PH12015501129A1 - Carrier-attached copper foil - Google Patents

Carrier-attached copper foil

Info

Publication number
PH12015501129A1
PH12015501129A1 PH12015501129A PH12015501129A PH12015501129A1 PH 12015501129 A1 PH12015501129 A1 PH 12015501129A1 PH 12015501129 A PH12015501129 A PH 12015501129A PH 12015501129 A PH12015501129 A PH 12015501129A PH 12015501129 A1 PH12015501129 A1 PH 12015501129A1
Authority
PH
Philippines
Prior art keywords
carrier
copper foil
roughness
attached copper
layer
Prior art date
Application number
PH12015501129A
Inventor
Kohiki Michiya
Nagaura Tomota
Sakaguchi Kazuhiko
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2012271613A external-priority patent/JP5286443B1/en
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12015501129A1 publication Critical patent/PH12015501129A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Provided is a copper foil with carrier that is suitable for fine pitch formation. The copper foil with carrier is equipped with, in the following order, a carrier, a release layer, an ultra thin copper layer, and an optional resin layer. The average value of the roughness (Rz) of the surface of the ultra thin copper layer as measured in accordance with JIS B0601-1982 using a contact roughness meter is at most 1.5mm, and the standard deviation of the roughness (Rz) is at most 0.1mm.
PH12015501129A 2012-11-20 2015-05-20 Carrier-attached copper foil PH12015501129A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012254793 2012-11-20
JP2012271613A JP5286443B1 (en) 2012-11-20 2012-12-12 Copper foil with carrier
JP2013187783 2013-09-10
PCT/JP2013/081327 WO2014080959A1 (en) 2012-11-20 2013-11-20 Copper foil with carrier

Publications (1)

Publication Number Publication Date
PH12015501129A1 true PH12015501129A1 (en) 2015-08-03

Family

ID=50776138

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015501129A PH12015501129A1 (en) 2012-11-20 2015-05-20 Carrier-attached copper foil

Country Status (6)

Country Link
JP (1) JP2015078422A (en)
KR (4) KR101954051B1 (en)
CN (4) CN108277509A (en)
PH (1) PH12015501129A1 (en)
TW (1) TWI504504B (en)
WO (1) WO2014080959A1 (en)

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JP5746402B2 (en) * 2013-06-13 2015-07-08 Jx日鉱日石金属株式会社 Copper foil with carrier, copper-clad laminate, printed wiring board, electronic device, and method for manufacturing printed wiring board
CN107926121B (en) 2015-08-11 2021-04-30 昭和电工材料株式会社 Method for manufacturing multilayer printed wiring board, metal foil with adhesive layer, metal-clad laminate, and multilayer printed wiring board
JP2017035843A (en) * 2015-08-11 2017-02-16 日立化成株式会社 Metal foil with adhesive layer, metal clad laminate and multilayer printed board using the same
JP6204430B2 (en) * 2015-09-24 2017-09-27 Ｊｘ金属株式会社 Metal foil, metal foil with release layer, laminate, printed wiring board, semiconductor package, electronic device and method for manufacturing printed wiring board
CN106544709B (en) * 2016-11-03 2019-04-05 山东金宝电子股份有限公司 A kind of process of surface treatment improving electrolytic copper foil high-temp antioxidizing performance
CN106757181B (en) * 2016-11-16 2019-04-16 山东金宝电子股份有限公司 A kind of preparation method of ultra-thin carrier copper foil
CN106757245B (en) * 2016-11-16 2019-05-21 山东金宝电子股份有限公司 A kind of process of surface treatment of melanism copper foil
JP7356209B2 (en) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices
WO2019131093A1 (en) * 2017-12-26 2019-07-04 Ｊｘ金属株式会社 Copper foil for heat dissipation and heat dissipation member
KR102302184B1 (en) * 2018-02-01 2021-09-13 에스케이넥실리스 주식회사 Copper Film With Dimensional Stability And Texture Stability At High Temperature, And Manufacturing Methods Thereof
CN110079840A (en) * 2019-04-26 2019-08-02 山东金宝电子股份有限公司 A kind of surface treatment additive package improving copper foil high-temp antioxidizing performance
CN112226790B (en) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 Production method of ultrathin high-strength electronic copper foil
TWI748769B (en) * 2020-11-27 2021-12-01 臻鼎科技股份有限公司 Polymer dispersion, method for manufacturing the polymer dispersion, and polymer composite film and its application
CN112792339A (en) * 2020-12-23 2021-05-14 东莞市新饰界材料科技有限公司 Preparation method of tungsten alloy sheet
KR20230160790A (en) * 2021-03-25 2023-11-24 나믹스 가부시끼가이샤 Method for manufacturing laminates
CN113286439A (en) * 2021-07-22 2021-08-20 深圳市志金电子有限公司 Method for manufacturing electroplated circuit board with built-in lead

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JP3977790B2 (en) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 Manufacturing method of ultra-thin copper foil with carrier, ultra-thin copper foil manufactured by the manufacturing method, printed wiring board using the ultra-thin copper foil, multilayer printed wiring board, chip-on-film wiring board
CN100515167C (en) * 2004-02-17 2009-07-15 日矿金属株式会社 Copper foil having blackened surface or layer
JP4570070B2 (en) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil provided with resin layer for forming insulating layer, copper-clad laminate, printed wiring board, method for producing multilayer copper-clad laminate, and method for producing printed wiring board
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KR20130067313A (en) * 2010-11-15 2013-06-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Electrolytic copper foil
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Also Published As

Publication number Publication date
WO2014080959A1 (en) 2014-05-30
CN110863221A (en) 2020-03-06
KR20190103452A (en) 2019-09-04
KR102015838B1 (en) 2019-08-29
CN104812944A (en) 2015-07-29
CN108277509A (en) 2018-07-13
KR101954051B1 (en) 2019-03-05
KR20150086541A (en) 2015-07-28
CN104812944B (en) 2019-02-19
TWI504504B (en) 2015-10-21
KR20190025739A (en) 2019-03-11
CN110117799A (en) 2019-08-13
JP2015078422A (en) 2015-04-23
TW201434622A (en) 2014-09-16
KR102051787B1 (en) 2019-12-03
KR20160145198A (en) 2016-12-19

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