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Application filed by Darfon Electronics CorpfiledCriticalDarfon Electronics Corp
Priority to TW099209295UpriorityCriticalpatent/TWM389411U/en
Publication of TWM389411UpublicationCriticalpatent/TWM389411U/en
A circuit board is disclosed and includes a connection portion. The connection portion has a metal foil on which there is a plurality of metal dots. The oxidation resistance of the metal dots is better than the oxidation resistance of the metal foil. Thereby, the circuit board can be electrical contacted with an external electronic device through the metal dots with better oxidation resistance, without the concern about the oxidation problem on the metal foil. Furthermore, a controllable flatness of the contact surface can be obtained by arranging the metal dots on the metal foil, without the concern of affecting the flatness of the contact surface due to coating other material on the metal foil.
Surface-treated metal material, metal foil with carrier, connector, terminal, laminate, shielding tape, shielding material, printed wiring board, processed metal member, electronic device, and method for manufacturing printed wiring board
Copper alloy for electronic and electrical equipment, copper alloy thin sheet for electronic and electrical equipment, and conductive component for electronic and electrical equipment, terminal
Copper alloy for electrical and electronic equipment, copper alloy thin sheet for electrical and electronic equipment, and conductive part and terminal for electrical and electronic equipment