PH12015501163A1 - Copper foil with carrier - Google Patents
Copper foil with carrierInfo
- Publication number
- PH12015501163A1 PH12015501163A1 PH12015501163A PH12015501163A PH12015501163A1 PH 12015501163 A1 PH12015501163 A1 PH 12015501163A1 PH 12015501163 A PH12015501163 A PH 12015501163A PH 12015501163 A PH12015501163 A PH 12015501163A PH 12015501163 A1 PH12015501163 A1 PH 12015501163A1
- Authority
- PH
- Philippines
- Prior art keywords
- carrier
- copper foil
- layer
- copper
- foil
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/04—Electroplating: Baths therefor from solutions of chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
Abstract
A copper foil with a carrier is provided. Said copper foil with a carrier makes it possible to form microscopic wiring with an L/S smaller than 20 mm/20 mm, e.g. 15 mm/15 mm. This copper foil with a carrier has the following, in this order: a copper-foil carrier, an intermediate layer, and an ultrathin copper layer. The intermediate layer contains nickel. If this copper foil with a carrier is heated for two hours at 220oC and the ultrathin copper layer is then separated in accordance with JIS C 6471, the amount of nickel on the intermediate-layer-side surface of the ultrathin copper layer is between 5 and 300 mg/dm2, inclusive.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012263841 | 2012-11-30 | ||
JP2012271631A JP5481553B1 (en) | 2012-11-30 | 2012-12-12 | Copper foil with carrier |
PCT/JP2013/082283 WO2014084385A1 (en) | 2012-11-30 | 2013-11-29 | Copper foil with carrier |
Publications (1)
Publication Number | Publication Date |
---|---|
PH12015501163A1 true PH12015501163A1 (en) | 2015-08-10 |
Family
ID=50749981
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PH12015501163A PH12015501163A1 (en) | 2012-11-30 | 2015-05-25 | Copper foil with carrier |
Country Status (7)
Country | Link |
---|---|
JP (2) | JP5481553B1 (en) |
KR (1) | KR101797333B1 (en) |
CN (1) | CN104822525B (en) |
MY (1) | MY171825A (en) |
PH (1) | PH12015501163A1 (en) |
TW (1) | TWI503456B (en) |
WO (1) | WO2014084385A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105189829B (en) * | 2013-06-13 | 2018-06-01 | Jx日矿日石金属株式会社 | The copper foil of appendix body, copper-cover laminated plate, printed circuit board (PCB), the manufacturing method of e-machine and printed circuit board (PCB) |
JP2016050364A (en) * | 2014-08-29 | 2016-04-11 | Jx金属株式会社 | Copper foil with carrier, copper-clad laminate, printed wiring board, electronic device, and laminate, and methods for manufacturing copper foil with carrier, copper-clad laminate, and printed wiring board |
JP6509608B2 (en) * | 2015-03-30 | 2019-05-08 | Jx金属株式会社 | Carrier-coated copper foil, laminate, printed wiring board, electronic device, and method of manufacturing printed wiring board |
US10383222B2 (en) | 2016-01-04 | 2019-08-13 | Jx Nippon Mining & Metals Corporation | Surface-treated copper foil |
JP6854114B2 (en) * | 2016-01-04 | 2021-04-07 | Jx金属株式会社 | Surface-treated copper foil |
US20230072120A1 (en) * | 2020-02-04 | 2023-03-09 | Mitsui Mining & Smelting Co., Ltd. | Metal foil with carrier |
CN113386417A (en) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | Copper-clad plate and preparation method thereof |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4672907B2 (en) * | 2001-06-04 | 2011-04-20 | Jx日鉱日石金属株式会社 | Composite copper foil provided with copper or copper alloy support and printed circuit board using the composite copper foil |
JP4612978B2 (en) * | 2001-09-20 | 2011-01-12 | 日本電解株式会社 | Composite copper foil and method for producing the same |
JP3854207B2 (en) * | 2002-09-06 | 2006-12-06 | 日鉱金属株式会社 | Composite copper foil provided with copper or copper alloy support and printed circuit board using the composite copper foil |
JP4955263B2 (en) * | 2004-12-15 | 2012-06-20 | イビデン株式会社 | Printed wiring board |
CN101646301B (en) * | 2004-12-15 | 2011-09-07 | 揖斐电株式会社 | Printed wiring board |
JP4429979B2 (en) * | 2005-06-29 | 2010-03-10 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and method for producing ultra-thin copper foil with carrier |
JP4829647B2 (en) * | 2006-03-10 | 2011-12-07 | 三菱瓦斯化学株式会社 | Printed wiring board and manufacturing method thereof |
US8512873B2 (en) * | 2008-07-22 | 2013-08-20 | Furukawa Electric Co., Ltd. | Surface treated copper foil and copper clad laminate |
JP2010006071A (en) * | 2009-08-21 | 2010-01-14 | Furukawa Electric Co Ltd:The | Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board |
JP5165773B2 (en) * | 2011-02-10 | 2013-03-21 | フリージア・マクロス株式会社 | Metal foil with carrier and method for producing laminated substrate using the same |
WO2012132578A1 (en) * | 2011-03-29 | 2012-10-04 | Jx日鉱日石金属株式会社 | Copper foil with copper carrier, method for producing same, copper foil for electronic circuit, method for producing same, and method for forming electronic circuit |
WO2012132572A1 (en) * | 2011-03-30 | 2012-10-04 | Jx日鉱日石金属株式会社 | Copper foil with copper carrier, method for producing said copper foil, copper foil for electronic circuit, method for producing said copper foil, and method for forming electronic circuit |
-
2012
- 2012-12-12 JP JP2012271631A patent/JP5481553B1/en active Active
-
2013
- 2013-09-20 JP JP2013195804A patent/JP2014128967A/en active Pending
- 2013-11-29 TW TW102143728A patent/TWI503456B/en active
- 2013-11-29 WO PCT/JP2013/082283 patent/WO2014084385A1/en active Application Filing
- 2013-11-29 CN CN201380062754.3A patent/CN104822525B/en active Active
- 2013-11-29 KR KR1020157015151A patent/KR101797333B1/en active IP Right Grant
- 2013-11-29 MY MYPI2015701635A patent/MY171825A/en unknown
-
2015
- 2015-05-25 PH PH12015501163A patent/PH12015501163A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN104822525B (en) | 2017-08-11 |
KR20150084924A (en) | 2015-07-22 |
JP2014128967A (en) | 2014-07-10 |
WO2014084385A1 (en) | 2014-06-05 |
JP2014129555A (en) | 2014-07-10 |
KR101797333B1 (en) | 2017-11-13 |
CN104822525A (en) | 2015-08-05 |
MY171825A (en) | 2019-10-31 |
TWI503456B (en) | 2015-10-11 |
JP5481553B1 (en) | 2014-04-23 |
TW201435155A (en) | 2014-09-16 |
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