MY167704A - Copper foil provided with carrier - Google Patents
Copper foil provided with carrierInfo
- Publication number
- MY167704A MY167704A MYPI2015000601A MYPI2015000601A MY167704A MY 167704 A MY167704 A MY 167704A MY PI2015000601 A MYPI2015000601 A MY PI2015000601A MY PI2015000601 A MYPI2015000601 A MY PI2015000601A MY 167704 A MY167704 A MY 167704A
- Authority
- MY
- Malaysia
- Prior art keywords
- carrier
- copper foil
- foil provided
- copper
- foil
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012200017 | 2012-09-11 | ||
JP2012200973 | 2012-09-12 | ||
JP2012280024 | 2012-12-21 | ||
JP2013012468A JP5481577B1 (en) | 2012-09-11 | 2013-01-25 | Copper foil with carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
MY167704A true MY167704A (en) | 2018-09-21 |
Family
ID=50278311
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018701007A MY188679A (en) | 2012-09-11 | 2013-09-11 | Copper foil provided with carrier |
MYPI2015000601A MY167704A (en) | 2012-09-11 | 2013-09-11 | Copper foil provided with carrier |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018701007A MY188679A (en) | 2012-09-11 | 2013-09-11 | Copper foil provided with carrier |
Country Status (7)
Country | Link |
---|---|
JP (1) | JP5481577B1 (en) |
KR (2) | KR102050646B1 (en) |
CN (4) | CN109379858A (en) |
MY (2) | MY188679A (en) |
PH (1) | PH12015500529A1 (en) |
TW (2) | TWI575120B (en) |
WO (1) | WO2014042201A1 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108277509A (en) * | 2012-11-20 | 2018-07-13 | Jx日矿日石金属株式会社 | Copper foil with carrier |
CN107031143A (en) * | 2013-03-04 | 2017-08-11 | Jx日矿日石金属株式会社 | Copper foil with carrier, the manufacture method using its copper-cover laminated plate, printing distributing board, e-machine and printing distributing board |
TWI613940B (en) * | 2014-03-31 | 2018-02-01 | Jx Nippon Mining & Metals Corp | Copper foil with printed carrier, printed wiring board, laminated body, electronic device, and printed wiring board manufacturing method |
JP2015205481A (en) * | 2014-04-22 | 2015-11-19 | Jx日鉱日石金属株式会社 | Copper foil with carrier, copper-clad laminate, printed wiring board, electronic apparatus and manufacturing method of printed wiring board |
JP6591766B2 (en) * | 2014-04-24 | 2019-10-16 | Jx金属株式会社 | Copper foil with carrier, printed wiring board, laminate, electronic device and method for manufacturing printed wiring board |
JP6297011B2 (en) * | 2014-08-28 | 2018-03-20 | 株式会社有沢製作所 | Three-layer flexible metal-clad laminate and double-sided three-layer flexible metal-clad laminate |
CN105050331B (en) * | 2015-07-07 | 2016-09-07 | 安徽铜冠铜箔有限公司 | A kind of manufacture method of the high roughness electronics Copper Foil for ceramic base high-frequency copper-clad plate |
JP6782561B2 (en) * | 2015-07-16 | 2020-11-11 | Jx金属株式会社 | Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment |
CN109072472B (en) * | 2016-04-14 | 2020-10-16 | 三井金属矿业株式会社 | Surface-treated copper foil, copper foil with carrier, and copper-clad laminate and printed wiring board manufacturing method using same |
WO2018198982A1 (en) * | 2017-04-27 | 2018-11-01 | 京セラ株式会社 | Circuit board and light-emitting device provided with same |
CN110800118B (en) | 2017-06-29 | 2022-10-28 | 京瓷株式会社 | Circuit board and light-emitting device provided with same |
US10711360B2 (en) * | 2017-07-14 | 2020-07-14 | Rohm And Haas Electronic Materials Llc | Nickel electroplating compositions with copolymers of arginine and bisepoxides and methods of electroplating nickel |
KR20200118144A (en) | 2018-03-30 | 2020-10-14 | 미쓰이금속광업주식회사 | Copper clad laminate |
KR102098475B1 (en) | 2018-07-06 | 2020-04-07 | 주식회사 포스코 | A Manufacturing Method of Surface-treated Zn-Ni Alloy Electroplated Steel Sheet Having Excellent Corrosion Resistivity and Paintability |
JP6895936B2 (en) * | 2018-09-28 | 2021-06-30 | 古河電気工業株式会社 | Surface-treated copper foil, and copper-clad laminates and circuit boards using this |
US10581081B1 (en) * | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
TWI740515B (en) | 2019-12-23 | 2021-09-21 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
TWI697549B (en) * | 2019-12-23 | 2020-07-01 | 長春人造樹脂廠股份有限公司 | Liquid crystal polymer film and laminate comprising the same |
US20230164924A1 (en) * | 2020-03-30 | 2023-05-25 | Mitsubishi Materials Corporation | Bonded body and insulating circuit board |
CN112226790B (en) * | 2020-10-19 | 2022-04-22 | 九江德福科技股份有限公司 | Production method of ultrathin high-strength electronic copper foil |
WO2022153580A1 (en) * | 2021-01-15 | 2022-07-21 | Jx金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
WO2022244826A1 (en) * | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board |
KR20240017841A (en) * | 2021-06-03 | 2024-02-08 | 미쓰이금속광업주식회사 | Roughened copper foil, copper clad laminate and printed wiring board |
EP4362611A1 (en) * | 2021-06-24 | 2024-05-01 | Kyocera Corporation | Wiring board |
WO2023281759A1 (en) * | 2021-07-09 | 2023-01-12 | Jx金属株式会社 | Surface-treated copper foil, copper-clad laminate, and printed wiring board |
TWI781818B (en) | 2021-11-05 | 2022-10-21 | 長春石油化學股份有限公司 | Surface-treated copper foil and copper clad laminate |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2536095B2 (en) * | 1988-10-20 | 1996-09-18 | 日立化成工業株式会社 | Manufacturing method of wiring board |
TW595280B (en) * | 2000-04-25 | 2004-06-21 | Nippon Denkai Kk | Copper foil for TAB tape carrier, TAB tape carrier using the copper foil and TAB carrier tape |
US7026059B2 (en) * | 2000-09-22 | 2006-04-11 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine printed wiring boad |
JP2002134858A (en) * | 2000-10-25 | 2002-05-10 | Hitachi Cable Ltd | Copper foil for printed boards |
WO2004005588A1 (en) | 2002-07-04 | 2004-01-15 | Mitsui Mining & Smelting Co.,Ltd. | Electrolytic copper foil with carrier foil |
JP2005008955A (en) * | 2003-06-19 | 2005-01-13 | Hitachi Cable Ltd | Surface treatment method for copper foil |
JP4087369B2 (en) * | 2003-11-11 | 2008-05-21 | 古河サーキットフォイル株式会社 | Ultra-thin copper foil with carrier and printed wiring board |
WO2005079130A1 (en) * | 2004-02-17 | 2005-08-25 | Nippon Mining & Metals Co., Ltd. | Copper foil having blackened surface or layer |
JP4567360B2 (en) * | 2004-04-02 | 2010-10-20 | 三井金属鉱業株式会社 | Copper foil manufacturing method and copper foil obtained by the manufacturing method |
JP4429979B2 (en) | 2005-06-29 | 2010-03-10 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and method for producing ultra-thin copper foil with carrier |
JP2007314855A (en) * | 2006-05-29 | 2007-12-06 | Furukawa Circuit Foil Kk | Ultra-thin copper foil provided with carrier, copper-clad laminate and printed circuit board |
JP4157898B2 (en) * | 2006-10-02 | 2008-10-01 | 株式会社神戸製鋼所 | Copper alloy sheet for electrical and electronic parts with excellent press punchability |
CN101636527B (en) * | 2007-03-15 | 2011-11-09 | 日矿金属株式会社 | Copper electrolyte solution and two-layer flexible substrate obtained by using the same |
JP5129642B2 (en) * | 2007-04-19 | 2013-01-30 | 三井金属鉱業株式会社 | Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate |
US8877348B2 (en) * | 2007-10-31 | 2014-11-04 | Jfe Steel Corporation | Surface-treated steel sheet and resin-coated steel sheet |
KR101351928B1 (en) * | 2007-12-28 | 2014-01-21 | 일진머티리얼즈 주식회사 | Copper foil attached to the carrier foil, a method for preparing the same and printed circuit board using the same |
TWI499690B (en) * | 2009-03-13 | 2015-09-11 | Ajinomoto Kk | Paste metal laminates |
JP2010236072A (en) * | 2009-03-31 | 2010-10-21 | Nippon Mining & Metals Co Ltd | Stacked copper foil and method for manufacturing the same |
JP5282675B2 (en) * | 2009-06-23 | 2013-09-04 | 日立電線株式会社 | Copper foil for printed wiring board and method for producing the same |
JP2010006071A (en) | 2009-08-21 | 2010-01-14 | Furukawa Electric Co Ltd:The | Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board |
JP5356968B2 (en) * | 2009-09-30 | 2013-12-04 | Jx日鉱日石金属株式会社 | Sn plating film and composite material having the same |
JP2011116074A (en) * | 2009-12-07 | 2011-06-16 | Jx Nippon Mining & Metals Corp | Metal foil equipped with electric resistance film and board for printed circuit using the metal foil |
CN103154327A (en) * | 2010-10-06 | 2013-06-12 | 古河电气工业株式会社 | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
CN102452197B (en) * | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | Foil-attached copper foil and method for producing same |
WO2012101985A1 (en) * | 2011-01-26 | 2012-08-02 | 住友ベークライト株式会社 | Printed wiring board and method for manufacturing printed wiring board |
JP2012167297A (en) * | 2011-02-09 | 2012-09-06 | Jfe Steel Corp | Electrogalvanized steel plate |
-
2013
- 2013-01-25 JP JP2013012468A patent/JP5481577B1/en active Active
- 2013-09-11 TW TW104115834A patent/TWI575120B/en active
- 2013-09-11 CN CN201811088181.2A patent/CN109379858A/en active Pending
- 2013-09-11 TW TW102132911A patent/TWI504788B/en active
- 2013-09-11 CN CN201380046519.7A patent/CN104619889B/en active Active
- 2013-09-11 MY MYPI2018701007A patent/MY188679A/en unknown
- 2013-09-11 CN CN201810371406.9A patent/CN108588766B/en active Active
- 2013-09-11 CN CN201710739142.3A patent/CN107641820A/en active Pending
- 2013-09-11 KR KR1020177011125A patent/KR102050646B1/en active IP Right Grant
- 2013-09-11 MY MYPI2015000601A patent/MY167704A/en unknown
- 2013-09-11 KR KR1020157009363A patent/KR101766554B1/en active IP Right Grant
- 2013-09-11 WO PCT/JP2013/074585 patent/WO2014042201A1/en active Application Filing
-
2015
- 2015-03-11 PH PH12015500529A patent/PH12015500529A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP5481577B1 (en) | 2014-04-23 |
CN104619889A (en) | 2015-05-13 |
KR102050646B1 (en) | 2019-11-29 |
TW201533280A (en) | 2015-09-01 |
CN109379858A (en) | 2019-02-22 |
CN108588766B (en) | 2020-02-18 |
TWI504788B (en) | 2015-10-21 |
KR101766554B1 (en) | 2017-08-08 |
KR20170046822A (en) | 2017-05-02 |
JP2014139336A (en) | 2014-07-31 |
CN107641820A (en) | 2018-01-30 |
PH12015500529B1 (en) | 2015-04-27 |
CN104619889B (en) | 2018-10-09 |
PH12015500529A1 (en) | 2015-04-27 |
KR20150052315A (en) | 2015-05-13 |
TWI575120B (en) | 2017-03-21 |
TW201428144A (en) | 2014-07-16 |
WO2014042201A1 (en) | 2014-03-20 |
MY188679A (en) | 2021-12-22 |
CN108588766A (en) | 2018-09-28 |
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