MY186394A - Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board - Google Patents

Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board

Info

Publication number
MY186394A
MY186394A MYPI2014702316A MYPI2014702316A MY186394A MY 186394 A MY186394 A MY 186394A MY PI2014702316 A MYPI2014702316 A MY PI2014702316A MY PI2014702316 A MYPI2014702316 A MY PI2014702316A MY 186394 A MY186394 A MY 186394A
Authority
MY
Malaysia
Prior art keywords
copper foil
wiring board
printed wiring
roughened
laminate
Prior art date
Application number
MYPI2014702316A
Inventor
Fukuchi Ryo
Nagaura Tomota
Arai Hideta
Miki Atsushi
Arai Kohsuke
Nakamuro Kaichiro
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY186394A publication Critical patent/MY186394A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Abstract

[Problem to be Solved] Provided is a surface- treated copper foil, and a laminate using the same, which has good adhesion with a resin and excellent resin transparency after removal of the copper foil by etching. [Solution) A surface-treated copper foil, wherein roughened particles are formed by a roughening treatment on one and/or both copper foil surfaces, a ten point average roughness ?z of the roughened surface in a TD measured by a contact roughness meter is 0.20 to 0 .80 ?m, a 60? gloss in an MD of the roughened surface is 76 to 350%, a ratio A/B between a surface area A of the roughened particles and an area B obtained when the roughened particles are viewed in a plane from the copper foil surface side is 1.90 to 2.40, the roughened surface includes any one or more elements selected from the group consisting of Ni and Co, if the roughened surface includes Ni, an amount of Ni deposited is 1,400 ?g/dm? or less, and if the roughened surface includes Co, an amount of Co deposited is 2,400 ?g/dm? or less.
MYPI2014702316A 2013-08-20 2014-08-20 Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board MY186394A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013186666 2013-08-20

Publications (1)

Publication Number Publication Date
MY186394A true MY186394A (en) 2021-07-22

Family

ID=52821355

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702316A MY186394A (en) 2013-08-20 2014-08-20 Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board

Country Status (5)

Country Link
JP (1) JP5885791B2 (en)
KR (1) KR101752528B1 (en)
CN (1) CN104427758B (en)
MY (1) MY186394A (en)
TW (1) TWI603655B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102136784B1 (en) * 2015-07-24 2020-07-22 케이씨에프테크놀로지스 주식회사 Electrolytic copper foil for lithium secondary battery and Lithium secondary battery comprising the same
TWI597390B (en) * 2015-11-10 2017-09-01 Jx Nippon Mining & Metals Corp Electrolytic copper foil, manufacturing method of electrolytic copper foil, copper clad laminated board, printed wiring board, the manufacturing method of a printed wiring board, and the manufacturing method of an electronic device
KR102274906B1 (en) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 Copper foil and copper clad laminate having the same
KR20180047897A (en) * 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 Electrodeposited copper foil with its surfaceprepared, process for producing the same and usethereof
JP2018122590A (en) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 Metallic foil with release layer, metallic foil, laminate, printed wiring board, semiconductor package, electronic apparatus and method for manufacturing printed wiring board
JP7033905B2 (en) * 2017-02-07 2022-03-11 Ｊｘ金属株式会社 Manufacturing method of surface-treated copper foil, copper foil with carrier, laminate, printed wiring board and manufacturing method of electronic equipment
CN110832120B (en) * 2017-03-30 2022-01-11 古河电气工业株式会社 Surface-treated copper foil, and copper-clad plate and printed circuit board using the same
KR102297790B1 (en) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 Roughening process copper foil, copper foil provided with a carrier, copper clad laminated board, and printed wiring board
KR102180926B1 (en) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 Copper foil having improved workability and charge discharge characteristics, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
JP2019065361A (en) * 2017-10-03 2019-04-25 Ｊｘ金属株式会社 Cu-Ni-Sn-BASED COPPER ALLOY FOIL, EXTENDED COPPER ARTICLE, ELECTRONIC DEVICE COMPONENT, AND AUTO FOCUS CAMERA MODULE
KR102390417B1 (en) * 2017-12-05 2022-04-22 후루카와 덴키 고교 가부시키가이샤 Surface-treated copper foil and copper clad laminate and printed wiring board using the same
JP6405482B1 (en) * 2018-03-27 2018-10-17 タツタ電線株式会社 Carrier film for conductive adhesive layer and bonding film provided therewith
CN111051546B (en) * 2018-03-29 2021-09-14 古河电气工业株式会社 Insulating substrate and method for manufacturing same
KR102214641B1 (en) * 2018-07-16 2021-02-10 삼성전기주식회사 Printed circuit board
JP7445830B2 (en) 2018-10-05 2024-03-08 パナソニックＩｐマネジメント株式会社 Copper-clad laminates, wiring boards, and copper foils with resin
KR102349377B1 (en) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 Surface-treated copper foil, preparing method thereof, copper foil laminate including the same, and printed wiring board including the same
JP7273883B2 (en) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 Surface-treated copper foil and copper-clad laminate and printed wiring board using the surface-treated copper foil

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
JP2000077851A (en) * 1998-09-03 2000-03-14 Ibiden Co Ltd Manufacture of multilayer printed wiring board
TWI414638B (en) * 2006-06-07 2013-11-11 Furukawa Electric Co Ltd A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
KR101288641B1 (en) * 2008-11-25 2013-07-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed circuit
JP4690475B2 (en) * 2009-03-24 2011-06-01 住友電気工業株式会社 Cermet and coated cermet tools
JP5379528B2 (en) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate obtained using the electrolytic copper foil with carrier foil
WO2011090044A1 (en) * 2010-01-25 2011-07-28 Jx日鉱日石金属株式会社 Copper foil for secondary battery negative electrode power collector
JP5497808B2 (en) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil and copper-clad laminate using the same
JP5204908B1 (en) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier, method for producing copper foil with carrier, copper foil with carrier for printed wiring board and printed wiring board
JP5228130B1 (en) 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 Copper foil with carrier

Also Published As

Publication number Publication date
TW201531173A (en) 2015-08-01
JP2015061935A (en) 2015-04-02
TWI603655B (en) 2017-10-21
KR20150021473A (en) 2015-03-02
KR101752528B1 (en) 2017-06-29
CN104427758B (en) 2018-06-29
CN104427758A (en) 2015-03-18
JP5885791B2 (en) 2016-03-15

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