MY174931A - Ultrathin copper foil with carrier and method for manufacturing same - Google Patents
Ultrathin copper foil with carrier and method for manufacturing sameInfo
- Publication number
- MY174931A MY174931A MYPI2017702395A MYPI2017702395A MY174931A MY 174931 A MY174931 A MY 174931A MY PI2017702395 A MYPI2017702395 A MY PI2017702395A MY PI2017702395 A MYPI2017702395 A MY PI2017702395A MY 174931 A MY174931 A MY 174931A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- carrier
- extremely thin
- thin copper
- release layer
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
There is provided an extremely thin copper foil with a carrier which can simultaneously achieve the formability of microcircuits and laser machining in processing of a copper-clad laminate or production of a printed wiring board. The extremely thin copper foil with a carrier of the present invention includes a carrier foil, a release layer, and an extremely thin copper foil disposed in this order. The surface of the extremely thin copper foil on the side of the release layer has an average distance between the surface peaks (Peak spacing) of 20 ?m or less and the surface of the extremely thin copper foil on the opposite side of the release layer has a maximum height difference of waviness (Wmax) of 1.0 ?m or less. Most illustrative Drawing : Figure 1
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015010431 | 2015-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY174931A true MY174931A (en) | 2020-05-24 |
Family
ID=56417128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2017702395A MY174931A (en) | 2015-01-22 | 2016-01-20 | Ultrathin copper foil with carrier and method for manufacturing same |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP6352449B2 (en) |
KR (2) | KR102031065B1 (en) |
CN (2) | CN110072334B (en) |
MY (1) | MY174931A (en) |
TW (1) | TWI572747B (en) |
WO (1) | WO2016117587A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110832120B (en) | 2017-03-30 | 2022-01-11 | 古河电气工业株式会社 | Surface-treated copper foil, and copper-clad plate and printed circuit board using the same |
CN107454762A (en) * | 2017-09-14 | 2017-12-08 | 桐城市闲产网络服务有限公司 | A kind of preparation method of computer circuit board |
CN108323025B (en) * | 2018-02-01 | 2020-01-14 | 北京启创驿讯科技有限公司 | Preparation method of printed circuit board and copper foil for processing |
MY186454A (en) * | 2018-08-10 | 2021-07-22 | Mitsui Mining & Smelting Co Ltd | Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board |
CN109518131A (en) * | 2018-12-25 | 2019-03-26 | 胡旭日 | A kind of ultrathin copper foil with carrier, ultrathin copper foil production method and device |
JP7259093B2 (en) * | 2020-02-04 | 2023-04-17 | 三井金属鉱業株式会社 | Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board |
WO2021157363A1 (en) * | 2020-02-04 | 2021-08-12 | 三井金属鉱業株式会社 | Roughened copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board |
CN112795964B (en) * | 2020-12-07 | 2021-11-19 | 安徽铜冠铜箔集团股份有限公司 | Ultrathin strippable composite copper foil and preparation method thereof |
WO2022209990A1 (en) * | 2021-03-29 | 2022-10-06 | 三井金属鉱業株式会社 | Roughened copper foil, copper-clad laminate and printed wiring board |
CN117044412A (en) * | 2021-03-29 | 2023-11-10 | 三井金属矿业株式会社 | Roughened copper foil, copper-clad laminate and printed circuit board |
KR20240009404A (en) | 2021-05-20 | 2024-01-22 | 미쓰이금속광업주식회사 | Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board |
WO2022244828A1 (en) | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board |
WO2022244826A1 (en) | 2021-05-20 | 2022-11-24 | 三井金属鉱業株式会社 | Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board |
CN115233262B (en) * | 2022-08-01 | 2023-12-12 | 九江德福科技股份有限公司 | Preparation method of extra-thin copper foil with carrier |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY138743A (en) * | 1996-05-13 | 2009-07-31 | Mitsui Mining & Smelting Co | High tensile strength electrodeposited copper foil and the production process of the same |
JP3142270B2 (en) | 1998-04-01 | 2001-03-07 | 三井金属鉱業株式会社 | Manufacturing method of printed wiring board |
JP4298943B2 (en) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | Copper foil surface treatment agent |
JP2005048277A (en) * | 2003-07-15 | 2005-02-24 | Mitsui Mining & Smelting Co Ltd | Electrolytic copper foil with carrier foil, and manufacturing method therefor |
EP1531656A3 (en) * | 2003-11-11 | 2007-10-03 | Furukawa Circuit Foil Co., Ltd. | Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier |
JP4087369B2 (en) * | 2003-11-11 | 2008-05-21 | 古河サーキットフォイル株式会社 | Ultra-thin copper foil with carrier and printed wiring board |
TW200738913A (en) * | 2006-03-10 | 2007-10-16 | Mitsui Mining & Smelting Co | Surface treated elctrolytic copper foil and process for producing the same |
JP5256747B2 (en) * | 2008-01-21 | 2013-08-07 | 宇部興産株式会社 | Manufacturing method of copper wiring insulating film by semi-additive method, and copper wiring insulating film manufactured therefrom |
CN103154327A (en) * | 2010-10-06 | 2013-06-12 | 古河电气工业株式会社 | Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board |
JP5705381B2 (en) * | 2013-02-28 | 2015-04-22 | 三井金属鉱業株式会社 | Blackened surface-treated copper foil, method for producing blackened surface-treated copper foil, copper-clad laminate and flexible printed wiring board |
JP6403969B2 (en) * | 2013-03-29 | 2018-10-10 | Jx金属株式会社 | Copper foil with carrier, printed wiring board, copper-clad laminate, electronic device, and method for manufacturing printed wiring board |
-
2016
- 2016-01-20 KR KR1020187035876A patent/KR102031065B1/en active IP Right Grant
- 2016-01-20 CN CN201910236053.6A patent/CN110072334B/en active Active
- 2016-01-20 JP JP2016570671A patent/JP6352449B2/en active Active
- 2016-01-20 CN CN201680003775.1A patent/CN107002265B/en active Active
- 2016-01-20 MY MYPI2017702395A patent/MY174931A/en unknown
- 2016-01-20 WO PCT/JP2016/051526 patent/WO2016117587A1/en active Application Filing
- 2016-01-20 KR KR1020177009811A patent/KR101929844B1/en active IP Right Grant
- 2016-01-22 TW TW105102048A patent/TWI572747B/en active
-
2018
- 2018-05-30 JP JP2018103931A patent/JP6529640B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JPWO2016117587A1 (en) | 2017-07-06 |
CN107002265A (en) | 2017-08-01 |
TW201636457A (en) | 2016-10-16 |
KR20170057327A (en) | 2017-05-24 |
JP2018138702A (en) | 2018-09-06 |
CN107002265B (en) | 2019-04-26 |
KR20180135105A (en) | 2018-12-19 |
KR102031065B1 (en) | 2019-10-11 |
JP6529640B2 (en) | 2019-06-12 |
KR101929844B1 (en) | 2018-12-17 |
JP6352449B2 (en) | 2018-07-04 |
CN110072334A (en) | 2019-07-30 |
CN110072334B (en) | 2022-04-01 |
WO2016117587A1 (en) | 2016-07-28 |
TWI572747B (en) | 2017-03-01 |
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