MY190542A - Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device - Google Patents

Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device

Info

Publication number
MY190542A
MY190542A MYPI2016704119A MYPI2016704119A MY190542A MY 190542 A MY190542 A MY 190542A MY PI2016704119 A MYPI2016704119 A MY PI2016704119A MY PI2016704119 A MYPI2016704119 A MY PI2016704119A MY 190542 A MY190542 A MY 190542A
Authority
MY
Malaysia
Prior art keywords
manufacturing
copper foil
wiring board
printed wiring
electrolytic copper
Prior art date
Application number
MYPI2016704119A
Inventor
Inukai Kenji
Kobayashi Yosuke
Iida Kazuhiko
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY190542A publication Critical patent/MY190542A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

An electrolytic copper foil with good circuit formability is provided. The electrolytic copper foil, comprising a shiny face on at least one side, wherein a roughened layer is not provided on the side of the shiny face, and a root mean square height Sq of the shiny face is 0.315 ?m or less.
MYPI2016704119A 2015-11-10 2016-11-09 Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device MY190542A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015220764 2015-11-10
JP2015250475 2015-12-22

Publications (1)

Publication Number Publication Date
MY190542A true MY190542A (en) 2022-04-27

Family

ID=59048932

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2016704119A MY190542A (en) 2015-11-10 2016-11-09 Electrolytic copper foil, method of manufacturing electrolytic copper foil, copper-clad laminate, printed wiring board, method of manufacturing printed wiring board, and method of manufacturing electronic device

Country Status (4)

Country Link
KR (1) KR101905998B1 (en)
CN (1) CN107018623B (en)
MY (1) MY190542A (en)
TW (1) TWI597390B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2019208520A1 (en) * 2018-04-27 2021-06-17 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate and printed wiring board
LU101698B1 (en) * 2020-03-18 2021-09-20 Circuit Foil Luxembourg Surface-treated copper foil for high-frequency circuit and method for producing same
US11540389B1 (en) * 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
CN115413119B (en) * 2021-07-06 2023-03-24 长春石油化学股份有限公司 Surface-treated copper foil and copper foil substrate
CN114182308B (en) * 2021-12-01 2023-11-10 江西省科学院能源研究所 Additive for preparing electrolytic copper foil and preparation method of electrolytic copper foil

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3313277B2 (en) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 Electrodeposited copper foil for fine pattern and its manufacturing method
JP3295308B2 (en) * 1996-06-28 2002-06-24 株式会社日鉱マテリアルズ Electrolytic copper foil
JP3690962B2 (en) * 2000-04-26 2005-08-31 三井金属鉱業株式会社 Electrolytic copper foil with carrier foil, method for producing electrolytic copper foil with carrier foil, and copper-clad laminate
CN101522318B (en) * 2006-08-08 2013-11-06 环球产权公司 Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
FR2990565B1 (en) * 2012-05-09 2016-10-28 Commissariat Energie Atomique METHOD FOR PRODUCING INFRARED DETECTORS
JP5885791B2 (en) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminate using the same, copper foil with carrier, copper foil, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
CN107018623A (en) 2017-08-04
KR101905998B1 (en) 2018-10-08
KR20170055004A (en) 2017-05-18
TW201730381A (en) 2017-09-01
CN107018623B (en) 2020-03-06
TWI597390B (en) 2017-09-01

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