CN112622368B - Low-stress heat conduction pad, preparation method thereof and electronic product - Google Patents

Low-stress heat conduction pad, preparation method thereof and electronic product Download PDF

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CN112622368B
CN112622368B CN202011498446.3A CN202011498446A CN112622368B CN 112622368 B CN112622368 B CN 112622368B CN 202011498446 A CN202011498446 A CN 202011498446A CN 112622368 B CN112622368 B CN 112622368B
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heat
parts
silica gel
gel layer
layer
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CN112622368A (en
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廖志盛
李峰
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Hangzhou Zhaoke Electronic Materials Co ltd
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Hangzhou Zhaoke Electronic Materials Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
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    • B32—LAYERED PRODUCTS
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
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    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
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Abstract

The application relates to the field of heat conducting materials, in particular to a low-stress heat conducting pad, a preparation method thereof and an electronic product. The preparation method of the heat conduction pad comprises the following steps: arranging protective layers on two surfaces of the heat-conducting silica gel layer; the protective layer is a glass fiber cloth layer and/or a polyimide film layer. By arranging the glass fiber cloth layers and/or the polyimide film layers on the two surfaces of the heat-conducting silica gel layer, the heat-conducting silica gel layer is supported, and even the very soft heat-conducting silica gel layer with the hardness shore 00 between 1 and 6 can be well used. And because the glass fiber cloth layers and/or the polyimide film layers are arranged on the two surfaces of the heat-conducting silica gel layer, the bending resistance of the heat-conducting silica gel layer is improved, the heat-conducting silica gel layer is prevented from being torn in the use process, and the application range is greatly enlarged.

Description

Low-stress heat conduction pad, preparation method thereof and electronic product
Technical Field
The application relates to the field of heat conducting materials, in particular to a low-stress heat conducting pad, a preparation method thereof and an electronic product.
Background
The electronic product is easy to generate heat due to the chip, the circuit board and the like, and a heat conducting pad is required to be arranged. Typically, a thermally conductive silicone sheet is used.
However, the conventional lowest hardness of the conventional heat conductive silicone sheet is shore 15, which results in limiting the range of use of the heat conductive silicone sheet in use due to the excessive hardness of the heat conductive silicone sheet.
Disclosure of Invention
An objective of the embodiments of the present application is to provide a low-stress thermal pad, a manufacturing method thereof, and an electronic product, which aims to provide a thermal pad with low hardness and convenient operation during use.
In a first aspect, the present application provides a method for preparing a thermal pad, including:
arranging protective layers on two surfaces of the heat-conducting silica gel layer; the protective layer is a glass fiber cloth layer and/or a polyimide film layer.
By arranging the glass fiber cloth layers and/or the polyimide film layers on the two surfaces of the heat-conducting silica gel layer, the heat-conducting silica gel layer is supported, and the heat-conducting silica gel layer can be well used even if the hardness of the heat-conducting silica gel layer is very low (shore 00 is between 1 and 6). The double-sided support not only can improve the supporting force of the heat conduction silica gel layer, but also can solve the problem of high viscosity of the low-hardness heat conduction silica gel. And because the glass fiber cloth layers and/or the polyimide film layers are arranged on the two surfaces of the heat-conducting silica gel layer, the bending resistance of the heat-conducting silica gel layer is improved, the heat-conducting silica gel layer is prevented from being torn in the use process, and the application range is greatly enlarged. The heat conducting pad can use heat conducting silica gel with the Shore 00 between 1 and 6, ensures excellent supporting strength and lower viscosity, and is convenient for a user to operate. The heat conducting pad is thinner, can meet the requirement of light and thin electronic products at present, and is wide in application range.
In other embodiments of the present application, the step of disposing the protective layer on two surfaces of the thermally conductive silicone adhesive layer includes:
and (3) compounding and forming the protective layer and the heat-conducting silica gel layer in a calendaring mode.
In other embodiments of the present application, the step of calendaring includes:
mixing and uniformly dispersing 2-30 parts by mass of methyl vinyl silicone rubber and 8-70 parts by mass of vinyl silicone oil to obtain a first dispersion material;
mixing the first dispersion material with 300-1900 parts of heat conducting powder and 0.5-100 parts of flame retardant auxiliary agent and uniformly dispersing to obtain a second dispersion material;
and coating the second dispersion material between the protective layers, and calendaring and forming.
In other embodiments of the present application, the raw materials of the methyl vinyl silicone rubber include: one or more of methyl end-capped glue, vinyl end-capped glue and linear polydimethylsiloxane;
alternatively, the linear polydimethylsiloxane has a molecular weight of 45-80 ten thousand and a vinyl content of between 0.0% and 5%;
optionally, the vinyl silicone oil is selected from one or more of monovinyl end-capped polydimethylsiloxane, divinyl end-capped polydimethylsiloxane and methyl end-capped polydimethylsiloxane;
alternatively, the viscosity of the vinyl silicone oil is in the range of 100 to 5000cps.
In other embodiments of the present application, the step of mixing and dispersing 2 to 30 parts of methyl vinyl silicone rubber and 8 to 70 parts of vinyl silicone oil uniformly to obtain a first dispersion comprises:
mixing 2-30 parts of methyl vinyl silicone rubber and 8-70 parts of vinyl silicone oil, and then dispersing at high speed under the condition of vacuum heating;
optionally, the linear velocity of dispersion is not less than 12m/s, the vacuum degree is 0.05-0.10 MPa, and the temperature is 130-150 ℃;
optionally, the stirring time is 30-40 minutes.
In other embodiments of the present application, the heat conductive powder is selected from one or more of aluminum nitride, boron nitride, aluminum oxide, aluminum hydroxide, zinc oxide, silicon carbide;
optionally, the flame retardant auxiliary is selected from one or more of aluminum hydroxide, aluminum oxide and magnesium oxide;
alternatively, the flame retardant aid is spherical or spheroidal in shape.
In other embodiments of the present application, the second dispersion is further mixed with an auxiliary agent prior to the step of calendaring the second dispersion;
optionally, the auxiliary agent comprises the following components in parts by weight: 0.3-10 parts of a mold release agent, 0.3-6 parts of a processing aid, 2-15 parts of a crosslinking aid, 0.3-3 parts of a retarder and 0.3-5 parts of a catalyst;
optionally, the release agent is one or more selected from surfactant, hydroxyl linear polydimethylsiloxane and diphenyl silicon glycol;
optionally, the processing aid is selected from one or more of talcum powder, silicon dioxide and titanium dioxide;
optionally, the cross-linking auxiliary agent is selected from one or more of bi-di-tetra, bi-di-penta and hydrogen-containing silicone oil;
alternatively, the retarder is ethynyl cyclohexanol;
alternatively, the main active component of the catalyst is metallic platinum.
In other embodiments of the present application, the fiberglass cloth layer is made of alkali-free fiberglass cloth, optionally, having a thickness of 0.033-0.082mm;
the polyimide film layer is made of pyromellitic dianhydride and 4, 4-diaminodiphenyl ether or resin; optionally, the thickness is between 0.025 and 0.2mm.
In a second aspect, the present application provides a thermal pad comprising:
a thermally conductive silicone layer; and
a protective layer; the protective layers are arranged on two surfaces of the heat-conducting silica gel layer; the protective layer is a glass fiber cloth layer and/or a polyimide film layer.
In other embodiments of the present application, the shore 00 of the thermally conductive silicone layer is between 1 and 6.
In a third aspect, the present application provides an electronic product, including a thermal pad manufactured by the method for manufacturing a thermal pad according to any one of the preceding claims; or the aforementioned thermal pad.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments.
Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
The inventors found that a thermally conductive silica gel with a shore 00 of between 1 and 6 not only has excellent thermal conductivity but can be adapted for a wider variety of use scenarios. Therefore, the problem that the application scene of the heat conduction silica gel is limited due to the fact that the heat conduction silica gel is too hard in the prior art can be solved. However, the heat-conducting silica gel with the shore 00 of between 1 and 6 is very easy to deform due to the low hardness and high in viscosity, the heat-conducting silica gel with the hardness is difficult to be made into a silica gel sheet, and the heat-conducting silica gel is very inconvenient to operate by a user due to the high deformation viscosity during use.
The embodiment of the application provides a heat conduction pad, which can use heat conduction silica gel with the shore 00 between 1 and 6, and ensures that the heat conduction pad has excellent supporting strength and lower viscosity, so that a user can operate the heat conduction pad conveniently. The heat conducting pad is thinner, can meet the requirement of light and thin electronic products at present, and is wide in application range.
Further, the thermal pad includes: a heat-conducting silica gel layer and a protective layer. Further, the protective layers are arranged on two surfaces of the heat-conducting silica gel layer.
Further, the protective layer is a glass fiber cloth layer and/or a polyimide film layer.
Further, the shore 00 of the heat-conducting silica gel layer is between 1 and 6.
Further alternatively, the above-mentioned thermally conductive silicone layer has a shore 00 of between 2 and 5.
Illustratively, the thermally conductive silicone layer has a shore 00 of 3, 4, or 5.
By arranging the glass fiber cloth layers and/or the polyimide film layers on the two surfaces of the heat-conducting silica gel layer, the heat-conducting silica gel layer is supported, and even the very soft heat-conducting silica gel layer with the hardness shore 00 between 1 and 6 can be well used. And because the glass fiber cloth layers and/or the polyimide film layers are arranged on the two surfaces of the heat-conducting silica gel layer, the bending resistance of the heat-conducting silica gel layer is improved, the heat-conducting silica gel layer is prevented from being torn in the use process, and the application range is greatly enlarged.
In some embodiments of the present application, a method for preparing a thermal pad is provided, which can be used to prepare the thermal pad provided in the foregoing embodiments.
In some embodiments of the present application, the method for preparing the thermal pad includes: and arranging protective layers on two surfaces of the heat-conducting silica gel layer.
Further, the step of disposing the protective layer on both surfaces of the thermally conductive silica gel layer includes: and (3) compounding and forming the protective layer and the heat-conducting silica gel layer in a calendaring mode.
Further, the step of calendaring includes: mixing and uniformly dispersing 2-30 parts by mass of methyl vinyl silicone rubber and 8-70 parts by mass of vinyl silicone oil to obtain a first dispersion material;
mixing the first dispersion material with 300-1900 parts of heat conducting powder and 0.5-100 parts of flame retardant auxiliary agent and uniformly dispersing to obtain a second dispersion material;
and coating the second dispersion material between the protective layers, and calendaring and forming.
In some embodiments, the preparation method of the heat conducting pad by adopting calendaring compounding comprises the following steps:
and S1, removing impurities from the heat conducting powder.
The heat conducting powder is subjected to impurity removal, so that the composite effect of the follow-up heat conducting powder and other raw materials can be improved.
Further, the heat conducting powder is subjected to impurity removal by adopting a high-temperature dehydration mode.
Further, the heat conducting powder is one or more selected from aluminum nitride, boron nitride, aluminum oxide, aluminum hydroxide, zinc oxide and silicon carbide.
Illustratively, the above-mentioned heat conductive powder is aluminum nitride, boron nitride, aluminum oxide, aluminum hydroxide, zinc oxide or silicon carbide; or the heat conducting powder is aluminum nitride and boron nitride; or the heat conducting powder is aluminum nitride, boron nitride and aluminum oxide; or the heat conducting powder is aluminum hydroxide, zinc oxide and silicon carbide.
And S2, preparing a heat-conducting silica gel layer.
The preparation steps of the heat-conducting silica gel layer comprise:
mixing 2-30 parts of methyl vinyl silicone rubber and 8-70 parts of vinyl silicone oil and uniformly dispersing to obtain a first dispersed material;
mixing the first dispersion material with 300-1900 parts of heat conducting powder and 0.5-100 parts of flame retardant auxiliary agent and uniformly dispersing to obtain a second dispersion material;
and calendaring and molding the second dispersion material to obtain the heat-conducting silica gel layer.
Further, the step of mixing and uniformly dispersing 2 to 30 parts of methyl vinyl silicone rubber and 8 to 70 parts of vinyl silicone oil to obtain a first dispersed material comprises the following steps:
mixing 2-30 parts of methyl vinyl silicone rubber and 8-70 parts of vinyl silicone oil, and then dispersing at high speed under the condition of vacuum heating;
optionally, the linear velocity of dispersion is not less than 12m/s, the vacuum degree is 0.05-0.10 MPa, and the temperature is 130-150 ℃;
optionally, the stirring time is 30-40 minutes.
In some embodiments of the present application, 2 to 30 parts of methyl vinyl silicone rubber and 8 to 70 parts of vinyl silicone oil are mixed and then added to a high-speed dispersing machine or a planetary mixer, and a high-speed dispersing disc is additionally arranged for high-speed dispersion.
Further alternatively, the linear velocity of the dispersion is 12-20 m/s, the vacuum degree is 0.06-0.09 MPa, and the temperature is 135-149 ℃.
Further alternatively, the linear velocity of the dispersion is 13-19 m/s, the vacuum degree is 0.07-0.09 MPa, and the temperature is 136-148 ℃.
Illustratively, the linear velocity of dispersion is 15m/s, the vacuum is 0.08MPa, and the temperature is 140 ℃.
Further, the raw materials of the methyl vinyl silicone rubber include: one or more of methyl end-capped glue, vinyl end-capped glue and linear polydimethylsiloxane.
Alternatively, the linear polydimethylsiloxane has a molecular weight of 45 to 80 ten thousand and a vinyl content of between 0.0% and 5%.
Further alternatively, the linear polydimethylsiloxane has a molecular weight of 46 to 79 ten thousand and a vinyl content of between 0.01% and 4%.
Illustratively, the linear polydimethylsiloxane has a molecular weight of 50 ten thousand and a vinyl content of 1%.
Further, the vinyl silicone oil is selected from one or more of monovinyl end-capped polydimethylsiloxane, divinyl end-capped polydimethylsiloxane and methyl end-capped polydimethylsiloxane.
Further, the viscosity of the vinyl silicone oil is 100-5000cps.
Further alternatively, the viscosity of the vinyl silicone oil is in the range of 110 to 4500cps.
Further alternatively, the viscosity of the vinyl silicone oil is 120-4000cps.
Illustratively, the vinyl silicone oil has a viscosity of 130cps, 200cps, 300cps, 400cps, 500cps, 600cps, 1000cps, 1500cps, 2500cps, 3000cps.
And step S3, uniformly mixing the second dispersion material and the auxiliary agent.
Further, the auxiliary agent comprises the following components in parts by weight: 0.3-10 parts of a mold release agent, 0.3-6 parts of a processing aid, 2-15 parts of a crosslinking aid, 0.3-3 parts of a retarder and 0.3-5 parts of a catalyst;
further, the release agent is one or more selected from surfactant, hydroxyl linear polydimethylsiloxane and diphenyl silicon glycol.
In some embodiments, the surfactant is a Silicone Oil surfactant.
Further, the processing aid is selected from one or more of talcum powder, silicon dioxide and titanium dioxide.
Further, the cross-linking auxiliary agent is selected from one or more of bi-di-tetra, bi-di-penta and hydrogen-containing silicone oil.
Further, the retarder is ethynyl cyclohexanol.
Further, the main active component of the catalyst is metallic platinum.
In some embodiments of the application, 300-1900 parts of the heat conducting powder prepared in the step S1, 0.5-100 parts of the first dispersing material prepared in the step S2 and the flame retardant auxiliary; and mixing and uniformly dispersing 0.3-10 parts of a mold release agent, 0.3-6 parts of a processing aid, 2-15 parts of a crosslinking aid, 0.3-3 parts of a retarder and 0.3-5 parts of a catalyst to obtain a second dispersion material.
Further, 300-1900 parts of the heat conducting powder prepared in the step S1, 0.5-100 parts of the first dispersing material prepared in the step S2 and the flame retardant auxiliary; mixing 0.3-10 parts of a mold release agent, 0.3-6 parts of a processing aid, 2-15 parts of a crosslinking aid, 0.3-3 parts of a retarder and 0.3-5 parts of a catalyst, and stirring by a high-speed dispersing machine or a planetary stirrer.
And S4, forming the heat-conducting silica gel layer obtained in the step S3 and the protective layer into a whole.
Further, the protective layers are arranged on the two surfaces of the heat-conducting silica gel layer in a physical compounding mode; the protective layer is a glass fiber cloth layer and/or a polyimide film layer.
Further, the step of disposing the protective layer on two surfaces of the heat-conducting silica gel layer in a physical compounding manner includes:
and stacking the protective layer and the heat-conducting silica gel layer, and then compounding into a whole in a calendaring mode.
In some embodiments of the application, an 8-roll calender is adopted, the upper film is provided with glass fiber cloth/polyimide film and PET release film, the lower film is provided with glass fiber cloth/polyimide film and PET release film, the sheet is discharged, and the thickness of different intervals is regulated to roll out the thickness product required by customers.
Further, the glass fiber cloth layer is made of alkali-free glass fiber cloth, and optionally has a thickness of 0.033-0.082mm.
Further alternatively, the fiberglass cloth layer has a thickness of 0.035-0.080mm.
Further alternatively, the fiberglass cloth layer has a thickness of 0.030-0.070mm.
Illustratively, the fiberglass cloth layer is 0.040mm, 0.050mm, or 0.060mm thick.
Further, the polyimide film layer is made of pyromellitic dianhydride and 4, 4-diaminodiphenyl ether or resin; optionally, the thickness is between 0.025 and 0.2mm.
Further alternatively, the polyimide film layer has a thickness of 0.030 to 0.15mm.
Further alternatively, the polyimide film layer thickness is in the range of 0.050 to 0.10mm.
Exemplary polyimide film layer thicknesses are 0.060mm, 0.080mm, 0.090mm.
In some embodiments of the present application, the upper surface and the lower surface of the heat conductive pad are both provided with a glass fiber cloth layer.
In some embodiments of the present application, the upper surface and the lower surface of the heat conductive pad are both provided with polyimide film layers.
In some embodiments of the present application, the upper surface of the heat conducting pad is provided with a glass fiber cloth layer, and the lower surface is provided with a polyimide film layer.
In some embodiments of the present application, the lower surface of the heat conducting pad is provided with a glass fiber cloth layer, and the upper surface is provided with a polyimide film layer.
The thicknesses of the glass fiber cloth layer and the polyimide film layer are selected and set according to actual needs. The number of layers of the glass fiber cloth layer and the polyimide film layer can be selected to be a plurality of layers according to actual needs.
Some embodiments of the present application further provide an electronic product, which includes the thermal pad manufactured by the method for manufacturing a thermal pad provided in any one of the foregoing embodiments; or the aforementioned thermal pad.
The features and capabilities of the present application are described in further detail below in connection with the examples:
example 1
Providing a heat conduction pad, which is prepared according to the following steps:
(1) Removing impurities from the heat conducting powder.
And removing impurities by adopting a high-temperature dehydration mode. The heat conducting powder consists of aluminum nitride, boron nitride, aluminum oxide, aluminum hydroxide, zinc oxide and silicon carbide.
(2) Removing impurities from the heat conducting powder.
Mixing 2-30 parts of methyl vinyl silicone rubber and 8-70 parts of vinyl silicone oil, and adding the mixture into a high-speed dispersing machine or a planetary stirrer, and adding a high-speed dispersing disc for high-speed dispersing to obtain a first dispersing material.
The raw materials of the methyl vinyl silicone rubber comprise: methyl-terminated gums, vinyl-terminated gums, and linear polydimethyl siloxanes.
The molecular weight of the linear polydimethylsiloxane is 50 ten thousand, and the vinyl content is between 4%.
(3) 800 parts of the heat conducting powder prepared in the step (1), 0.5 part of the first dispersing material prepared in the step (2) and the flame retardant auxiliary; and (3) mixing 0.3 part of a mold release agent, 0.3 part of a processing aid, 3 parts of a crosslinking aid, 0.3 part of a retarder and 0.3 part of a catalyst, and uniformly stirring and dispersing by a high-speed dispersing machine or a planetary stirrer to obtain a second dispersing material.
(4) And (3) adopting an 8-roll calender, feeding a polyimide film and a PET release film, feeding a glass fiber cloth and a PET release film with a lower film, adjusting the thickness of different intervals, and carrying out calendaring molding on the second dispersion material obtained in the step (S3) and the protective layer to obtain a product with preset thickness.
Example 2
A thermal pad was provided substantially the same as the preparation step of example 1, except that in step (4), the upper film was provided with a glass fiber cloth and a PET release film, and the lower film was provided with a polyimide film and a PET release film.
Example 3
A thermal pad was provided substantially the same as the preparation step of example 1, except that in step (4), the upper film was provided with a glass fiber cloth and a PET release film, and the lower film was provided with a glass fiber cloth and a PET release film.
Example 4
A thermal pad was provided substantially the same as the preparation step of example 1, except that in step (4), the upper film had polyimide film and PET release film, and the lower film had polyimide film and PET release film were peeled off.
Example 5
Providing a heat conducting pad, which is basically the same as the preparation step of the embodiment 1, except that in the step (3), 1900 parts of heat conducting powder, 100 parts of the first dispersing material prepared in the step (2) and flame retardant auxiliary; 10 parts of a mold release agent, 6 parts of a processing aid, 2 parts of a crosslinking aid, 3 parts of a retarder and 5 parts of a catalyst are mixed and uniformly stirred and dispersed by a high-speed dispersing machine or a planetary stirrer to obtain a second dispersing material.
Example 6
Providing a heat conducting pad, which is basically the same as the preparation step of the embodiment 1, except that in the step (3), 1900 parts of heat conducting powder, 100 parts of the first dispersing material prepared in the step (2) and flame retardant auxiliary; 10 parts of a mold release agent, 6 parts of a processing aid, 2 parts of a crosslinking aid, 3 parts of a retarder and 5 parts of a catalyst are mixed and uniformly stirred and dispersed by a high-speed dispersing machine or a planetary stirrer to obtain a second dispersing material.
Comparative example 1
A process was provided which was substantially identical to the process of example 1, except that in step (4), only the glass fiber cloth and PET release film were applied.
Comparative example 2
A process was provided substantially identical to the process of example 1, except that in step (4), only the lower film was provided with polyimide glass and PET release film.
Experimental example
The performance of the 2.0mm thick thermal pads of the test specimens provided in examples 1 to 6 and comparative examples 1 to 2 was tested.
1. The compression rate detection step comprises the following steps:
1.1 taking a sample with the specification phi 27 mm;
1.2, testing by adopting a compression ratio tester, and selecting 10/20/30 PSI pressure;
1.3 recording the numerical value according to the test result.
2. The detection step of the thermal conductivity comprises the following steps:
2.1 sampling a sample with a specification phi of 30 mm;
2.2, testing by adopting a DRL thermal conductivity tester, and testing the thermal conductivity coefficient;
2.3 recording the numerical value according to the test result.
3. The detection step of the breakdown voltage comprises the following steps:
3.1 sampling a 30mm by 60mm specification sample;
3.2, testing by adopting a breakdown voltage tester, and testing breakdown voltage resistance;
and 3.3, recording a numerical value according to the test result.
4. The hardness detection step comprises the following steps:
4.1 sampling 60mm by 60mm specification;
4.2, testing hardness by using a Shore oo hardness tester;
4.3 recording the numerical value according to the test result.
The detection results are shown in Table 1.
TABLE 1
Figure BDA0002842899570000121
From the above test results in table 1, it can be seen that the compression ratio of the thermal pad prepared in the embodiment of the present application is significantly smaller than that of the comparative example, and the thermal conductivity and the breakdown voltage meet the requirements. This demonstrates that the solution of the present application is able to maintain small stresses even with very soft thermally conductive silicone layers with hardness shore 00 between 1 and 6. And because the glass fiber cloth layers and/or the polyimide film layers are arranged on the two surfaces of the heat-conducting silica gel layer, the bending resistance of the heat-conducting silica gel layer is improved, the heat-conducting silica gel layer is prevented from being torn in the use process, and the application range is greatly enlarged.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (2)

1. The preparation method of the low-stress heat conduction pad is characterized by comprising the following steps of:
arranging protective layers on two surfaces of the heat-conducting silica gel layer; the protective layer is an upper film polyimide film and a PET release film, the lower film is provided with glass fiber cloth and a PET release film, and the hardness Shore 00 of the heat-conducting silica gel layer is 3;
the step of disposing the protective layer on two surfaces of the heat-conducting silica gel layer comprises the following steps: compounding and forming the protective layer and the heat-conducting silica gel layer in a calendaring mode;
the step of calendaring includes:
mixing 2-30 parts by mass of methyl vinyl silicone rubber and 8-70 parts by mass of vinyl silicone oil, and then adding the mixture into a high-speed dispersing machine or a planetary stirrer, and adding a high-speed dispersing disc to carry out high-speed dispersion to obtain a first dispersing material;
mixing the first dispersion material with 1900 parts of heat conducting powder, 100 parts of flame retardant auxiliary agent, 10 parts of mold release agent, 6 parts of processing auxiliary agent, 2 parts of crosslinking auxiliary agent, 3 parts of retarder and 5 parts of catalyst, and uniformly stirring and dispersing by adopting a high-speed dispersing machine or a planetary stirrer to obtain a second dispersion material; coating the second dispersion material between the protective layers, and adopting an 8-roller calender for calendaring molding;
the methyl vinyl silicone rubber comprises the following raw materials: methyl end-capped glue, vinyl end-capped glue and linear polydimethylsiloxane;
the linear polydimethylsiloxane had a molecular weight of 50 ten thousand and a vinyl content of 4%;
the heat conducting powder consists of aluminum nitride, boron nitride, aluminum oxide, aluminum hydroxide, zinc oxide and silicon carbide, and is subjected to impurity removal by adopting a high-temperature dehydration mode;
the thickness of the heat conduction pad is 2.0mm, the heat conduction coefficient of the heat conduction pad is 5.32W/m.k, the breakdown voltage is more than 6kV, the compression ratio under 10psi pressure is 13.5%, the compression ratio under 20psi pressure is 23.2%, and the compression ratio under 30psi pressure is 37.5%.
2. An electronic product comprising the low stress thermal pad of claim 1.
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