MY186397A - Roughened copper foil, copper-clad laminate, and printed wiring board - Google Patents

Roughened copper foil, copper-clad laminate, and printed wiring board

Info

Publication number
MY186397A
MY186397A MYPI2018700155A MYPI2018700155A MY186397A MY 186397 A MY186397 A MY 186397A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY PI2018700155 A MYPI2018700155 A MY PI2018700155A MY 186397 A MY186397 A MY 186397A
Authority
MY
Malaysia
Prior art keywords
roughened
copper foil
copper
wiring board
printed wiring
Prior art date
Application number
MYPI2018700155A
Inventor
Hiroaki Tsuyoshi
Ayumu Tateoka
Makoto Hosokawa
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of MY186397A publication Critical patent/MY186397A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

There is provided a roughened copper foil which have not only high adhesion to the resin but also high frictional endurance while having low roughness suitable for forming a fine-pitch circuit and high-frequency applications, resulting in stable high adhesion to the resin even after friction against something during the treatment of copper-clad laminates and/or production of printed circuit boards. The roughened copper foil has at least one roughened surface having fine irregularities composed of acicular crystals and/or tabular crystals. The roughened surface has a maximum height Sz of 1.5 ?m or less determined in accordance with ISO 25178 and an arithmetic mean peak curvature Spc determined of 1300 mm-1 or less in accordance with ISO 25178.
MYPI2018700155A 2015-07-29 2016-07-14 Roughened copper foil, copper-clad laminate, and printed wiring board MY186397A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015149717 2015-07-29
PCT/JP2016/070876 WO2017018232A1 (en) 2015-07-29 2016-07-14 Roughened copper foil, copper-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
MY186397A true MY186397A (en) 2021-07-22

Family

ID=57885564

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018700155A MY186397A (en) 2015-07-29 2016-07-14 Roughened copper foil, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6342078B2 (en)
KR (1) KR102490491B1 (en)
CN (1) CN107923047B (en)
MY (1) MY186397A (en)
TW (1) TWI609780B (en)
WO (1) WO2017018232A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017179416A1 (en) * 2016-04-14 2017-10-19 三井金属鉱業株式会社 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
KR102136794B1 (en) 2017-03-09 2020-07-22 케이씨에프테크놀로지스 주식회사 Copper foil having improved adheshion property, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
JP7166334B2 (en) * 2018-03-30 2022-11-07 三井金属鉱業株式会社 copper clad laminate
WO2019208368A1 (en) * 2018-04-25 2019-10-31 古河電気工業株式会社 Surface-treated copper foil, copper-cladded laminate plate, and printed wiring board
EP3567993B1 (en) 2018-05-08 2022-02-23 Atotech Deutschland GmbH & Co. KG A method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, and acidic aqueous non-etching protector solution
JP6985745B2 (en) * 2018-06-20 2021-12-22 ナミックス株式会社 Roughened copper foil, copper-clad laminate and printed wiring board
ES2956260T3 (en) 2018-06-22 2023-12-18 Sekisui Polymatech Co Ltd Thermally conductive sheet
KR102480377B1 (en) * 2018-08-10 2022-12-23 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
EP3860321A4 (en) 2018-09-26 2022-06-29 Sekisui Polymatech Co., Ltd. Heat conductive sheet
JP6805217B2 (en) * 2018-10-18 2020-12-23 Ｊｘ金属株式会社 Conductive materials, molded products and electronic components
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
US20220040769A1 (en) * 2019-03-22 2022-02-10 Moldino Tool Engineering, Ltd. Coated cutting tool
JP7328671B2 (en) * 2019-05-09 2023-08-17 ナミックス株式会社 laminate
JP7456578B2 (en) * 2019-05-09 2024-03-27 ナミックス株式会社 Copper surface processing equipment
JPWO2022014648A1 (en) * 2020-07-16 2022-01-20

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3977790B2 (en) * 2003-09-01 2007-09-19 古河サーキットフォイル株式会社 Manufacturing method of ultra-thin copper foil with carrier, ultra-thin copper foil manufactured by the manufacturing method, printed wiring board using the ultra-thin copper foil, multilayer printed wiring board, chip-on-film wiring board
JP4704025B2 (en) * 2004-12-21 2011-06-15 Ｊｘ日鉱日石金属株式会社 Roughening rolled copper foil for high frequency circuit and method for producing the same
KR20110126128A (en) * 2009-03-27 2011-11-22 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 Copper foil for printed wiring board and method for producing same
JP5297546B1 (en) * 2012-04-23 2013-09-25 三井金属鉱業株式会社 Electrode foil and electronic device
CN104812945B (en) * 2012-11-26 2018-08-28 Jx日矿日石金属株式会社 Surface-treated electro-deposited copper foil, laminated plates, printing distributing board and e-machine
JP5809361B2 (en) * 2013-02-14 2015-11-10 三井金属鉱業株式会社 Surface-treated copper foil and copper-clad laminate obtained by using surface-treated copper foil
JP6166614B2 (en) * 2013-07-23 2017-07-19 Ｊｘ金属株式会社 Surface-treated copper foil, copper foil with carrier, substrate, printed wiring board, printed circuit board, copper-clad laminate, and printed wiring board manufacturing method
WO2015012327A1 (en) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 Treated surface copper foil, copper foil with carrier, substrate, resin substrate, printed circuit board, copper clad laminate, and printed circuit board manufacturing method
MY182166A (en) * 2013-09-20 2021-01-18 Namics Corp Copper foil, copper foil with carrier foil, and copper-clad laminate
JP2015134953A (en) * 2014-01-17 2015-07-27 Jx日鉱日石金属株式会社 Surface-treated copper foil, copper foil with carrier, printed wiring board, printed circuit board, copper-clad laminate, and method for producing printed wiring board

Also Published As

Publication number Publication date
JP6342078B2 (en) 2018-06-13
CN107923047B (en) 2020-05-01
KR20180036693A (en) 2018-04-09
KR102490491B1 (en) 2023-01-19
JPWO2017018232A1 (en) 2017-09-21
TWI609780B (en) 2018-01-01
WO2017018232A1 (en) 2017-02-02
TW201710079A (en) 2017-03-16
CN107923047A (en) 2018-04-17

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