MY187285A - Copper foil provided with carrier foil, copper clad laminate and printed wiring board - Google Patents

Copper foil provided with carrier foil, copper clad laminate and printed wiring board

Info

Publication number
MY187285A
MY187285A MYPI2016701883A MYPI2016701883A MY187285A MY 187285 A MY187285 A MY 187285A MY PI2016701883 A MYPI2016701883 A MY PI2016701883A MY PI2016701883 A MYPI2016701883 A MY PI2016701883A MY 187285 A MY187285 A MY 187285A
Authority
MY
Malaysia
Prior art keywords
foil
copper
carrier
copper foil
wiring board
Prior art date
Application number
MYPI2016701883A
Inventor
Tetsuhiro Matsunaga
Mitsuyoshi Matsuda
Akitoshi Takanashi
Nobuyuki Kawai
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY187285A publication Critical patent/MY187285A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Object is to provide a copper foil provided with a carrier foil (1) in which the carrier foil (2) can be easily released from the copper foil (3) even after the copper foil (3) is used for manufacturing of copper clad laminates loading temperature of 250?C or more. To achieve the object, employ a copper foil provided with a carrier foil (1) having a layer structure of carrier foil (2)/bonding interface layer (4)/copper foil (3) characterized in that an electrodeposited copper foil having tensile strength of 40 kgf/mm2 or more after heating at 250?C for 60 minutes is used as the carrier foil (2). (Figure 1)
MYPI2016701883A 2013-11-27 2014-11-21 Copper foil provided with carrier foil, copper clad laminate and printed wiring board MY187285A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013245256 2013-11-27
PCT/JP2014/080921 WO2015080052A1 (en) 2013-11-27 2014-11-21 Copper foil with attached carrier foil and copper-clad laminate

Publications (1)

Publication Number Publication Date
MY187285A true MY187285A (en) 2021-09-19

Family

ID=53198993

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016701883A MY187285A (en) 2013-11-27 2014-11-21 Copper foil provided with carrier foil, copper clad laminate and printed wiring board

Country Status (6)

Country Link
JP (2) JP6855164B2 (en)
KR (2) KR102272762B1 (en)
CN (1) CN105745360B (en)
MY (1) MY187285A (en)
TW (1) TWI644995B (en)
WO (1) WO2015080052A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6546526B2 (en) * 2015-12-25 2019-07-17 三井金属鉱業株式会社 Patent application title: Copper foil with carrier, laminate for coreless support, coreless support with wiring layer, and method for producing printed wiring board
CN107248591A (en) * 2017-06-14 2017-10-13 深圳先进技术研究院 Flexible all solid-state thin-film lithium battery and preparation method thereof
WO2020145003A1 (en) * 2019-01-11 2020-07-16 三井金属鉱業株式会社 Laminate body
US10697082B1 (en) * 2019-08-12 2020-06-30 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
CN113684506B (en) * 2021-08-30 2022-02-11 广东嘉元科技股份有限公司 Foil producing machine with edge tearing online winding device
WO2023189566A1 (en) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Metal foil with carrier, metal-clad laminate, and printed wiring board
WO2023189565A1 (en) * 2022-03-29 2023-10-05 三井金属鉱業株式会社 Carrier-attached metal foil, metal-clad laminate, and printed wiring board

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3466506B2 (en) 1999-04-23 2003-11-10 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing the electrolytic copper foil, and copper-clad laminate using the electrolytic copper foil
JP3370624B2 (en) * 1999-08-24 2003-01-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil
JP2001068804A (en) 1999-08-31 2001-03-16 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil and its manufacture, and copper plated laminate provided therewith
JP3670179B2 (en) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil
JP4073248B2 (en) 2002-05-14 2008-04-09 三井金属鉱業株式会社 Method for producing electrolytic copper foil with carrier foil for high temperature and heat resistance and electrolytic copper foil with carrier foil for high temperature and heat obtained by the production method
JP2005288856A (en) * 2004-03-31 2005-10-20 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminated sheet using electrolytic copper foil with carrier foil
JP2005307270A (en) * 2004-04-21 2005-11-04 Mitsui Mining & Smelting Co Ltd Carrier foil-fitted electrolytic copper foil and method for producing the carrier foil-fitted electrolytic copper foil
JP4065004B2 (en) * 2005-03-31 2008-03-19 三井金属鉱業株式会社 Electrolytic copper foil, surface-treated electrolytic copper foil obtained using the electrolytic copper foil, copper-clad laminate and printed wiring board using the surface-treated electrolytic copper foil
CN101146933B (en) * 2005-03-31 2010-11-24 三井金属矿业株式会社 Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed ci
TWI394659B (en) * 2005-07-27 2013-05-01 Nippon Steel Chemical Co Method for making high anti-flexion flexible copper clad laminate board
JP2007294923A (en) * 2006-03-31 2007-11-08 Nikko Kinzoku Kk Manufacturing method of copper strip or copper foil having excellent strength, electric conductivity, and bendability, and electronic component using the same
TW200804626A (en) * 2006-05-19 2008-01-16 Mitsui Mining & Smelting Co Copper foil provided with carrier sheet, method for fabricating copper foil provided with carrier sheet, surface-treated copper foil provided with carrier sheet, and copper-clad laminate using the surface-treated copper foil provided with carrier she
JP4777206B2 (en) * 2006-09-29 2011-09-21 新日鐵化学株式会社 Method for producing flexible copper-clad laminate
JP5588607B2 (en) * 2007-10-31 2014-09-10 三井金属鉱業株式会社 Electrolytic copper foil and method for producing the electrolytic copper foil
JP5379528B2 (en) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
WO2012002526A1 (en) * 2010-07-01 2012-01-05 三井金属鉱業株式会社 Electrodeposited copper foil and process for production thereof

Also Published As

Publication number Publication date
WO2015080052A1 (en) 2015-06-04
JP6784806B2 (en) 2020-11-11
JP6855164B2 (en) 2021-04-07
KR20210037020A (en) 2021-04-05
CN105745360B (en) 2017-12-08
KR102272762B1 (en) 2021-07-05
JPWO2015080052A1 (en) 2017-03-16
TW201536876A (en) 2015-10-01
KR102356179B1 (en) 2022-02-08
JP2019178431A (en) 2019-10-17
KR20160090818A (en) 2016-08-01
TWI644995B (en) 2018-12-21
CN105745360A (en) 2016-07-06

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