PH12015500529A1 - Carrier-attached copper foil - Google Patents

Carrier-attached copper foil

Info

Publication number
PH12015500529A1
PH12015500529A1 PH12015500529A PH12015500529A PH12015500529A1 PH 12015500529 A1 PH12015500529 A1 PH 12015500529A1 PH 12015500529 A PH12015500529 A PH 12015500529A PH 12015500529 A PH12015500529 A PH 12015500529A PH 12015500529 A1 PH12015500529 A1 PH 12015500529A1
Authority
PH
Philippines
Prior art keywords
carrier
copper foil
attached copper
layer
copper
Prior art date
Application number
PH12015500529A
Other versions
PH12015500529B1 (en
Inventor
Kohiki Michiya
Nagaura Tomota
Sakaguchi Kazuhiko
Chiba Toru
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50278311&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PH12015500529(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12015500529B1 publication Critical patent/PH12015500529B1/en
Publication of PH12015500529A1 publication Critical patent/PH12015500529A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Abstract

Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper layer layered onto the release layer; wherein the very thin copper layer has been roughened and the Rz of the very thin copper layer surface is 1.6 mm or less as measured with a non-contact roughness meter.
PH12015500529A 2012-09-11 2015-03-11 Carrier-attached copper foil PH12015500529A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2012200017 2012-09-11
JP2012200973 2012-09-12
JP2012280024 2012-12-21
JP2013012468A JP5481577B1 (en) 2012-09-11 2013-01-25 Copper foil with carrier
PCT/JP2013/074585 WO2014042201A1 (en) 2012-09-11 2013-09-11 Copper foil provided with carrier

Publications (2)

Publication Number Publication Date
PH12015500529B1 PH12015500529B1 (en) 2015-04-27
PH12015500529A1 true PH12015500529A1 (en) 2015-04-27

Family

ID=50278311

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12015500529A PH12015500529A1 (en) 2012-09-11 2015-03-11 Carrier-attached copper foil

Country Status (7)

Country Link
JP (1) JP5481577B1 (en)
KR (2) KR102050646B1 (en)
CN (4) CN109379858A (en)
MY (2) MY188679A (en)
PH (1) PH12015500529A1 (en)
TW (2) TWI575120B (en)
WO (1) WO2014042201A1 (en)

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CN108277509A (en) * 2012-11-20 2018-07-13 Jx日矿日石金属株式会社 Copper foil with carrier
CN107031143A (en) * 2013-03-04 2017-08-11 Jx日矿日石金属株式会社 Copper foil with carrier, the manufacture method using its copper-cover laminated plate, printing distributing board, e-machine and printing distributing board
TWI613940B (en) * 2014-03-31 2018-02-01 Jx Nippon Mining & Metals Corp Copper foil with printed carrier, printed wiring board, laminated body, electronic device, and printed wiring board manufacturing method
JP2015205481A (en) * 2014-04-22 2015-11-19 Jx日鉱日石金属株式会社 Copper foil with carrier, copper-clad laminate, printed wiring board, electronic apparatus and manufacturing method of printed wiring board
JP6591766B2 (en) * 2014-04-24 2019-10-16 Ｊｘ金属株式会社 Copper foil with carrier, printed wiring board, laminate, electronic device and method for manufacturing printed wiring board
JP6297011B2 (en) * 2014-08-28 2018-03-20 株式会社有沢製作所 Three-layer flexible metal-clad laminate and double-sided three-layer flexible metal-clad laminate
CN105050331B (en) * 2015-07-07 2016-09-07 安徽铜冠铜箔有限公司 A kind of manufacture method of the high roughness electronics Copper Foil for ceramic base high-frequency copper-clad plate
JP6782561B2 (en) * 2015-07-16 2020-11-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
CN109072472B (en) * 2016-04-14 2020-10-16 三井金属矿业株式会社 Surface-treated copper foil, copper foil with carrier, and copper-clad laminate and printed wiring board manufacturing method using same
WO2018198982A1 (en) * 2017-04-27 2018-11-01 京セラ株式会社 Circuit board and light-emitting device provided with same
CN110800118B (en) 2017-06-29 2022-10-28 京瓷株式会社 Circuit board and light-emitting device provided with same
US10711360B2 (en) * 2017-07-14 2020-07-14 Rohm And Haas Electronic Materials Llc Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel
KR20200118144A (en) 2018-03-30 2020-10-14 미쓰이금속광업주식회사 Copper clad laminate
KR102098475B1 (en) 2018-07-06 2020-04-07 주식회사 포스코 A Manufacturing Method of Surface-treated Zn-Ni Alloy Electroplated Steel Sheet Having Excellent Corrosion Resistivity and Paintability
JP6895936B2 (en) * 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
TWI740515B (en) 2019-12-23 2021-09-21 長春人造樹脂廠股份有限公司 Liquid crystal polymer film and laminate comprising the same
TWI697549B (en) * 2019-12-23 2020-07-01 長春人造樹脂廠股份有限公司 Liquid crystal polymer film and laminate comprising the same
US20230164924A1 (en) * 2020-03-30 2023-05-25 Mitsubishi Materials Corporation Bonded body and insulating circuit board
CN112226790B (en) * 2020-10-19 2022-04-22 九江德福科技股份有限公司 Production method of ultrathin high-strength electronic copper foil
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2022244826A1 (en) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
KR20240017841A (en) * 2021-06-03 2024-02-08 미쓰이금속광업주식회사 Roughened copper foil, copper clad laminate and printed wiring board
EP4362611A1 (en) * 2021-06-24 2024-05-01 Kyocera Corporation Wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
TWI781818B (en) 2021-11-05 2022-10-21 長春石油化學股份有限公司 Surface-treated copper foil and copper clad laminate

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JP4087369B2 (en) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 Ultra-thin copper foil with carrier and printed wiring board
WO2005079130A1 (en) * 2004-02-17 2005-08-25 Nippon Mining & Metals Co., Ltd. Copper foil having blackened surface or layer
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JP4429979B2 (en) 2005-06-29 2010-03-10 古河電気工業株式会社 Ultra-thin copper foil with carrier and method for producing ultra-thin copper foil with carrier
JP2007314855A (en) * 2006-05-29 2007-12-06 Furukawa Circuit Foil Kk Ultra-thin copper foil provided with carrier, copper-clad laminate and printed circuit board
JP4157898B2 (en) * 2006-10-02 2008-10-01 株式会社神戸製鋼所 Copper alloy sheet for electrical and electronic parts with excellent press punchability
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KR101351928B1 (en) * 2007-12-28 2014-01-21 일진머티리얼즈 주식회사 Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same
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JP2010236072A (en) * 2009-03-31 2010-10-21 Nippon Mining & Metals Co Ltd Stacked copper foil and method for manufacturing the same
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JP2010006071A (en) 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board
JP5356968B2 (en) * 2009-09-30 2013-12-04 Ｊｘ日鉱日石金属株式会社 Sn plating film and composite material having the same
JP2011116074A (en) * 2009-12-07 2011-06-16 Jx Nippon Mining & Metals Corp Metal foil equipped with electric resistance film and board for printed circuit using the metal foil
CN103154327A (en) * 2010-10-06 2013-06-12 古河电气工业株式会社 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
CN102452197B (en) * 2010-10-21 2014-08-20 财团法人工业技术研究院 Foil-attached copper foil and method for producing same
WO2012101985A1 (en) * 2011-01-26 2012-08-02 住友ベークライト株式会社 Printed wiring board and method for manufacturing printed wiring board
JP2012167297A (en) * 2011-02-09 2012-09-06 Jfe Steel Corp Electrogalvanized steel plate

Also Published As

Publication number Publication date
JP5481577B1 (en) 2014-04-23
CN104619889A (en) 2015-05-13
KR102050646B1 (en) 2019-11-29
TW201533280A (en) 2015-09-01
CN109379858A (en) 2019-02-22
CN108588766B (en) 2020-02-18
MY167704A (en) 2018-09-21
TWI504788B (en) 2015-10-21
KR101766554B1 (en) 2017-08-08
KR20170046822A (en) 2017-05-02
JP2014139336A (en) 2014-07-31
CN107641820A (en) 2018-01-30
PH12015500529B1 (en) 2015-04-27
CN104619889B (en) 2018-10-09
KR20150052315A (en) 2015-05-13
TWI575120B (en) 2017-03-21
TW201428144A (en) 2014-07-16
WO2014042201A1 (en) 2014-03-20
MY188679A (en) 2021-12-22
CN108588766A (en) 2018-09-28

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