JP2011001473A - Insulating material for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulating material for an electronic component showing excellence in high adhesion, low thermal expansion, low dielectric loss and processability.SOLUTION: The insulating material for the electronic component is composed of a resin composition containing a crosslinked resin component obtained by adding 0.1 to 15 pts.wt. of a polyfunctional crosslinking auxiliary having a molecular weight of not more than 1,000 to 85 to 99.9 pts.wt. of a thermosetting compound, 10 to 50 pts.wt. of a polymer component and 40 to 400 pts.wt. of an inorganic filler. The elongation of the polymer component is 700% or more.

Description

  The present invention relates to an insulating material for electronic parts.

  In recent years, electronic devices have become smaller and lighter, and with regard to electronic circuit boards used therefor, it has been studied to reduce the board size by increasing the wiring density, such as multilayering, fine wiring, and shortening the distance between wirings. Yes. Even in semiconductor devices in which electronic components such as semiconductor elements are mounted on a substrate, the conventional method of providing a metal cap has shifted to a method of packaging by resin sealing, and the semiconductor device has been reduced in size, thickness and height. Costs are being reduced.

  In order to achieve the above-mentioned higher density, smaller size, and thinner thickness, it is indispensable to improve the connection reliability of wiring and electronic components. In particular, there is a strong demand for high adhesion and low thermal expansion of the multilayer substrate and the sealing material.

  In addition, high-capacity and high-speed information communication such as PHS and mobile phones and computer clock frequency are increasing. The transmission loss of an electric signal mainly includes a dielectric loss, a conductor loss, and a radiation loss, and the transmission loss tends to increase as the frequency of the electric signal increases. Since transmission loss attenuates an electrical signal and impairs the reliability of the electrical signal, a wiring board that handles high-frequency signals must be devised to suppress an increase in dielectric loss, conductor loss, and radiation loss.

  The dielectric loss is proportional to the square root of the dielectric constant of the insulator forming the circuit, the dielectric loss tangent and the frequency of the signal used. Therefore, an increase in dielectric loss can be suppressed by selecting an insulating material having a low relative dielectric constant and dielectric loss tangent as the insulator.

  The conductor loss is derived from a phenomenon (skin effect) that, when a high-frequency current flows through a circuit, the current density increases as it approaches the surface of the conductor and decreases as it moves away from the surface of the conductor. Therefore, reduction is possible by reducing the surface roughness of the conductor layer. However, when the surface roughness of the conductor layer is reduced, there arises a new problem that the adhesiveness with the insulating layer is lowered.

  In view of the above, it can be said that the insulating material should satisfy the requirements for low dielectric loss in addition to high adhesion and low thermal expansion.

  A conventional typical low dielectric loss material is a fluororesin represented by polytetrafluoroethylene (PTFE). Fluororesin has a low relative dielectric constant and dielectric loss tangent, and has long been used as a substrate material for high-frequency signals. However, PTFE and the like are likely to be deformed at high temperatures and have low workability and adhesiveness, so that they are extremely difficult to apply to sealing materials and multilayer substrates.

  On the other hand, various non-fluorine-based low dielectric constant and low dielectric loss tangent insulating materials that are easy to prepare varnishes with organic solvents, have a low molding temperature and curing temperature, and are easy to handle have been studied.

  For example, Patent Document 1 discloses an example in which a glass cloth is impregnated with a diene polymer such as polybutadiene and cured with a peroxide.

  Patent Document 2 discloses an example in which a cyanate ester, a diene polymer, and an epoxy resin are heated to form a B stage.

  Patent Document 3 discloses an example of a resin composition comprising an allylated polyphenylene ether and triallyl isocyanate.

  Patent Document 4 discloses a low dielectric loss tangent resin composition containing a crosslinking component having a plurality of styrene groups.

  Patent Document 5 discloses an example in which a polyfunctional styrene compound having an all-hydrocarbon skeleton is used as a crosslinking component.

  However, no system has yet been found that satisfies all of high adhesion, low thermal expansion and low dielectric loss.

  On the other hand, when used for an insulating layer of a wiring board, glass cloth is often included as a base material, and various studies have been made on the low dielectric constant and low dielectric loss tangent of the base material.

  Examples include NE glass cloth that defines the compounding ratio of silicon oxide, aluminum oxide, boron oxide, and the like described in Patent Document 6, glass cloth that combines quartz glass fiber and non-quartz glass fiber described in Patent Document 7, Examples thereof include a fine-wire quartz cloth fiber having a diameter of 7 μm or less described in Patent Document 8, a method for producing a cloth using the same.

  By combining a low-permittivity and low-dielectric loss tangent cloth or nonwoven fabric with an insulating material that satisfies all of high adhesion, low thermal expansion and low dielectric loss, it has excellent high-frequency signal transmission characteristics. It is possible to obtain wiring board materials such as a high-frequency printed board, a multilayer printed board, a laminated board used therefor, and a prepreg that have excellent reliability while being compatible with wiring processing.

  Patent Document 9 provides a low dielectric loss resin composition that is soluble in a low-boiling general-purpose solvent while maintaining the excellent properties of polyphenylene ether and excellent in processability of a wiring board. As an object, a low dielectric loss resin for multilayer wiring boards, which is a copolymer composed of repeating units represented by a specific structural formula, is disclosed.

Japanese Patent Laid-Open No. 08-208856 Japanese Patent Laid-Open No. 11-124491 JP 09-246429 A Japanese Patent Laid-Open No. 2002-249531 JP 2005-89691 A JP 09-74255 A JP 2005-336695 A JP 2006-282401 A JP 2006-93690 A

  An object of the present invention is to provide an insulating material for electronic parts that is excellent in high adhesion, low thermal expansion, low dielectric loss, and workability.

  The insulating material for electronic parts of the present invention comprises a crosslinked resin component obtained by adding 0.1 to 15 parts by weight of a polyfunctional crosslinking aid having a molecular weight of 1000 or less to 85 to 99.9 parts by weight of a thermosetting compound, and a high molecular weight component It is comprised with the resin composition containing 10-50 weight part and 40-400 weight part of inorganic fillers, The elongation rate of the said high molecular weight component is 700% or more, It is characterized by the above-mentioned.

  ADVANTAGE OF THE INVENTION According to this invention, the insulating material for electronic components excellent in high adhesiveness, low thermal expansion property, low dielectric loss property, and workability can be provided.

It is a graph which shows the temperature dependence of the equilibrium elastic modulus which the insulating material for electronic components of the Example by this invention has. It is a graph which shows the copper foil peel strength and the thermal expansion coefficient with respect to the elongation rate of the elastomer contained in the insulating material for electronic components of the Example by this invention. It is a schematic cross section which shows the manufacturing process of the module precursor of this invention. It is a schematic cross section which shows the process of forming interlayer wiring in the copper clad laminated board of this invention.

  The present invention relates to an electronic component insulating material applicable to a sealing material for electronic components (for example, semiconductor elements) and a prepreg for a multilayer substrate, and in particular, an insulating material for electronic components that achieves both low thermal expansion and high adhesiveness. Further, the present invention relates to a sealing material, a liquid potting agent, a sealing resin film, an electronic component adhesive film, a prepreg sheet, a wiring board material such as a laminated board, and a printed board using the same.

  As described in the background art above, in order to achieve a reduction in size, thickness and cost of a semiconductor device, it is indispensable to improve the connection reliability of wiring and electronic components. In particular, it is important that the sealing material in contact with the electronic components and the wiring circuit is configured so that deformation or damage due to heat or stress applied to the circuit does not occur, and high adhesion and low thermal expansion of the multilayer substrate and the sealing material. There is a strong demand for it.

  An object of the present invention is to provide an insulating material for electronic components having low thermal expansion and high adhesiveness, and an electronic component using the insulating material for electronic components, which enables mounting and sealing of the electronic components all at once. It is providing the module using the sealing material for electronic devices, and this electronic material sealing material.

  Patent Document 5 discloses wiring board materials such as a prepreg, a laminated board, a wiring board, and a multilayer wiring board using a resin composition having a polyfunctional styrene compound having a very low dielectric loss tangent as a crosslinking component. Yes. The dielectric loss tangent of the insulating layer has an extremely excellent characteristic of 0.0009 at 10 GHz. However, the laminated board, wiring board, and multilayer wiring board described in Patent Document 5 have room for improvement with respect to drilling workability (drilling workability). That is, the laminated board, wiring board, and multilayer wiring board to which quartz glass cloth is applied are very hard, and the drilling workability by a drill or the like is not sufficient as compared with the case of using a general glass cloth.

  As a technology to improve processability while maintaining the low dielectric loss tangent of quartz glass cloth, we have developed a technique using a composite cloth in which quartz fiber and olefin fiber such as polypropylene, polyethylene and polymethylpentene are combined. A technology for applying a thin quartz cloth having a thin and dense structure has been found and studied. As a result, as a common problem for practical application of the composite cloth and the thin quartz cloth, a thermal expansion coefficient in the thickness direction (Z-axis direction) when applied to a laminated board or a printed board (hereinafter abbreviated as a thermal expansion coefficient). ) Was found to be reduced.

  This is because in the case of composite cloth, the thermal expansion coefficient tends to increase due to the influence of olefin fibers contained in the cloth, and in the case of thin quartz cloth, the resin composition is easily applied excessively during the production of the prepreg, The content rate of the glass fiber etc. which are the low thermal expansion components in a system fell, and the thermal expansion coefficient of the laminated board and the printed circuit board increased.

  The problem of the coefficient of thermal expansion can be solved by highly filling the resin composition with a low thermal expansion inorganic filler such as quartz. However, in general, a resin composition highly filled with an inorganic filler is hard and forms a brittle cured product, which causes a new problem that the adhesive strength with a conductor layer is reduced. Moreover, since the high temperature fluidity before heat-curing of a resin composition is remarkably impaired, work moldability is low, and an excessive amount of filling with an inorganic filler is not preferable.

  The fundamental reason why the inorganic filler needs to be highly filled is that the thermal expansion coefficient of the resin component contained in the resin composition is still high, and strong support of the inorganic filler or the like is essential. Conversely, it can be estimated that by reducing the thermal expansion coefficient of the resin component to a low level, it is possible to achieve low thermal expansion without using an excessive amount of inorganic filler. Moreover, it is thought that the adhesive force of a resin composition also improves by the reduction of filler addition amount.

  Another object of the present invention is to provide an insulating material for electronic parts that can achieve both high adhesion and low thermal expansion even under conditions where the inorganic filler filling amount is low as well as the inorganic filler filling amount being low. It is to provide.

  Still another object of the present invention is to apply to a wiring board material by combining the above insulating material for electronic parts and a low dielectric loss cloth, low dielectric loss property, low thermal expansion property, high adhesiveness and excellent Another object of the present invention is to provide a prepreg, a laminated board, a printed wiring board, and a multilayer printed board that satisfy all the drilling workability.

  The present invention is characterized by the following configurations.

  (1) Insulating material for electronic parts of the present invention is 0.1 to 15 parts by weight of polyfunctional crosslinking aid (B) having a molecular weight of 1000 or less to 85 to 99.9 parts by weight of thermosetting compound (A). The resin composition comprising a crosslinked resin component, 10 to 50 parts by weight of a high molecular weight component (C), and 40 to 400 parts by weight of an inorganic filler (D). It is also characterized by being 700% or more.

  (2) In addition to the above feature (1), the insulating material for electronic parts of the present invention has a crosslink density of a cured product of the resin composition represented by the following formula (1) of 2.0 mol / L (mol / liter). ) That's it.

  (3) In addition to the characteristics (1) or (2) above, the insulating material for electronic parts of the present invention is such that the thermosetting compound is a thermosetting polyphenylene ether compound and the high molecular weight component is hydrogenated. It is a styrene-based elastomer, and the inorganic filler is a spherical silicon oxide filler.

  (4) In addition to the above feature (3), the insulating material for electronic parts of the present invention is represented by the following chemical formula (1) or (2), and is measured by gel permeation chromatography. It is a compound having a number average molecular weight in terms of styrene of 1000 to 15000.

(The above chemical formula (1) represents a polymer or random copolymer containing one or two phenol derivatives, l and m are degrees of polymerization, and at least one is represented by an integer that is not 0. The coalesced or random copolymer may have a molecular weight distribution: R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ and R ⁸ are hydrogen atoms, halogen atoms, or carbon Each of which may be the same or different, and at least one is a hydrocarbon group containing an unsaturated hydrocarbon group having 2 to 10 carbon atoms, and R ⁹ is hydrogen. An atom, a halogen atom, or a hydrocarbon group having 1 to 10 carbon atoms.)

(The above chemical formula (2) represents a polymer containing a phenol derivative, n and o are polymerization degrees, at least one is represented by an integer other than 0, and this polymer may have a molecular weight distribution. P and q are each independently an integer of 0 or 1. R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ and R ¹⁷ are each a hydrogen atom or a halogen atom; Or a hydrocarbon group having 1 to 10 carbon atoms, which may be the same or different, and each of R ¹⁸ , R ¹⁹ , R ²⁰ and R ²¹ is a hydrogen atom or a halogen atom, or a carbon atom having 1 to 10 carbon atoms. Each of which may be the same or different, and W and X are each an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, The same Is optionally may .Y and Z also has a structure represented by the following chemical formula (3) or (4).)

(The above chemical formula (3) represents a functional group having a styrene skeleton, and R ²² , R ²³ , R ²⁴ , R ²⁵ , R ²⁶ , R ²⁷ and R ²⁸ are hydrocarbon groups having 1 to 10 carbon atoms. , A hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom, which may be the same or different.

(The above chemical formula (4) represents a bridging group having an epoxy skeleton, and R ²⁹ is an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. ³⁰ , R ³¹ and R ³² are each a hydrocarbon group having 1 to 10 carbon atoms and may contain a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, and they may be the same or different. May be.)
(5) In the insulating material for electronic parts of the present invention, in addition to the above-mentioned feature (3) or (4), the polyfunctional crosslinking aid contains at least one heterocyclic compound containing a nitrogen atom in the ring structure. It is characterized by including.

  (6) The insulating material for electronic parts according to the present invention is characterized in that, in addition to the feature (5), the heterocyclic compound is a compound represented by the following chemical formula (5) or (6): .

(In the above chemical formula (5), R ³³ , R ³⁴ and R ³⁵ are organic groups having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. R ³⁶ , R ³⁷ , R ³⁸ , R ³⁹ , R ⁴⁰ , R ⁴¹ , R ⁴² , R ⁴³ and R ⁴⁴ are each a hydrocarbon group having 1 to 10 carbon atoms, a hydrogen atom, a halogen atom An atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom may be contained, and each may be the same or different.)

(In the above chemical formula (6), R ⁴⁵ , R ⁴⁶ and R ⁴⁷ are organic groups having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. R ⁴⁸ , R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵³ , R ⁵⁴ , R ⁵⁵ and R ⁵⁶ are each a hydrocarbon group having 1 to 10 carbon atoms, a hydrogen atom, a halogen atom An atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom may be contained, and each may be the same or different.)
(7) In addition to any of the above characteristics (3) to (6), the hydrogenated styrene elastomer is an styrene-equivalent number average molecular weight in gel permeation chromatography measurement. Is 50,000 to 100,000, and the styrene content is 10 to 40% by weight.

  (8) In addition to any of the above characteristics (3) to (7), the insulating material for electronic components of the present invention has an average particle size of the spherical silicon oxide filler of 0.2 to 3 μm, It is characterized in that at least one silane coupling agent of vinyl type, methacrylate type, acrylate type or styrene type is supported.

  (9) In addition to any of the above characteristics (3) to (8), the insulating material for electronic parts of the present invention further includes at least a flame retardant represented by the following chemical formula (7) or (8): One or more types are included.

  (10) The insulating material for electronic parts of the present invention is characterized in that, in addition to any of the above characteristics (3) to (9), a polyfunctional styrene compound represented by the following chemical formula (9) is further included. To do.

(The chemical formula (9) represents a polyfunctional styrene compound having a plurality of styrene type skeletons, and r represents an integer of 2 or more. R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶¹ , R ⁶² and R ⁶³ is a hydrocarbon group having 1 to 10 carbon atoms and may contain a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, and each may be the same or different. ⁶⁴ is an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom.
(11) The insulating material for electronic parts of the present invention is characterized by further including a bismaleimide compound represented by the following chemical formula (10) in addition to any of the above characteristics (3) to (10).

(In the chemical formula (10), R ⁶⁵ is a hydrocarbon group having 1 to 10 carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom. R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ , R ⁷² and R ⁷³ are each a hydrocarbon group having 1 to 4 carbon atoms, including a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. And each may be the same or different.)
(12) The insulating material for electronic components of the present invention includes a 1,2-polybutadiene compound represented by the following chemical formula (11) in addition to any of the above characteristics (3) to (11). Features.

(In the above chemical formula (11), s is the degree of polymerization and is represented by an integer of 1 or more. This compound may have a molecular weight distribution, and the number average molecular weight in terms of styrene in gel permeation chromatography measurement is 100,000 to 200,000.)
(13) The electronic component sealing material of the present invention is characterized by including an insulating material for electronic components having any one of the above characteristics (1) to (12).

  (14) The module of the present invention is characterized in that the electronic component sealing material having the above feature (13), a substrate on which a wiring pattern is formed, and an electronic component are laminated.

  (15) The liquid potting agent of the present invention is characterized in that 50 to 90 parts by weight of an insulating material for electronic parts having any one of the above characteristics (1) to (12) is dissolved in an organic solvent. To do.

  (16) The resin film for sealing an electronic component of the present invention is characterized by including an insulating material for an electronic component having any one of the above characteristics (1) to (12).

  (17) The adhesive film for electronic parts of the present invention includes an insulating material for electronic parts having any one of the above characteristics (1) to (12).

  (18) The prepreg of the present invention is characterized by having a structure in which a cloth or a nonwoven fabric is impregnated with an insulating material for electronic parts having any one of the above characteristics (1) to (12).

  (19) The prepreg of the present invention is characterized in that, in addition to the above feature (18), the cloth or the nonwoven fabric contains quartz fibers.

  (20) The prepreg sheet of the present invention is characterized in that, in addition to the above feature (18) or (19), the cloth or the nonwoven fabric contains a polyolefin fiber.

  (21) The laminated board of the present invention is characterized in that a conductor layer is provided on one or both sides of a cured product obtained by curing a prepreg having any one of the above characteristics (18) to (20).

  (22) The printed board of the present invention is characterized in that a conductor wiring is provided on one or both sides of a cured product obtained by curing the prepreg having any one of the above characteristics (18) to (20).

  (23) The multilayer printed board of the present invention is formed by alternately laminating a plurality of printed circuit boards having the above feature (22) and prepregs having any of the above features (18) to (20). It has a configuration, and has an interlayer wiring for electrically connecting the printed circuit board and the prepreg.

  (24) A module manufacturing method of the present invention is a method for manufacturing a module having a configuration in which an electronic component sealing material having the above feature (13), a substrate on which a wiring pattern is formed, and an electronic component are stacked. And the component fixing process which installs and fixes the said electronic component on the said board | substrate, installs the said sealing material for electronic components on the said board | substrate which fixed the said electronic component, and fixes by heat molding And a molding step.

  In semiconductor encapsulants and printed circuit boards, there is a demand for low thermal expansion of insulating materials. In particular, in multilayer printed circuit boards, low thermal expansion in the Z-axis direction is the reliability of interlayer connection using through holes and blind via holes. This is an important issue from the standpoint of improving safety. Generally, as a technique for reducing the thermal expansion of a resin, a technique for increasing the filling of a filler is known.

  However, since the insulating layer with a high filler content is hard and brittle, adhesion between the conductor layer and the electronic component and the insulating layer is impaired. The improvement of the adhesiveness is also an important issue, and 0.7 kN / m or more is preferable in this industry.

  As a technique for improving the adhesion between a conductor layer and an insulating layer in a printed board, a technique for applying a conductor layer having a large surface roughness or a technique for adding an elastomer component in a resin system is known. However, an increase in surface roughness is not preferable because it causes an increase in conductor loss.

  Usually, the surface roughness of a conductor (10-point average surface roughness, Rz, hereinafter referred to as surface roughness) is about 7 μm, but in a high-frequency signal printed circuit board, the surface roughness of the conductor layer is preferably 3 μm or less. Has been.

  Moreover, although an increase in the amount of the elastomer component has a certain effect on improving the adhesiveness, the coefficient of thermal expansion increases remarkably, making it difficult to maintain the shape under high temperature conditions. In addition, increasing the amount of the elastomer component has the problem of deteriorating moisture absorption heat resistance and solvent resistance, so it is difficult for conventional insulating materials to achieve both low thermal expansion and high adhesion that meet the challenges of this study. Met.

  As a result of intensive investigations on measures for reducing the thermal expansion in response to the above-mentioned problems, in the resin composite containing a plurality of components, between the crosslinking density of the crosslinking component contained in the resin and the thermal expansion coefficient. I found that there is a close relationship. Further, it has been newly found that by adding a polyfunctional crosslinking aid, a dense three-dimensional network structure is formed, the crosslinking density of the resin composite is increased, and as a result, low thermal expansion can be achieved.

  The crosslinking density n (mol / L) of the crosslinking component is generally determined by the equilibrium elastic modulus E ′ (Pa) in the dynamic thermoelasticity measurement (the storage elastic modulus when the equilibrium is reached at a temperature equal to or higher than the glass transition temperature). Value) and the absolute temperature T when the equilibrium elastic modulus is reached. By forming a dense three-dimensional network structure by adding a crosslinking aid, the crosslinking density shows a value of 2.0 (mol / L) or more, and it is estimated that the low thermal expansion has progressed as the crosslinking density increased. it can.

  Further, it has been found that the low thermal expansion of the resin material can maintain the low thermal expansion matching the problem of the present study even when the excessive amount of the inorganic filler is added, and even under the condition where the addition amount is small.

  In addition, as a method of enhancing the adhesiveness of the resin system even by adding a small amount of elastomer component, paying attention to the elongation at break of the elastomer, by applying a material having a break elongation of 700% or more, a specifically high adhesiveness is obtained. It was found to be expressed. The cross-linking component that forms a dense three-dimensional network structure contains minute domains containing a high-elongation and flexible elastomer component, so that the elastomer component in the system effectively disperses the stress generated by the adhesive interface. It is thought that this is because the stress concentration on the peeled portion is alleviated.

  The basic composition of the resin composition that achieves both low thermal expansion and high adhesiveness is as follows. The crosslinking component (A) is 85 to 99.9 parts by weight and the polyfunctional crosslinking assistant (B) having a molecular weight of 1000 or less is 0.1 to A resin composition containing 15 to 50 parts by weight of a crosslinked resin component, 10 to 50 parts by weight of a polymer component (C) having an elongation of 700% or more, and 40 to 400 parts by weight of an inorganic filler (D). It is desirable to be. In said structure, it is desirable that inorganic filler (D) is 40-400 weight part, and when setting it as the structure which considered drill drilling, workability, etc., it is more preferable that it is 40-100 weight part. By adopting this composition ratio, both low thermal expansion and high adhesion can be achieved.

  The combination of the crosslinking component and the high molecular weight component can be freely selected. In this combination, it is preferable from the viewpoint of workability such as varnishing and prepreging that both have the property of being soluble in the same single solvent or a mixed solvent having the same composition.

  Specifically, an epoxy resin having a plurality of epoxy groups as a crosslinking component, a phenol resin having a phenolic hydroxyl group, a cyanate resin having a plurality of cyanate groups, an acrylate resin having a plurality of acrylate groups or a methacrylate group, and an epoxy acrylate resin Is mentioned. The crosslinking aid is a compound having a molecular weight of 1000 or less, and if it is a polyfunctional compound containing a plurality of crosslinking groups in one molecule, the effects mentioned in this study can be obtained, but a particularly preferred compound Is a polyfunctional heterocyclic compound containing a nitrogen atom in its structure.

  Specifically, it is a compound containing a triazine ring in the skeleton, and examples thereof include triallyl isocyanurate, trimethallyl isocyanurate, triallyl cyanurate and the like. High molecular weight combinations of acrylonitrile butadiene rubber, epoxidized acrylonitrile butadiene rubber, natural rubber, polyamide elastomer, styrene-butadiene copolymer, styrene-butadiene-ethylene copolymer, styrene-ethylene, butylene copolymer, etc. Is mentioned.

  The blending ratio of the crosslinking component (A) and the crosslinking aid (B) is preferably 85 to 99.9 parts by weight of the crosslinking component, more preferably 90 to 90 parts by weight, with the total amount of the crosslinked resin component being 100 parts by weight. 99.9 parts by weight. Even when a very small amount of the crosslinking aid is added, the crosslinking density can be improved. On the other hand, if a crosslinking aid is added excessively, the crosslinked resin component becomes too dense, and the fine domains of the high molecular weight body may be broken. Further, as a result, although the adhesiveness is high due to the effect of the high molecular weight body, the thermal expansion of the resin component may increase.

  The blending ratio of the polymer component (C) is preferably 10 to 50 parts by weight, more preferably 15 to 30 parts by weight, with the total amount of the crosslinked resin components being generally 100 parts by weight. is there. When the addition amount of the polymer component is large, the thermal expansion coefficient may be increased, and the solvent resistance and heat resistance may be decreased.

Compounding ratio of the inorganic filler (D), the shape of the filler, it is possible to adjust any desired thermal expansion coefficient, thermal expansion coefficient alpha ₁ of the cured product of the resin composition is 50 ppm / ° C. or less, more Preferably, it is adjusted to be 30 ppm / ° C. or less. By adopting such a configuration, it is possible to reduce the thermal expansion of the sealing material and to reduce the thermal expansion of the laminated board, the printed board, and the multilayer printed board regardless of the type of cloth or nonwoven fabric.

  The specific blending ratio of the inorganic filler is influenced by the coefficient of thermal expansion of the resin itself and the required processability at the time of heat molding, but generally 40 wt. It is preferable to add more than one part. More preferably, it is 50-400 weight part, More preferably, it is 50-200 weight part.

The limit of the amount of spherical silicon oxide filler added is approximately 75 vol%. When the specific gravity of the resin component is 1 g / cm ³ and the specific gravity of silicon oxide is 2.65 g / cm ³ , the resin component is 100 weight. Part is 796 parts by weight. In addition, it is preferable that the addition amount of a silicon oxide filler when a moldability is considered is about 400 weight part or less.

  When applying the low thermal expansion resin composition of the present invention to an insulating material of a high-frequency device, it is preferable to apply a thermosetting poly (phenylene ether) resin as the crosslinking component (A), and particularly preferable examples include: The thermosetting poly (phenylene ether) represented by the above chemical formulas (1) and (2), which has high solubility in a varnishing solvent and excellent dielectric properties, has a number average molecular weight in terms of styrene of 1000 to 15000. Can be mentioned. Further, in the poly (phenylene ether) in the chemical formula (2), the structure of the terminal functional group is a functional group having a styrene skeleton as shown in the chemical formula (3), or an epoxy skeleton as shown in the chemical formula (4). By using the functional group having, a crosslinking component having excellent thermosetting reactivity can be obtained.

  The crosslinking aid (B) of the low thermal expansion resin composition of the present invention is a compound having a molecular weight of 1000 or less, and preferred compounds include many nitrogen atoms represented by the above chemical formulas (5) and (6) in the structure. It is a functional heterocyclic compound. Specifically, it is a compound containing a triazine ring in the skeleton, and examples thereof include triallyl isocyanurate, trimethallyl isocyanurate, triallyl cyanurate and the like.

  When a thermosetting poly (phenylene ether) is used as the crosslinking component (A), it is preferable to use a styrene-based elastomer excellent in compatibility with poly (phenylene ether) as the high molecular weight component (C). In particular, it is preferable to use a hydrogenated styrene-based elastomer from the viewpoint of dielectric properties. Preferred examples of the hydrogenated styrene-based elastomer include a hydrogenated styrene-ethylene / butylene copolymer having a styrene content of 10 to 40 wt% and a styrene-equivalent number average molecular weight of 50,000 to 100,000. And a high molecular weight material having an elongation percentage of 700% or more. Specific examples of such a high molecular weight component include Asahi Kasei Chemicals, Tuftec (registered trademark) H1052, H1221, H1272 and the like.

  As the inorganic filler, it is preferable to use a silicon oxide filler in order to improve the dielectric properties of the cured product of the resin composition, and it is preferable to use a spherical filler in order to make the filler highly filled. The particle size of the spherical silicon oxide filler is not particularly limited, but when the low thermal expansion resin composition is varnished, no significant precipitation occurs in the varnish and the large surface area leads to low thermal expansion. A small-diameter filler having a large contribution is preferably used. The particle diameter of the specific spherical silicon oxide filler is preferably 10 μm or less, and more preferably in the range of 0.2 to 3 μm. The spherical silicon oxide filler is preferably used after its surface is treated with a silane coupling agent from the viewpoint of improving dielectric properties, low moisture absorption, and solder heat resistance.

  The surface treatment of the spherical silicon oxide filler with a coupling agent may be performed by adding a filler that has been subjected to a surface treatment in advance to the resin composition, or by adding a silane coupling agent to the resin composition at the time of preparing the resin composition. You may implement. Examples of the silane coupling agent preferably used in the present invention include γ-methacryloxypropyldimethoxysilane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, Examples thereof include vinyl tris (β-methoxyethoxy) silane and p-styryltrimethoxysilane.

  In printed circuit boards and multilayer printed circuit boards, flame retardancy is often required from the viewpoint of safety. In resin materials, flame retarding technology by adding a flame retardant is usually used. In the present invention, it is preferable to use a flame retardant that is solid at least at room temperature in order to achieve both low thermal expansion and adhesiveness of the insulating layer, and in order to maintain low dielectric loss, the chemical formula (7 ) And (8) are preferably used as flame retardants. The flame retardants represented by the chemical formulas (7) and (8) have a low dielectric loss tangent, and are suitable for flame retardant of electrical parts that handle high-frequency signals.

  Furthermore, although there is no restriction | limiting in particular in the average particle diameter of a flame retardant, precipitation of a flame retardant in a varnish can be suppressed by making an average particle diameter 0.2-3.0 micrometers, and the storage stability of a varnish It is preferable because the property can be improved. Although it depends on the varnish viscosity, the occurrence of precipitation can be suppressed by using a flame retardant having a particle size in the range of 0.1 to 10 Pa · s (Pascal · second) and a silicon oxide filler.

  The amount of the flame retardant added is preferably 5 to 200 parts by weight, with the total amount of the crosslinked resin component being 100 parts by weight, and is blended according to the desired flame retardant level, the cloth used, and the type of nonwoven fabric. It is preferred to determine the amount. When the cloth or nonwoven fabric contains olefin fibers, it is desirable to add 100 parts by weight or more.

  In the present invention, an additive represented by the above chemical formulas (9), (10), and (11) can be added for the purpose of adjusting dielectric properties, varnish viscosity, and film formability. Of the compounds represented by the chemical formula (9), more preferred is a polyfunctional styrene compound having an all-hydrocarbon skeleton that does not contain heteroatoms in its structure. This has a function of further reducing the dielectric loss tangent of the cured product of the resin composition.

  Since the polyfunctional styrene compound represented by the chemical formula (9) has high reactivity, the resin system can be cured without adding a curing catalyst. Since the curing catalyst has a heteroatom in the structure, a further lower dielectric loss tangent can be expected by using a polyfunctional styrene compound having an all-hydrocarbon skeleton.

  Although the details of the bismaleimide compound having the specific structure represented by the chemical formula (10) are unknown, it has an effect of reducing the varnish viscosity when added to the varnish, and its dielectric loss tangent is small as the maleimide compound. .

  The 1,2-polybutadiene compound represented by the chemical formula (11) has a high molecular weight body and thus has an effect of increasing the varnish viscosity, and improves the film forming property of the prepreg and improves the flexibility of the prepreg. Contribute to. In addition, since it is an all-hydrocarbon skeleton and does not have an aromatic ring, it contributes to a reduction in dielectric constant.

  The blending ratio of each additive is preferably 10 to 100 parts by weight with respect to 100 parts by weight of the total amount of the crosslinked resin components so as not to impair the low thermal expansion property, adhesiveness, and dielectric properties.

  Examples of the polyfunctional styrene compound represented by the chemical formula (9) include 1,2-bis (p-vinylphenyl) ethane, 1,2-bis (m-vinylphenyl) ethane, and 1- (p-vinyl). Phenyl) -2- (m-vinylphenyl) ethane, bis (p-vinylphenyl) methane, bis (m-vinylphenyl) methane, p-vinylphenyl-m-vinylphenylmethane, 1,4-bis (p- Vinylphenyl) benzene, 1,4-bis (m-vinylphenyl) benzene, 1- (p-vinylphenyl) -4- (m-vinylphenyl) benzene, 1,3-bis (p-vinylphenyl) benzene, 1,3-bis (m-vinylphenyl) benzene, 1- (p-vinylphenyl) -3- (m-vinylphenyl) benzene, 1,6-bis (p-vinylphenyl) hexane 1,6-bis (m-vinylphenyl) hexane, 1- (p-vinylphenyl) -6- (m-vinylphenyl) hexane, divinylbenzene polymer (oligomer) having a vinyl group in the side chain, etc. Can be mentioned. Among these compounds, a part of the functional group may be substituted with a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, or a hydrocarbon group containing a halogen atom. A compound. These are used alone or as a mixture of two or more.

  Examples of the bismaleimide represented by the chemical formula (10) include bis (3-methyl-4-maleimidophenyl) methane, bis (3,5-dimethyl-4-maleimidophenyl) methane, and bis (3-ethyl- 4-maleimidophenyl) methane, bis (3-n-butyl-4-maleimidophenyl) methane, and the like.

  Examples of the 1,2-polybutadiene compound represented by the chemical formula (11) include RB810, RB820, and RB830 manufactured by JSR.

  In the present invention, a polymerization initiator may be added for the purpose of promoting the thermosetting reaction and lowering the temperature. The polymerization initiator is appropriately selected depending on the type of functional group of the crosslinking component. When the thermosetting poly (phenylene ether) represented by (2) containing the thermosetting group represented by the chemical formula (1) or (3) is used as a crosslinking component, a radical polymerization initiator is applied. Is preferred. The starting temperature of the curing reaction can be adjusted depending on the type of radical polymerization initiator.

  Examples of radical polymerization initiators include isobutyl peroxide, α, α′-bis (neodecanoylperoxy) diisopropylbenzene, cumylperoxyneodecanoate, di-n-propylperoxydicarbonate, 1, 1 3,3-tetramethylbutylperoxyneodecanoate, diisopropylperoxydicarbonate, 1-cyclohexyl-1-methylethylperoxyneodecanoate, di-2-ethoxyethylperoxydicarbonate, di (2 -Ethylhexylperoxy) dicarbonate, t-hexylperoxyneodecanoate, dimethoxybutylperoxydidecanate, di (3-methyl-3-methoxybutylperoxy) dicarbonate, t-butylperoxyneodecanoate, t-hexylperoxypi Valate, t-butylperoxypivalate, 3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, 1,1,3,3-tetramethylbutylperoxy-2-ethylhexanoate, 2, 5-dimethyl-2,5-di (2-ethylhexanoylperoxy) hexane, 1-cyclohexyl-1-methylethylperoxy-2-ethylhexanoate, t-hexylperoxy-2-ethylhexanoate, t-butylperoxy-2-ethylhexanoate, m-toluoyl peroxide, t-butylperoxyisobutyrate, α, α′-bis (t-butylperoxy) diisopropylbenzene, dicumyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexane, t-butylcumylperoxy And di-t-butyl peroxide, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne-3, t-butyltrimethylsilyl peroxide, and the like. It can be used in combination.

  In addition, when the thermosetting poly (phenylene ether) represented by (2) containing the thermosetting group represented by (4) is used as a crosslinking component, in addition to the polymerization initiator, for example, 1, 8-diazabicyclo (5,4,0) undecene-7, tertiary amines such as triethylenediamine, benzyldimethylamine, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl- It is desirable to add an accelerator that promotes the reaction of epoxy groups contained in imidazoles such as 4-methylimidazole, organic phosphines such as tributylphosphine and triphenylphosphine, and the like. Of these, triphenylphosphine is preferable because it improves the electrical properties of the sealing layer. About these crosslinking accelerators, the addition amount is adjusted in the range of 0.0005 to 20 parts by weight, with the total amount of the crosslinked resin components being 100 parts by weight.

  Furthermore, a polymerization inhibitor is added for the purpose of suppressing the progress of the curing reaction when storing the sealing film, potting agent, prepreg and the like while suppressing the curing reaction due to heating during varnish and prepreg production. May be. The polymerization inhibitor is appropriately selected depending on the type of functional group of the crosslinking component. When the thermosetting poly (phenylene ether) represented by the chemical formula (1) or (2) is used as a crosslinking component, a radical polymerization inhibitor may be applied. Examples thereof include quinones such as hydroquinone, p-benzoquinone, chloranil, trimethylquinone and 4-t-butylpyrocatechol, and aromatic diols. A preferable range of the addition amount is 0.0005 to 5 parts by weight, where the total amount of the crosslinked resin components is 100 parts by weight.

  The varnishing solvent of the resin composition used in the present invention preferably has a boiling point of 140 ° C. or lower, and examples of such a solvent include xylene, more preferably a boiling point of 110 ° C. The following is preferable, and examples of such a solvent include toluene, cyclohexane and the like. These solvents may be used as a mixture, and may further contain a polar solvent such as methyl ethyl ketone and methanol used for the coupling treatment of the inorganic filler. The varnish concentration is preferably 40 to 65 wt%, and the varnish viscosity is in the range of 0.1 to 10 Pa · s, more preferably in the range of 0.1 to 1 Pa · s depending on the type and blending amount of the components constituting the resin composition. Adjust as appropriate.

The sealing material of this invention is a sealing material for sealing the electronic component mounted on the board | substrate with which the wiring pattern was formed. The shape of the precursor to be sealed is not particularly defined, but more preferably a film-like resin composite or a potting agent in which the resin composite is dissolved or dispersed in an organic solvent. From the viewpoint of workability and handling at the time of sealing, the minimum viscosity during heating is 1 to 10 ⁷ Pa · s.

Here, in the present invention, the “minimum viscosity at the time of heating” refers to a rotational viscometer (RS-100, HAAKE), a rotational speed of 10 rpm, a rotating disk diameter of 20 mm, and a heating rate of 2 ° C./min (° C./min. Min), the minimum value of the viscosity at 50 to 200 ° C. that can be measured. In the present invention, the minimum viscosity at the time of heating is preferably 1 to 10 ⁵ Pa · s, more preferably 1 to 10 ⁴ Pa · s from the viewpoint that sealing is possible at a low pressure.

  By using a resin composition having such a viscosity property as a sealing material, it is possible to perform mounting and sealing of electronic components all at a low pressure. As shown in the method for producing the module of the present invention, which will be described later, by sealing the electronic component at 60 to 300 ° C., the embedding property of the obtained sealing material of the present invention between the electronic components becomes good. In addition, it is considered that the electronic components positioned on the substrate are not displaced and the thickness design accuracy is improved. Further, by using a resin composition having such viscosity physical properties as a sealing material, even a thin electronic component or a high-frequency electronic component is not damaged and can be sealed with excellent reliability.

  The prepreg in the present invention can be produced by impregnating a varnish of the resin composition into a cloth or a nonwoven fabric and drying it. It is preferable that the drying temperature is 80 to 150 ° C. The drying temperature is 80 to 110 ° C. in order to sufficiently dry while suppressing an unnecessary curing reaction during drying. preferable.

  There are no particular restrictions on the material of the cloth and non-woven fabric, but when applying to insulating materials for high-frequency equipment, a composite cloth in which quartz fibers and olefin fibers are combined, or a thin quartz cloth having a thin and dense structure is applied. It is preferable. The composite cloth is preferably produced using a yarn containing both olefin fiber and glass fiber and using this mixed yarn. Olefin fibers and glass fibers have different elongation rates, so when weaving alternately using olefin fiber yarns and glass fiber yarns, the cross may be wrinkled or kinked due to the difference in stretch between the two fibers. It is.

  The diameters of the glass fiber and the olefin fiber are preferably 5 to 20 μm. If the fiber diameter is too large, the folds of the base material are rough and the surface irregularities become large, so the appearance of the prepreg and laminate is impaired, which is not preferable. Also, if the fiber diameter is too small, it is not preferable because the fiber is likely to be cut during weaving. The mixing ratio of the quartz fiber and the polyolefin fiber is preferably 40/60 weight ratio to 60/40 weight ratio in order to maintain the low thermal expansion of the laminated board, the printed board and the multilayer printed board.

A preferable configuration of the thin quartz glass cloth is a quartz glass cloth produced using quartz glass yarns containing 15 to 49 fused silica glass fibers having a filament diameter of 5 to 9 μm, and the weave density of warp and weft yarns Is a sparse quartz glass cloth having a weight of 10 to 18 g / m ³ and a thickness of 10 to 30 μm.

  By adopting this configuration, the quartz fiber content per layer of the prepreg can be reduced, so that drilling workability can be improved. A prepreg to which a thin quartz cloth is applied can have a film thickness of 10 to 100 μm per layer, which can contribute to a reduction in thickness of an electronic device. Further, the thickness can be arbitrarily controlled by adjusting the resin content.

  The resin content of the prepreg of the present invention is 50 to 90 wt%. If the resin content is lower than 50 wt%, sufficient moldability may not be ensured. If the resin content exceeds 90 wt%, the flowability of the resin becomes too high during molding and the cloth breaks. There is. A more preferable range of the resin content is 50 to 80 wt%.

  A laminated board is manufactured by installing a conductor layer on both sides or one side of the cured prepreg produced as described above. For the installation of the conductor layer, it is preferable from the viewpoint of workability that the conductor layer is stacked on the prepreg and heated and pressed by hot pressing to simultaneously adhere to the conductor layer and cure the prepreg.

  In addition, since the resin composition of this invention has low thermal expansibility, you may use the conductor foil with resin produced by apply | coating and drying the resin composition varnish on conductor foil instead of a prepreg. Moreover, you may use the insulating material formed into a film as an adhesive film for electronic components, for adhesion | attachment of a printed circuit board. Since the resin-coated conductor foil and adhesive film do not contain cloth or nonwoven fabric, drilling workability is further improved and laser drilling is facilitated.

  Using the prepreg or laminate of the present invention, a printed circuit board or a multilayer printed circuit board can be produced through regular wiring processing, multilayering, and interlayer connection processes.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

  First, reagents and evaluation methods are shown.

(1) Thermosetting poly (phenylene ether) (compound of the above chemical formula (1), abbreviated as thermosetting PPE)
Di-μ-hydroxobis [(N, N, N ′, N′-tetramethylethylenediamine) copper (II)] dichloride (manufactured by Tokyo Chemical Industry) 0.464 g (1) 0.0 mmol (mmol)), water: 4 mL (milliliter), and tetramethylethylenediamine (manufactured by Wako Pure Chemical Industries) 1 mL were added and stirred. After the stirring was stopped, 9.90 g (81.0 mmol) of 2,6-dimethylphenol (manufactured by Tokyo Chemical Industry) and 1.34 g (9.0 mmol) of 2-allyl-6-methylphenol (manufactured by Aldrich) were dissolved in 500 mL of toluene. The solution was gently added to the flask and sealed with a three-way cock and glass stopper. A rubber oxygen balloon was connected to a three-way cock, and the inside of the system was repeatedly replaced by deaeration and oxygen filling, and then stirred at 500 to 800 rpm for 6 hours in an oxygen atmosphere at 40 ° C. After completion of the polymerization, it is diluted with toluene and then precipitated in a large excess of hydrochloric acid / methanol solution (about 1 to 5M). The precipitate is washed with methanol, dried, dissolved again in toluene, and then a large excess of hydrochloric acid / methanol (about 1M). And washed with methanol, followed by vacuum drying at 120 ° C./2 hours and 140 ° C./30 minutes to obtain a white solid. The yield was 93%. The structure was identified by 1H-NMR and 13C-NMR. The molecular weight and molecular weight distribution of the solid were Mn = 15000 and Mw / Mn = 1.7. Here, Mn is a number average molecular weight, and Mw is a weight average molecular weight.

(2) Synthesis of 1,2-bis (vinylphenyl) ethane (BVPE) (compound of the above chemical formula (9))
In a 500 mL three-necked flask, 536 g (220 mmol) of granular magnesium for Grignard reaction (manufactured by Kanto Chemical Co., Inc.) was taken, and a dropping funnel, a nitrogen introduction basket and a septum cap were attached. The whole system was heated and dehydrated while stirring the magnesium particles with a stirrer under a nitrogen stream. 300 mL of dry tetrahydrofuran was taken into a syringe and injected through a septum cap. After cooling the solution to −5 ° C., 30.5 g (200 mmol) of vinylbenzyl chloride (manufactured by Tokyo Chemical Industry) was dropped over about 4 hours using a dropping funnel. After completion of the dropwise addition, stirring was continued at 0 ° C. for 20 hours.

  After completion of the reaction, the solution was filtered to remove residual magnesium and concentrated with an evaporator. The concentrated solution was diluted with hexane, washed once with a 3.6% aqueous hydrochloric acid solution and three times with pure water, and then dehydrated with magnesium sulfate. A dewatered solution was produced by passing through a short column of silica gel (Wakogel C300 manufactured by Wako Pure Chemical Industries) / hexane, and finally, the desired BVPE was obtained by a vacuum tube layer. The obtained BVPE is 1,2-bis (p-vinylphenyl) ethane (pp body, solid), 1,2-bis (p-vinylphenyl) ethane (mm body, liquid), 1, The yield was 90% with a mixture of 2-bis (p-vinylphenyl) ethane (mp form, liquid). The structure of the obtained BVPE was consistent with literature values and was used as an additive.

(3) Other reagents Thermosetting poly (phenylene ether) (compound of the above chemical formula (2)): (1) OPE-2St, number average molecular weight 2200 in terms of styrene, manufactured by Mitsubishi Gas Chemical (styrene skeleton end), (2 ) OPE-2Ep, styrene equivalent number average molecular weight 2200, manufactured by Mitsubishi Gas Chemical (epoxy skeleton end).

Multifunctional crosslinking assistant (compound of the above chemical formula (5)): (1) TAIC (trademark), triallyl isocyanurate, manufactured by Nippon Kasei Kogyo, (2) TMAIC (trademark), trimethallyl isocyanurate, manufactured by Nippon Kasei Kogyo Multifunctional crosslinking assistant (compound of the above chemical formula (6)): triallyl cyanurate, manufactured by Tokyo Chemical Industry Styrenic elastomer: (1) Tuftec ™ H1043, styrene content 67 wt%, Mn = 76000, elongation 20% (2) Tuftec (trademark) H1051, styrene content 42 wt%, Mn = 75000, elongation 600%, Asahi Kasei Chemicals (3) Tuftec (trademark) H1031, styrene content 30 wt%, Mn = 53000, elongation 650%, manufactured by Asahi Kasei Chemicals, (4) Tuftec ™ H1052 Styrene content 20 wt%, Mn = 72000, elongation 700%, manufactured by Asahi Kasei Chemicals, (5) Tuftec ™ H1221, styrene content 12 wt%, Mn = 71000, elongation 980%, manufactured by Asahi Kasei Chemicals, (6) Tuftec (trademark) H1272, styrene content 35 wt%, Mn = 74000, elongation 950%, manufactured by Asahi Kasei Chemicals flame retardant (compound of the above chemical formula (7)): SAYTEX 8010, 1,2-bis (pentabromophenyl) ethane Flame retardant made by Albemarle Japan (compound of the above chemical formula (8)): SAYTEX BT-93 / W, ethylenebistetrabromophthalimide, made by Albemarle Japan Silicon oxide filler: Admafine, average particle size 0.5 μm, Cup made by Admatex Ring agent: KBM-503, γ-meta Liloxypropyldimethoxysilane, manufactured by Shin-Etsu Chemical Co., Ltd. Copper foil: AMFN foil (1/2 Oz), low profile copper foil with coupling treatment, thickness 18 μm, Rz≈2.1 μm, bismaleimide from Nikko Materials (the above chemical formula ( Compound 10)): BMI-5100, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide, high molecular weight polybutadiene (compound of the above chemical formula (11)) manufactured by Daiwa Kasei Kogyo: RB810, Mn = 130,000, manufactured by JSR Curing catalyst: 2,5-dimethyl-2,5-di (tert-butylperoxy) hexyne-3 (abbreviation 25B), manufactured by NOF Co., Ltd. Curing catalyst: triphenylphosphine, manufactured by Tokyo Chemical Industry Glass cloth: # 2116, NE glass-based glass cloth, manufactured by Nittobo Composite cloth: quartz fiber φ = 7 μm: 6 0 wt%, polypropylene fiber φ = 20 μm: 40 wt%, Shin-Etsu quartz thin quartz cloth: quartz fiber φ = 7 μm, warp 60/25 mm, weft 60/25 mm, Shin-Etsu quartz (4) Preparation method of varnish The coupling agent and filler were stirred in a methyl ethyl ketone solution with a ball mill for 2 hours to subject the filler surface to a coupling treatment. Next, a predetermined amount of a crosslinking agent, a resin material, a flame retardant, a curing catalyst, a crosslinking aid, and toluene were added, and stirring was continued until the resin component was completely dissolved to prepare a varnish. The varnish concentration was 45 to 65 wt%.

(5) Production method of resin film and cured product (resin plate) A resin varnish was applied onto a PET film, dried at room temperature, and then dried at 100 ° C. for 10 minutes to obtain an insulating film. The film was filled in a PTFE-made spacer having a thickness of 1.0 mm, and pressurized and heated by vacuum press molding to obtain a cured product. As the curing conditions, the pressure was increased from room temperature to 2 MPa in vacuum, the temperature was increased at 10 ° C./min, and the temperature was maintained at 210 ° C. for 60 minutes.

(6) Preparation method of test piece for evaluating adhesive strength between cured product and copper foil An insulating film is filled in a PTFE-made spacer having a thickness of 1.0 mm, and the upper and lower surfaces are sandwiched between copper foils and pressed by vacuum press molding. To obtain a cured product. As the curing conditions, the pressure was increased from room temperature to 2 MPa in vacuum, the temperature was increased at 10 ° C./min, and the temperature was maintained at 210 ° C. for 60 minutes. The adhesion evaluation of the insulating film was performed using the peel strength (described later) of the copper foil.

(7) Surface treatment of glass cloth The glass cloth was immersed in a 0.5 wt% KBM-503 methanol solution for 1 hour, and the taken-out glass cloth was dried at 100 ° C. for 30 minutes in the atmosphere to perform surface treatment.

(8) Preparation method of prepreg After the cloth was dipped in the varnish prepared by the method described above, the gap between the slits having a predetermined gap length was pulled up vertically at a constant speed, and then dried. The amount of resin applied was adjusted by the slit gap. Drying conditions were 100 ° C. and 10 minutes.

(9) Method for Producing Copper Clad Laminate Four to six prepregs produced by the above method were laminated, the upper and lower surfaces were sandwiched between copper foils, and pressurized and heated by vacuum press molding to obtain a cured product. The curing condition was that the pressure was increased from room temperature to 4 MPa in vacuum, the temperature was increased at 10 ° C./min, and the temperature was maintained at 210 ° C. for 60 minutes.

(10) Measurement of peel strength Peel strength was measured in accordance with Japanese Industrial Standard (JIS C6481).

(11) Measurement of coefficient of thermal expansion The coefficient of thermal expansion is measured in the thickness direction (Z-axis direction) of the measurement sample under a nitrogen atmosphere using a thermomechanical measuring device (TM-9300 type thermomechanical tester, ULVAC-RIKO). It was measured. The sample was cut to a size of 5 × 5 mm and annealed at 175 ° C. to obtain a sample. The temperature increase time was 10 ° C / min, and the thermal expansion coefficient between 50 and 100 ° C was determined.

(12) Measurement of Crosslink Density of Cured Product The crosslink density n (mol / L) of the cured resin is stored in a temperature condition higher than the glass transition temperature by dynamic viscoelasticity measurement (Rheogel-E4000, manufactured by UBM). It calculated using the said Numerical formula (1) from the value of the equilibrium elastic modulus E 'when the elastic modulus change reached equilibrium, and the value of the temperature T when the equilibrium was reached.

(13) Measurement of relative dielectric constant and dielectric loss tangent A value of 10 GHz was measured by a cavity resonance method (8722ES network analyzer, manufactured by Agilent Technologies: cavity resonator, manufactured by Kanto Applied Electronics).

  A sample prepared from a copper clad laminate was prepared by cutting out copper to a size of 1.0 × 80 mm. A sample prepared from the resin plate was cut out from the resin plate into a size of 1.0 × 80 mm.

(14) Measurement of elongation at break The measurement of elongation at break was performed in accordance with Japanese Industrial Standard (JIS K6251). The sample piece was No. 3 dumbbell, the pulling speed was 500 mm / min, and the change in elongation until the sample broke was measured.

(15) Evaluation of flame retardancy Flame retardancy was evaluated according to the UL-94 standard using a sample cut out to 70 × 3 mm.

(16) Evaluation of solvent resistance (copper-clad laminate)
The copper foil was removed from the cured laminate by etching and cut into a size of 20 × 20 mm, and then dried at 110 ° C. for 2 hours to obtain a sample. After observing the initial weight of the sample, it was immersed in toluene at room temperature for 20 hours. Then, the sample was taken out from toluene, dried at 110 ° C. for 2 hours, and the weight of the sample after treatment was observed. The elution rate was determined from the amount of the eluted resin / percentage of the initial weight, and a sample having an elution rate of 0.1 wt% or more was regarded as defective.

(17) Minimum viscosity evaluation during heating The minimum viscosity is measured using a rotational viscometer (RS-100, HAAKE) under the conditions of a rotation speed of 10 rpm, a rotating disk diameter of 20 mm, and a heating rate of 2 ° C./min. Evaluation was based on the minimum value of the viscosity at 50 to 200 ° C. that can be measured.

(Examples 1-4)
Examples 1 to 4 are examples in which triallyl isocyanurate was added as a crosslinking aid to a resin composition containing 30 parts by weight of an elastomer having an elongation of 700% as a high molecular weight component.

  Table 1 shows the compositions and evaluation results of Examples 1 to 4 and Comparative Examples 1 and 2.

In the table, ε ′ (10 GHz), tan δ (10 GHz), T _g and α ₁ represent a relative dielectric constant, a dielectric loss tangent, a glass transition temperature, and a thermal expansion coefficient (also referred to as a thermal expansion coefficient), respectively.

  By adding the crosslinking aid, the thermal expansion coefficient of the cured product was significantly reduced as compared with Comparative Example 1 in which the crosslinking aid was not added. Further, from the change in storage elastic modulus at this time, a peak due to the addition of the crosslinking aid was confirmed at around 200 ° C. The crosslink density n calculated from the equilibrium elastic modulus is 2.0 mol / L or more.

  FIG. 1 is a graph showing the temperature dependence of the equilibrium elastic modulus of an electronic component insulating material according to an embodiment of the present invention. The horizontal axis represents temperature, and the vertical axis represents equilibrium elastic modulus E '. The data of Examples 1 and 4 and Comparative Examples 1 and 2 are shown.

  As shown in the figure, the value of the storage elastic modulus is increased by increasing the crosslink density, and it can be estimated that the low thermal expansion coefficient is achieved by increasing the crosslink density.

  On the other hand, in the case of Comparative Example 2 in which the addition amount of the crosslinking aid was 20 parts by weight or more, the crosslinking density was significantly lowered and the thermal expansion coefficient was also increased. This is presumably because the balance between the high molecular weight material and the crosslinking component was lost due to the excessive addition of the crosslinking aid, and phase separation occurred in the cured product.

  From the above points, it can be said that the addition of the crosslinking aid is preferably between 0.1 and 15 parts by weight.

(Examples 5-7)
Examples 5 to 7 and Comparative Examples 3 to 5 are examples of resin compositions containing 30 parts by weight of elastomers having different elongation rates as high molecular weight components.

  Table 2 shows the compositions and evaluation results of Examples 5 to 7 and Comparative Examples 3 to 5.

  FIG. 2 is a graph showing the copper foil peel strength and the thermal expansion coefficient with respect to the elongation at break of the elastomer, by summarizing the data in Table 2.

  By adding a crosslinking aid, a cured product having a low coefficient of thermal expansion was obtained under any conditions including the comparative example.

  On the other hand, by blending an elastomer having an elongation at break of 700% or more, the adhesiveness to the copper foil is peeled off from the copper foil even though the surface roughness (Rz) is 2.1 μm and a small copper foil is used. It was confirmed that the strength showed a high adhesive strength of 0.7 kN / m or more. In addition, the adhesion between the dense cross-linked structure and the copper foil is also good. From the above points, it can be said that the elongation of the resin used for the composite is desirably 700% or more.

(Examples 8 to 11)
Table 3 shows the compositions and evaluation results of Examples 8 to 11.

  Examples 8 to 11 are examples in which the types of the crosslinking component and the crosslinking aid were changed.

  Even when OPE-2Ep and thermosetting PPE were used as the crosslinking component, the same performance as OPE-2St could be obtained. Further, even when trimethallyl isocyanurate or triallyl cyanurate having a structure different from that of triallyl isocyanurate was used as a crosslinking aid, a sufficiently low thermal expansion coefficient could be achieved by addition of 1 part by weight. From the above results, it can be presumed that, under any condition, the crosslink density is increased by the construction of a dense three-dimensional network structure by the crosslink component and the crosslink aid, and the low thermal expansion coefficient of the resin is achieved.

(Examples 12 to 16)
Table 4 shows the compositions and evaluation results of Examples 12 to 16.

  Examples 12-16 are the examples which added the additional component with respect to said Example.

  A system in which BVPE, which is a polyfunctional styrene compound, is added as an additive component is effective in reducing the dielectric properties of the insulating material, particularly the dielectric loss tangent. Moreover, the system which added the flame retardant of the specific structure achieved the flame retardance (UL94 V-0), maintaining the dielectric loss of an insulating material. In a system in which a bismaleimide compound having a specific structure was added as an additive component, the varnish viscosity was lower than in other systems, and in a system in which polybutadiene was added, the varnish viscosity increased. Moreover, the influence on a thermal expansion coefficient and adhesiveness was hardly seen.

  From the above results, it was confirmed that the above-described additives can improve dielectric properties, flame retardancy, and adjust the varnish viscosity.

(Example 17)
Table 5 shows the composition and evaluation results of Example 17.

  In Example 17, the electronic component (Si chip, dimensions: 5 mm × 5 mm × 250 μm) was sealed using the resin film prepared from Example 2 above.

  FIG. 3 is a schematic cross-sectional view showing the manufacturing process of the module precursor of the present invention.

  First, the first sealing film 2 (also referred to as a sealing material) is placed on the surface of the first base material 1 (also referred to as a substrate). The first substrate 1 is a PET substrate with a polytetrafluoroethylene (PTFE) cushion, and the first sealing film 2 is a 10 μm resin film. The electronic component 5 is installed on the first sealing film 2 (resin film) at 150 ° C. (FIG. 3A).

  And the electronic component 5 is fixed on the 1st base material 1 (PET base material) with the 1st sealing film 2 (FIG.3 (B)).

  Next, a second sealing film 3 (resin film) having a thickness of 135 μm is placed on the first base 1 to which the electronic component 5 is fixed, and further, the second base 4 (PTFE) is placed thereon. A base material with a cushion is installed (FIG. 3C).

  Then, using a high-temperature vacuum press, vacuum pressing is performed at 210 ° C. and a press pressure of 1 MPa for 60 minutes to obtain a module precursor (FIG. 3D).

(Example 18)
Table 6 shows the composition and evaluation results of Example 18.

  Example 18 is a liquid resin composition containing the resin composition prepared from Example 2 and forming a cured product having a low dielectric constant and a low dielectric loss tangent. The liquid resin composition can be cast at room temperature and low pressure. Not only in Example 2, but in a system where varnish can be prepared, a liquid resin composition can be prepared.

(Examples 19 to 21)
Table 7 shows the compositions and evaluation results of Examples 19-21.

  Examples 19 to 21 are examples of copper clad laminates using the varnish prepared from Example 12.

  Glass cloth, composite cloth, and thin quartz cloth can be made into prepregs by immersing the cloth in varnish. In addition, each copper-clad laminate has a surface roughness (Rz) of 2.1 μm and a small copper foil, but the adhesiveness to the copper foil has a peel strength of 0.7 kN / m or more. It was confirmed that a high adhesive strength was exhibited.

  In composite cloths containing olefin fibers, by increasing the coating gap and increasing the thickness of the prepreg, the thermal expansion coefficient in the thickness direction of the laminate is 30 ppm / ° C level low thermal expansion and extremely low dielectric loss performance. confirmed. Furthermore, by using a thin quartz cloth, it was possible to achieve a low coefficient of thermal expansion even in a prepreg coated with a thin coating gap. It was also confirmed that the amount of chemical substance used per unit area can be reduced by thinning the prepreg per layer.

(Example 22)
FIG. 4 is a schematic cross-sectional view showing a step of forming an interlayer wiring on the copper clad laminate of the present invention.

  First, arbitrary photosensitive resist 8 is apply | coated to the surface of the copper clad laminated board of Example 20 formed by overlapping the copper foil 7 on the prepreg hardened | cured material 6 which laminated | stacked 6 layers (FIG. 4 (A)).

  Next, a conductor wiring is drawn by an etching process to remove the photosensitive resist 8, and a copper-clad laminate 9 on which a circuit is drawn is produced (FIG. 4B).

  The surface of the copper foil 7 remaining on the copper-clad laminate 9 is roughened (blackened), and a plurality of copper-clad laminates 11 are laminated and bonded via a prepreg 10 that is an adhesive layer (FIG. 4 ( C) and (D)).

  Further, a via hole forming cavity 12 is formed by drilling by laser processing (FIG. 4E), and a via hole connecting portion 13 (interlayer wiring) is formed by electroless plating (FIG. 4F).

  The present invention is not limited to this embodiment, and various wiring boards can be formed. For example, a build-up multilayer wiring board in which layers are electrically connected by blind via holes formed by laser processing or dry etching processing can be manufactured. In the production of multilayer wiring boards, the dielectric constant and dielectric loss tangent of each insulating layer can be selected arbitrarily. For the purpose of low dielectric loss, high-speed transmission, miniaturization, cost reduction, etc. by mixing insulating layers with different characteristics. You can combine them accordingly.

  According to the present invention, an insulating material for electronic parts that achieves both high adhesiveness and low thermal expansion with the conductor layer, as well as a sealing material, a liquid potting agent, a sealing resin film, and an adhesive film for electronic parts using the same. Further, wiring board materials such as prepreg sheets and laminated boards, printed boards and multilayer printed boards can be obtained.

  Furthermore, according to the present invention, a rigid cross-linked structure is formed by a dense cross-linked structure formed by a curing reaction of thermosetting polyphenylene ether and triallyl isocyanurate which are low dielectric loss materials. Resin components that satisfy both low thermal expansibility and high adhesiveness were successfully formed by forming small domains that were flexible and had excellent adhesive properties. Since the amount of inorganic filler added can be changed arbitrarily, the amount of inorganic filler in a configuration that requires workability and adhesion, including drilling, and a configuration that requires further low thermal expansion. Is adjustable. Under any of the conditions, it is possible to achieve low thermal expansion of the resin component without depending on the conventional excessive filler.

  1: first base material, 2: first sealing film, 3: second sealing film, 4: second base material, 5: electronic component, 6: prepreg cured product (six layers laminated), 7: Copper foil, 8: Photosensitive resist, 9: Copper-clad laminate (circuit drawing), 10: Pre-preg (adhesive layer), 11: Copper-clad laminate, 12: Cavity for forming via holes, 13: Via hole connection part.

Claims (24)

  A crosslinked resin component obtained by adding 0.1 to 15 parts by weight of a polyfunctional crosslinking aid having a molecular weight of 1000 or less to 85 to 99.9 parts by weight of a thermosetting compound, 10 to 50 parts by weight of a high molecular weight component, and an inorganic filler 40 An insulating material for electronic parts, comprising: a resin composition containing ˜400 parts by weight, wherein the high molecular weight component has an elongation percentage of 700% or more.   2. The insulating material for electronic parts according to claim 1, wherein a crosslink density of a cured product of the resin composition is 2.0 mol / L or more.   3. The thermosetting compound is a thermosetting polyphenylene ether compound, the high molecular weight component is a hydrogenated styrene elastomer, and the inorganic filler is a spherical silicon oxide filler. An insulating material for electronic parts as described in 1. The said thermosetting polyphenylene ether compound is represented by the following chemical formula (1) or (2), and is a compound having a styrene conversion number average molecular weight of 1000 to 15000 in gel permeation chromatography measurement. Insulation material for electronic parts.

(The above chemical formula (1) represents a polymer or random copolymer containing one or two phenol derivatives, l and m are degrees of polymerization, and at least one is represented by an integer that is not 0. The coalesced or random copolymer may have a molecular weight distribution: R ¹ , R ² , R ³ , R ⁴ , R ⁵ , R ⁶ , R ⁷ and R ⁸ are hydrogen atoms, halogen atoms, or carbon Each of which may be the same or different, and at least one is a hydrocarbon group containing an unsaturated hydrocarbon group having 2 to 10 carbon atoms, and R ⁹ is hydrogen. An atom, a halogen atom, or a hydrocarbon group having 1 to 10 carbon atoms.)

(The above chemical formula (2) represents a polymer containing a phenol derivative, n and o are polymerization degrees, at least one is represented by an integer other than 0, and this polymer may have a molecular weight distribution. P and q are each independently an integer of 0 or 1. R ¹⁰ , R ¹¹ , R ¹² , R ¹³ , R ¹⁴ , R ¹⁵ , R ¹⁶ and R ¹⁷ are each a hydrogen atom or a halogen atom; Or a hydrocarbon group having 1 to 10 carbon atoms, which may be the same or different, and each of R ¹⁸ , R ¹⁹ , R ²⁰ and R ²¹ is a hydrogen atom or a halogen atom, or a carbon atom having 1 to 10 carbon atoms. Each of which may be the same or different, and W and X are each an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, The same Is optionally may .Y and Z also has a structure represented by the following chemical formula (3) or (4).)

(The above chemical formula (3) represents a functional group having a styrene skeleton, and R ²² , R ²³ , R ²⁴ , R ²⁵ , R ²⁶ , R ²⁷ and R ²⁸ are hydrocarbon groups having 1 to 10 carbon atoms. , A hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom, which may be the same or different.

(The above chemical formula (4) represents a bridging group having an epoxy skeleton, and R ²⁹ is an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. ³⁰ , R ³¹ and R ³² are each a hydrocarbon group having 1 to 10 carbon atoms and may contain a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, and they may be the same or different. May be.)   The insulating material for electronic parts according to claim 3 or 4, wherein the polyfunctional crosslinking aid contains at least one heterocyclic compound containing a nitrogen atom in the ring structure. 6. The insulating material for electronic parts according to claim 5, wherein the heterocyclic compound is a compound represented by the following chemical formula (5) or (6).

(In the above chemical formula (5), R ³³ , R ³⁴ and R ³⁵ are organic groups having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. R ³⁶ , R ³⁷ , R ³⁸ , R ³⁹ , R ⁴⁰ , R ⁴¹ , R ⁴² , R ⁴³ and R ⁴⁴ are each a hydrocarbon group having 1 to 10 carbon atoms, a hydrogen atom, a halogen atom An atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom may be contained, and each may be the same or different.)

(In the above chemical formula (6), R ⁴⁵ , R ⁴⁶ and R ⁴⁷ are organic groups having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. R ⁴⁸ , R ⁴⁹ , R ⁵⁰ , R ⁵¹ , R ⁵² , R ⁵³ , R ⁵⁴ , R ⁵⁵ and R ⁵⁶ are each a hydrocarbon group having 1 to 10 carbon atoms, a hydrogen atom, a halogen atom An atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom may be contained, and each may be the same or different.)   The hydrogenated styrene elastomer has a number average molecular weight in terms of styrene in gel permeation chromatography measurement of 50,000 to 100,000, and a styrene content of 10 to 40% by weight. The insulating material for electronic components as described in any one.   The spherical silicon oxide filler has an average particle size of 0.2 to 3 μm, and at least one kind of vinyl-based, methacrylate-based, acrylate-based or styrene-based silane coupling agent is supported on the surface thereof. The insulating material for electronic components according to any one of claims 3 to 7. Furthermore, at least 1 or more types are included among the flame retardants represented by following Chemical formula (7) or (8), The insulating material for electronic components as described in any one of Claims 3-8 characterized by the above-mentioned.

Furthermore, the polyfunctional styrene compound represented by following Chemical formula (9) is included, The insulating material for electronic components as described in any one of Claims 3-9 characterized by the above-mentioned.

(The chemical formula (9) represents a polyfunctional styrene compound having a plurality of styrene type skeletons, and r represents an integer of 2 or more. R ⁵⁷ , R ⁵⁸ , R ⁵⁹ , R ⁶⁰ , R ⁶¹ , R ⁶² and R ⁶³ is a hydrocarbon group having 1 to 10 carbon atoms and may contain a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom, and each may be the same or different. ⁶⁴ is an organic group having 1 or more carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. Furthermore, the bismaleimide compound represented by following Chemical formula (10) is included, The insulating material for electronic components as described in any one of Claims 3-10 characterized by the above-mentioned.

(In the chemical formula (10), R ⁶⁵ is a hydrocarbon group having 1 to 10 carbon atoms and may contain an oxygen atom, a nitrogen atom, a sulfur atom, or a halogen atom. R ⁶⁶ , R ⁶⁷ , R ⁶⁸ , R ⁶⁹ , R ⁷⁰ , R ⁷¹ , R ⁷² and R ⁷³ are each a hydrocarbon group having 1 to 4 carbon atoms, including a hydrogen atom, a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. And each may be the same or different.) Furthermore, the 1,2-polybutadiene compound represented by following Chemical formula (11) is included, The insulating material for electronic components as described in any one of Claims 3-11 characterized by the above-mentioned.

(In the above chemical formula (11), s is the degree of polymerization and is represented by an integer of 1 or more. This compound may have a molecular weight distribution, and the number average molecular weight in terms of styrene in gel permeation chromatography measurement is 100,000 to 200,000.)   A sealing material for electronic parts, comprising the insulating material for electronic parts according to any one of claims 1 to 12.   14. A module having a configuration in which the electronic component sealing material according to claim 13, a substrate on which a wiring pattern is formed, and an electronic component are laminated.   A liquid potting agent characterized in that 50 to 90 parts by weight of the insulating material for electronic parts according to any one of claims 1 to 12 is dissolved in an organic solvent.   The resin film for electronic component sealing containing the insulating material for electronic components as described in any one of Claims 1-12.   An adhesive film for electronic parts, comprising the insulating material for electronic parts according to any one of claims 1 to 12.   A prepreg comprising a cloth or a nonwoven fabric impregnated with the insulating material for electronic parts according to any one of claims 1 to 12.   The prepreg according to claim 18, wherein the cloth or the nonwoven fabric contains quartz fibers.   The prepreg according to claim 18 or 19, wherein the cloth or the nonwoven fabric contains polyolefin fibers.   A laminate comprising a conductor layer provided on one or both sides of a cured product obtained by curing the prepreg according to any one of claims 18 to 20.   21. A printed board comprising conductor wiring provided on one side or both sides of a cured product obtained by curing the prepreg according to any one of claims 18 to 20.   A printed circuit board according to claim 22 and a prepreg according to any one of claims 18 to 20 are alternately laminated and bonded together, and the printed circuit board and the prepreg are electrically connected. A multilayer printed circuit board characterized by having an interlayer wiring to perform.   14. A method of manufacturing a module having a configuration in which an electronic component sealing material according to claim 13, a substrate on which a wiring pattern is formed, and an electronic component are stacked, wherein the electronic component is installed on the substrate. A module fixing method comprising: a component fixing step of fixing the electronic component; and a molding step of installing the electronic component sealing material on the substrate on which the electronic component is fixed and fixing by heat molding. .

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