PH12014502509A1 - Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board - Google Patents

Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Info

Publication number
PH12014502509A1
PH12014502509A1 PH12014502509A PH12014502509A PH12014502509A1 PH 12014502509 A1 PH12014502509 A1 PH 12014502509A1 PH 12014502509 A PH12014502509 A PH 12014502509A PH 12014502509 A PH12014502509 A PH 12014502509A PH 12014502509 A1 PH12014502509 A1 PH 12014502509A1
Authority
PH
Philippines
Prior art keywords
copper foil
wiring board
printed wiring
laminate
treated copper
Prior art date
Application number
PH12014502509A
Other versions
PH12014502509B1 (en
Inventor
Arai Hideta
Miki Atsushi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of PH12014502509B1 publication Critical patent/PH12014502509B1/en
Publication of PH12014502509A1 publication Critical patent/PH12014502509A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/12—Electroforming by electrophoresis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/12—Electroforming by electrophoresis
    • C25D1/14—Electroforming by electrophoresis of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Metal Rolling (AREA)

Abstract

Provided are: a surface-treated copper foil which can adhere satisfactorily to a resin and which has an advantage in that, when the foil has been removed by etching, the resulting resin exhibits high transparency; and a laminate using the foil. This surface-treated copper foil has roughening particles on the surface, said particles being formed by roughening treatment. In the surface-treated copper foil, the surface which has undergone roughening treatment exhibits a TD average roughness (Rz) of 0.20 to 0.80�m and an MD glossiness at 60�of 76 to 350 pcnt , and the A/B ratio is 1.90 to 2.40 [wherein A is the surface area of the roughening particles and B is the area of the roughening particles as observed in the planar view from the surface side of the copper foil.]
PH12014502509A 2012-05-11 2014-11-10 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board PH12014502509A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012122448 2012-05-11
JP2013003867 2013-01-11
JP2013008519A JP5475897B1 (en) 2012-05-11 2013-01-21 Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board
PCT/JP2013/062658 WO2013168646A1 (en) 2012-05-11 2013-04-30 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Publications (2)

Publication Number Publication Date
PH12014502509B1 PH12014502509B1 (en) 2014-12-22
PH12014502509A1 true PH12014502509A1 (en) 2014-12-22

Family

ID=49550688

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014502509A PH12014502509A1 (en) 2012-05-11 2014-11-10 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Country Status (7)

Country Link
JP (1) JP5475897B1 (en)
KR (2) KR101822325B1 (en)
CN (2) CN104271813B (en)
MY (2) MY194478A (en)
PH (1) PH12014502509A1 (en)
TW (1) TWI479036B (en)
WO (1) WO2013168646A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (en) * 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene using the same
JP5850720B2 (en) 2011-06-02 2016-02-03 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
US9255007B2 (en) 2011-06-02 2016-02-09 Jx Nippon Mining & Metals Corporation Copper foil for producing graphene and method of producing graphene using the same
JP5721609B2 (en) 2011-11-15 2015-05-20 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5885790B2 (en) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 Surface treated copper foil and laminated board using the same, copper foil with carrier, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board
JP5710737B1 (en) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 Surface-treated copper foil, laminated board, printed wiring board, printed circuit board, and electronic equipment
JP5756547B1 (en) * 2014-04-28 2015-07-29 株式会社Ｓｈカッパープロダクツ Surface-treated copper foil and laminate
JP6078024B2 (en) 2014-06-13 2017-02-08 Ｊｘ金属株式会社 Rolled copper foil for producing a two-dimensional hexagonal lattice compound and a method for producing a two-dimensional hexagonal lattice compound
TWI676405B (en) * 2016-07-26 2019-11-01 日商Ｊｘ金屬股份有限公司 Printed wiring boards, electronic equipment, ducts and metal materials
KR102274906B1 (en) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 Copper foil and copper clad laminate having the same
CN108696987B (en) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
KR102349377B1 (en) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 Surface-treated copper foil, preparing method thereof, copper foil laminate including the same, and printed wiring board including the same
CN112566373B (en) * 2020-11-13 2022-11-04 广东工业大学 Coarsening method based on tin template

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849059B2 (en) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 Processing method of copper foil for printed circuit
WO2003096776A1 (en) 2002-05-13 2003-11-20 Mitsui Mining & Smelting Co.,Ltd. Flexible printed wiring board for chip-on-film
JP2004098659A (en) 2002-07-19 2004-04-02 Ube Ind Ltd Copper-clad laminate and its manufacturing process
KR100852863B1 (en) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 Copper foil having blackened surface or layer
JP2005344174A (en) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil, flexible copper-clad laminate manufactured using the same, and film carrier tape
CN101851769B (en) * 2005-03-31 2012-07-04 三井金属矿业株式会社 Electrolytic copper foil, surface-treated electrolytic copper foil obtained by using the electrolytic copper foil, copper-clad laminate using the surface-treated electrolytic copper foil, and printed circuit board
KR20070044774A (en) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 Two-layer flexible printed wiring board and method for manufacturing the same
TW200728515A (en) * 2005-10-31 2007-08-01 Mitsui Mining & Smelting Co Method for manufacture of electrolytic copper foil, electrolytic copper foil manufactured by the method, surface-treated copper foil manufactured using the electrolytic copper foil, and copper-clad laminate manufactured using the electrolytic copper
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP2007332458A (en) 2006-05-18 2007-12-27 Sony Corp Vapor deposition apparatus, and vapor deposition source, and display device manufacturing method
JP2007332418A (en) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd Surface treated copper foil
JP4240506B2 (en) * 2006-09-05 2009-03-18 三井金属鉱業株式会社 Manufacturing method of film carrier tape for mounting electronic components
JP5129642B2 (en) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
CN102224281B (en) * 2008-11-25 2014-03-26 吉坤日矿日石金属株式会社 Copper foil for printed circuit
KR101046545B1 (en) * 2009-12-22 2011-07-05 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Manufacturing Method of Laminate and Laminate
JP5242710B2 (en) * 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
JP5411192B2 (en) * 2011-03-25 2014-02-12 Ｊｘ日鉱日石金属株式会社 Rolled copper foil and method for producing the same
JP5261595B1 (en) * 2012-06-29 2013-08-14 Ｊｘ日鉱日石金属株式会社 Rolled copper foil, method for producing the same, and laminate

Also Published As

Publication number Publication date
JP5475897B1 (en) 2014-04-16
CN104271813A (en) 2015-01-07
MY171074A (en) 2019-09-24
TWI479036B (en) 2015-04-01
KR20150008482A (en) 2015-01-22
TW201402840A (en) 2014-01-16
WO2013168646A1 (en) 2013-11-14
KR101704892B1 (en) 2017-02-08
MY194478A (en) 2022-11-30
CN107022774A (en) 2017-08-08
PH12014502509B1 (en) 2014-12-22
CN104271813B (en) 2018-08-28
KR101822325B1 (en) 2018-01-25
JP2014148691A (en) 2014-08-21
KR20160128467A (en) 2016-11-07

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