CN107471784A - A kind of composite glass fiber heat conductive silica gel pad - Google Patents
A kind of composite glass fiber heat conductive silica gel pad Download PDFInfo
- Publication number
- CN107471784A CN107471784A CN201710664498.5A CN201710664498A CN107471784A CN 107471784 A CN107471784 A CN 107471784A CN 201710664498 A CN201710664498 A CN 201710664498A CN 107471784 A CN107471784 A CN 107471784A
- Authority
- CN
- China
- Prior art keywords
- silica gel
- glass fiber
- gel pad
- heat conductive
- fiber heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of composite glass fiber heat conductive silica gel pad, including composite glass fiber heat conductive silica gel shim body, the composite glass fiber heat conductive silica gel shim body includes glass fibre and silica gel pad, and the silica gel pad connects glass fibre.The present invention is simple in construction, using the fine good toughness later of ripple, solid, enhancing high shear strength, the tear-resistant product of anti-puncture on product, and does not influence Heat Conduction Material possessed Suresh Kumar hot property itself, is suitable for the application of any electronic and electrical equipment extensively.
Description
Technical field
The present invention relates to compound interface Heat Conduction Material field, more particularly to a kind of composite glass fiber heat conductive silica gel pad.
Background technology
With the development of the assembling densification of integrated technology and microelectronics, heat caused by electronic equipment accumulates rapidly,
Increase, and as the rise of electronic component self-temperature can directly result in the performance and reliability decrease of itself, therefore energy
An important factor for no radiating in time turns into its service life of influence.To ensure that electronic component remains to protect at a temperature of use environment
Normal operating conditions is held, one layer of heat conductive insulating film would generally be set to be used as heat conduction on the heat exchange interface of related component
Boundary material, rapidly by heater element heat transfer to heat dissipation equipment, to ensure electronic equipment normal operation.
The heat-conducting insulation material provided in the market is mainly exhausted using a kind of individual layer silicon rubber heat conduction simple in construction
Edge pad, silicon rubber are a kind of conventional insulating gasket materials, with performances such as excellent heat-resisting, cold-resistant and resistance to ozone, but
Shortcomings are gone back in heat conduction, anti-corrosion and shock resistance etc. causes the performance of insulation spacer of the prior art also to be deposited
In deficiency, its material need to be improved, and combination property need further to improve and improve, now conventional heat conductive silica gel on the market
Piece stretch-resistance is poor and proof voltage can be low, can be easy to tear because stretch-resistance is poor in use in addition
Situation.
The content of the invention
It is an object of the invention to overcome problem above existing for prior art, there is provided a kind of composite glass fiber thermal conductive silicon rubber cushion
Piece, band ripple fibre heat-conducting silica gel sheet are using glass and silica gel as base material, the compound of containing silicone resin, boron nitride and glass, use ripple
Toughness of products is good, solid after fine, enhancing high shear strength, the tear-resistant product of anti-puncture.And do not influence Heat Conduction Material in itself
Possessed Suresh Kumar hot property, is suitable for the application of any electronic and electrical equipment extensively.
To realize above-mentioned technical purpose and the technique effect, the present invention is achieved through the following technical solutions：
A kind of composite glass fiber heat conductive silica gel pad, including composite glass fiber heat conductive silica gel shim body, the composite glass fiber thermal conductive silicon
Glue gasket body includes glass fibre and silica gel pad, and the silica gel pad connects glass fibre, the composite glass fiber thermal conductive silicon
Glue gasket body is prepared by following raw material by weight：
Boron nitride 20-100 parts
Vinyldimethicone 10-50 parts
Crosslinking agent 1-20 parts
Vulcanizing agent 1-20 parts
Further, preferred scheme 1, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
60 parts of boron nitride
30 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, preferred scheme 2, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
80 parts of boron nitride
20 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, preferred scheme 3, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
90 parts of boron nitride
10 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, the composite glass fiber heat conductive silica gel shim body is to be prepared by the following method：
1) by boron nitride, vinyldimethicone, crosslinking agent, vulcanizing agent is according to 6：3:0.5:0.5 ratio is matched somebody with somebody
Than；
2) boron nitride, polysiloxanes, crosslinking agent, vulcanizing agent are added in stirred tank and stirred 1 hour, rotating speed be 120r~
160rpm, uniform stirring；
3) by the sizing material that step 2 obtains by calendering process, by glass fibre and silica gel pad calender lamination；
4) product after calender lamination in step 3 is subjected to vulcanizing treatment, 140 DEG C of curing temperature, 25~35min of cure time；
5) product after step 4 is handled carries out cutting processing, shaping.
Further, the composite glass fiber heat conductive silica gel shim body is square or circular or obtains difference as needed
Customization shape.
Further, the glass fibre is arranged to 1 layer or more than 1 layer, preferably 1 layer.
Further, the thickness of the composite glass fiber heat conductive silica gel shim body is arranged to 0.1-10mm.
Further, the glass fibre being capable of one side calender lamination and/or two-sided calender lamination.
Further, the glass fibre includes AR glass fibres, E-CR glass fibres, A glass, D glass.
Further, the thickness of the glass fibre is arranged to 0.05-0.1mm.
Further, the glass fibre and silica gel pad single-sided lamination and/or two-sided can be bonded.
The beneficial effects of the invention are as follows：
1. cost is low, glass fibre relative to other materials material benefit and with cost-benefit；
2. stability is strong, glass fiber compound material, which has, can be used for one of maximum intensity weight ratio of manufacture component；
3. product appearance meets many demands, glass fibre and composite material component can make flat board, semi-gloss or bloom
Pool.The needs of so as to meet heat-conducting silica gel sheet and various Heat Conduction Materials in appearance.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, with presently preferred embodiments of the present invention and coordinate accompanying drawing to describe in detail below.This hair
Bright embodiment is shown in detail by following examples and its accompanying drawing.
Brief description of the drawings
Accompanying drawing described herein is used for providing a further understanding of the present invention, forms the part of the application, this hair
Bright schematic description and description is used to explain the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings：
Fig. 1 is a kind of schematic diagram of composite glass fiber heat conductive silica gel pad of the present invention；
Label declaration in figure：Composite glass fiber heat conductive silica gel shim body 1, glass fibre 2, silica gel pad 3.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings：
Shown in reference picture 1, a kind of composite glass fiber heat conductive silica gel pad, including composite glass fiber heat conductive silica gel shim body 1, it is described multiple
Combined glass fibre heat conductive silica gel shim body 1 includes glass fibre 2 and silica gel pad 3, and the silica gel pad 3 connects glass fibre 4, institute
Composite glass fiber heat conductive silica gel shim body 1 is stated to be prepared by following raw material by weight：
Boron nitride 20-100 parts
Vinyldimethicone 10-50 parts
Crosslinking agent 1-20 parts
Vulcanizing agent 1-20 parts
Further, preferred scheme 1, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
60 parts of boron nitride
30 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, preferred scheme 2, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
80 parts of boron nitride
20 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, preferred scheme 3, a kind of compound polyimide film heat conductive silica gel pad of the present invention by weight following
Raw material is prepared：
90 parts of boron nitride
10 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
Further, the composite glass fiber heat conductive silica gel shim body is to be prepared by the following method：
1) by boron nitride, vinyldimethicone, crosslinking agent, vulcanizing agent is according to 6：3:0.5:0.5 ratio is matched somebody with somebody
Than；
2) boron nitride, polysiloxanes, crosslinking agent, vulcanizing agent are added in stirred tank and stirred 1 hour, rotating speed be 120r~
160rpm, uniform stirring；
3) by the sizing material that step 2 obtains by calendering process, by glass fibre and silica gel pad calender lamination；
4) product after calender lamination in step 3 is subjected to vulcanizing treatment, 140 DEG C of curing temperature, 25~35min of cure time；
5) product after step 4 is handled carries out cutting processing, shaping.
Further, the composite glass fiber heat conductive silica gel shim body 1 is square circular or as needed obtained not
The shape of same customization.
Further, the glass fibre 2 is arranged to 1 layer or more than 1 layer, preferably 1 layer.
Further, the thickness of the composite glass fiber heat conductive silica gel shim body 1 is arranged to 0.1-10mm.
Further, the glass fibre 2 being capable of one side calender lamination and/or two-sided calender lamination.
Further, the glass fibre 2 includes AR glass fibres, E-CR glass fibres, A glass, D glass.
Further, the thickness of the glass fibre 2 is arranged to 0.05-0.1mm.
Specific embodiment 1：
First, 60 parts of boron nitride, 30 parts of vinyldimethicone, 5 parts of crosslinking agent, 5 parts of vulcanizing agent are added to
Uniform stirring in stirred tank, stir 1 hour, rotating speed is 120r~160rpm, is stirred, secondly, by glass fibre and silica gel
Pad calender lamination, then by after fitting product carry out vulcanizing treatment, 140 DEG C of curing temperature, finally, formed product.
Specific embodiment 2：
First, 80 parts of boron nitride, 20 parts of vinyldimethicone, 5 parts of crosslinking agent, 5 parts of vulcanizing agent are added to
Uniform stirring in stirred tank, stir 1 hour, rotating speed is 120r~160rpm, is stirred, secondly, by glass fibre and silica gel
Pad calender lamination, then by after fitting product carry out vulcanizing treatment, 140 DEG C of curing temperature, finally, formed product.
Specific embodiment 3：
First, 90 parts of boron nitride, 10 parts of vinyldimethicone, 5 parts of crosslinking agent, 5 parts of vulcanizing agent are added to
Uniform stirring in stirred tank, stir 1 hour, rotating speed is 120r~160rpm, is stirred, secondly, by glass fibre and silica gel
Pad calender lamination, then by after fitting product carry out vulcanizing treatment, 140 DEG C of curing temperature, finally, formed product.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention described should be defined by scope of the claims.
Claims (7)
1. a kind of composite glass fiber heat conductive silica gel pad, including composite glass fiber heat conductive silica gel shim body（1）, it is characterised in that：Institute
State composite glass fiber heat conductive silica gel shim body（1）Including glass fibre（2）And silica gel pad（3）, the silica gel pad（3）Connection
Glass fibre（4）, the composite glass fiber heat conductive silica gel shim body（1）It is prepared by following raw material by weight：
Boron nitride 20-100 parts
Vinyldimethicone 10-50 parts
Crosslinking agent 1-20 parts
Vulcanizing agent 1-20 parts
A kind of composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that below by weight
Raw material is prepared：
60 parts of boron nitride
30 parts of vinyldimethicone
5 parts of crosslinking agent
5 parts of vulcanizing agent
A kind of composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The composite glass fiber thermal conductive silicon
Glue gasket body is to be prepared by the following method：
By boron nitride, vinyldimethicone, crosslinking agent, vulcanizing agent is according to 6：3:0.5:0.5 ratio is matched；
Boron nitride, polysiloxanes, crosslinking agent, vulcanizing agent are added in stirred tank and stirred 1 hour, rotating speed is 120r~160rpm
, uniform stirring；
By the sizing material that step 2 obtains by calendering process, by glass fibre and silica gel pad calender lamination；
Product after calender lamination in step 3 is subjected to vulcanizing treatment, 140 DEG C of curing temperature, 25~35min of cure time；
Product after step 4 is handled carries out cutting processing, shaping.
A kind of 2. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The composite glass fiber heat conduction
Silica gel pad body（1）To be square or circular or obtain the shape of different customizations as needed.
A kind of 3. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The glass fibre（2）
It is arranged to 1 layer or more than 1 layer, preferably 1 layer.
A kind of 4. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The composite glass fiber heat conduction
Silica gel pad body（1）Thickness be arranged to 0.1-10mm.
A kind of 5. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The glass fibre（2）
Being capable of one side calender lamination and/or two-sided calender lamination.
A kind of 6. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The glass fibre（2）
Including AR glass fibres, E-CR glass fibres, A glass, D glass.
A kind of 7. composite glass fiber heat conductive silica gel pad according to claim 1, it is characterised in that：The glass fibre（2）
Thickness be arranged to 0.05-0.1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710664498.5A CN107471784A (en) | 2017-08-07 | 2017-08-07 | A kind of composite glass fiber heat conductive silica gel pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710664498.5A CN107471784A (en) | 2017-08-07 | 2017-08-07 | A kind of composite glass fiber heat conductive silica gel pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107471784A true CN107471784A (en) | 2017-12-15 |
Family
ID=60597732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710664498.5A Pending CN107471784A (en) | 2017-08-07 | 2017-08-07 | A kind of composite glass fiber heat conductive silica gel pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107471784A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108859324A (en) * | 2018-04-26 | 2018-11-23 | 东莞市博恩复合材料有限公司 | Insulate silica gel pad and preparation method thereof and equipment |
| CN109648940A (en) * | 2018-12-06 | 2019-04-19 | 安徽旭川新材料科技有限公司 | A kind of frosted PET hot pressing silica gel material and preparation method thereof |
| CN112622368A (en) * | 2020-12-17 | 2021-04-09 | 杭州兆科电子材料有限公司 | Low-stress heat conduction pad, preparation method thereof and electronic product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942197A (en) * | 2009-07-09 | 2011-01-12 | 昆山伟翰电子有限公司 | Heat-conducting silicon rubber composite material and preparing method thereof |
| CN104163016A (en) * | 2013-05-20 | 2014-11-26 | 深圳市傲川科技有限公司 | High-heat-conductivity high-compression wet-viscous-state heat-conducting gasket and preparation thereof |
| CN105017542A (en) * | 2015-07-28 | 2015-11-04 | 惠州市安品新材料有限公司 | Preparation method of reinforced organosilicon heat-conducting fin |
| CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
-
2017
- 2017-08-07 CN CN201710664498.5A patent/CN107471784A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942197A (en) * | 2009-07-09 | 2011-01-12 | 昆山伟翰电子有限公司 | Heat-conducting silicon rubber composite material and preparing method thereof |
| CN104163016A (en) * | 2013-05-20 | 2014-11-26 | 深圳市傲川科技有限公司 | High-heat-conductivity high-compression wet-viscous-state heat-conducting gasket and preparation thereof |
| CN105017542A (en) * | 2015-07-28 | 2015-11-04 | 惠州市安品新材料有限公司 | Preparation method of reinforced organosilicon heat-conducting fin |
| CN105566920A (en) * | 2015-12-24 | 2016-05-11 | 平湖阿莱德实业有限公司 | Low-oil-permeability super-soft thermally-conductive silica gel composition and thermally-conductive silica gel gasket and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108859324A (en) * | 2018-04-26 | 2018-11-23 | 东莞市博恩复合材料有限公司 | Insulate silica gel pad and preparation method thereof and equipment |
| CN109648940A (en) * | 2018-12-06 | 2019-04-19 | 安徽旭川新材料科技有限公司 | A kind of frosted PET hot pressing silica gel material and preparation method thereof |
| CN112622368A (en) * | 2020-12-17 | 2021-04-09 | 杭州兆科电子材料有限公司 | Low-stress heat conduction pad, preparation method thereof and electronic product |
| CN112622368B (en) * | 2020-12-17 | 2023-05-26 | 杭州兆科电子材料有限公司 | Low-stress heat conduction pad, preparation method thereof and electronic product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101701501B1 (en) | Excellent interlayer adhesive graphite sheet for composite sheet with EMI shield and heat radiation, Composite sheet with EMI shield and heat radiation containing the same and Manufacturing method thereof | |
| JPH0721308Y2 (en) | Thermal conductive sheet | |
| CN102660210A (en) | Halogen-free high heat-resistant and heat-conducting resin film and manufacturing method thereof | |
| CN101928462B (en) | Acetone-removing silicon rubber and preparation method thereof | |
| CN107471784A (en) | A kind of composite glass fiber heat conductive silica gel pad | |
| CN102676109A (en) | Method for preparing flexible heat conducting insulating adhesive film used in LED heat radiation substrate | |
| CN102161871A (en) | Heat-conductive insulated adhesive tape for large-power light-emitting diode (LED) and preparation method thereof | |
| CN103030976A (en) | Single-component heat-curing liquid silicone rubber and preparation method thereof | |
| CN104748606A (en) | Cooling structure | |
| CN102593338A (en) | Thin high-thermal-conductivity metal substrate and production method thereof | |
| CN108093501A (en) | Membrane module is heated suitable for the graphene heating film and graphene of power battery pack | |
| CN103409041A (en) | Application of flexible thermal conductive insulation adhesive on LED (Light Emitting Diode) heat dissipation substrate | |
| CN109762497A (en) | A kind of insulating heat-conductive glue film for heating device and its manufactured heating device | |
| CN107791627A (en) | A kind of metal-based copper-clad plate preparation method of resinous composition | |
| CN102746615A (en) | Formula and preparation process of heat-conducting aluminum base copper-clad plate with high heat resistance and high insulation | |
| CN106832792A (en) | A kind of insulated type epoxy resin composite material high of copper-clad plate silicon nitride comprising and preparation method thereof | |
| CN110072303A (en) | A kind of Electric radiant Heating Film and manufacturing method, heating device | |
| CN109880541A (en) | Can rapid curing and have high-adhesive-strength Heat Conduction Material | |
| CN107353432A (en) | A kind of compound polyimide film heat conductive silica gel pad | |
| KR101387086B1 (en) | Insulative and heat-dissipative master batch and insulative and heat-dissipative products | |
| CN107502258A (en) | A kind of heat-conducting glue and preparation method thereof | |
| CN102469685A (en) | Heat-conducting double-faced soft and hard combined base plate and manufacturing method thereof | |
| CN109207084A (en) | Electromagnetic wave shielding and heat dissipation composite sheet and preparation method thereof | |
| CN103826425B (en) | A kind of preparation method of high heat conduction foam | |
| CN208069347U (en) | A kind of high-power electric heating assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171215 |
|
| WD01 | Invention patent application deemed withdrawn after publication |