PH12017502362A1 - Roughened copper foil, copper-clad laminate and printed wiring board - Google Patents

Roughened copper foil, copper-clad laminate and printed wiring board

Info

Publication number
PH12017502362A1
PH12017502362A1 PH12017502362A PH12017502362A PH12017502362A1 PH 12017502362 A1 PH12017502362 A1 PH 12017502362A1 PH 12017502362 A PH12017502362 A PH 12017502362A PH 12017502362 A PH12017502362 A PH 12017502362A PH 12017502362 A1 PH12017502362 A1 PH 12017502362A1
Authority
PH
Philippines
Prior art keywords
roughened
copper
printed wiring
copper foil
wiring board
Prior art date
Application number
PH12017502362A
Other versions
PH12017502362B1 (en
Inventor
Shinichi Obata
Ayumu Tateoka
Kazuhiro Yoshikawa
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of PH12017502362B1 publication Critical patent/PH12017502362B1/en
Publication of PH12017502362A1 publication Critical patent/PH12017502362A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

Provided is a roughened copper foil with which both microcircuit formation (particularly circuit linearity) and close adhesion to resin can be achieved in processing of copper-clad laminates and manufacturing of printed wiring boards. This roughened copper foil has a roughened surface on at least one side, and for said roughened surface, Sa x Spd, which is the product of the arithmetic mean height Sa (mm) and the density of peaks Spd (peaks/mm2) that are measured according to ISO 25178, is at least 250000 mm/mm2, and the arithmetic mean waviness Wa measured according to JIS B0601-2001 is 0.030-0.060 mm.
PH12017502362A 2015-07-03 2017-12-19 Roughened copper foil, copper-clad laminate and printed wiring board PH12017502362A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015134707 2015-07-03
PCT/JP2016/067972 WO2017006739A1 (en) 2015-07-03 2016-06-16 Roughened copper foil, copper-clad laminate and printed wiring board

Publications (2)

Publication Number Publication Date
PH12017502362B1 PH12017502362B1 (en) 2018-06-25
PH12017502362A1 true PH12017502362A1 (en) 2018-06-25

Family

ID=57686211

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12017502362A PH12017502362A1 (en) 2015-07-03 2017-12-19 Roughened copper foil, copper-clad laminate and printed wiring board

Country Status (7)

Country Link
JP (1) JP6193534B2 (en)
KR (1) KR101895745B1 (en)
CN (1) CN107614760B (en)
MY (1) MY177676A (en)
PH (1) PH12017502362A1 (en)
TW (1) TWI630289B (en)
WO (1) WO2017006739A1 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102338103B1 (en) * 2016-04-14 2021-12-10 미쓰이금속광업주식회사 Surface-treated copper foil, copper foil provided with carrier, copper clad laminate using them, and manufacturing method of a printed wiring board
JP6824004B2 (en) 2016-11-09 2021-02-03 株式会社クボタ Casting product with an alumina barrier layer on the surface and its manufacturing method
CN110382745B (en) * 2017-05-19 2021-06-25 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
US20210115610A1 (en) * 2017-12-13 2021-04-22 Kuraray Co., Ltd. Printed napped sheet and napped sheet for printing
JP6400875B1 (en) * 2018-02-14 2018-10-03 住友化学株式会社 Laminate
EP3786318A4 (en) 2018-04-27 2022-04-27 JX Nippon Mining & Metals Corporation Surface-treated copper foil, copper clad laminate, and printed wiring board
KR102480377B1 (en) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
TWI668333B (en) * 2018-09-17 2019-08-11 金居開發股份有限公司 Micro-rough electrolytic copper foil and copper foil substrate
TWI669032B (en) 2018-09-26 2019-08-11 金居開發股份有限公司 Micro-rough electrolytic copper foil and copper foil substrate
JP7014695B2 (en) * 2018-10-18 2022-02-01 Ｊｘ金属株式会社 Conductive materials, molded products and electronic components
TWI695898B (en) * 2018-11-05 2020-06-11 金居開發股份有限公司 Micro-roughened electrolytic copper foil and copper clad laminate using the same
CN111194134B (en) * 2018-11-15 2021-11-02 金居开发股份有限公司 Electrolytic copper foil subjected to fine roughening treatment and copper-clad substrate using same
JP7453154B2 (en) 2018-11-19 2024-03-19 三井金属鉱業株式会社 Surface treated copper foil, copper foil with carrier, copper clad laminates and printed wiring boards
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
KR102585011B1 (en) * 2019-03-19 2023-10-04 타츠타 전선 주식회사 Shielded printed wiring board, manufacturing method of shielded printed wiring board, and connection member
TWM608774U (en) * 2019-06-19 2021-03-11 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
JP7270579B2 (en) * 2019-06-19 2023-05-10 金居開發股▲分▼有限公司 Micro-roughened electrodeposited copper foil and copper-clad laminate
JP2021021137A (en) * 2019-06-19 2021-02-18 金居開發股▲分▼有限公司 Advanced treated electrodeposited copper foil having long and island-shaped structures and copper clad laminate using the same
US11332839B2 (en) 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
JP7421208B2 (en) * 2019-12-24 2024-01-24 日本電解株式会社 Surface treated copper foil and its manufacturing method
KR20220106200A (en) * 2020-02-04 2022-07-28 미쓰이금속광업주식회사 Roughening process copper foil, copper foil provided with a carrier, copper clad laminated board, and printed wiring board
CN115038818A (en) * 2020-02-04 2022-09-09 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
US10991948B1 (en) * 2020-03-20 2021-04-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil for lithium-ion secondary batteries
KR102454686B1 (en) 2020-12-30 2022-10-13 에스케이씨 주식회사 Surface treated copper foil and circuit board including the same
KR102506594B1 (en) 2021-04-09 2023-03-03 에스케이씨 주식회사 Surface treated copper foil and circuit board including the same
WO2023281775A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281778A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate board, and printed wiring board
JPWO2023281777A1 (en) * 2021-07-09 2023-01-12
TW202302918A (en) * 2021-07-09 2023-01-16 日商Ｊｘ金屬股份有限公司 Surface-treated copper foil, copper-clad laminate and printed wiring board
WO2023281776A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board
CN117916553A (en) 2021-12-22 2024-04-19 三井金属矿业株式会社 Method for measuring surface parameters of copper foil, method for screening copper foil, and method for producing surface-treated copper foil

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004263296A (en) 2003-02-12 2004-09-24 Furukawa Techno Research Kk Copper foil for fine pattern printed circuit and manufacturing method therefor
TW200500199A (en) * 2003-02-12 2005-01-01 Furukawa Circuit Foil Copper foil for fine patterned printed circuits and method of production of same
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
CN100591809C (en) * 2007-01-25 2010-02-24 湖北中科铜箔科技有限公司 Electrolytic copper foil surface low-coarsing processing method
JP5129642B2 (en) 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
TWI434965B (en) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
WO2012046804A1 (en) * 2010-10-06 2012-04-12 古河電気工業株式会社 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
KR101593282B1 (en) * 2010-11-22 2016-02-11 미쓰이금속광업주식회사 Surface-treated copper foil
WO2014081041A1 (en) * 2012-11-26 2014-05-30 Jx日鉱日石金属株式会社 Surface-treated electrolytic copper foil, laminate, and printed circuit board
JP6353193B2 (en) * 2013-04-02 2018-07-04 Ｊｘ金属株式会社 Copper foil with carrier, method for producing a copper-clad laminate using the copper foil with carrier, method for producing a printed wiring board using the copper foil with carrier, and method for producing a printed wiring board
TWI515342B (en) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 Surface-treated copper foil, and copper clad laminate and printed wiring board obtained by using the same

Also Published As

Publication number Publication date
WO2017006739A1 (en) 2017-01-12
KR20170137932A (en) 2017-12-13
JP6193534B2 (en) 2017-09-06
TW201718948A (en) 2017-06-01
MY177676A (en) 2020-09-23
PH12017502362B1 (en) 2018-06-25
CN107614760B (en) 2018-07-13
TWI630289B (en) 2018-07-21
CN107614760A (en) 2018-01-19
JPWO2017006739A1 (en) 2017-09-07
KR101895745B1 (en) 2018-09-05

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