MY186266A - Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board - Google Patents

Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Info

Publication number
MY186266A
MY186266A MYPI2017703411A MYPI2017703411A MY186266A MY 186266 A MY186266 A MY 186266A MY PI2017703411 A MYPI2017703411 A MY PI2017703411A MY PI2017703411 A MYPI2017703411 A MY PI2017703411A MY 186266 A MY186266 A MY 186266A
Authority
MY
Malaysia
Prior art keywords
copper foil
copper
roughened
substantially spherical
spherical protrusions
Prior art date
Application number
MYPI2017703411A
Inventor
Hiroto Iida
Mitsuyoshi Matsuda
Kazuhiro Yoshikawa
Nobuyuki Kawai
Tsubasa Kato
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY186266A publication Critical patent/MY186266A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemically Coating (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Provided is a roughened copper foil which, when used in a SAP, can provide a laminate with a surface profile that achieves high adhesion to a plated circuit, high etching efficiency of an electroless copper plated layer, and high dry film resolution. The roughened copper foil of the present invention has at least one roughened surface provided with a plurality of substantially spherical protrusions composed of copper particles, the substantially spherical protrusions having an average height of 2.60 ?m or less and exhibiting a ratio bave/aave of 1.2 or more where aave represents the average neck diameter of the substantially spherical protrusions and bave represents the average maximum diameter of the substantially spherical protrusions.
MYPI2017703411A 2015-03-31 2016-03-25 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board MY186266A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015073356 2015-03-31
PCT/JP2016/059671 WO2016158775A1 (en) 2015-03-31 2016-03-25 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Publications (1)

Publication Number Publication Date
MY186266A true MY186266A (en) 2021-07-01

Family

ID=57004659

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017703411A MY186266A (en) 2015-03-31 2016-03-25 Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6293365B2 (en)
KR (1) KR102273442B1 (en)
CN (1) CN107429417B (en)
MY (1) MY186266A (en)
TW (1) TWI620662B (en)
WO (1) WO2016158775A1 (en)

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KR102340473B1 (en) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 surface treatment copper foil
JP6430092B1 (en) * 2017-05-19 2018-11-28 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
KR102016494B1 (en) * 2017-10-23 2019-09-02 삼성전기주식회사 Coil component
KR102390417B1 (en) * 2017-12-05 2022-04-22 후루카와 덴키 고교 가부시키가이샤 Surface-treated copper foil and copper clad laminate and printed wiring board using the same
TWI798287B (en) * 2017-12-08 2023-04-11 日商日本電產理德股份有限公司 Manufacturing method of MI element and MI element
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
JP7166335B2 (en) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
CN110783727A (en) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 Connector and manufacturing method
CN110783728A (en) 2018-11-09 2020-02-11 广州方邦电子股份有限公司 Flexible connector and manufacturing method
JP7453154B2 (en) * 2018-11-19 2024-03-19 三井金属鉱業株式会社 Surface treated copper foil, copper foil with carrier, copper clad laminates and printed wiring boards
JP7411638B2 (en) * 2019-03-26 2024-01-11 三井金属鉱業株式会社 Manufacturing method of printed wiring board
JP6816193B2 (en) * 2019-03-26 2021-01-20 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and printed wiring boards using this
KR102554287B1 (en) 2019-03-26 2023-07-12 미쓰이금속광업주식회사 Manufacturing method of printed wiring board
JPWO2022244828A1 (en) * 2021-05-20 2022-11-24

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JP3664533B2 (en) * 1995-11-28 2005-06-29 信越ポリマー株式会社 Laminated board for printed wiring boards
JP2003243785A (en) * 2002-02-18 2003-08-29 Hitachi Cable Ltd Resin bonding copper-foil, copper-foil/resin bonded film, and method of manufacturing resin bonding copper-foil
JP2009176770A (en) * 2008-01-21 2009-08-06 Ube Ind Ltd Method of manufacturing copper wiring insulation film, and copper wiring insulation film manufactured from the same
JP2009293103A (en) * 2008-06-09 2009-12-17 Nippon Denkai Kk Ultrathin copper foil with support and method of manufacturing the same
KR20110126128A (en) * 2009-03-27 2011-11-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed wiring board and method for producing same
JP5400447B2 (en) * 2009-03-31 2014-01-29 三井金属鉱業株式会社 Roughened copper foil, method for producing roughened copper foil, and copper-clad laminate
JP5636367B2 (en) * 2009-07-24 2014-12-03 三菱瓦斯化学株式会社 Resin composite electrolytic copper foil, copper-clad laminate and printed wiring board
JP5242710B2 (en) * 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
JP4927963B2 (en) * 2010-01-22 2012-05-09 古河電気工業株式会社 Surface-treated copper foil, method for producing the same, and copper-clad laminate
KR20130027484A (en) * 2010-03-01 2013-03-15 후루카와 덴키 고교 가부시키가이샤 Surface treatment method for copper foil, surface-treated copper foil, and copper foil for negative electrode collector of lithium ion secondary battery
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JP6593979B2 (en) * 2013-07-24 2019-10-23 Ｊｘ金属株式会社 Surface treated copper foil, copper foil with carrier, base material, copper clad laminate manufacturing method, electronic device manufacturing method, and printed wiring board manufacturing method
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Also Published As

Publication number Publication date
CN107429417A (en) 2017-12-01
JP6293365B2 (en) 2018-03-14
WO2016158775A1 (en) 2016-10-06
TW201707948A (en) 2017-03-01
KR20170132128A (en) 2017-12-01
KR102273442B1 (en) 2021-07-06
CN107429417B (en) 2019-11-22
JPWO2016158775A1 (en) 2017-07-27
TWI620662B (en) 2018-04-11

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