JP2019220647A - Surface treatment method, printed wiring board manufacturing method, and surface treatment device - Google Patents

Abstract

To provide a surface treatment method that can reduce signal delay in a wiring while improving the adhesion between the wiring and a resin layer, a printed wiring board manufacturing method, and a surface treatment device.SOLUTION: A surface treatment method includes adding a hydroxy group to the surface SF having a wiring in a processing target S in a gas phase, and supplying a silane coupling agent having a functional group reactive with the hydroxy group at the terminal to the surface SF to which the hydroxy group is added in the gas phase, and condensing the hydroxy group and the silane coupling agent on the surface SF.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a surface treatment method, a method for manufacturing a printed wiring board, and a surface treatment device.

  The printed wiring board has a multilayer wiring layer in which wiring and resin layers are alternately laminated on both surfaces of a base material formed of a prepreg or the like. When a multilayer wiring layer is formed on a substrate, first, a metal film for forming a wiring is formed on each surface of the substrate, and then the wiring is formed by patterning the metal film. Then, a structure in which the wiring and the resin layer are stacked is formed by attaching the resin layer to the surface of the substrate on which the wiring is located. By repeating these processes a plurality of times, a multilayer wiring layer is formed on both surfaces of the base material.

  In the manufacture of a printed wiring board, a process for increasing the surface roughness of the surface of the wiring is performed for the purpose of increasing the adhesion between the wiring and the resin layer (for example, see Patent Document 1).

JP 2000-282265 A

  When a high-frequency device is mounted on a printed wiring board, a signal input to the device and a signal output from the device propagate near the surface of the wiring due to a skin effect. Therefore, a signal is delayed by unevenness formed on the surface of the wiring to increase the surface roughness of the wiring.

  An object of the present invention is to provide a surface treatment method, a method for manufacturing a printed wiring board, and a surface treatment apparatus that can suppress signal delay in wiring while increasing adhesion between the wiring and a resin layer. And

  The surface treatment method for solving the above-mentioned problem is that, in a gas phase, a hydroxy group is added to a surface having wirings to be treated, and in the gas phase, the hydroxy group is added to the surface to which the hydroxy group is added. Supplying a silane coupling agent having a functional group reactive to the hydroxy group at the terminal, and condensing the hydroxy group and the silane coupling agent on the surface.

  A surface treatment apparatus for solving the above-mentioned problem includes a treatment tank for partitioning a vapor phase space for accommodating a treatment target including a surface having wiring, A silane coupling agent that supplies a silane coupling agent having, at the terminal, a functional group reactive with the hydroxy group to the surface to which the hydroxy group has been added in the gas phase space; A ring agent supply unit.

  According to the above configurations, when the resin layer is attached to the surface to be treated, the functional group contained in the resin forming the resin layer and the functional group contained in the silane coupling agent added to the surface to be treated are included. Wherein the organic substance and the functional group capable of reacting are condensed. In other words, the surface to be treated and the resin layer are chemically bonded. Therefore, the adhesion between the surface of the processing target and the resin layer can be increased without forming irregularities on the surface of the processing target. As a result, it is possible to suppress the signal delay in the wiring while improving the adhesion between the wiring and the resin layer.

  In the above-described surface treatment method, adding the hydroxy group may supply a radical contained in a plasma generated from a gas containing oxygen and hydrogen to the surface. According to the above configuration, the roughness of the surface to be treated is suppressed from increasing as compared with the case where the ions contained in the plasma are supplied to the surface.

  In the surface treatment method, condensing the hydroxy group and the silane coupling agent may include a temperature of the treatment target being 70 ° C or more and 150 ° C or less. According to the above configuration, by setting the temperature of the processing target to 70 ° C. or higher, condensation between the silane coupling agent and the hydroxy group is reliably caused, and the temperature of the processing target is set to 150 ° C. or lower. Thus, polymerization of the silane coupling agents is suppressed.

  In the above-mentioned surface treatment method, adding the hydroxy group to the surface may include that the temperature of the treatment target is 70 ° C or more and 150 ° C or less. According to the above configuration, since the temperature of the processing target is 70 ° C. or more and 150 ° C. or less before the supply of the silane coupling agent, the temperature of the processing target is reduced after the hydroxy group is added to the surface. There is no waiting time to increase the temperature to increase the reaction between the ring agent and the hydroxy group.

  A method of manufacturing a printed wiring board for solving the above-mentioned problem includes condensing the hydroxy group and the silane coupling agent by the surface treatment method, and attaching a resin layer containing an epoxy resin to the surface. And condensing the hydroxy group with the silane coupling agent includes supplying the silane coupling agent having an amino group at the terminal. According to the above configuration, since the amino group derived from the silane coupling agent is added to the surface to be treated, the epoxy group contained in the epoxy resin and the amino group are condensed.

  In the above surface treatment apparatus, the hydroxy group addition section supplies a gas containing oxygen and hydrogen to the gas phase space separately from the silane coupling agent supplied by the silane coupling agent supply section. And a radical supply unit that generates plasma from the gas and supplies radicals contained in the plasma to the surface.

  According to the above configuration, since the silane coupling agent is not mixed into the passage of the gas containing oxygen and hydrogen, radicals generated from the gas containing oxygen and hydrogen can be deactivated due to the silane coupling agent. Can be suppressed.

FIG. 1 is a cross-sectional view schematically illustrating a structure of a surface treatment apparatus according to an embodiment. FIG. 4 is a process chart for explaining a surface treatment method according to one embodiment. FIG. 4 is a process chart for explaining a surface treatment method according to one embodiment. FIG. 4 is a process chart for explaining a surface treatment method according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. FIG. 4 is a process chart for describing a method for manufacturing a printed wiring board according to one embodiment. Sectional drawing which shows the structure of the example of application of a printed wiring board.

  An embodiment of a surface treatment method, a method of manufacturing a printed wiring board, and a surface treatment apparatus will be described with reference to FIGS. Hereinafter, the configuration of the surface treatment apparatus, the surface treatment method, the method of manufacturing the printed wiring board, and the application example of the printed wiring board will be described in order.

[Configuration of surface treatment device]
The configuration of the surface treatment apparatus will be described with reference to FIG.
The surface treatment apparatus 10 includes a treatment tank 11, a hydroxy group addition unit 10A, and a silane coupling agent supply unit 10B. The processing tank 11 defines a gas phase space 11A that stores the processing target S including the surface SF having the wiring. The hydroxy group addition unit 10A adds a hydroxy group to the processing target S accommodated in the gas phase space 11A. The silane coupling agent supply unit 10B supplies the silane coupling agent to the surface SF to which the hydroxy group has been added in the gas phase space 11A. Hereinafter, the configuration of the surface treatment apparatus 10 will be described in more detail with reference to FIG.

  The processing tank 11 has a supply port 11a penetrating the processing tank 11 and two exhaust ports 11b. The supply port 11a forms a space for generating plasma for adding a hydroxy group to the surface SF of the processing target S. An exhaust unit that exhausts the inside of the gas phase space 11A is connected to the exhaust port 11b. Therefore, the fluid in the gas phase space 11A flows along the direction from the supply port 11a to the exhaust port 11b.

  In the processing tank 11, a support portion 12 that supports the processing target S is located. The support unit 12 is, for example, a stage that supports the processing target S. The support portion 12 is disposed in the processing bath 11 at a position facing a supply port 11 a formed in the processing bath 11. The heating unit 13 is located in the support unit 12. The heating unit 13 heats the processing target S disposed on the support unit 12 by heating the support unit 12. The heating unit 13 heats the processing target S to a temperature of 70 ° C. or more and 150 ° C. or less, for example.

  A passage member 14 is located in the supply port 11 a of the processing tank 11. The passage member 14 is fixed to the processing tank 11. The passage member 14 has a through hole 14a penetrating the passage member 14 along the thickness direction. The passage member 14 has a shape that fits into the supply port 11a, and a surface of the passage member 14 opposite to the surface facing the support portion 12 generates plasma together with a surface that defines the supply port 11a. A plasma generation space. The through-hole 14a is connected to the plasma generation space and forms a plasma passage.

  The passage member 14 is preferably at a ground potential. Thereby, ions having electric charges included in the plasma are captured by the passage member 14 while passing through the through-hole 14a. Therefore, it is difficult to supply ions to the gas phase space 11A defined by the processing tank 11, and most of the active species supplied to the gas phase space 11A become radicals.

  The shower plate 15 is fixed to the passage member 14. The shower plate 15 diffuses the radicals that have reached the shower plate 15 through the through holes 14a of the passage member 14 into the gas phase space 11A.

On the outer surface of the processing tank 11, a transmission window 16 closing the supply port 11a is located. The material forming the transmission window 16 may be, for example, quartz (SiO ₂ ). A waveguide 17 for guiding microwaves to the transmission window 16 is connected to the transmission window 16.

  The surface treatment apparatus 10 further includes a gas supply unit 21 and a microwave source 22. The gas supply unit 21 supplies a gas for generating plasma to a plasma generation space defined by the processing tank 11 and the passage member 14. The gas supply unit 21 supplies, for example, oxygen gas and hydrogen gas. The gas supply unit 21 supplies a gas other than the oxygen gas and the hydrogen gas as long as the gas includes oxygen and hydrogen and can add a hydroxy group to the surface SF of the processing target S. Is also good. For example, the gas containing oxygen and hydrogen may be water vapor. The gas supplied by the gas supply unit 21 to the gas-phase space 11A is supplied to the plasma generation space through a passage formed in the processing bath 11 and a passage formed by a part of the passage member 14 and the processing bath 11. Is done.

  The microwave source 22 is connected to the waveguide 17. When the microwave source 22 irradiates the microwave to the waveguide 17, the microwave is radiated to the plasma generation space through the transmission window 16.

  In the surface treatment apparatus 10, after the gas supply unit 21 supplies the hydrogen gas and the oxygen gas to the plasma generation space, the microwave source 22 irradiates the plasma generation space with the microwave through the waveguide 17 and the transmission window 16. As a result, plasma is generated in the plasma generation space. The plasma contains radicals for adding a hydroxy group to the surface of the processing target S in the gas phase space 11A. That is, in this embodiment, the gas supply unit 21 and the microwave source 22 constitute the hydroxy group addition unit 10A.

  In the processing bath 11, a gas supply ring 18 is located between the shower plate 15 and the support 12 in a direction in which the shower plate 15 and the support 12 face each other. The gas supply ring 18 is annular in plan view facing the surface SF of the processing target S. The gas supply ring 18 has a plurality of gas supply ports in the circumferential direction of the gas supply ring 18.

A raw material tank 31 is connected to the gas supply ring 18 via a buffer chamber 32, two valves 33, and a variable flow valve 34. The raw material tank 31 holds the silane coupling agent in a state of gas-liquid equilibrium. Therefore, the vapor of the silane coupling agent is supplied from the raw material tank 31. The silane coupling agent is an organosilicon compound having, in one molecule, a functional group that reacts with an organic substance and a functional group that reacts with an inorganic substance. The silane coupling agent can be represented by the following formula.
YR-Si- (X) ₃

  In the above formula, Y is a functional group that reacts with an organic substance, X is a functional group that reacts with an inorganic substance, and R is an organic group such as an aliphatic hydrocarbon group. Y may be, for example, a vinyl group, an epoxy group, an amino group, or the like. X is a functional group that is hydrolyzed by water or the like. X may be, for example, an alkoxy group, a chlorosilyl group, an acetoxy group, or the like.

  In the passage where the silane coupling agent is supplied from the raw material tank 31 toward the gas supply ring 18, the buffer chamber 32 is sandwiched between two valves 33. The buffer chamber 32 suppresses variation in the flow rate of the silane coupling agent supplied from the raw material tank 31 to the variable flow rate valve 34. The variable flow valve 34 is located downstream of the two valves 33 in the passage to which the silane coupling agent is supplied. The variable flow valve 34 controls the flow rate of the silane coupling agent supplied to the gas supply ring 18. That is, in the present embodiment, the raw material tank 31, the buffer chamber 32, the valve 33, the variable flow valve 34, and the gas supply ring 18 constitute a silane coupling agent supply unit.

  Thus, in the surface treatment apparatus 10, the hydroxy group addition unit 10A contains oxygen and hydrogen separately from the silane coupling agent supplied by the silane coupling agent supply unit 10B with respect to the vapor phase space 11A. The gas supply unit 21 for supplying gas is included. The hydroxy group addition unit 10A includes a radical supply unit that generates plasma from a gas containing oxygen and hydrogen and supplies radicals contained in the plasma to the surface.

  That is, the oxygen gas and the hydrogen gas used for adding the hydroxy group are supplied to the gas phase space 11A through the passage formed by the processing tank 11 and the passage member 14 as described above. On the other hand, the silane coupling agent is supplied to the gas phase space 11A through a passage connecting the raw material tank 31 to the gas supply ring 18. Since the oxygen gas and the hydrogen gas and the silane coupling agent are supplied to the gas phase space 11A through the individual passages, the silane coupling agent does not enter the passage of the gas containing oxygen and hydrogen. Therefore, the deactivation of radicals generated from the gas containing oxygen and hydrogen due to the silane coupling agent can be suppressed. In the present embodiment, the microwave source 22 and the passage member 14 constitute a radical supply unit.

  According to the surface treatment apparatus 10 of the present embodiment, the addition of the hydroxy group to the surface of the treatment target S and the condensation of the hydroxy group and the silane coupling agent can be performed in one treatment tank 11. It is possible. Therefore, the installation area of the apparatus is reduced as compared with the case where the addition of the hydroxy group to the surface of the processing target S and the condensation of the hydroxy group and the silane coupling agent are performed in separate processing tanks. It is possible.

[Surface treatment method]
The surface treatment method will be described with reference to FIGS. 2 to 4 schematically show steps performed in the surface treatment method.

  The surface treatment method includes adding a hydroxy group and condensing the hydroxy group and the silane coupling agent on the surface SF of the treatment target S. The addition of the hydroxy group adds the hydroxy group to the surface of the processing target S having the wiring in the gas phase. Condensing the hydroxy group and the silane coupling agent is, in the gas phase, supplying the silane coupling agent to the surface to which the hydroxy group has been added, and the hydroxy group and the silane coupling agent on the surface. Is condensed.

  Accordingly, when the resin layer is attached to the surface SF of the processing target S, the functional group contained in the resin forming the resin layer and the functional group contained in the silane coupling agent added to the surface SF of the processing target S Wherein the organic substance and the functional group capable of reacting are condensed. In other words, the surface SF of the processing target S and the resin layer are chemically bonded. Therefore, the adhesion between the surface SF of the processing target S and the resin layer can be increased without forming irregularities on the surface SF of the processing target S. As a result, it is possible to suppress the signal delay in the wiring while improving the adhesion between the wiring and the resin layer. Hereinafter, the surface treatment method will be described in more detail with reference to FIGS.

  As shown in FIG. 2, in the surface treatment method, first, radicals R included in plasma generated from hydrogen gas and oxygen gas are supplied to the surface SF of the processing target S. Therefore, compared with the case where the ions contained in the plasma are supplied to the surface, the increase in the roughness of the surface SF of the processing target S is further suppressed. A mixed gas of hydrogen gas and oxygen gas is an example of a gas containing hydrogen and oxygen. Thereby, a hydroxy group (OH group) is added to the surface SF of the processing target S. As described above, the surface SF of the processing target S includes the wiring. Therefore, a hydroxy group is also added to the wiring. The material for forming the wiring may be, for example, a metal, and the metal may be, for example, copper.

As shown in FIG. 3, the silane coupling agent SC is supplied to the surface SF of the processing target S to which the hydroxy group has been added. The silane coupling agent SC may have, for example, a methoxy group (CH ₃ O group) as X described above, for example. The silane coupling agent SC having a methoxy group can be represented by the following formula.
YR-Si- (OCH ₃ ) ₃

  A methoxy group is a functional group reactive with a hydroxy group. The methoxy group and the hydroxy group condense.

  It is preferable that the condensation of the hydroxy group and the silane coupling agent includes that the temperature of the treatment target S is 70 ° C. or more and 150 ° C. or less. That is, when the hydroxy group and the silane coupling agent SC are condensed, it is preferable to heat the processing target S to a temperature included in the range of 70 ° C to 150 ° C by the above-described heating unit 13. By setting the temperature of the processing target S to 70 ° C. or more, the condensation of the silane coupling agent and the hydroxy group is surely caused, and by setting the temperature of the processing target S to 150 ° C. or less, The polymerization of the ring agents is suppressed.

  In addition, it is preferable that adding a hydroxy group to the surface SF includes that the temperature of the processing target S is 70 ° C. or more and 150 ° C. or less. That is, when adding a hydroxy group to the surface SF, it is preferable that the heating target 13 heats the processing target S to a temperature included in the range of 70 ° C to 150 ° C. Thus, the temperature of the processing target S is 70 ° C. or more and 150 ° C. or less before the supply of the silane coupling agent, and after the hydroxy group is added to the surface SF, the temperature of the processing target S decreases. There is no waiting time to increase the temperature to increase the reaction between the ring agent and the hydroxy group.

  As shown in FIG. 4, an organic group containing silicon is added to the surface SF of the processing target S by condensation of the methoxy group and the hydroxy group. Thereby, a monomolecular layer is formed on the surface SF by the plurality of organic groups added to the surface SF. The organic group added to the surface SF includes Y, which is a functional group having reactivity with an organic substance. Therefore, the monolayer has reactivity with the resin layer attached on the monolayer.

  When adding a hydroxy group to the surface SF of the processing target S and condensing the hydroxy group with the silane coupling agent in a liquid phase, moisture is adsorbed to the processing target S. Therefore, it is necessary to sufficiently dry the processing target S in order to avoid the influence of moisture on the processes after the surface treatment and the characteristics of the printed wiring board. On the other hand, according to the surface treatment method of the present embodiment, the addition of the hydroxy group to the surface of the treatment target S and the condensation of the hydroxy group with the silane coupling agent are performed in the gas phase. Therefore, moisture does not adsorb to the processing target S. Therefore, time for drying the processing target S can be omitted.

[Manufacturing method of printed wiring board]
A method for manufacturing a printed wiring board will be described with reference to FIGS. Hereinafter, in the method of manufacturing a printed wiring board, a step of forming a monomolecular layer on the surface SF of the processing target S and a step of bonding a resin layer to the surface SF of the processing target S via the monomolecular layer Only will be described in detail. In FIGS. 6 and 7, for convenience of illustration, a monomolecular layer composed of an organic group is illustrated as one layer having a predetermined thickness.

  The method for manufacturing a printed wiring board includes condensing a hydroxy group and a silane coupling agent SC by the above-described surface treatment method, and attaching a resin layer containing an epoxy resin to the surface of the processing target S. Condensing the hydroxy group with the silane coupling agent SC includes providing the silane coupling agent SC having an amino group at the terminal. Thereby, the amino group derived from the silane coupling agent is added to the surface SF of the processing target S, so that the epoxy group and the amino group contained in the epoxy resin are condensed. Hereinafter, a method for manufacturing a printed wiring board will be described in more detail with reference to FIGS.

  As shown in FIG. 5, when manufacturing a printed wiring board, first, a base material 41 formed of a prepreg or the like is prepared. Then, the wiring 42 that fills the through hole 41 a of the base material 41 and forms the surface SF of the processing target S is formed in the base material 41. Thereby, the processing target S can be obtained. In the present embodiment, the wiring 42 is located on both the front surface 41F and the rear surface 41R of the base material 41, thereby forming a part of the first surface SF1 and a part of the second surface SF2 in the processing target S. ing. That is, in the present embodiment, both the first surface SF1 and the second surface SF2 of the processing target S are examples of the surface SF of the processing target S.

  As shown in FIG. 6, by adding a hydroxy group to the first surface SF1 and the second surface SF2 of the processing target S and condensing the hydroxy group with the silane coupling agent SC, the first processing target S is processed. On the surface SF1 and the second surface SF2, the monomolecular layer 43 composed of the above-described organic group is formed. In FIG. 6, the monomolecular layer 43 is illustrated only on the wiring 42, but actually, the monomolecular layer 43 is also formed on a portion of the base material 41 exposed from the wiring 42. .

  As shown in FIG. 7, a resin layer 44 containing an epoxy resin is attached to each of the first surface SF1 and the second surface SF2 of the processing target S. Thus, the amino group contained in the organic group constituting the monomolecular layer 43 reacts with the epoxy group located at the end of the epoxy resin, whereby the amino group and the epoxy group are chemically bonded. Hereinafter, the bonding between the amino group and the epoxy group will be described in more detail with reference to FIGS.

FIG. 8 shows an example of the structure of the epoxy resin forming the resin layer 44.
As shown in FIG. 8, an epoxy group (C ₂ H ₄ O group) is located at each end of the epoxy resin. In FIG. 8, the epoxy group at one end is surrounded by a broken line. The resin layer 44 is formed of a plurality of epoxy resins having a predetermined molecular weight, in other words, a polymer.

As shown in FIG. 9, the epoxy group located at the end of a part of the polymer constituting the resin layer 44 is exposed on the surface of the resin layer 44. An organic group containing silicon is added to the wiring 42 configuring the surface SF of the processing target S. Note that the silane coupling agent SC used for adding an organic group to the first surface SF1 and the second surface SF2 of the processing target S has an amino group (NH ₂ group) at the end. Therefore, the organic group added to the first surface SF1 and the second surface SF2 also has an amino group at the terminal.

  As shown in FIG. 10, since the amino group has reactivity with the epoxy group, the polymer included in the resin layer 44 is condensed with the amino group and the epoxy group, and the polymer contained in the resin layer 44 passes through the organic group to form a second polymer. It couple | bonds with each of 1st surface SF1 or 2nd surface SF2.

  As shown in FIG. 11, since the amino group can be condensed with two epoxy groups, the amino group is further condensed with the epoxy group of another polymer, so that the other polymer contained in the resin layer 44 can be condensed. To the first surface SF1 or the second surface SF2 via the same organic group.

  When the printed wiring board is manufactured, the steps described above with reference to FIGS. 6 and 7 and the step of forming a new wiring connected to the wiring already formed on the resin layer 44 are performed on each surface. It is alternately repeated a plurality of times. Thereby, a multilayer wiring layer is formed on each of the front surface 41F and the back surface 41R of the base material 41.

[Application example of printed wiring board]
Referring to FIG. 12, an application example of the printed wiring board will be described.
As shown in FIG. 12, the printed circuit board 50 includes a printed wiring board 51 and a plurality of mold chips 60. Each mold chip 60 is mounted on the printed wiring board 51 by solder 52. The printed wiring board of the present embodiment can be applied to the printed wiring board 51.

  Each mold chip 60 includes a printed wiring board 61, a plurality of IC chips 62, a solder 63, and a mold resin 64. Each IC chip 62 is mounted on the printed wiring board 61 by solder 63. The mold resin 64 covers the whole of the plurality of IC chips 62 and the solder 63 that connects each IC chip 62 to the printed wiring board 61. The printed wiring board of the present embodiment can be applied to the printed wiring board 61.

  According to the printed circuit board 50 including the printed wiring boards 51 and 61, even if a high-frequency device using a high frequency as a signal is mounted as the IC chip 62, the occurrence of signal delay in the printed wiring boards 51 and 61 is suppressed. Can be

As described above, according to the surface treatment method, the method for manufacturing a printed wiring board, and the embodiment of the surface treatment device, the following effects can be obtained.
(1) A functional group included in the resin forming the resin layer 44 and a functional group included in the silane coupling agent added to the surface SF of the processing target S and capable of reacting with an organic substance are included. Condenses. In other words, the surface SF of the processing target S and the resin layer 44 are chemically bonded. Therefore, the adhesion between the surface SF of the processing target S and the resin layer 44 can be improved without forming irregularities on the surface SF of the processing target S. As a result, it is possible to suppress the signal delay in the wiring 42 while improving the adhesion between the wiring 42 and the resin layer 44.

(2) Roughness on the surface SF of the processing target S is suppressed more than when the ions contained in the plasma are supplied to the surface.
(3) By setting the temperature of the processing target S to 70 ° C. or more, condensation of the silane coupling agent SC and the hydroxy group is reliably caused, and the temperature of the processing target S is set to 150 ° C. or less. Thus, polymerization of the silane coupling agents SC is suppressed.

  (4) Before the supply of the silane coupling agent SC, the temperature of the processing target S is 70 ° C. or more and 150 ° C. or less. There is no waiting time to increase the temperature to increase the reaction between the ring agent and the hydroxy group.

(5) Since the amino group derived from the silane coupling agent SC is added to the surface SF of the processing target S, the epoxy group contained in the epoxy resin and the amino group are condensed.
(6) Since the silane coupling agent SC is not mixed into the passage of the gas containing oxygen and hydrogen, radicals generated from the gas containing oxygen and hydrogen are prevented from being deactivated due to the silane coupling agent SC. Can be

The above-described embodiment can be modified and implemented as follows.
[Hydroxy group addition part]
-The hydroxy group addition part 10A may be comprised from an ultraviolet irradiation part and an ozone supply part. The ozone supply unit supplies ozone to the surface of the processing target S, and the ultraviolet irradiation unit irradiates the surface SF to which ozone is supplied with ultraviolet light, thereby adding a hydroxy group to the surface SF. is there.

  The hydroxy group addition unit 10A may add a hydroxy group to the surface SF by supplying ions contained in the plasma to the surface SF of the processing target S. Even with such a configuration, it is possible to suppress the signal delay in the printed wiring board as compared with a case where the adhesion between the processing target S and the resin layer 44 is increased by roughening the surface SF of the processing target S.

[Silane coupling agent supply unit]
If the vapor pressure of the silane coupling agent is high enough to stably maintain the flow rate of the silane coupling agent over the period of supplying the silane coupling agent to the gas phase space 11A, the silane coupling agent supply unit 10B , The buffer chamber 32 and the valve 33 located upstream of the buffer chamber 32 can be omitted.

[Silane coupling agent]
-The silane coupling agent may have a functional group other than an amino group as a functional group which reacts with an organic substance. In this case, a functional group capable of condensing with a functional group located at a terminal of the polymer contained in the resin layer may be selected as the functional group contained in the silane coupling agent.

  DESCRIPTION OF SYMBOLS 10 ... Surface treatment apparatus, 10A ... Hydroxy group addition part, 10B ... Silane coupling agent supply part, 11 ... Processing tank, 11A ... Gas phase space, 11a ... Supply port, 11b ... Exhaust port, 12 ... Support part, 13 ... Heating part, 14 ... passage member, 14a, 41a ... through hole, 15 ... shower plate, 16 ... transmission window, 17 ... waveguide, 18 ... gas supply ring, 21 ... gas supply part, 22 ... microwave source, 31 ... Raw material tank, 32 buffer chamber, 33 valve, 34 variable flow valve, 41 base material, 41R back surface, 42 wiring, 43 monolayer, 44 resin layer, 50 printed circuit board, 51, 61 printed wiring board, 52, 63 solder, 60 mold chip, 62 IC chip, 64 mold resin, R radical, S processing target, SC silane coupling agent, 41F, SF Surface, SF1 ... first surface, SF2 ... second surface.

Claims (7)

In the gas phase, adding a hydroxy group to the surface of the processing object having wiring,
In the gaseous phase, a silane coupling agent having a functional group reactive with the hydroxy group at a terminal is supplied to the surface to which the hydroxy group is added, and the hydroxy group and the silane are added to the surface. Condensing with a coupling agent. The surface treatment method according to claim 1, wherein adding the hydroxy group supplies radicals contained in plasma generated from a gas containing oxygen and hydrogen to the surface. The surface treatment method according to claim 1, wherein condensing the hydroxy group and the silane coupling agent includes a temperature of the treatment target being 70 ° C. or more and 150 ° C. or less. The surface treatment method according to claim 3, wherein adding the hydroxy group to the surface includes that the temperature of the treatment target is 70 ° C. or more and 150 ° C. or less. Condensing the hydroxy group and the silane coupling agent by the surface treatment method according to any one of claims 1 to 4,
Affixing a resin layer containing an epoxy resin to the surface,
The method of manufacturing a printed wiring board, wherein condensing the hydroxy group and the silane coupling agent includes supplying the silane coupling agent having an amino group at a terminal. A processing tank that partitions a gas phase space that contains a processing target including a surface having wiring,
For the processing object accommodated in the gas phase space, a hydroxy group addition unit that adds a hydroxy group,
A silane coupling agent supply unit for supplying a silane coupling agent having a functional group reactive with the hydroxy group at the terminal to the surface to which the hydroxy group is added in the gas phase space. apparatus. The hydroxy group addition unit, for the gas phase space, separately from the silane coupling agent supplied by the silane coupling agent supply unit, a gas supply unit that supplies a gas containing oxygen and hydrogen,
The surface treatment apparatus according to claim 6, further comprising: a radical supply unit configured to generate plasma from the gas and supply radicals included in the plasma to the surface.

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