JPWO2022244827A1 - - Google Patents

Info

Publication number
JPWO2022244827A1
JPWO2022244827A1 JP2023522711A JP2023522711A JPWO2022244827A1 JP WO2022244827 A1 JPWO2022244827 A1 JP WO2022244827A1 JP 2023522711 A JP2023522711 A JP 2023522711A JP 2023522711 A JP2023522711 A JP 2023522711A JP WO2022244827 A1 JPWO2022244827 A1 JP WO2022244827A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023522711A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022244827A1 publication Critical patent/JPWO2022244827A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2023522711A 2021-05-20 2022-05-18 Pending JPWO2022244827A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021085490 2021-05-20
PCT/JP2022/020748 WO2022244827A1 (en) 2021-05-20 2022-05-18 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
JPWO2022244827A1 true JPWO2022244827A1 (en) 2022-11-24

Family

ID=84141655

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023522711A Pending JPWO2022244827A1 (en) 2021-05-20 2022-05-18

Country Status (5)

Country Link
JP (1) JPWO2022244827A1 (en)
KR (1) KR20240009404A (en)
CN (1) CN117321254A (en)
TW (1) TWI805378B (en)
WO (1) WO2022244827A1 (en)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP6373166B2 (en) * 2014-10-30 2018-08-15 Ｊｘ金属株式会社 Surface-treated copper foil and laminate
KR101929844B1 (en) 2015-01-22 2018-12-17 미쓰이금속광업주식회사 Ultrathin copper foil with carrier and method for manufacturing same
JP6200042B2 (en) * 2015-08-06 2017-09-20 Ｊｘ金属株式会社 Copper foil with carrier, laminate, printed wiring board manufacturing method and electronic device manufacturing method
JP6182584B2 (en) * 2015-12-09 2017-08-16 古河電気工業株式会社 Surface-treated copper foil for printed wiring board, copper-clad laminate for printed wiring board, and printed wiring board
JP6462961B2 (en) * 2016-12-14 2019-01-30 古河電気工業株式会社 Surface treated copper foil and copper clad laminate
MY194654A (en) * 2017-05-19 2022-12-10 Mitsui Mining & Smelting Co Ltd Roughened copper foil, carrier-attached copper foil, copper clad laminate, and printed wiring board
CN111344435A (en) * 2017-11-10 2020-06-26 纳美仕有限公司 Composite copper foil
MY186454A (en) 2018-08-10 2021-07-22 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery

Also Published As

Publication number Publication date
TW202302915A (en) 2023-01-16
CN117321254A (en) 2023-12-29
KR20240009404A (en) 2024-01-22
TWI805378B (en) 2023-06-11
WO2022244827A1 (en) 2022-11-24

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