SG11201404327PA - Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same - Google Patents
Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using sameInfo
- Publication number
- SG11201404327PA SG11201404327PA SG11201404327PA SG11201404327PA SG11201404327PA SG 11201404327P A SG11201404327P A SG 11201404327PA SG 11201404327P A SG11201404327P A SG 11201404327PA SG 11201404327P A SG11201404327P A SG 11201404327PA SG 11201404327P A SG11201404327P A SG 11201404327PA
- Authority
- SG
- Singapore
- Prior art keywords
- wiring board
- printed wiring
- prepreg
- metal foil
- same
- Prior art date
Links
- -1 and prepreg Substances 0.000 title 1
- 239000000463 material Substances 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 239000011342 resin composition Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012018958 | 2012-01-31 | ||
| JP2012079615 | 2012-03-30 | ||
| PCT/JP2013/051501 WO2013115069A1 (en) | 2012-01-31 | 2013-01-24 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201404327PA true SG11201404327PA (en) | 2014-10-30 |
Family
ID=48905110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201404327PA SG11201404327PA (en) | 2012-01-31 | 2013-01-24 | Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9351397B2 (en) |
| EP (1) | EP2810971B1 (en) |
| JP (1) | JP6065845B2 (en) |
| KR (1) | KR101920106B1 (en) |
| CN (1) | CN104093764B (en) |
| SG (1) | SG11201404327PA (en) |
| TW (1) | TWI577710B (en) |
| WO (1) | WO2013115069A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130101863A1 (en) * | 2010-04-21 | 2013-04-25 | Mitsubishi Gas Chemical Company, Inc. | Heat curable composition |
| KR101987310B1 (en) * | 2013-12-16 | 2019-06-10 | 삼성전기주식회사 | Insulating resin composition for printed circuit board and products manufactured by using the same |
| JP6379600B2 (en) * | 2014-04-03 | 2018-08-29 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, resin sheet, and metal foil-clad laminate |
| JP6458978B2 (en) * | 2014-04-17 | 2019-01-30 | 日立化成株式会社 | Laminated board |
| JP6485728B2 (en) * | 2014-05-23 | 2019-03-20 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board material, prepreg, resin sheet, metal foil-clad laminate and printed wiring board using the same |
| JP2016010964A (en) * | 2014-06-03 | 2016-01-21 | 三菱瓦斯化学株式会社 | Resin sheet and printed wiring board |
| TWI519559B (en) | 2014-11-21 | 2016-02-01 | 財團法人工業技術研究院 | Resin formulations, resin polymers and composite materials comprising the resin polymers |
| JP6090684B1 (en) * | 2015-03-31 | 2017-03-08 | 三菱瓦斯化学株式会社 | Resin composition for printed wiring board, prepreg, resin composite sheet and metal foil-clad laminate |
| TW201704278A (en) * | 2015-04-07 | 2017-02-01 | 三菱瓦斯化學股份有限公司 | Underlayer film-forming material for lithography, underlayer film-forming composition for lithography, underlayer film for lithography, and pattern formation method |
| US20180051168A1 (en) * | 2015-04-21 | 2018-02-22 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| CN107709468B (en) * | 2015-07-06 | 2020-06-16 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, and printed wiring board |
| EP3357687B1 (en) * | 2015-09-28 | 2020-09-16 | Zeon Corporation | Laminate, method for producing same, and flexible printed circuit board |
| JP6531910B2 (en) * | 2015-10-09 | 2019-06-19 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| JP6913305B2 (en) * | 2016-06-29 | 2021-08-04 | 三菱瓦斯化学株式会社 | Resin composition, resin sheet, multilayer printed wiring board and semiconductor device |
| KR102324899B1 (en) * | 2016-06-29 | 2021-11-10 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, resin sheet, multilayer printed wiring board and semiconductor device |
| JP6632739B2 (en) * | 2017-04-25 | 2020-01-22 | 古河電気工業株式会社 | Surface treated copper foil |
| WO2019044977A1 (en) * | 2017-08-31 | 2019-03-07 | 三菱瓦斯化学株式会社 | Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board |
| CN111465496B (en) * | 2017-12-14 | 2022-03-01 | 三菱瓦斯化学株式会社 | Copper foil with insulating resin layer |
| WO2019189466A1 (en) * | 2018-03-28 | 2019-10-03 | 積水化学工業株式会社 | Resin material and multilayer printed wiring board |
| JP6636599B2 (en) * | 2018-11-30 | 2020-01-29 | 日本化薬株式会社 | Epoxy resin composition, prepreg and metal-clad laminate, printed wiring board |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6097089A (en) * | 1998-01-28 | 2000-08-01 | Mitsubishi Gas Chemical Company, Inc. | Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package |
| US4918157A (en) * | 1987-07-08 | 1990-04-17 | Amoco Corporation | Thermosetting composition comprising cyanate ester, urea compound and epoxy resin |
| US4931496A (en) * | 1987-07-08 | 1990-06-05 | Amoco Corporation | Damage tolerant fiber-reinforced composites based on cyanate ester/urea thermosetting composition |
| US4804740A (en) * | 1987-07-08 | 1989-02-14 | Amoco Corporation | Cyanate ester with urea latent cure accelerator |
| US5385989A (en) * | 1991-04-15 | 1995-01-31 | Mitsubishi Gas Chemical Company, Inc. | Thermal resistance resin dust for friction material |
| EP0604823A1 (en) * | 1992-12-29 | 1994-07-06 | International Business Machines Corporation | Triazine polymer and use thereof |
| JP2991054B2 (en) | 1994-09-20 | 1999-12-20 | 住友化学工業株式会社 | Method for producing cyanate compound |
| JPH09148748A (en) | 1995-11-20 | 1997-06-06 | Taiyo Ink Mfg Ltd | Multilayer printed wiring board, manufacture thereof and composite for forming resin insulating layer to be used therefor |
| US6194495B1 (en) * | 1998-03-23 | 2001-02-27 | General Electric Company | Cyanate ester based thermoset compositions |
| US6396143B1 (en) * | 1999-04-30 | 2002-05-28 | Mitsubishi Gas Chemical Company, Inc. | Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board |
| US6254972B1 (en) * | 1999-06-29 | 2001-07-03 | International Business Machines Corporation | Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| JP2001342230A (en) | 1999-09-24 | 2001-12-11 | Sumitomo Bakelite Co Ltd | Photosensitive resin composition, multilayered printed circuit board and method for manufacturing the same |
| EP1087261A1 (en) | 1999-09-24 | 2001-03-28 | Sumitomo Bakelite Company Limited | Photosensitive resin composition, multilayer printed wiring board and process for production thereof |
| US6534179B2 (en) * | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
| JP2003249751A (en) | 2002-02-22 | 2003-09-05 | Mitsubishi Gas Chem Co Inc | Method for producing multilayer printed wiring board using additive method |
| JP2004175925A (en) | 2002-11-27 | 2004-06-24 | Mitsubishi Gas Chem Co Inc | Prepreg and laminate |
| JP2004182850A (en) * | 2002-12-03 | 2004-07-02 | Mitsubishi Gas Chem Co Inc | Prepreg having excellent balance of characteristics and laminated sheet |
| TWI321975B (en) * | 2003-06-27 | 2010-03-11 | Ajinomoto Kk | Resin composition and adhesive film for multi-layered printed wiring board |
| KR100561070B1 (en) * | 2003-09-05 | 2006-03-15 | 주식회사 엘지화학 | Thermosetting resin composition for high speed transmission circuit film |
| TWI262041B (en) * | 2003-11-14 | 2006-09-11 | Hitachi Chemical Co Ltd | Formation method of metal layer on resin layer, printed wiring board, and production method thereof |
| TWI282259B (en) * | 2004-01-30 | 2007-06-01 | Hitachi Chemical Co Ltd | Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board |
| US20050182203A1 (en) * | 2004-02-18 | 2005-08-18 | Yuuichi Sugano | Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
| US7892651B2 (en) | 2004-09-14 | 2011-02-22 | Mitsubishi Gas Chemical Company, Inc. | Resin composite metal foil, laminate and process for the production of printed wiring board using the laminate |
| TW200626659A (en) * | 2004-11-05 | 2006-08-01 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| TWI494228B (en) * | 2004-11-10 | 2015-08-01 | Hitachi Chemical Co Ltd | Metal foil with adhesive adjuvant and printed circuit board using the same |
| JP5090635B2 (en) | 2005-09-20 | 2012-12-05 | 住友ベークライト株式会社 | Resin composition, insulating sheet with substrate, and multilayer printed wiring board |
| JP4983228B2 (en) | 2005-11-29 | 2012-07-25 | 味の素株式会社 | Resin composition for insulating layer of multilayer printed wiring board |
| TWI410442B (en) | 2005-11-29 | 2013-10-01 | Ajinomoto Kk | A resin composition for an insulating layer of a multilayer printed circuit board |
| KR101019738B1 (en) * | 2006-02-24 | 2011-03-08 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Resin Composition, Prepreg and Metal-Foil-Clad Laminate |
| JP5026727B2 (en) | 2006-04-03 | 2012-09-19 | 三菱瓦斯化学株式会社 | Method for producing high purity cyanate ester |
| JP4944483B2 (en) | 2006-04-20 | 2012-05-30 | パナソニック株式会社 | Method for manufacturing printed wiring board |
| EP1961554B1 (en) * | 2007-02-07 | 2010-01-27 | Mitsubishi Gas Chemical Company, Inc. | Prepreg and laminate |
| EP2116902A4 (en) * | 2007-02-16 | 2011-02-02 | Taiyo Ink Mfg Co Ltd | Composition for forming cured film pattern, and method for producing cured film pattern by using the same |
| MY150705A (en) | 2007-04-10 | 2014-02-28 | Sumitomo Bakelite Co | Epoxy resin composition, prepreg, laminate board, multilayer printed wiring board, semiconductor device, insulating resin sheet, and process for manufacturing multilayer printed wiring board |
| JPWO2008153082A1 (en) * | 2007-06-12 | 2010-08-26 | 住友ベークライト株式会社 | Resin composition, embedding material, insulating layer, and semiconductor device |
| JP5024205B2 (en) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
| JP5384809B2 (en) | 2007-07-18 | 2014-01-08 | 三菱瓦斯化学株式会社 | Prepreg and laminate |
| WO2009018194A1 (en) * | 2007-08-02 | 2009-02-05 | Dow Global Technologies Inc. | Thermoset dampener material |
| KR101466181B1 (en) * | 2007-10-29 | 2014-11-27 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Resin composition, prepreg and laminate using the same |
| JP5233710B2 (en) * | 2008-02-12 | 2013-07-10 | 三菱瓦斯化学株式会社 | Resin composition, prepreg and metal foil-clad laminate |
| MY149431A (en) * | 2008-03-26 | 2013-08-30 | Sumitomo Bakelite Co | Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device |
| EP2113534B8 (en) * | 2008-04-01 | 2011-09-21 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg and metal-foil-clad laminate |
| WO2009150985A1 (en) * | 2008-06-12 | 2009-12-17 | 住友ベークライト株式会社 | Semiconductor device mounting substrate |
| JP5206600B2 (en) * | 2008-06-30 | 2013-06-12 | 住友ベークライト株式会社 | Epoxy resin composition, prepreg, laminate, resin sheet, multilayer printed wiring board, and semiconductor device |
| KR20110049921A (en) * | 2008-09-11 | 2011-05-12 | 스미토모 베이클리트 컴퍼니 리미티드 | Semiconductor device and resin composition used in semiconductor device |
| WO2010050472A1 (en) * | 2008-10-29 | 2010-05-06 | 住友ベークライト株式会社 | Resin composition, resin sheet, prepreg, laminate board, multilayer printed wiring board, and semiconductor device |
| CN102264539B (en) * | 2008-12-26 | 2015-08-19 | 三菱瓦斯化学株式会社 | Resin composite copper foil |
| KR101668327B1 (en) * | 2009-03-27 | 2016-10-21 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | Method for storing resin solution, and methods for producing prepreg and laminate |
| US8876510B2 (en) * | 2009-08-31 | 2014-11-04 | Sumitomo Bakelite Company Ltd. | Molded body production device, molded body production method, and molded body |
| US8888477B2 (en) * | 2009-08-31 | 2014-11-18 | Sumitomo Bakelite Company Limited | Molded product production device |
| TWI540170B (en) * | 2009-12-14 | 2016-07-01 | Ajinomoto Kk | Resin composition |
| EP2522698B1 (en) * | 2010-01-08 | 2017-05-17 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and metal-clad laminate |
| EP2543687B1 (en) * | 2010-03-02 | 2020-01-15 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, and laminated sheet |
| JP2011184650A (en) * | 2010-03-11 | 2011-09-22 | Nitto Denko Corp | Resin composition for electronic component encapsulation and electronic component device using the same |
| JP2011219674A (en) * | 2010-04-13 | 2011-11-04 | Sumitomo Bakelite Co Ltd | Thermosetting resin composition for circuit board |
| KR20130141449A (en) * | 2010-08-31 | 2013-12-26 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg, and laminate |
| CN103180366B (en) * | 2010-10-29 | 2015-09-09 | 三菱瓦斯化学株式会社 | Cyanate esters, curable resin composition containing cyanate esters and cured article thereof |
| JP5115645B2 (en) * | 2010-11-18 | 2013-01-09 | 住友ベークライト株式会社 | Insulating substrate, metal-clad laminate, printed wiring board, and semiconductor device |
| CN102558759B (en) * | 2010-12-24 | 2014-07-16 | 广东生益科技股份有限公司 | Cyanate ester resin composition and prepreg and laminated material manufactured by using same |
| CN102532801B (en) | 2010-12-24 | 2014-04-09 | 广东生益科技股份有限公司 | Cyanate resin composition as well as prepreg and laminated material manufactured using same |
| TW201235402A (en) * | 2011-01-07 | 2012-09-01 | Ajinomoto Kk | Resin composition for release film |
| US9955573B2 (en) * | 2011-01-20 | 2018-04-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg and laminate |
| WO2012121164A1 (en) | 2011-03-07 | 2012-09-13 | 三菱瓦斯化学株式会社 | Resin composition for printed circuit board |
-
2013
- 2013-01-24 EP EP13743143.3A patent/EP2810971B1/en active Active
- 2013-01-24 CN CN201380007608.0A patent/CN104093764B/en active Active
- 2013-01-24 US US14/375,269 patent/US9351397B2/en active Active
- 2013-01-24 JP JP2013556358A patent/JP6065845B2/en active Active
- 2013-01-24 KR KR1020147021255A patent/KR101920106B1/en active IP Right Grant
- 2013-01-24 SG SG11201404327PA patent/SG11201404327PA/en unknown
- 2013-01-24 WO PCT/JP2013/051501 patent/WO2013115069A1/en active Application Filing
- 2013-01-31 TW TW102103766A patent/TWI577710B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2810971A4 (en) | 2016-01-13 |
| US20150014032A1 (en) | 2015-01-15 |
| KR101920106B1 (en) | 2018-11-19 |
| JPWO2013115069A1 (en) | 2015-05-11 |
| KR20140128309A (en) | 2014-11-05 |
| TWI577710B (en) | 2017-04-11 |
| US9351397B2 (en) | 2016-05-24 |
| EP2810971A1 (en) | 2014-12-10 |
| TW201336885A (en) | 2013-09-16 |
| JP6065845B2 (en) | 2017-01-25 |
| CN104093764A (en) | 2014-10-08 |
| WO2013115069A1 (en) | 2013-08-08 |
| EP2810971B1 (en) | 2018-09-19 |
| CN104093764B (en) | 2018-06-08 |
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