PH12015501174A1 - Surface-treated electrolytic copper foil, laminate, and printed circuit board - Google Patents

Surface-treated electrolytic copper foil, laminate, and printed circuit board

Info

Publication number
PH12015501174A1
PH12015501174A1 PH12015501174A PH12015501174A PH12015501174A1 PH 12015501174 A1 PH12015501174 A1 PH 12015501174A1 PH 12015501174 A PH12015501174 A PH 12015501174A PH 12015501174 A PH12015501174 A PH 12015501174A PH 12015501174 A1 PH12015501174 A1 PH 12015501174A1
Authority
PH
Philippines
Prior art keywords
copper foil
electrolytic copper
laminate
circuit board
printed circuit
Prior art date
Application number
PH12015501174A
Other versions
PH12015501174B1 (en
Inventor
Kohiki Michiya
Inukai Kenji
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12015501174A1 publication Critical patent/PH12015501174A1/en
Publication of PH12015501174B1 publication Critical patent/PH12015501174B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Abstract

Provided are a surface-treated electrolytic copper foil, a laminate, and a printed circuit board with which increased fineness of pitch is possible and for which the reliability of resin adherence is excellent. A surface-treated electrolytic copper foil for which the roughness (Rz) of the roughened surface of the copper foil measured using a stylus-type roughness meter is 2.0 mm or less and the kurtosis (Sku) of the roughness curve of the roughened surface is 2-4.
PH12015501174A 2012-11-26 2015-05-26 Surface-treated electrolytic copper foil, laminate, and printed circuit board PH12015501174B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012257896 2012-11-26
PCT/JP2013/081806 WO2014081041A1 (en) 2012-11-26 2013-11-26 Surface-treated electrolytic copper foil, laminate, and printed circuit board

Publications (2)

Publication Number Publication Date
PH12015501174A1 true PH12015501174A1 (en) 2015-08-10
PH12015501174B1 PH12015501174B1 (en) 2015-08-10

Family

ID=50776215

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501174A PH12015501174B1 (en) 2012-11-26 2015-05-26 Surface-treated electrolytic copper foil, laminate, and printed circuit board

Country Status (7)

Country Link
JP (1) JP5710845B2 (en)
KR (2) KR20140124402A (en)
CN (1) CN104812945B (en)
MY (1) MY176308A (en)
PH (1) PH12015501174B1 (en)
TW (1) TWI509111B (en)
WO (1) WO2014081041A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107614760B (en) * 2015-07-03 2018-07-13 三井金属矿业株式会社 Roughening treatment copper foil, copper-clad laminated board and printed circuit board
CN107923047B (en) * 2015-07-29 2020-05-01 纳美仕有限公司 Roughened copper foil, copper-clad laminate, and printed wiring board
TWI732892B (en) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 Laminate board for see-through electrode, see-through electrode material, component, and method for manufacturing laminate board for see-through electrode
KR102274906B1 (en) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 Copper foil and copper clad laminate having the same
KR101734840B1 (en) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 Electrolytic copper foil of secondary battery enhanced for flexibility resistance and manufacturing method thereof
JP2018172782A (en) 2017-03-31 2018-11-08 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, laminate, method for producing printed wiring board and method for producing electronic apparatus
JP7356209B2 (en) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices
CN110546313A (en) * 2017-04-25 2019-12-06 古河电气工业株式会社 Surface treated copper foil
KR20200118144A (en) 2018-03-30 2020-10-14 미쓰이금속광업주식회사 Copper clad laminate
KR102342125B1 (en) * 2018-04-10 2021-12-22 디아이씨 가부시끼가이샤 Composite structure and its manufacturing method
JP6606317B1 (en) * 2018-04-25 2019-11-13 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
JP7032239B2 (en) * 2018-05-28 2022-03-08 古河電気工業株式会社 Lead frame material and its manufacturing method and semiconductor package
JP6895936B2 (en) * 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
CN113795615A (en) * 2019-06-07 2021-12-14 古河电气工业株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
JP7392996B2 (en) 2019-06-19 2023-12-06 金居開發股▲分▼有限公司 Advanced electrolytic copper foil and copper-clad laminates using it
TWM608774U (en) * 2019-06-19 2021-03-11 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
TWI697574B (en) 2019-11-27 2020-07-01 長春石油化學股份有限公司 Electrolytic copper foil and electrode and lithium-ion battery comprising the same
US20230164924A1 (en) * 2020-03-30 2023-05-25 Mitsubishi Materials Corporation Bonded body and insulating circuit board
WO2021251288A1 (en) * 2020-06-11 2021-12-16 三井金属鉱業株式会社 Double-sided copper-clad laminate
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4567360B2 (en) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 Copper foil manufacturing method and copper foil obtained by the manufacturing method
JP5129642B2 (en) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
JP5215631B2 (en) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 Surface treated copper foil
TWI434965B (en) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
KR101288641B1 (en) * 2008-11-25 2013-07-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed circuit
JP5282675B2 (en) * 2009-06-23 2013-09-04 日立電線株式会社 Copper foil for printed wiring board and method for producing the same
JP5885054B2 (en) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
JP5634103B2 (en) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
CN103154327A (en) * 2010-10-06 2013-06-12 古河电气工业株式会社 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
WO2012101985A1 (en) * 2011-01-26 2012-08-02 住友ベークライト株式会社 Printed wiring board and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
KR102078897B1 (en) 2020-02-19
CN104812945A (en) 2015-07-29
TW201428139A (en) 2014-07-16
KR20170002705A (en) 2017-01-06
JPWO2014081041A1 (en) 2017-01-05
KR20140124402A (en) 2014-10-24
JP5710845B2 (en) 2015-04-30
TWI509111B (en) 2015-11-21
WO2014081041A1 (en) 2014-05-30
PH12015501174B1 (en) 2015-08-10
CN104812945B (en) 2018-08-28
MY176308A (en) 2020-07-28

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