MY194654A - Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board - Google Patents

Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board

Info

Publication number
MY194654A
MY194654A MYPI2019006734A MYPI2019006734A MY194654A MY 194654 A MY194654 A MY 194654A MY PI2019006734 A MYPI2019006734 A MY PI2019006734A MY PI2019006734 A MYPI2019006734 A MY PI2019006734A MY 194654 A MY194654 A MY 194654A
Authority
MY
Malaysia
Prior art keywords
copper foil
roughened
neck
roughening particles
carrier
Prior art date
Application number
MYPI2019006734A
Inventor
Akitoshi Takanashi
Kazuhiro Yoshikawa
Hiroto Iida
Mitsuyoshi Matsuda
Tsubasa Kato
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY194654A publication Critical patent/MY194654A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

A roughened copper foil (110) is provided that has a low roughness suitable for formation of a fine circuit and can provide a laminate with a surface profile that can achieve not only high etching properties of an electroless copper plating layer (115) and high resolution of a dry film (116) pattern but also high adhesion to a circuit when used in a semi-additive process (SAP). The roughened copper foil (110) of the present invention has at least one roughened surface. The roughened surface is provided with a plurality of primary roughening particles (12) each having a neck (12a). The primary roughening particles (12) have a plurality of secondary roughening particles (14) that are disposed on the entire surface including the neck (12a) and are smaller than the primary roughening particles (12). The density, calculated by division of the number of secondary protrusions on the neck (12a) by the surface area of the neck (12a), of the secondary roughening particles (14) is within a range of 9 to 30/?m2. The roughened surface has a ten-point average roughness Rz of 0.7 to 1.7 ?m. (Figure 3)
MYPI2019006734A 2017-05-19 2018-04-27 Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board MY194654A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017099935 2017-05-19
PCT/JP2018/017276 WO2018211951A1 (en) 2017-05-19 2018-04-27 Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
MY194654A true MY194654A (en) 2022-12-10

Family

ID=64273618

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019006734A MY194654A (en) 2017-05-19 2018-04-27 Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP6430092B1 (en)
KR (1) KR102297790B1 (en)
CN (1) CN110382745B (en)
MY (1) MY194654A (en)
TW (1) TWI675748B (en)
WO (1) WO2018211951A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7166335B2 (en) * 2018-03-27 2022-11-07 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
US20220183158A1 (en) 2019-03-26 2022-06-09 Mitsui Mining & Smelting Co., Ltd. Method of manufacturing printed wiring board
CN113574977A (en) 2019-03-26 2021-10-29 三井金属矿业株式会社 Method for manufacturing printed circuit board
CN112447967B (en) * 2019-09-02 2022-03-08 宁德时代新能源科技股份有限公司 Positive electrode active material, positive electrode plate and lithium ion secondary battery
JP7051988B1 (en) * 2020-11-27 2022-04-11 古河電気工業株式会社 Roughened copper foil, copper-clad laminate, and printed wiring board
WO2022244826A1 (en) * 2021-05-20 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
JPWO2022244827A1 (en) * 2021-05-20 2022-11-24
KR20240009937A (en) * 2021-05-20 2024-01-23 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4251319B2 (en) * 2003-06-27 2009-04-08 日本製箔株式会社 Thick copper sheet and printed wiring board using it
JP5242710B2 (en) * 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
JP5985812B2 (en) * 2011-11-04 2016-09-06 Ｊｘ金属株式会社 Copper foil for printed circuit
KR102128954B1 (en) * 2012-06-06 2020-07-01 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil
JP5417538B1 (en) * 2012-06-11 2014-02-19 Ｊｘ日鉱日石金属株式会社 Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for manufacturing printed wiring board
JP6425401B2 (en) * 2013-04-26 2018-11-21 Ｊｘ金属株式会社 Copper foil for high frequency circuit, copper clad laminate for high frequency circuit, printed wiring board for high frequency circuit, copper foil with carrier for high frequency circuit, electronic device, and method of manufacturing printed wiring board
CN104125711B (en) * 2013-04-26 2017-10-24 Jx日矿日石金属株式会社 High-frequency circuit copper foil, copper-clad plate, printed wiring board, the copper foil with carrier, the manufacture method of electronic equipment and printed wiring board
JP5885791B2 (en) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminate using the same, copper foil with carrier, copper foil, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board
JP5885790B2 (en) * 2013-08-20 2016-03-15 Ｊｘ金属株式会社 Surface treated copper foil and laminated board using the same, copper foil with carrier, printed wiring board, electronic device, method for manufacturing electronic device, and method for manufacturing printed wiring board
JP6487704B2 (en) * 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 Treated copper foil, copper-clad laminate using the treated copper foil, and printed wiring board
CN107429417B (en) * 2015-03-31 2019-11-22 三井金属矿业株式会社 Roughening treatment copper foil, band carrier copper foil, copper-clad laminated board and printed circuit board
CN107532322B (en) * 2015-04-28 2019-07-16 三井金属矿业株式会社 Roughening treatment copper foil and printed circuit board
KR101895745B1 (en) * 2015-07-03 2018-09-05 미쓰이금속광업주식회사 Roughened copper foil, copper clad laminate and printed wiring board
KR101759288B1 (en) * 2015-10-15 2017-07-19 와이엠티 주식회사 Ultra thin film of copper having bump and fabrication method for printed circuit board using the same

Also Published As

Publication number Publication date
JP6430092B1 (en) 2018-11-28
TW201900410A (en) 2019-01-01
KR20190121327A (en) 2019-10-25
CN110382745A (en) 2019-10-25
CN110382745B (en) 2021-06-25
WO2018211951A1 (en) 2018-11-22
JPWO2018211951A1 (en) 2019-06-27
KR102297790B1 (en) 2021-09-06
TWI675748B (en) 2019-11-01

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