MY182166A - Copper foil, copper foil with carrier foil, and copper-clad laminate - Google Patents
Copper foil, copper foil with carrier foil, and copper-clad laminateInfo
- Publication number
- MY182166A MY182166A MYPI2016700973A MYPI2016700973A MY182166A MY 182166 A MY182166 A MY 182166A MY PI2016700973 A MYPI2016700973 A MY PI2016700973A MY PI2016700973 A MYPI2016700973 A MY PI2016700973A MY 182166 A MY182166 A MY 182166A
- Authority
- MY
- Malaysia
- Prior art keywords
- copper foil
- foil
- copper
- layer
- carrier
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/82—After-treatment
- C23C22/83—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
- C23C2222/20—Use of solutions containing silanes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
- C25D5/611—Smooth layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
An object of the present disclosure is to provide a copper foil that has excellent adhesion to an insulating resin substrate compared with an unroughened copper foil and favorable etchability equivalent to that of the unroughened copper foil. In order to accomplish the object of the present disclosure, a copper foil is employed. The copper foil is characterized in that the copper foil includes a roughened layer on at least one surface thereof, wherein the roughened layer has a fine concave-convex structure being formed of needle-like or plate-like convex sections including a copper composite compound and having a size smaller than or equal to 500 nm; and wherein a silane coupling agent treatment layer is formed on a surface of the roughened layer. Alternatively, a copper foil with a carrier foil is employed. The copper foil with a carrier foil is characterized in that the copper foil with a carrier foil has a layer structure of carrier foil/binding interface layer/copper foil layer, wherein a roughened layer that has a fine concave-convex structure being formed of needle-like or plate-like convex sections including a copper composite compound and having a size smaller than or equal to 500 nm is provided on a surface of the copper foil layer; and wherein a silane coupling agent treatment layer is formed on a surface of the roughened layer.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013195940 | 2013-09-20 | ||
PCT/JP2014/071798 WO2015040998A1 (en) | 2013-09-20 | 2014-08-20 | Copper foil, copper foil with carrier foil, and copper-clad laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
MY182166A true MY182166A (en) | 2021-01-18 |
Family
ID=52688654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2016700973A MY182166A (en) | 2013-09-20 | 2014-08-20 | Copper foil, copper foil with carrier foil, and copper-clad laminate |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP6283664B2 (en) |
KR (1) | KR101920976B1 (en) |
CN (1) | CN105556004B (en) |
MY (1) | MY182166A (en) |
TW (1) | TWI587757B (en) |
WO (1) | WO2015040998A1 (en) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106103082B (en) * | 2014-03-31 | 2019-04-26 | 三井金属矿业株式会社 | Copper foil, copper clad laminate and printed wiring board with carrier foils |
WO2016088884A1 (en) * | 2014-12-05 | 2016-06-09 | 三井金属鉱業株式会社 | Surface-treated copper foil for forming high frequency signal transmission circuit, copper clad laminate board and printed wiring board |
CN107923047B (en) * | 2015-07-29 | 2020-05-01 | 纳美仕有限公司 | Roughened copper foil, copper-clad laminate, and printed wiring board |
JP6087028B1 (en) * | 2015-09-30 | 2017-03-01 | 三井金属鉱業株式会社 | Roughening copper foil, copper clad laminate and printed wiring board |
US10280501B2 (en) | 2015-09-30 | 2019-05-07 | Mitsui Mining & Smelting Co., Ltd. | Roughened copper foil, copper clad laminate, and printed circuit board |
WO2017073121A1 (en) * | 2015-10-28 | 2017-05-04 | 三井金属鉱業株式会社 | Method for manufacturing printed wiring board |
JP6294862B2 (en) * | 2015-12-09 | 2018-03-14 | 古河電気工業株式会社 | Surface-treated copper foil for printed wiring board, copper-clad laminate for printed wiring board, and printed wiring board |
WO2017149810A1 (en) * | 2016-02-29 | 2017-09-08 | 三井金属鉱業株式会社 | Copper foil with carrier, production method for same, production method for coreless support with wiring layer, and production method for printed circuit board |
JP6178035B1 (en) * | 2016-03-03 | 2017-08-09 | 三井金属鉱業株式会社 | Method for producing copper clad laminate |
KR101846141B1 (en) | 2016-03-03 | 2018-04-05 | 미쓰이금속광업주식회사 | Manufacturing method of copper clad laminate |
TWI616336B (en) * | 2016-03-03 | 2018-03-01 | 三井金屬鑛業股份有限公司 | Method for manufacturing copper-clad laminate |
JP6832581B2 (en) * | 2016-07-15 | 2021-02-24 | ナミックス株式会社 | Manufacturing method of copper foil used for printed wiring boards |
TWI775981B (en) * | 2017-11-10 | 2022-09-01 | 日商納美仕有限公司 | Composite copper foil and method for producing the same |
JP7013003B2 (en) * | 2017-11-10 | 2022-01-31 | ナミックス株式会社 | Objects with a roughened copper surface |
KR102390417B1 (en) * | 2017-12-05 | 2022-04-22 | 후루카와 덴키 고교 가부시키가이샤 | Surface-treated copper foil and copper clad laminate and printed wiring board using the same |
US10337115B1 (en) * | 2018-01-05 | 2019-07-02 | Chang Chun Petrochemical Co., Ltd. | Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making |
JP6985745B2 (en) * | 2018-06-20 | 2021-12-22 | ナミックス株式会社 | Roughened copper foil, copper-clad laminate and printed wiring board |
JP2019220647A (en) * | 2018-06-22 | 2019-12-26 | 株式会社アルバック | Surface treatment method, printed wiring board manufacturing method, and surface treatment device |
US10581081B1 (en) | 2019-02-01 | 2020-03-03 | Chang Chun Petrochemical Co., Ltd. | Copper foil for negative electrode current collector of lithium ion secondary battery |
JP7456578B2 (en) * | 2019-05-09 | 2024-03-27 | ナミックス株式会社 | Copper surface processing equipment |
JP7352939B2 (en) * | 2019-05-09 | 2023-09-29 | ナミックス株式会社 | composite copper parts |
JP7409602B2 (en) * | 2019-05-09 | 2024-01-09 | ナミックス株式会社 | composite copper parts |
CN112533388B (en) * | 2019-09-19 | 2022-10-18 | 比亚迪股份有限公司 | Ceramic copper-clad plate and preparation method thereof |
CN110838408A (en) * | 2019-10-10 | 2020-02-25 | 深圳市峰泳科技有限公司 | Planar capacitor with high stripping force and high dielectric constant and preparation method thereof |
WO2021132191A1 (en) * | 2019-12-26 | 2021-07-01 | ナミックス株式会社 | Composite copper member treated with silane coupling agent |
JPWO2021172096A1 (en) * | 2020-02-28 | 2021-09-02 | ||
WO2021220524A1 (en) * | 2020-04-27 | 2021-11-04 | ナミックス株式会社 | Composite copper member |
KR20230007390A (en) * | 2020-04-27 | 2023-01-12 | 나믹스 가부시끼가이샤 | composite copper member |
JP7353254B2 (en) * | 2020-10-20 | 2023-09-29 | プライムプラネットエナジー&ソリューションズ株式会社 | secondary battery |
EP4057782A1 (en) * | 2021-03-12 | 2022-09-14 | Atotech Deutschland GmbH & Co. KG | Method for increasing adhesion strength between copper and an organic material and reducing halo and wedge void formation by modifying the copper surface and/or by using heteroaromatic silane compounds |
CN116745462A (en) * | 2021-03-25 | 2023-09-12 | 纳美仕有限公司 | Method for producing laminate |
KR20230159392A (en) * | 2021-03-26 | 2023-11-21 | 미쓰이금속광업주식회사 | Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board |
JPWO2022202541A1 (en) * | 2021-03-26 | 2022-09-29 | ||
KR20230170899A (en) * | 2021-04-20 | 2023-12-19 | 나믹스 가부시끼가이샤 | copper member |
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CN1024981C (en) * | 1991-02-04 | 1994-06-08 | 陈晓旼 | Adhesion method of copper to resin |
JP3123109B2 (en) * | 1991-05-09 | 2001-01-09 | 凸版印刷株式会社 | Multilayer wiring board and its manufacturing method |
JPH08222857A (en) * | 1995-02-16 | 1996-08-30 | Mitsui Mining & Smelting Co Ltd | Copper foil and high-density multilayered printed circuit board using the foil for its internal-layer circuit |
JPH10242638A (en) * | 1996-12-19 | 1998-09-11 | Ibiden Co Ltd | Multilayer printed wiring board and its manufacture |
DE69915395D1 (en) * | 1999-09-29 | 2004-04-08 | Europa Metalli Spa | AN ELECTROCHEMICAL METHOD FOR PRODUCING AN INORGANIC COVER LAYER ON A COPPER SURFACE |
JP4191881B2 (en) * | 2000-08-10 | 2008-12-03 | メルテックス株式会社 | Treatment liquid and treatment method for copper oxide reduction |
JP3752161B2 (en) * | 2001-06-13 | 2006-03-08 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Method for roughening copper surface of printed wiring board, printed wiring board, and manufacturing method thereof |
JP4144711B2 (en) * | 2002-06-04 | 2008-09-03 | 三井金属鉱業株式会社 | Surface treated copper foil for low dielectric substrate, copper-clad laminate and printed wiring board using the same |
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
JP4354955B2 (en) * | 2004-02-17 | 2009-10-28 | 日鉱金属株式会社 | Copper foil with blackened surface or layer |
JP2006249519A (en) * | 2005-03-11 | 2006-09-21 | Hitachi Chem Co Ltd | Surface treatment method for copper and copper |
JP5588607B2 (en) * | 2007-10-31 | 2014-09-10 | 三井金属鉱業株式会社 | Electrolytic copper foil and method for producing the electrolytic copper foil |
WO2010050266A1 (en) * | 2008-10-27 | 2010-05-06 | 日立化成工業株式会社 | Method for surface treatment of copper and copper |
JP4441658B1 (en) * | 2008-12-19 | 2010-03-31 | 国立大学法人東北大学 | Copper wiring forming method, copper wiring, and semiconductor device |
JP5406278B2 (en) | 2009-03-27 | 2014-02-05 | Jx日鉱日石金属株式会社 | Copper foil for printed wiring board and method for producing the same |
JP5400447B2 (en) * | 2009-03-31 | 2014-01-29 | 三井金属鉱業株式会社 | Roughened copper foil, method for producing roughened copper foil, and copper-clad laminate |
JP5634103B2 (en) * | 2010-04-06 | 2014-12-03 | 福田金属箔粉工業株式会社 | A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate. |
JP5204908B1 (en) * | 2012-03-26 | 2013-06-05 | Jx日鉱日石金属株式会社 | Copper foil with carrier, method for producing copper foil with carrier, copper foil with carrier for printed wiring board and printed wiring board |
JP5417538B1 (en) * | 2012-06-11 | 2014-02-19 | Jx日鉱日石金属株式会社 | Surface-treated copper foil, laminate using the same, printed wiring board, electronic device, and method for manufacturing printed wiring board |
-
2014
- 2014-08-20 JP JP2015515306A patent/JP6283664B2/en active Active
- 2014-08-20 MY MYPI2016700973A patent/MY182166A/en unknown
- 2014-08-20 WO PCT/JP2014/071798 patent/WO2015040998A1/en active Application Filing
- 2014-08-20 CN CN201480051363.6A patent/CN105556004B/en active Active
- 2014-08-20 TW TW103128590A patent/TWI587757B/en active
- 2014-08-20 KR KR1020167007204A patent/KR101920976B1/en active IP Right Grant
-
2016
- 2016-11-29 JP JP2016231862A patent/JP6297124B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
TW201524279A (en) | 2015-06-16 |
JPWO2015040998A1 (en) | 2017-03-02 |
JP2017048467A (en) | 2017-03-09 |
JP6297124B2 (en) | 2018-03-20 |
WO2015040998A1 (en) | 2015-03-26 |
TWI587757B (en) | 2017-06-11 |
JP6283664B2 (en) | 2018-02-21 |
CN105556004A (en) | 2016-05-04 |
KR20160060046A (en) | 2016-05-27 |
KR101920976B1 (en) | 2018-11-21 |
CN105556004B (en) | 2018-11-30 |
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