MY194478A - Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board - Google Patents

Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board

Info

Publication number
MY194478A
MY194478A MYPI2018001779A MYPI2018001779A MY194478A MY 194478 A MY194478 A MY 194478A MY PI2018001779 A MYPI2018001779 A MY PI2018001779A MY PI2018001779 A MYPI2018001779 A MY PI2018001779A MY 194478 A MY194478 A MY 194478A
Authority
MY
Malaysia
Prior art keywords
wiring board
printed wiring
fabricating
copper foil
same
Prior art date
Application number
MYPI2018001779A
Inventor
Hideta Arai
Atsushi Miki
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY194478A publication Critical patent/MY194478A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/12—Electroforming by electrophoresis
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/12—Electroforming by electrophoresis
    • C25D1/14—Electroforming by electrophoresis of inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Metal Rolling (AREA)

Abstract

.Provided is a copper foil, and a laminate using the same, which has good s adhesion with a resin and excellent resin transparency after removal of the copper foil by etching. The copper foil has a 60? gloss in an MD of 501 to 800%. (Figure 1e)
MYPI2018001779A 2012-05-11 2013-04-30 Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board MY194478A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012122448 2012-05-11
JP2013003867 2013-01-11
JP2013008519A JP5475897B1 (en) 2012-05-11 2013-01-21 Surface-treated copper foil and laminate using the same, copper foil, printed wiring board, electronic device, and method for manufacturing printed wiring board

Publications (1)

Publication Number Publication Date
MY194478A true MY194478A (en) 2022-11-30

Family

ID=49550688

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI2018001779A MY194478A (en) 2012-05-11 2013-04-30 Copper foil, printed wiring board using same, method for fabricating electronic device, and method for fabricating printed wiring board
MYPI2014703339A MY171074A (en) 2012-05-11 2013-04-30 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI2014703339A MY171074A (en) 2012-05-11 2013-04-30 Surface-treated copper foil and laminate using same, copper foil, printed wiring board, electronic device, and process for producing printed wiring board

Country Status (7)

Country Link
JP (1) JP5475897B1 (en)
KR (2) KR101822325B1 (en)
CN (2) CN104271813B (en)
MY (2) MY194478A (en)
PH (1) PH12014502509A1 (en)
TW (1) TWI479036B (en)
WO (1) WO2013168646A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5822669B2 (en) * 2011-02-18 2015-11-24 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene using the same
JP5850720B2 (en) 2011-06-02 2016-02-03 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
CN103596879B (en) 2011-06-02 2018-06-12 Jx日矿日石金属株式会社 The manufacturing method of graphene manufacture copper foil and graphene
JP5721609B2 (en) 2011-11-15 2015-05-20 Jx日鉱日石金属株式会社 Copper foil for producing graphene and method for producing graphene
JP5885790B2 (en) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 Surface treated copper foil and laminated board using the same, copper foil with carrier, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board
JP5710737B1 (en) * 2013-11-29 2015-04-30 Jx日鉱日石金属株式会社 Surface-treated copper foil, laminated board, printed wiring board, printed circuit board, and electronic equipment
JP5756547B1 (en) * 2014-04-28 2015-07-29 株式会社Ｓｈカッパープロダクツ Surface-treated copper foil and laminate
JP6078024B2 (en) 2014-06-13 2017-02-08 Ｊｘ金属株式会社 Rolled copper foil for producing a two-dimensional hexagonal lattice compound and a method for producing a two-dimensional hexagonal lattice compound
TWI676405B (en) * 2016-07-26 2019-11-01 日商Ｊｘ金屬股份有限公司 Printed wiring boards, electronic equipment, ducts and metal materials
JP6479254B2 (en) * 2016-09-12 2019-03-06 古河電気工業株式会社 Copper foil and copper-clad laminate having the same
CN108697006B (en) * 2017-03-31 2021-07-16 Ｊｘ金属株式会社 Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
KR102349377B1 (en) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 Surface-treated copper foil, preparing method thereof, copper foil laminate including the same, and printed wiring board including the same
CN112566373B (en) * 2020-11-13 2022-11-04 广东工业大学 Coarsening method based on tin template

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2849059B2 (en) 1995-09-28 1999-01-20 日鉱グールド・フォイル株式会社 Processing method of copper foil for printed circuit
US6984456B2 (en) * 2002-05-13 2006-01-10 Mitsui Mining & Smelting Co., Ltd. Flexible printed wiring board for chip-on flexibles
JP2004098659A (en) 2002-07-19 2004-04-02 Ube Ind Ltd Copper-clad laminate and its manufacturing process
US7341796B2 (en) * 2004-02-17 2008-03-11 Nippon Mining & Metals Co., Ltd Copper foil having blackened surface or layer
JP2005344174A (en) * 2004-06-03 2005-12-15 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil, flexible copper-clad laminate manufactured using the same, and film carrier tape
TWI285686B (en) * 2005-03-31 2007-08-21 Mitsui Mining & Smelting Co Electrolytic copper foil and process for producing electrolytic copper foil, surface treated electrolytic copper foil using said electrolytic copper foil, and copper-clad laminate plate and printed wiring board using said surface treated electrolytic
KR20070044774A (en) * 2005-10-25 2007-04-30 미쓰이 긴조꾸 고교 가부시키가이샤 Two-layer flexible printed wiring board and method for manufacturing the same
CN101297067A (en) * 2005-10-31 2008-10-29 三井金属矿业株式会社 Method for producing electrolytic copper foil, electrolytic copper foil obtained by the production method, surface-treated copper foil obtained using the electrolytic copper foil, and copper-clad laminate obtained using the electrolytic copper foil or the surface-treated copper foil
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP2007332458A (en) 2006-05-18 2007-12-27 Sony Corp Vapor deposition apparatus, and vapor deposition source, and display device manufacturing method
JP2007332418A (en) * 2006-06-15 2007-12-27 Fukuda Metal Foil & Powder Co Ltd Surface treated copper foil
JP4240506B2 (en) * 2006-09-05 2009-03-18 三井金属鉱業株式会社 Manufacturing method of film carrier tape for mounting electronic components
JP5129642B2 (en) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
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Also Published As

Publication number Publication date
PH12014502509B1 (en) 2014-12-22
PH12014502509A1 (en) 2014-12-22
JP5475897B1 (en) 2014-04-16
CN107022774A (en) 2017-08-08
KR101822325B1 (en) 2018-01-25
KR20150008482A (en) 2015-01-22
JP2014148691A (en) 2014-08-21
WO2013168646A1 (en) 2013-11-14
CN104271813A (en) 2015-01-07
CN104271813B (en) 2018-08-28
KR101704892B1 (en) 2017-02-08
KR20160128467A (en) 2016-11-07
TWI479036B (en) 2015-04-01
MY171074A (en) 2019-09-24
TW201402840A (en) 2014-01-16

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