surface. The opening is located on the side surface and penetrates through the top surface and the bottom surface. The through hole penetrates through the top surface and the bottom surface and is spaced apart from the side surface. The electrically conductive part includes a pad. The pad includes a first part, a second part and a third part. The first part is located on a first surface of the plate forming the opening. The third part is located on a second surface of the plate forming the through hole. The second part is located on the top surface and connected between the first part and the third part. The expansion circuit board is configured to be electrically connected to the base circuit board via the first part, the second part or the third part.

Description

Expansion circuit board

The invention relates to a circuit board, in particular to an expansion circuit board for electrically connecting a circuit carrier board.

Generally speaking, the board body of the circuit board is provided with pads, and surface-mount technology (SMT) or electrical connectors are used to electrically connect the circuit boards to each other through the pads.

Due to space constraints, circuit boards in different electronic devices need to be electrically connected to each other in different ways. However, the conventional pad can only electrically connect the circuit board to other circuit boards in a single manner, so that the circuit board provided with the conventional pad cannot be electrically connected to another circuit board in many different ways. In addition, when using surface adhesive technology, the expansion circuit board stacked on the main circuit board will occupy the installation space on the main circuit board, thereby compressing the space on the main circuit board for other electronic components.

The invention provides an expansion circuit board, so that the expansion circuit board can be electrically connected to the circuit carrier board in many different ways.

The expansion circuit board disclosed in an embodiment of the present invention is used to be electrically connected to a circuit carrier board, and includes a board body and at least one signal transmission part. Board body There is a top surface, a bottom surface, at least one side surface, at least one conducting groove and at least one conducting hole. The top surface and the bottom surface are opposed to each other. At least one side surface is connected to the top surface and the bottom surface. At least one conducting groove is located on at least one side surface and penetrates the top surface and the bottom surface. At least one via hole penetrates the bottom surface and the top surface and is separated from at least one side surface. At least one signal transmission part includes at least one electrical connection plate. At least one electrical connection pad includes a first part, a second part, and a third part. The first part is located on at least one first wall surface forming at least one conducting groove in the plate body. The third part is located on at least one second wall surface forming at least one via hole in the board body. The second part is located on the top surface and connects the first part and the third part. The expansion circuit board is electrically connected to the circuit board through the first part, the second part or the third part.

The expansion circuit board disclosed in another embodiment of the present invention is used to be electrically connected to a circuit carrier board, and includes a board body and at least one signal transmission part. The plate body has a top surface, a bottom surface, at least one side surface and a plurality of conducting grooves. The top surface and the bottom surface are opposed to each other. At least one side surface is connected to the top surface and the bottom surface. The conducting groove is located on at least one side surface and penetrates the top surface and the bottom surface. At least one signal transmission part includes a plurality of electrical connection pads. Each electrical connection pad includes a connected first part and a second part. The first parts are respectively located on a plurality of walls of the plate body that form the conductive grooves. The second part is located on the top surface, and each has two wide sections and one narrow section. In each electrical connection plate, the opposite sides of the narrow section are connected to the two wide sections, one of which is connected to the first part, and the minimum width of the two wide sections is larger than the narrow section in an arrangement direction of the electrical connection pads The minimum width. The expansion circuit board is used to be electrically connected to the circuit board through the first part or the second part.

According to the expansion circuit board disclosed in the above embodiment, since the first part of the electrical connection pad is located on the wall surface of the board body forming the conduction groove, and the second part of the electrical connection pad The part is connected to the first part and located on the top surface, so the expansion circuit board can be electrically connected to the circuit carrier board in a horizontal or vertical manner through the first part and the second part, respectively. In this way, the expansion circuit board can be electrically connected to the circuit carrier board in many different ways.

In addition, since the electrical connection pad further includes a third portion of the wall surface forming the through hole in the board body, the expansion circuit board can be electrically connected to the circuit carrier board with an additional electrical connector through the third portion, and The method of electrically connecting the expansion circuit board to the circuit carrier board is more diverse.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principles of the present invention, and provide a further explanation of the scope of the patent application of the present invention.

10, 10a, 10b, 10c, 10d: expansion circuit board

100, 100a, 100d: plate body

101, 101a: top surface

102, 102a: bottom surface

103, 103x, 103y: side

104, 104d, 104x, 104y: conduction groove

105, 105a, 105x, 105y: via hole

106: The first wall

106d: Wall

107: second wall

108: Depression

109: bearing surface

110a: Grooving

200, 200x, 200y: Signal transmission department

201, 201d: electric connection plate

202, 202c, 202d: Part I

203, 203c, 203d: the second part

2030: wide segment

2031: Narrow segment

2032: Parallel sides

2032c: Hypotenuse

2033, 2033c: first side

2034, 2034c: second side

204, 204b: Part III

20, 20a, 20b: circuit board

21: slot

22, 22a: electrical connection pad

24b: Wall

30: Electrical connector

D1: protrusion distance

P: cutting plane

A1: Arrangement direction

W1, W2: minimum width

T: thickness

FIG. 1 is a schematic perspective view of a circuit carrier board and an expansion circuit board according to a first embodiment of the invention.

FIG. 2 is a perspective view of the expansion circuit board in FIG. 1.

FIG. 3 is a partially enlarged view of the perspective view of the expansion circuit board in FIG. 2.

FIG. 4 is a partially enlarged view of the upper view of the expansion circuit board in FIG. 2.

FIG. 5 is a partially enlarged view of an exploded view of the expansion circuit board in FIG. 2.

6 is a partially enlarged view showing a front cross-sectional view of the board body of the expansion circuit board inserted into the circuit carrier board.

7 is a schematic side view of the expansion circuit board and circuit carrier board in FIG. 6.

FIG. 8 is a partially enlarged view showing a perspective view of an expansion circuit board electrically connected to a circuit carrier board through surface adhesive technology.

9 is a partial enlarged view showing an exploded perspective view of an expansion circuit board electrically connected to a circuit carrier board through an electrical connector.

10 is a partially enlarged view of a perspective view of an expansion circuit board according to a second embodiment of the invention.

11 is a schematic side sectional view of the expansion circuit board in FIG. 10.

FIG. 12 is a partially enlarged view of the perspective view of the expansion circuit board in FIG. 10 after being cut along the slot.

13 is a partially enlarged view of a top view of an expansion circuit board according to a third embodiment of the present invention.

14 is a partially enlarged view of an exploded view of an expansion circuit board according to a fourth embodiment of the present invention.

The following describes in detail the detailed features and advantages of the present invention in the embodiments. The content is sufficient for any person skilled in the relevant art to understand and implement the technical content of the present invention, and according to the contents disclosed in this specification, the scope of patent application and the drawings Anyone skilled in the relevant art can easily understand the purpose and advantages of the present invention. The following examples further illustrate the views of the present invention in detail, but do not limit the scope of the present invention in any way.

Please refer to Figure 1 to Figure 4. FIG. 1 is a schematic perspective view of a circuit carrier board and an expansion circuit board according to a first embodiment of the invention. Figure 2 is the standing of the expansion circuit board in Figure 1 Body diagram. FIG. 3 is a partially enlarged view of the perspective view of the expansion circuit board in FIG. 2.

An expansion circuit board 10 of this embodiment is electrically connected to a circuit carrier board 20, and includes a board body 100 and a plurality of signal transmission parts 200, 200x, 200y.

The board body 100 has a top surface 101, a bottom surface 102, a plurality of side surfaces 103, 103x, 103y, a plurality of via grooves 104, 104x, 104y, a plurality of via holes 105, 105x, 105y, and a plurality of recessed portions 108. The top surface 101 and the bottom surface 102 face each other. The side surfaces 103, 103x, and 103y are connected to the top surface 101 and the bottom surface 102. The conducting groove 104 is located on the side surface 103 and penetrates the top surface 101 and the bottom surface 102. The conducting groove 104x is located on the side surface 103x and penetrates the top surface 101 and the bottom surface 102. The conducting groove 104y is located on the side surface 103y and penetrates the top surface 101 and the bottom surface 102. The via groove 104 and the via hole 105 are located on the same side of the plate body 100, and the via hole 105 penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103. The via 104x and the via 105x are located on the same side of the board body 100, and the via 105x penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103x. The via 104y and the via 105y are located on the same side of the plate body 100, and the via 105y penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103y.

It should be noted that, in order to facilitate description and clearly present the features of the present invention, only the side surface 103 is shown in some drawings.

As shown in FIG. 3, the two recessed portions 108 are respectively located on opposite sides of the side surface 103, so that the plate body 100 has two bearing surfaces 109, wherein the two bearing surfaces 109 are located in the two recessed portions 108 and are at a protruding distance D1 Apart from the side 103.

Please refer to Figure 3, Figure 4 and Figure 5. FIG. 4 is a partially enlarged view of the upper view of the expansion circuit board in FIG. 2. 5 is a partial exploded view of the expansion circuit board in FIG. 2 Zoom in.

Since the signal transmission unit 200 is similar in structure to the signal transmission units 200x and 200y in FIG. 2, in order to facilitate description and clearly present the features of the present invention, only the structure of the signal transmission unit 200 will be described in detail below, without repeating FIG. 2. The structure of the signal transmission section 200x, 200y in the.

The signal transmission parts 200 each include a plurality of electrical connection pads 201. Each electrical connection pad 201 includes a first portion 202, a second portion 203, and a third portion 204. The first portions 202 are respectively located on the plurality of first wall surfaces 106 in which the conductive grooves 104 are respectively formed in the board body 100. The third portions 204 are respectively located on the second wall surfaces 107 of the plate body 100 where the through holes 105 are formed. The second portion 203 is located on the top surface 101, and in each electrical connection pad 201, the second portion 203 connects the first portion 202 and the third portion 204.

In addition, as shown in FIG. 5, the second portions 203 each have two wide sections 2030 and one narrow section 2031. In each electrical connection pad 201, the opposite sides of the narrow section 2031 are connected to the two wide sections 2030, two wide The segment 2030 is connected to the first part 202 and the third part 204 respectively. In an arrangement direction A1 of the electrical lands 201, the minimum width W1 of the wide section 2030 is greater than the minimum width W2 of the narrow section 2031.

In addition, the second parts 203 each have two parallel sides 2032. In each second part 203, the two parallel sides 2032 each have a first side 2033 and a second side 2034 opposite to each other, wherein the two first sides 2033 are located on the side 103, and the distance between the two parallel sides 2032 is from the second One side 2033 to two second sides 2034 are kept the same.

In this embodiment, the second part of the electrical connection pad 201 is used for example The plating method is formed on the top surface 101 of the board body 100, but the invention is not limited thereto. In other embodiments, if the board includes a conductive layer and an insulating layer covering the conductive layer, the second part of the electrical connection pad may also be exposed in the conductive layer of the board due to the removal of the insulating layer Outside part.

Please refer to Figure 1, Figure 6 and Figure 7. 6 is a partially enlarged view showing a front cross-sectional view of the board body of the expansion circuit board inserted into the circuit carrier board. 7 is a schematic side view of the expansion circuit board and circuit carrier board in FIG. 6.

As shown in FIGS. 6 and 7, when the board body 100 is inserted into a slot 21 of the circuit board 20, the two bearing surfaces 109 will bear against the circuit board 20, and the board body 100 is added to the circuit The stability of the carrier board 20, and part of the second part 203 will be located in the slot 21. Next, for example, wave soldering is performed to electrically connect the expansion circuit board 10 and the circuit carrier board 20 through the second portion 203 and the electrical pad 22 on the circuit carrier board 20. After the wave soldering is completed, the expansion circuit board 10 can be electrically connected to the circuit carrier board 20 in a vertical manner.

As shown in FIG. 6, since the protrusion distance D1 between the side surface 103 and the two bearing surfaces 109 is greater than a thickness T of the circuit board 20, part of the second portion 203 will be exposed to the outside. In this way, during the wave soldering process, the second portion 203 can have a surface with a larger area for solder attachment, thereby increasing the stability of the expansion circuit board 10 fixed to the circuit carrier 20.

However, the protrusion distance D1 between the side surface 103 and the two bearing surfaces 109 is not limited to greater than the thickness T of the circuit board 20; in other embodiments, the protrusion distance may not be greater than the thickness of the circuit board, in this case You can further expand the circuit An adhesive is filled between the board and the circuit board to increase the stability of the expansion circuit board fixed to the circuit board.

In addition, please refer to FIG. 5 additionally, since the narrow section 2031 is located in the slot 21, and the minimum width W2 of the narrow section 2031 is smaller than the minimum width W1 of the wide section 2030; that is, for the adjacent two electrical connection pads 201 The distance between adjacent two narrow sections 2031 is greater than the distance between adjacent two wide sections 2030. In this way, during the wave soldering process, the solder attached to the circuit board 20 and located in the slot 21 is less likely to spread to the adjacent two narrow sections 2031, thereby preventing the adjacent two narrow sections 2031 from contacting each other. Form a short circuit.

However, the board body 100 is not limited to having a plurality of recessed portions 108; in other embodiments, the board body may not have a recessed portion, and instead a support member provided on the board body is used to bear or be inserted on the circuit carrier board, and further Increase the stability of the expansion circuit board inserted on the circuit board.

In addition, the second portion 203 is not limited to the wide section 2030 and the narrow section 2031 having the smallest widths different from each other in the arrangement direction A1. In other embodiments, the second section 203 may also have a fixed width in the arrangement direction. In addition, the distance between adjacent electrical connection pads is increased to prevent the solders attached to the adjacent electrical connection pads from contacting each other to form a short circuit.

In addition, please refer to FIG. 8, which is a partially enlarged view illustrating a perspective view of an expansion circuit board electrically connected to a circuit carrier board through surface adhesive technology. The expansion circuit board 10 can also be horizontally and electrically connected to the electrical connection pad 22a on the circuit carrier board 20a through the first portion 202, for example, by surface bonding technology.

Furthermore, please refer to FIG. 9, which is a partially enlarged view illustrating an exploded perspective view of the expansion circuit board electrically connected to the circuit carrier board through the electrical connector. The expansion circuit board 10 can also be electrically connected to the circuit board 20b through the electrical connector 30, wherein the electrical connector 30 contacts the third portion 204 and the wall surface 24b of the circuit board 20b where the via 23b is formed.

Please refer to FIG. 1 and FIG. 2 again, these signal transmission parts 200, 200x, 200y can be electrically connected to additional expansion circuit boards or circuit carrier boards in different ways according to actual needs, however, the expansion circuit board 10 is not limited to It includes a plurality of signal transmission parts 200, and each signal transmission part 200 is not limited to include a plurality of electrical connection pads 201, and the board body 100 is not limited to include a plurality of conduction grooves 104, a plurality of conduction holes 105, and a plurality of depressions 108; In other embodiments, the expansion circuit board may only include a signal transmission part, and the signal transmission part may only include an electrical connection pad. Further, in an embodiment in which the expansion circuit board only includes a signal transmission portion, and the signal transmission portion includes only an electrical connection pad, the board body may only have a conductive groove, a conductive hole, and a recessed portion.

Please refer to Figure 10 and Figure 11. 10 is a partially enlarged view of a perspective view of an expansion circuit board according to a second embodiment of the invention. 11 is a schematic side sectional view of the expansion circuit board in FIG. 10. Since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the second embodiment, only the parts of the second embodiment that are different from the first embodiment will be described below, and the same will not be repeated. Part.

The expansion circuit board 10a of this embodiment further has a two-cut groove 110a. The two cut grooves 110a are recessed from the top surface 101a and the bottom surface 102a, respectively, and are, for example, V-cut grooves. Define a cutting plane P, the cutting plane P is perpendicular to the plate body 100a The bottom surface 102a and the top surface 101a pass through the two-cut groove 110a and the via hole 105a.

Please refer to FIG. 12, which is a partially enlarged view of the perspective view of the expansion circuit board in FIG. 10 after being cut along the slot.

After cutting the board body 100a in FIG. 10 along the cutting plane P, the expansion circuit board 10b can still be horizontally electrically connected to the circuit carrier board by the surface bonding technique through the third portion 204b that is not completely cut off. Therefore, if there is only a need to electrically connect the expansion circuit board 10a and the circuit carrier board in a horizontal manner in FIG. 10, the above cutting operation can be performed to obtain an expansion circuit board 10b with a smaller size. In this way, the expansion circuit board 10b occupies less space in the electronic device than the expansion circuit board 10a in FIG.

Please refer to FIG. 13, which is a partially enlarged view of a top view of an expansion circuit board according to a third embodiment of the present invention. It should be noted that since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the third embodiment, only the parts of the third embodiment that are different from the first embodiment will be described below, and I will not repeat the same part.

In this embodiment, the second portions 203c each have two hypotenuses 2032c. In each second portion 203c, the two hypotenuses 2032c each have a first side 2033c and a second side 2034c opposite to each other, wherein the two first sides 2033c are located on the side 103c, and the distance between the two hypotenuses 2032c is from the second One side 2033c to two second sides 2034c gradually increase. In this way, since the distance between the two first sides 2033c of each second part 203c is smaller than the distance between the two second sides 2034c of each second part 203c, the first part 202c is used for horizontal electrical connection When expanding the circuit board 10c and the circuit board, the oblique edge 2032c can prevent the solder attached to the adjacent second portion 203c from contacting each other And form a short circuit.

In addition, the board body is not limited to having via holes, and each electrical connection pad is not limited to include the third part. Please refer to FIG. 14, which is a partially enlarged view of an exploded view of an expansion circuit board according to a fourth embodiment of the present invention. Figure. It should be noted that since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the fourth embodiment, only the parts of the fourth embodiment that are different from the first embodiment will be described below, and I will not repeat the same part.

In this embodiment, the board body 100d of the expansion circuit board 10d does not have the via hole 105 in FIG. 5, and the electrical land 201d does not include the third portion 204 in FIG. 5, that is, the electrical land 201d is only The first portion 202d and the second portion 203d are connected, wherein the first portion 202d is located on the wall surface 106d of the plate body 100d where the conductive groove 104d is formed.

The expansion circuit board 10d of this embodiment can be electrically connected to the circuit carrier board in a vertical manner through the second portion 203d, or can be electrically connected to the circuit carrier board in the horizontal manner through the first portion 202d.

According to the expansion circuit board disclosed in the above embodiment, since the first part of the electrical connection pad is located on the wall surface of the board body forming the conductive groove, and the second part of the electrical connection pad is connected to the first part and located on the top surface, Therefore, the expansion circuit board can be electrically connected to the circuit board in a horizontal or vertical manner through the first part and the second part, respectively. In this way, the expansion circuit board can be electrically connected to the circuit carrier board in many different ways.

In addition, since the electrical connection pad further includes a conduction located in the board body The third part of the wall surface of the hole, so the expansion circuit board can be electrically connected to the circuit carrier board with an additional electrical connector through the third part, thereby making the expansion circuit board electrically connected to the circuit carrier board more diverse .

Although the present invention is disclosed as above with the foregoing embodiments, it is not intended to limit the present invention. Any person familiar with similar arts can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of patent protection for inventions shall be subject to the scope defined in the patent application scope attached to this specification.

10: Expansion circuit board

100: plate body

200, 200x, 200y: Signal transmission department

20: circuit board

21: slot

22: Electrical connection pad

Claims (9)

An expansion circuit board is used to be electrically connected to a circuit carrier board. The expansion circuit board includes: a board body having a top surface, a bottom surface, at least one side surface, at least one conduction groove and at least one conduction hole, the top The bottom surface and the bottom surface are opposite to each other, the at least one side surface is connected to the top surface and the bottom surface, the at least one via groove is located on the at least one side surface and penetrates the top surface and the bottom surface, the at least one through hole penetrates the bottom surface and the top surface And separated from the at least one side; and at least one signal transmission part, including at least one electrical connection pad, the at least one electrical connection pad includes a first part, a second part and a third part, the The first part is located in the plate body to form at least one first wall surface of the at least one conducting groove, the third part is located in the plate body to form at least one second wall surface of the at least one via hole, the second part Located on the top surface and connecting the first part and the third part, the expansion circuit board is used to electrically connect to the circuit carrier through the first part, the second part or the third part Plate; wherein the number of the at least one electrical connection pad, the number of the at least one conduction slot and the number of the at least one conduction hole are all multiple, the conduction slots are located on the at least one side, the electrical connection pads The second part has two wide sections and one narrow section. In each of the electrical connection pads, the opposite sides of the narrow section are connected to the two wide sections, and the two wide sections are respectively connected to the first section and In the third part, and in an arrangement direction of the electrical connection pads, the minimum width of the two wide sections is greater than the minimum width of the narrow section. The expansion circuit board as described in item 1 of the patent application scope, wherein the number of the at least one signal transmission part, the number of the at least one conduction slot, the number of the at least one conduction hole and the number of the at least one side are all multiple , And the conducting grooves are respectively located on the sides. The expansion circuit board as described in item 1 of the patent scope, wherein the board body has a recessed portion, the recessed portion is located on one side of the at least one side surface, so that the board body has a bearing surface, and the bearing surface Located in the recessed portion and spaced apart from the at least one side, when the board body is inserted into a slot of the circuit carrier board, the bearing surface is used to bear against the circuit carrier board. An expansion circuit board as described in item 3 of the patent application scope, wherein a protrusion distance between the at least one side surface and the bearing surface is greater than a thickness of the circuit carrier board. The expansion circuit board as described in item 1 of the patent application scope, wherein the second part has two hypotenuses, and the two hypotenuses each have a first side and a second side opposite, the two first sides are located On the at least one side, the distance between the two hypotenuses gradually increases from the two first sides to the two second sides. The expansion circuit board as described in item 1 of the patent application scope, wherein the board body has two cut grooves, defining a cutting plane, the cutting plane is perpendicular to the bottom surface and the top surface of the board body, and passes through the two cut grooves And the via hole. An expansion circuit board is used to be electrically connected to a circuit carrier board. The expansion circuit board includes: A plate body has a top surface, a bottom surface, at least one side surface, and a plurality of conduction grooves, the top surface and the bottom surface are opposite to each other, the at least one side surface is connected to the top surface and the bottom surface, the conduction grooves are located in the at least A side surface penetrating the top surface and the bottom surface; and at least one signal transmission portion, including a plurality of electrical connection pads, each of the electrical connection pads includes a first part and a second part connected, the first parts The parts are respectively located on the wall surfaces of the plate body forming the through slots, the second parts are located on the top surface, and each has two wide sections and a narrow section, each of the electrical connection pads, the narrow The opposite sides of the segment are respectively connected to the two wide segments, one of the wide segments is connected to the first part, and the minimum width of the two wide segments is greater than the narrow segment in an arrangement direction of the electrical connection pads The minimum width of the expansion circuit board is used to electrically connect to the circuit board through the first part or the second part. The expansion circuit board as described in item 7 of the patent application scope, wherein the number of the at least one signal transmission part and the number of the at least one side are both plural, and the conduction slots are respectively located on the sides. The expansion circuit board according to item 7 of the patent application scope, wherein at least one side of the side has a recessed portion, so that the board body has a bearing surface, the bearing surface is located in the recessed portion and is in contact with the at least one The side surfaces are spaced apart from each other. When the board body is inserted into a slot of the circuit carrier board, the bearing surface is used to bear against the circuit carrier board.

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