SG11201600586XA - Prepreg, metal foil-clad laminate, and printed wiring board - Google Patents
Prepreg, metal foil-clad laminate, and printed wiring boardInfo
- Publication number
- SG11201600586XA SG11201600586XA SG11201600586XA SG11201600586XA SG11201600586XA SG 11201600586X A SG11201600586X A SG 11201600586XA SG 11201600586X A SG11201600586X A SG 11201600586XA SG 11201600586X A SG11201600586X A SG 11201600586XA SG 11201600586X A SG11201600586X A SG 11201600586XA
- Authority
- SG
- Singapore
- Prior art keywords
- prepreg
- wiring board
- printed wiring
- metal foil
- clad laminate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/248—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using pre-treated fibres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/14—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor using multilayered preforms or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/06—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials
- C08J5/08—Reinforcing macromolecular compounds with loose or coherent fibrous material using pretreated fibrous materials glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/10—Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
- B29K2105/0872—Prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2300/00—Characterised by the use of unspecified polymers
- C08J2300/24—Thermosetting resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013186307 | 2013-09-09 | ||
| JP2014028381 | 2014-02-18 | ||
| PCT/JP2014/070742 WO2015033731A1 (en) | 2013-09-09 | 2014-08-06 | Prepreg, metal foil-clad laminate, and printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201600586XA true SG11201600586XA (en) | 2016-02-26 |
Family
ID=52628214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201600586XA SG11201600586XA (en) | 2013-09-09 | 2014-08-06 | Prepreg, metal foil-clad laminate, and printed wiring board |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10791626B2 (en) |
| EP (1) | EP3045283B1 (en) |
| JP (2) | JP6421755B2 (en) |
| KR (2) | KR102267649B1 (en) |
| CN (2) | CN105517767B (en) |
| SG (1) | SG11201600586XA (en) |
| TW (2) | TWI702128B (en) |
| WO (1) | WO2015033731A1 (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5831665B1 (en) * | 2015-08-12 | 2015-12-09 | 日東紡績株式会社 | Glass cloth |
| JP6664092B2 (en) * | 2015-10-07 | 2020-03-13 | パナソニックＩｐマネジメント株式会社 | Resin composition, resin varnish, prepreg, metal-clad laminate, and printed wiring board |
| JP6020764B1 (en) * | 2016-08-03 | 2016-11-02 | 日東紡績株式会社 | Glass cloth |
| JP6969574B2 (en) * | 2016-11-09 | 2021-11-24 | 昭和電工マテリアルズ株式会社 | FRP precursor manufacturing method, laminated body manufacturing method, printed wiring board manufacturing method, semiconductor package manufacturing method |
| US11098195B2 (en) * | 2017-02-07 | 2021-08-24 | Mitsubishi Gas Chemical Company, Inc. | Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed circuit board |
| KR102056303B1 (en) | 2017-05-15 | 2019-12-16 | 주식회사 엘지화학 | Resin composition for semiconductor package, prepreg and metal clad laminate using the same |
| KR102419891B1 (en) * | 2017-08-14 | 2022-07-13 | 삼성전자주식회사 | Circuit board and semiconductor package using the same |
| KR102083587B1 (en) * | 2018-02-22 | 2020-03-02 | 니토 보세키 가부시기가이샤 | Glass cloth, prepreg and glass fiber reinforced resin molding |
| JP7434707B2 (en) * | 2018-11-30 | 2024-02-21 | 株式会社レゾナック | FRP precursor, FRP, laminate, metal clad laminate, printed wiring board, semiconductor package, and method for producing FRP precursor |
| JP6589172B1 (en) * | 2019-01-11 | 2019-10-16 | 吉川工業株式会社 | Laminated iron core |
| JP7434855B2 (en) | 2019-12-04 | 2024-02-21 | 住友ベークライト株式会社 | Prepreg, printed wiring boards and semiconductor devices |
| US20230122917A1 (en) * | 2020-03-31 | 2023-04-20 | Denka Company Limited | Semicured product complex and method for producing same, cured product complex and method for producing same, and thermosetting composition used to impregnate porous body |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5202775B2 (en) | 2000-05-23 | 2013-06-05 | 三菱瓦斯化学株式会社 | Prepreg, metal-clad laminate and use thereof |
| JP2004149577A (en) | 2002-10-28 | 2004-05-27 | Matsushita Electric Works Ltd | Prepreg and laminated sheet |
| JP4192054B2 (en) | 2003-07-31 | 2008-12-03 | ユニチカ株式会社 | Super lightweight glass cloth |
| JP4446754B2 (en) * | 2004-01-27 | 2010-04-07 | 旭化成イーマテリアルズ株式会社 | Glass cloth |
| JP4407823B2 (en) | 2004-02-18 | 2010-02-03 | 三菱瓦斯化学株式会社 | Novel cyanate ester compound, flame retardant resin composition, and cured product thereof |
| WO2008099940A1 (en) | 2007-02-16 | 2008-08-21 | Sumitomo Bakelite Co., Ltd. | Circuit board manufacturing method, semiconductor manufacturing apparatus, circuit board and semiconductor device |
| JP2009231222A (en) | 2008-03-25 | 2009-10-08 | Ajinomoto Co Inc | Insulating resin sheet |
| JP4613977B2 (en) * | 2008-04-28 | 2011-01-19 | 日立化成工業株式会社 | Prepreg including thin-layer quartz glass cloth and wiring board using the same |
| JP5177742B2 (en) * | 2008-04-28 | 2013-04-10 | 信越石英株式会社 | Quartz glass cloth |
| JP5453746B2 (en) * | 2008-07-30 | 2014-03-26 | 日東紡績株式会社 | Glass cloth manufacturing method and glass cloth |
| US9238720B2 (en) | 2009-02-25 | 2016-01-19 | Mitsubishi Gas Chemical Company, Inc. | Prepreg and laminate |
| JP2011001473A (en) * | 2009-06-19 | 2011-01-06 | Hitachi Chem Co Ltd | Insulating material for electronic component |
| KR20120123031A (en) * | 2009-12-25 | 2012-11-07 | 히다찌 가세이 고오교 가부시끼가이샤 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate |
| CN102822228B (en) * | 2010-03-26 | 2015-03-25 | 松下电器产业株式会社 | Epoxy resin composition for prepreg, prepreg, and multilayer printed circuit board |
| KR101856806B1 (en) | 2011-01-20 | 2018-06-19 | 미츠비시 가스 가가쿠 가부시키가이샤 | Resin composition, prepreg and laminate |
| SG10201600443SA (en) * | 2011-03-07 | 2016-02-26 | Mitsubishi Gas Chemical Co | Resin composition, and prepreg as well as laminate using the same |
| SG195033A1 (en) | 2011-05-31 | 2013-12-30 | Mitsubishi Gas Chemical Co | Resin composition, prepreg and laminate |
-
2014
- 2014-08-06 KR KR1020167005492A patent/KR102267649B1/en active IP Right Grant
- 2014-08-06 WO PCT/JP2014/070742 patent/WO2015033731A1/en active Application Filing
- 2014-08-06 SG SG11201600586XA patent/SG11201600586XA/en unknown
- 2014-08-06 JP JP2015535396A patent/JP6421755B2/en active Active
- 2014-08-06 US US14/913,766 patent/US10791626B2/en active Active
- 2014-08-06 CN CN201480049713.5A patent/CN105517767B/en active Active
- 2014-08-06 KR KR1020217000707A patent/KR102328216B1/en active IP Right Grant
- 2014-08-06 CN CN201810339451.6A patent/CN108503868A/en active Pending
- 2014-08-06 EP EP14842952.5A patent/EP3045283B1/en active Active
- 2014-09-05 TW TW107120613A patent/TWI702128B/en active
- 2014-09-05 TW TW103130896A patent/TWI631000B/en active
-
2018
- 2018-10-05 JP JP2018189714A patent/JP6628213B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI702128B (en) | 2020-08-21 |
| KR20160053920A (en) | 2016-05-13 |
| JPWO2015033731A1 (en) | 2017-03-02 |
| WO2015033731A1 (en) | 2015-03-12 |
| KR102267649B1 (en) | 2021-06-21 |
| EP3045283B1 (en) | 2023-11-01 |
| TW201524728A (en) | 2015-07-01 |
| KR20210006528A (en) | 2021-01-18 |
| CN108503868A (en) | 2018-09-07 |
| EP3045283A4 (en) | 2017-05-10 |
| JP6628213B2 (en) | 2020-01-08 |
| EP3045283A1 (en) | 2016-07-20 |
| US10791626B2 (en) | 2020-09-29 |
| TWI631000B (en) | 2018-08-01 |
| CN105517767A (en) | 2016-04-20 |
| TW201831294A (en) | 2018-09-01 |
| JP2018204037A (en) | 2018-12-27 |
| US20160219700A1 (en) | 2016-07-28 |
| KR102328216B1 (en) | 2021-11-17 |
| CN105517767B (en) | 2018-04-20 |
| JP6421755B2 (en) | 2018-11-14 |
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