MY171825A - Copper foil with carrier - Google Patents

Copper foil with carrier

Info

Publication number
MY171825A
MY171825A MYPI2015701635A MYPI2015701635A MY171825A MY 171825 A MY171825 A MY 171825A MY PI2015701635 A MYPI2015701635 A MY PI2015701635A MY PI2015701635 A MYPI2015701635 A MY PI2015701635A MY 171825 A MY171825 A MY 171825A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
intermediate layer
copper
lis
Prior art date
Application number
MYPI2015701635A
Inventor
Tomota Nagaura
Michiya Kohiki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY171825A publication Critical patent/MY171825A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/04—Electroplating: Baths therefor from solutions of chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

There is provided a copper foil with carrier allowing formation of finer wiring than LIS = 20 ?m/20 ?m, for example, fine wiring of LIS = 15 ?m/15 ?m. A copper foil with carrier, comprising: a copper foil carrier; an intermediate layer laminated on or over the copper foil carrier; and an ultrathin copper layer laminated on or over the intermediate layer, wherein the intermediate layer comprises Ni, and when the ultrathin copper layer is peeled according to JIS C 6471 after the copper foil with carrier is heated at 220?c for 2 hours, a depositing amount of Ni on a surface of the intermediate layer side of the ultrathin copper layer is 5 ?g/dm2 or more and 300 ?g/dm2 or less.
MYPI2015701635A 2012-11-30 2013-11-29 Copper foil with carrier MY171825A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012263841 2012-11-30
JP2012271631A JP5481553B1 (en) 2012-11-30 2012-12-12 Copper foil with carrier

Publications (1)

Publication Number Publication Date
MY171825A true MY171825A (en) 2019-10-31

Family

ID=50749981

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015701635A MY171825A (en) 2012-11-30 2013-11-29 Copper foil with carrier

Country Status (7)

Country Link
JP (2) JP5481553B1 (en)
KR (1) KR101797333B1 (en)
CN (1) CN104822525B (en)
MY (1) MY171825A (en)
PH (1) PH12015501163A1 (en)
TW (1) TWI503456B (en)
WO (1) WO2014084385A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101762049B1 (en) * 2013-06-13 2017-07-26 제이엑스금속주식회사 Copper foil with carrier, copper-clad laminate, printed wiring board, electronic device, and production method for printed wiring board
JP2016050364A (en) * 2014-08-29 2016-04-11 Ｊｘ金属株式会社 Copper foil with carrier, copper-clad laminate, printed wiring board, electronic device, and laminate, and methods for manufacturing copper foil with carrier, copper-clad laminate, and printed wiring board
JP6509608B2 (en) * 2015-03-30 2019-05-08 Ｊｘ金属株式会社 Carrier-coated copper foil, laminate, printed wiring board, electronic device, and method of manufacturing printed wiring board
JP6854114B2 (en) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 Surface-treated copper foil
US10383222B2 (en) 2016-01-04 2019-08-13 Jx Nippon Mining & Metals Corporation Surface-treated copper foil
WO2021157373A1 (en) * 2020-02-04 2021-08-12 三井金属鉱業株式会社 Metal foil with carrier
CN113386417A (en) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 Copper-clad plate and preparation method thereof

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4672907B2 (en) * 2001-06-04 2011-04-20 Ｊｘ日鉱日石金属株式会社 Composite copper foil provided with copper or copper alloy support and printed circuit board using the composite copper foil
JP4612978B2 (en) * 2001-09-20 2011-01-12 日本電解株式会社 Composite copper foil and method for producing the same
JP3854207B2 (en) * 2002-09-06 2006-12-06 日鉱金属株式会社 Composite copper foil provided with copper or copper alloy support and printed circuit board using the composite copper foil
JP4955263B2 (en) * 2004-12-15 2012-06-20 イビデン株式会社 Printed wiring board
CN100556228C (en) * 2004-12-15 2009-10-28 揖斐电株式会社 Printed circuit board (PCB)
JP4429979B2 (en) * 2005-06-29 2010-03-10 古河電気工業株式会社 Ultra-thin copper foil with carrier and method for producing ultra-thin copper foil with carrier
JP4829647B2 (en) * 2006-03-10 2011-12-07 三菱瓦斯化学株式会社 Printed wiring board and manufacturing method thereof
US8512873B2 (en) * 2008-07-22 2013-08-20 Furukawa Electric Co., Ltd. Surface treated copper foil and copper clad laminate
JP2010006071A (en) * 2009-08-21 2010-01-14 Furukawa Electric Co Ltd:The Surface treatment copper foil, extremely thin copper foil with carrier, flexible copper clad laminate, and polyimide based flexible printed wiring board
JP5165773B2 (en) * 2011-02-10 2013-03-21 フリージア・マクロス株式会社 Metal foil with carrier and method for producing laminated substrate using the same
WO2012132578A1 (en) * 2011-03-29 2012-10-04 Jx日鉱日石金属株式会社 Copper foil with copper carrier, method for producing same, copper foil for electronic circuit, method for producing same, and method for forming electronic circuit
WO2012132572A1 (en) * 2011-03-30 2012-10-04 Jx日鉱日石金属株式会社 Copper foil with copper carrier, method for producing said copper foil, copper foil for electronic circuit, method for producing said copper foil, and method for forming electronic circuit

Also Published As

Publication number Publication date
PH12015501163A1 (en) 2015-08-10
JP2014128967A (en) 2014-07-10
TW201435155A (en) 2014-09-16
KR101797333B1 (en) 2017-11-13
JP2014129555A (en) 2014-07-10
CN104822525B (en) 2017-08-11
KR20150084924A (en) 2015-07-22
CN104822525A (en) 2015-08-05
JP5481553B1 (en) 2014-04-23
TWI503456B (en) 2015-10-11
WO2014084385A1 (en) 2014-06-05

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