MY157604A - Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board - Google Patents

Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board

Info

Publication number
MY157604A
MY157604A MYPI2013003917A MYPI2013003917A MY157604A MY 157604 A MY157604 A MY 157604A MY PI2013003917 A MYPI2013003917 A MY PI2013003917A MY PI2013003917 A MYPI2013003917 A MY PI2013003917A MY 157604 A MY157604 A MY 157604A
Authority
MY
Malaysia
Prior art keywords
carrier
copper foil
wiring board
printed wiring
copper
Prior art date
Application number
MYPI2013003917A
Inventor
Terumasa Moriyama
Kazuhiko Sakaguchi
Tomota Nagaura
Michiya Kohiki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY157604A publication Critical patent/MY157604A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
    • B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A COPPER FOIL WITH CARRIER IS PROVIDED IN WHICH THE WARP OF THE COPPER FOIL IS WELL SUPPRESSED WHILE THE KINDS OF AN ULTRATHIN COPPER LAYER AND THE CARRIER AND THICKNESSES THEREOF ARE NOT LIMITED. THE COPPER FOIL WITH CARRIER COMPRISES A COPPER FOIL CARRIER, AN INTERMEDIATE LAYER LAMINATED ON THE COPPER FOIL CARRIER, AND AN ULTRATHIN COPPER LAYER LAMINATED ON THE INTERMEDIATE LAYER, WHEREIN THE ABSOLUTE VALUE [(T/2) X D] OF A PRODUCT OF 1/2 OF A TOTAL THICKNESS T OF THE COPPER FOIL WITH CARRIER AND A DIFFERENCE D BETWEEN A RESIDUAL STRESS OF AN OUTER SURFACE OF THE COPPER FOIL CARRIER AND A RESIDUAL STRESS OF AN OUTER SURFACE OF THE ULTRATHIN COPPER LAYER IS 0 (µM-MPA) OR MORE AND 155 (µM-MPA) OR LESS.
MYPI2013003917A 2012-10-26 2013-10-28 Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board MY157604A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012236858 2012-10-26
JP2013016116A JP5358740B1 (en) 2012-10-26 2013-01-30 Copper foil with carrier, copper-clad laminate using the same, printed wiring board, printed circuit board, and printed wiring board manufacturing method

Publications (1)

Publication Number Publication Date
MY157604A true MY157604A (en) 2016-06-30

Family

ID=49850277

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013003917A MY157604A (en) 2012-10-26 2013-10-28 Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board

Country Status (5)

Country Link
JP (1) JP5358740B1 (en)
KR (1) KR101569253B1 (en)
CN (1) CN103786389B (en)
MY (1) MY157604A (en)
TW (1) TWI564144B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6782561B2 (en) 2015-07-16 2020-11-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, manufacturing method of laminate, manufacturing method of printed wiring board and manufacturing method of electronic equipment
JP6058182B1 (en) 2015-07-27 2017-01-11 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6006445B1 (en) 2015-07-27 2016-10-12 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6200042B2 (en) 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6339636B2 (en) 2015-08-06 2018-06-06 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6190500B2 (en) 2015-08-06 2017-08-30 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP2018171902A (en) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 Copper foil with release layer, laminate, method for producing printed wiring board and method for producing electronic apparatus
JP2018171899A (en) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 Copper foil with release layer, laminate, method for producing printed wiring board and method for producing electronic apparatus
JP6606317B1 (en) * 2018-04-25 2019-11-13 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
CN112423983A (en) * 2018-09-25 2021-02-26 东丽Kp薄膜股份有限公司 Laminate and method for producing laminate
US20230276579A1 (en) * 2020-07-16 2023-08-31 Mitsui Mining & Smelting Co., Ltd. Manufacturing methods for copper-clad laminate and printed wiring board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
US3984598A (en) * 1974-02-08 1976-10-05 Universal Oil Products Company Metal-clad laminates
JPS60147192A (en) * 1984-01-11 1985-08-03 株式会社日立製作所 Method of producing printed circuit board
JP3612594B2 (en) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 Composite foil with resin, method for producing the same, multilayer copper-clad laminate using the composite foil, and method for producing multilayer printed wiring board
JP4329953B2 (en) * 1999-05-19 2009-09-09 古河電気工業株式会社 Copper foil for high-density ultra-fine wiring boards
JP3770537B2 (en) * 2001-07-30 2006-04-26 三井金属鉱業株式会社 Capacitor and method for producing double-sided copper-clad laminate for forming the same
JP4570070B2 (en) * 2004-03-16 2010-10-27 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil provided with resin layer for forming insulating layer, copper-clad laminate, printed wiring board, method for producing multilayer copper-clad laminate, and method for producing printed wiring board
JP4906332B2 (en) * 2005-12-06 2012-03-28 三井金属鉱業株式会社 Curling correction method for composite foil, composite foil and composite foil-clad laminate

Also Published As

Publication number Publication date
CN103786389A (en) 2014-05-14
KR20140053797A (en) 2014-05-08
JP5358740B1 (en) 2013-12-04
TW201431678A (en) 2014-08-16
JP2014100905A (en) 2014-06-05
KR101569253B1 (en) 2015-11-13
CN103786389B (en) 2017-01-04
TWI564144B (en) 2017-01-01

Similar Documents

Publication Publication Date Title
MY157604A (en) Copper foil with carrier, and copper clad laminate, printed wiring board and printed circuit board using the same, and method for manufacturing printed wiring board
MY185462A (en) Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
PH12017502362A1 (en) Roughened copper foil, copper-clad laminate and printed wiring board
MY173569A (en) Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
MY186451A (en) Copper foil provided with carrier, laminate, printed wiring board, electronic device, and method for fabricating printed wiring board
PH12019000429A1 (en) Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
MY177723A (en) Surface-treated copper foil, laminate using same, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3026145A4 (en) Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
MY180511A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
MY177771A (en) Carrier-attached copper foil, laminate, method for producing printed wiring board, and method for producing electronic device
MY170684A (en) Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
MY176763A (en) Carrier-attached copper foil, laminate, method for manufacturing printed- wiring board and method for manufacturing electronic device
MY163173A (en) Manufacturing method of multilayer printed wiring board
MY186394A (en) Surface-treated copper foil, laminate using same, copper foil, printed wiring board, electronic device, and method for fabricating printed wiring board
EP3786316A4 (en) Surface-treated copper foil, copper clad laminate, and printed wiring board
MY194478A (en) Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board
MY174931A (en) Ultrathin copper foil with carrier and method for manufacturing same
TW200735730A (en) Resin composite copper foil, printed wiring board, and production process thereof
EP3026144A4 (en) Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper-clad laminate, and method for manufacturing printed circuit board
MY185927A (en) Copper foil provided with carrier, laminate, method for fabricating printed wiring board and method for fabricating electronic device
WO2009054456A1 (en) Method for manufacturing printed wiring board
MY193835A (en) Production method for printed wiring board having dielectric layer
MY180430A (en) Copper foil with carrier, laminate, printed wiring board, and method of producing electronic devices
MY167064A (en) Multilayer printed wiring board manufacturing method
MY178787A (en) Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices