JP4612978B2 - Composite copper foil and method for producing the same - Google Patents
Composite copper foil and method for producing the same Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は銅張積層板、プリント配線板に用いられる極薄銅箔を提供するための複合銅箔及びその製造方法に関し、より詳細には支持体銅箔と極薄銅箔の間に、剥離層を設けることにより、樹脂基材積層後の支持体銅箔の剥離強度を安定させた複合銅箔及びその製造方法に関する。
【０００２】
【従来の技術】
近年、電子機器の小型化、軽量化に伴いプリント配線板も高密度化が要求されている。この動きに伴い、使用される銅箔も薄くなる傾向にあり、高密度プリント配線板の製造には厚さが１２μｍ以下の薄い銅箔が使用されている。
しかし厚さが１２μｍ以下の薄い銅箔はシワが生じたり、箔が切れたりし易いので製造及び使用時に極めて慎重さが要求され、ハンドリング性の改善が望まれている。
このような問題点を改善するため、支持体銅箔に極薄銅箔を設けた複合銅箔が提案されている（特公昭５３−１８３２９号公報：複合箔及びその製法）。
【０００３】
前記した複合銅箔は、極薄銅箔側が樹脂基材に接触するようにして樹脂基材と重ねて加熱、加圧積層した後、支持体銅箔を剥離して極薄銅張積層板とされる。この複合銅箔では、極薄銅箔と支持体銅箔との間に、剥離層として金属酸化物皮膜が設けられており、この層を介して剥離するものである。しかしながら、積層時、支持体銅箔と極薄銅箔間が加熱されることにより密着性が急激に上昇し、著しい場合は剥離不可能となり、支持体銅箔が極薄銅箔側に残留してしまったり、もしくは極薄銅箔が破損し、ピンホールとなってしまう等、高密度プリント配線板の製造に対して実用上の問題があった。
【０００４】
【発明が解決しようとする課題】
本発明の目的は、複合銅箔の極薄銅箔側に樹脂基材を重ねて加熱、加圧により積層した後、支持体銅箔を剥離するとき、加熱温度による剥離強度の変化が小さく、樹脂基材と積層後に支持体銅箔が容易に剥離し、剥離強度が安定している複合銅箔を提供することにある。
本発明の他の目的は、上記の複合銅箔の好適な製造方法、上記の複合銅箔を用いた銅張積層板及びプリント配線板を提供することにある。
【０００５】
【課題を解決するための手段】
本発明は、支持体銅箔と極薄銅箔との間に、Ｃｕ−Ｎｉ−Ｍｏ合金からなる剥離層を有する複合銅箔に関する。
【０００６】
本発明はまた、支持体銅箔上に、めっきによりＣｕ−Ｎｉ−Ｍｏ合金層からなる剥離層を形成し、次いで剥離層上にめっきにより極薄銅箔を形成することを特徴とする複合銅箔の製造方法に関する。
【０００７】
本発明はまた、本発明の複合銅箔と樹脂基材とを、極薄銅箔を樹脂基材に接触させて積層成形した後、複合銅箔から支持体銅箔を機械的に剥離することを特徴とする銅張積層板の製造方法に関する。
本発明はまた、上記の複合銅箔を用いた銅張積層板及びプリント配線板に関する。
【０００８】
【発明の実施の形態】
本発明において、支持体銅箔は、例えば、圧延銅箔、電解銅箔に代表されるがその材質、表面形状について限定はない。支持体銅箔の選択は、主にプリント配線板形成の段階で要求される極薄銅箔の形状に基づいて決定される。極薄銅箔と樹脂基材との接着強度を重視するならば、粗さの大きい表面形状のものを選択する。また、ファインラインの形成を重視するならば、粗さの小さい表面形状のものを選択する。このため、支持体銅箔としては電解銅箔が好ましく用いられる。電解銅箔の表面は、粗さの異なるＭ面（非光沢面）とＳ面（光沢面）があり、いずれかを選択することができる。また、必要ならば両面に適用してもよい。支持体銅箔の厚さはハンドリング性の点から１０〜１５０μｍのものが好ましく用いられ、１５〜１００μｍのものがより好ましく用いられる。また、支持体銅箔は適切な前処理によってその表面が清浄化されていることが好ましい。
【０００９】
本発明において、剥離層は、支持体銅箔と極薄銅箔を機械的に分離するための層であり、Ｃｕ−Ｎｉ−Ｍｏ合金からなる層が用いられる。
剥離層のＣｕ−Ｎｉ−Ｍｏ合金のＣｕ含有量は、１００〜５００，０００μｇ／ｄｍ２が好ましく、１，０００〜５０，０００μｇ／ｄｍ２がより好ましく、Ｎｉ含有量は１０〜１０，０００μｇ／ｄｍ２が好ましく、１００〜１，０００μｇ／ｄｍ２がより好ましく、Ｍｏ含有量は５〜８００μｇ／ｄｍ２が好ましく、５０〜４００μｇ／ｄｍ２がより好ましい。
Ｃｕ含有量が１００μｇ／ｄｍ２未満であるとピンホールが発生し、剥離強度が不安定になる傾向があり、５００，０００μｇ／ｄｍ２を超えると生産性が低下する傾向がある。Ｎｉ含有量が１０μｇ／ｄｍ２未満であると剥離強度が上昇する傾向があり、１０，０００μｇ／ｄｍ２を超えるとエッチング性が低下する傾向がある。Ｍｏ含有量が５μｇ／ｄｍ２未満であると剥離強度が上昇し、剥離強度が温度により不安定になる傾向があり、８００μｇ／ｄｍ２を超えると剥離強度が小さくなり過ぎる傾向がある。
また、剥離層の厚さは、０．００１〜５μｍが好ましく、０．０１〜０．５μｍがより好ましい。剥離層の厚さが０．００１μｍ未満であるとピンホールが発生し、剥離強度が不安定になる傾向があり、５μｍを超えると生産性が悪化する傾向がある。
剥離層のＣｕ−Ｎｉ−Ｍｏ合金の合金組成は、Ｃｕは７０〜９９．８９重量％が好ましく、８５〜９８．９重量％がより好ましく、Ｎｉは０．１〜１５重量％が好ましく、１．０〜８．０重量％がより好ましく、Ｍｏは０．０１〜１５重量％が好ましく、０．１〜７．０重量％がより好ましい。
上記のＣｕ、Ｎｉ及びＭｏの含有量は、ＩＣＰ（誘導結合プラズマ発光分析装置）分析で測定した値である。また、Ｃｕ、Ｎｉ及びＭｏが合金化されていることはＥＳＣＡ（Ｘ線光電子分析装置）分析により確認した。
【００１０】
支持体銅箔上に、めっきによりＣｕ−Ｎｉ−Ｍｏ合金層からなる剥離層を形成する。好ましくはＣｕ塩、Ｎｉ塩、Ｍｏ塩及びクエン酸塩を含む水溶液からの陰極処理でこれらの金属の合金皮膜を形成する。剥離強度は、めっき液組成、電解処理の電流密度、時間、ｐＨなどによって皮膜の厚さを変えることにより調整可能である。
剥離層の形成に用いられるめっき液としては、硫酸銅・五水和物（濃度が好ましくは、０．６〜２４０ｇ／ｌ、より好ましくは、６〜１２０ｇ／ｌ）、硫酸ニッケル・六水和物（濃度が好ましくは、０．１〜４０ｇ／ｌ、より好ましくは、１〜２０ｇ／ｌ）、モリブデン酸ナトリウム・二水和物（濃度が好ましくは、０．１〜４０ｇ／ｌ、より好ましくは、１〜２０ｇ／ｌ）及びクエン酸三ナトリウム・二水和物（濃度が好ましくは、１〜４００ｇ／ｌ、より好ましくは、１０〜２００ｇ／ｌ）を含有するめっき液が好ましく用いられる。
めっき液のｐＨは、好ましくは３〜８、より好ましくは４〜７とし、めっき時間は、好ましくは０．１〜１，０００秒、より好ましくは１〜５００秒とし、電流密度は、好ましくは０．１〜１６Ａ／ｄｍ２、より好ましくは０．４〜８Ａ／ｄｍ２とし、液温は好ましくは１０〜６０℃、より好ましくは２５〜４５℃とする。
【００１１】
極薄銅箔は剥離層上に電着される。銅を電着する方法については制限はなく、一般的には硫酸銅浴もしくはピロリン酸銅浴が好適である。なお、極薄銅箔とは厚さが９μｍ以下であり、好ましくは１〜５μｍのものをいう。
極薄銅箔と樹脂基材との接着力を強化するための、銅又は銅合金等による電着粗化処理などや、更に極薄銅箔の耐酸化性、耐薬品性、耐熱性などを向上させるためのクロム、亜鉛、ニッケル、コバルト、モリブデン、シランカップリング剤等による防錆処理などの表面処理を行ってもよい。また、エポキシ樹脂層等を積層して樹脂付複合銅箔とすることもできる。
【００１２】
【実施例】
以下、本発明を実施例に基づいて詳細に説明するが、本発明はこれに限定されるものではない。
実施例１
厚さ３５μｍの電解銅箔を支持体銅箔として、その光沢面（Ｓ面、表面粗さＲａ０．２μｍ）を３０ｇ／ｌ硫酸に２０秒間浸漬することにより酸洗浄した後、２０秒間水洗した。
次いで、ＣｕＳＯ４・５Ｈ２Ｏ：６ｇ／ｌ、ＮｉＳＯ４・６Ｈ２Ｏ：１ｇ／ｌ、Ｎａ２ＭｏＯ４・２Ｈ２Ｏ：１ｇ／ｌ、Ｃ６Ｈ５Ｎａ３Ｏ７・２Ｈ２Ｏ：１０ｇ／ｌからなるＣｕ−Ｎｉ−Ｍｏ合金めっき浴で、温度：３５℃、ｐＨ：５．０、電流密度：０．４Ａ／ｄｍ２、処理時間：５００秒の条件でめっきを行い、光沢面上にＣｕ−Ｎｉ−Ｍｏ合金の剥離層を形成した後、２０秒間水洗した。Ｃｕ−Ｎｉ−Ｍｏ合金層厚さ：０．４９μｍ、Ｃｕ含有量：４３，０００μｇ／ｄｍ２、Ｃｕ含有率：９８．３ｗｔ％、Ｎｉ含有量：６２０μｇ／ｄｍ２、Ｎｉ含有率：１．４ｗｔ％、Ｍｏ含有量：１１０μｇ／ｄｍ２、Ｍｏ含有率：０．３ｗｔ％であった。
この剥離層を形成した支持体銅箔を２０秒間水洗した後、ＣｕＳＯ４・５Ｈ２Ｏ：１３５ｇ／ｌ、Ｈ２ＳＯ４：１００ｇ／ｌの硫酸銅浴で、温度：４０℃、電流密度：３．５Ａ／ｄｍ２、処理時間：３００秒の条件で厚さ３．９μｍの銅めっきを行い、極薄銅箔層を形成した後、２０秒間水洗した。
更にこの極薄銅箔層の表面に対し、公知の硫酸銅めっき浴を用いて厚さ１．０μｍの電着微細銅粗化処理を施し水洗した後、粗化処理が施された極薄銅箔の表面に公知の方法でクロメートの防錆処理を施し、水洗乾燥して複合銅箔を得た。
この複合銅箔の極薄銅箔側をガラスエポキシプリプレグ（ＦＲ−４基材）に重ね、温度１７０℃、圧力３０ｋＮ／ｍ２、６０分間積層し、銅張積層板を得た。
また、この複合銅箔をガラスエポキシプリプレグ（ＦＲ−５基材）に重ね、温度２００℃、圧力３０ｋＮ／ｍ２、６０分間積層し、銅張積層板を得た。
支持体銅箔と極薄銅箔間の積層前剥離強度、積層後剥離強度（１７０℃、６０分及び２００℃、６０分）をＪＩＳ−Ｃ−６４８１に準拠して測定した結果を表３に示す。ＦＲ−４基材及びＦＲ−５基材に積層した剥離強度はいずれも０．０２ｋＮ／ｍであり容易に剥離できた。
【００１３】
実施例２〜６及び比較例１〜５
剥離層の形成を表１に示す条件で行った他は、実施例１と同様の支持体銅箔に剥離層、極薄銅箔層、粗化処理層、防錆処理層の順に各層を形成し、複合銅箔を得た。なお、実施例６では使用する銅箔支持体の被めっき面はＭ面とした。
【００１４】
表３に支持体銅箔と極薄銅箔間の剥離強度の測定結果を示す。
【００１５】
【表１】
【表２】
【表３】
【００１８】
【発明の効果】
本発明の複合銅箔は加熱温度によって剥離強度が変化しないため、積層の温度条件を変えても剥離強度が安定している。また、剥離強度が任意に設定可能で、穴あけ時バリ発生防止に有効である。
さらに、支持体銅箔が極薄銅箔側に残留したり、もしくは極薄銅箔が破損し、ピンホールとなってしまう等の実用上の問題がなく、極薄銅張積層板の製造、ひいては高密度プリント配線板の製造においてその有用性は明白である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a copper clad laminate, a composite copper foil for providing an ultrathin copper foil for use in a printed wiring board, and a method for producing the same, and more particularly, between a support copper foil and an ultrathin copper foil. The present invention relates to a composite copper foil in which the peel strength of a support copper foil after lamination of a resin base material is stabilized by providing a layer, and a method for producing the same.
[0002]
[Prior art]
In recent years, with the miniaturization and weight reduction of electronic devices, printed wiring boards are also required to have high density. Along with this movement, the copper foil used tends to be thin, and a thin copper foil having a thickness of 12 μm or less is used for manufacturing a high-density printed wiring board.
However, since a thin copper foil having a thickness of 12 μm or less is likely to be wrinkled or to be cut off, it is required to be extremely careful during manufacture and use, and improvement in handling properties is desired.
In order to improve such problems, a composite copper foil in which an ultrathin copper foil is provided on a support copper foil has been proposed (Japanese Examined Patent Publication No. 53-18329: composite foil and its manufacturing method).
[0003]
The composite copper foil described above is laminated with the resin base material so that the ultra-thin copper foil side is in contact with the resin base material, and after heating and pressure laminating, the support copper foil is peeled off and the ultra-thin copper-clad laminate and Is done. In this composite copper foil, a metal oxide film is provided as a peeling layer between the ultrathin copper foil and the support copper foil, and peeling is performed via this layer. However, during lamination, the adhesion between the support copper foil and the ultrathin copper foil is rapidly increased, and in the case of remarkable, peeling becomes impossible and the support copper foil remains on the ultrathin copper foil side. There have been practical problems for the production of high-density printed wiring boards, such as pinholes or broken ultrathin copper foils, resulting in pinholes.
[0004]
[Problems to be solved by the invention]
The purpose of the present invention is to superpose a resin base on the ultrathin copper foil side of the composite copper foil, and after laminating by heating and pressing, when peeling the support copper foil, the change in peel strength due to heating temperature is small, An object of the present invention is to provide a composite copper foil in which the support copper foil is easily peeled off after being laminated with the resin base material and the peel strength is stable.
Another object of the present invention is to provide a suitable method for producing the composite copper foil, a copper-clad laminate using the composite copper foil, and a printed wiring board.
[0005]
[Means for Solving the Problems]
The present invention relates to a composite copper foil having a release layer made of a Cu-Ni-Mo alloy between a support copper foil and an ultrathin copper foil.
[0006]
The present invention also provides a composite copper characterized in that a release layer composed of a Cu-Ni-Mo alloy layer is formed on a support copper foil by plating, and then an ultrathin copper foil is formed on the release layer by plating. The present invention relates to a method for manufacturing a foil.
[0007]
In the present invention, the composite copper foil of the present invention and the resin base material are laminated and formed by bringing the ultrathin copper foil into contact with the resin base material, and then the support copper foil is mechanically peeled from the composite copper foil. It is related with the manufacturing method of the copper clad laminated board characterized by these.
The present invention also relates to a copper clad laminate and a printed wiring board using the above composite copper foil.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, the support copper foil is represented by, for example, a rolled copper foil and an electrolytic copper foil, but there is no limitation on the material and the surface shape. The selection of the support copper foil is determined mainly based on the shape of the ultrathin copper foil required at the stage of forming the printed wiring board. If importance is attached to the adhesive strength between the ultrathin copper foil and the resin base material, a surface shape having a large roughness is selected. Further, if importance is attached to the formation of fine lines, a surface shape having a small roughness is selected. For this reason, electrolytic copper foil is preferably used as the support copper foil. The surface of the electrolytic copper foil has an M surface (non-glossy surface) and an S surface (glossy surface) with different roughness, and either one can be selected. Moreover, you may apply to both surfaces if necessary. The thickness of the support copper foil is preferably 10 to 150 μm, more preferably 15 to 100 μm, from the viewpoint of handling properties. Moreover, it is preferable that the surface of the support copper foil is cleaned by an appropriate pretreatment.
[0009]
In the present invention, the release layer is a layer for mechanically separating the support copper foil and the ultrathin copper foil, and a layer made of a Cu—Ni—Mo alloy is used.
Cu content of Cu-Ni-Mo alloy of the release layer is preferably 100~500,000μg / dm 2, more preferably 1,000~50,000μg / dm 2, Ni content 10～10,000Myug / dm 2 is preferred, more preferably 100~1,000μg / dm 2, Mo content is preferably 5~800μg / dm 2, 50~400μg / dm 2 is more preferable.
If the Cu content is less than 100 μg / dm 2 , pinholes are generated and the peel strength tends to become unstable, and if it exceeds 500,000 μg / dm 2 , the productivity tends to decrease. If the Ni content is less than 10 μg / dm 2 , the peel strength tends to increase, and if it exceeds 10,000 μg / dm 2 , the etching property tends to decrease. When the Mo content is less than 5 μg / dm 2 , the peel strength increases, and the peel strength tends to become unstable with temperature, and when it exceeds 800 μg / dm 2 , the peel strength tends to be too small.
Moreover, 0.001-5 micrometers is preferable and, as for the thickness of a peeling layer, 0.01-0.5 micrometer is more preferable. When the thickness of the release layer is less than 0.001 μm, pinholes are generated and the peel strength tends to become unstable, and when it exceeds 5 μm, the productivity tends to deteriorate.
The alloy composition of the Cu—Ni—Mo alloy of the release layer is preferably 70 to 99.89% by weight of Cu, more preferably 85 to 98.9% by weight, and preferably 0.1 to 15% by weight of Ni. 0.0 to 8.0% by weight is more preferable, and Mo is preferably 0.01 to 15% by weight, and more preferably 0.1 to 7.0% by weight.
The contents of Cu, Ni, and Mo are values measured by ICP (inductively coupled plasma emission spectrometer) analysis. Moreover, it was confirmed by ESCA (X-ray photoelectron analyzer) analysis that Cu, Ni and Mo were alloyed.
[0010]
A release layer composed of a Cu—Ni—Mo alloy layer is formed on the support copper foil by plating. Preferably, an alloy film of these metals is formed by cathodic treatment from an aqueous solution containing Cu salt, Ni salt, Mo salt and citrate. The peel strength can be adjusted by changing the thickness of the coating depending on the plating solution composition, the current density of the electrolytic treatment, time, pH, and the like.
As the plating solution used for forming the release layer, copper sulfate pentahydrate (concentration is preferably 0.6 to 240 g / l, more preferably 6 to 120 g / l), nickel sulfate hexahydrate. Product (concentration is preferably 0.1 to 40 g / l, more preferably 1 to 20 g / l), sodium molybdate dihydrate (concentration is preferably 0.1 to 40 g / l, more preferably Is a plating solution containing 1 to 20 g / l) and trisodium citrate dihydrate (concentration is preferably 1 to 400 g / l, more preferably 10 to 200 g / l).
The pH of the plating solution is preferably 3 to 8, more preferably 4 to 7, the plating time is preferably 0.1 to 1,000 seconds, more preferably 1 to 500 seconds, and the current density is preferably 0.1-16 A / dm < 2 >, More preferably, it is 0.4-8 A / dm < 2 >, A liquid temperature becomes like this. Preferably it is 10-60 degreeC, More preferably, it is 25-45 degreeC.
[0011]
The ultrathin copper foil is electrodeposited on the release layer. There is no restriction | limiting about the method of electrodepositing copper, Generally a copper sulfate bath or a copper pyrophosphate bath is suitable. The ultrathin copper foil has a thickness of 9 μm or less, preferably 1 to 5 μm.
Electrodeposition roughening treatment with copper or copper alloy, etc. to strengthen the adhesion between ultrathin copper foil and resin base material, and also the oxidation resistance, chemical resistance, heat resistance, etc. of ultrathin copper foil Surface treatment such as rust prevention treatment with chromium, zinc, nickel, cobalt, molybdenum, silane coupling agent or the like for improvement may be performed. Moreover, an epoxy resin layer etc. can be laminated | stacked and it can also be set as composite copper foil with resin.
[0012]
【Example】
EXAMPLES Hereinafter, although this invention is demonstrated in detail based on an Example, this invention is not limited to this.
Example 1
An electrolytic copper foil having a thickness of 35 μm was used as a support copper foil, and the glossy surface (S surface, surface roughness Ra 0.2 μm) was acid-washed by immersing it in 30 g / l sulfuric acid for 20 seconds, followed by washing with water for 20 seconds.
Next, CuSO 4 .5H 2 O: 6 g / l, NiSO 4 .6H 2 O: 1 g / l, Na 2 MoO 4 .2H 2 O: 1 g / l, C 6 H 5 Na 3 O 7 .2H 2 O: It is a Cu-Ni-Mo alloy plating bath composed of 10 g / l, plated under conditions of temperature: 35 ° C., pH: 5.0, current density: 0.4 A / dm 2 , and processing time: 500 seconds. A Cu—Ni—Mo alloy release layer was formed thereon, and then washed with water for 20 seconds. Cu—Ni—Mo alloy layer thickness: 0.49 μm, Cu content: 43,000 μg / dm 2 , Cu content: 98.3 wt%, Ni content: 620 μg / dm 2 , Ni content: 1.4 wt %, Mo content: 110 μg / dm 2 , and Mo content: 0.3 wt%.
The support copper foil on which the release layer was formed was washed with water for 20 seconds, and then a copper sulfate bath of CuSO 4 .5H 2 O: 135 g / l, H 2 SO 4 : 100 g / l, temperature: 40 ° C., current density: After carrying out copper plating with a thickness of 3.9 μm under the conditions of 3.5 A / dm 2 and processing time: 300 seconds to form an ultrathin copper foil layer, it was washed with water for 20 seconds.
Furthermore, the surface of this ultrathin copper foil layer was subjected to an electrodeposition fine copper roughening treatment having a thickness of 1.0 μm using a known copper sulfate plating bath, washed with water, and then subjected to the roughening treatment. The surface of the foil was subjected to rust prevention treatment of chromate by a known method, washed with water and dried to obtain a composite copper foil.
The ultrathin copper foil side of this composite copper foil was overlaid on a glass epoxy prepreg (FR-4 base material) and laminated at a temperature of 170 ° C. and a pressure of 30 kN / m 2 for 60 minutes to obtain a copper-clad laminate.
Moreover, this composite copper foil was laminated | stacked on the glass epoxy prepreg (FR-5 base material), the temperature of 200 degreeC, the pressure of 30 kN / m < 2 > were laminated | stacked for 60 minutes, and the copper clad laminated board was obtained.
Table 3 shows the results of measuring the peel strength before lamination between the support copper foil and the ultrathin copper foil and the peel strength after lamination (170 ° C., 60 minutes and 200 ° C., 60 minutes) in accordance with JIS-C-6481. Show. The peel strengths laminated on the FR-4 base material and the FR-5 base material were both 0.02 kN / m and could be easily peeled off.
[0013]
Examples 2-6 and Comparative Examples 1-5
Except that the release layer was formed under the conditions shown in Table 1, each layer was formed in the order of the release layer, the ultrathin copper foil layer, the roughening treatment layer, and the rust prevention treatment layer on the same support copper foil as in Example 1. As a result, a composite copper foil was obtained. In Example 6, the surface to be plated of the copper foil support used was an M surface.
[0014]
Table 3 shows the measurement results of the peel strength between the support copper foil and the ultrathin copper foil.
[0015]
[Table 1]
[Table 2]
[Table 3]
[0018]
【The invention's effect】
Since the peel strength of the composite copper foil of the present invention does not change depending on the heating temperature, the peel strength is stable even if the temperature condition of the lamination is changed. In addition, the peel strength can be set arbitrarily, which is effective for preventing the occurrence of burrs when drilling.
Furthermore, there is no practical problem such that the support copper foil remains on the ultrathin copper foil side, or the ultrathin copper foil is broken and becomes a pinhole, and the production of an ultrathin copper-clad laminate, As a result, its usefulness in the production of high-density printed wiring boards is obvious.
Claims (7)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104662206A (en) * | 2012-10-31 | 2015-05-27 | 古河电气工业株式会社 | Copper foil, negative electrode for non-aqueous electrolyte secondary cell, and non-aqueous electrolyte secondary cell |
| WO2020173574A1 (en) | 2019-02-28 | 2020-09-03 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
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|---|---|---|---|---|
| TW200609109A (en) | 2004-08-02 | 2006-03-16 | Nippon Denkai Ltd | Composite copper foil and method for production thereof |
| CN1984527B (en) * | 2005-12-15 | 2010-12-01 | 古河电气工业株式会社 | Ultrathin copper foil with carrier and printed circuit board |
| JP4927503B2 (en) | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and printed wiring board |
| JP4934409B2 (en) * | 2005-12-15 | 2012-05-16 | 古河電気工業株式会社 | Ultra-thin copper foil with carrier and printed wiring board |
| WO2012048460A1 (en) * | 2010-10-13 | 2012-04-19 | 大连理工大学 | Low resistivity high thermal-stability copper-nickel-molybdenum alloy film and producing method thereof |
| CN102452197B (en) | 2010-10-21 | 2014-08-20 | 财团法人工业技术研究院 | Foil-attached copper foil and method for producing same |
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| JP5481553B1 (en) * | 2012-11-30 | 2014-04-23 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
| JP5364838B1 (en) * | 2012-11-30 | 2013-12-11 | Ｊｘ日鉱日石金属株式会社 | Copper foil with carrier |
| CN105142897B (en) * | 2013-03-29 | 2018-09-28 | Jx日矿日石金属株式会社 | The manufacturing method of Copper foil with carrier, printing distributing board, copper-cover laminated plate, e-machine and printing distributing board |
| JP2018009237A (en) * | 2016-07-15 | 2018-01-18 | Ｊｘ金属株式会社 | Copper foil with carrier, method for producing copper foil with carrier, laminate, method for producing laminate, method for manufacturing printed wiring board and method for manufacturing electronic equipment |
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| JP2000309898A (en) * | 1999-04-23 | 2000-11-07 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil with carrier foil, production of the electrolytic copper foil and copper laminated sheet using the electrolytic copper foil |
| JP2001301087A (en) * | 2000-03-10 | 2001-10-30 | Olin Corp | Copper foil reinforced in low profile bonding |
| WO2002024444A1 (en) * | 2000-09-22 | 2002-03-28 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine wiring board |
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- 2001-09-20 JP JP2001286702A patent/JP4612978B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309898A (en) * | 1999-04-23 | 2000-11-07 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil with carrier foil, production of the electrolytic copper foil and copper laminated sheet using the electrolytic copper foil |
| JP2001301087A (en) * | 2000-03-10 | 2001-10-30 | Olin Corp | Copper foil reinforced in low profile bonding |
| WO2002024444A1 (en) * | 2000-09-22 | 2002-03-28 | Circuit Foil Japan Co., Ltd. | Copper foil for high-density ultrafine wiring board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104662206A (en) * | 2012-10-31 | 2015-05-27 | 古河电气工业株式会社 | Copper foil, negative electrode for non-aqueous electrolyte secondary cell, and non-aqueous electrolyte secondary cell |
| WO2020173574A1 (en) | 2019-02-28 | 2020-09-03 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
| US11639557B2 (en) | 2019-02-28 | 2023-05-02 | Circuit Foil Luxembourg | Composite copper foil and method of fabricating the same |
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| JP2003094553A (en) | 2003-04-03 |
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