CN108859324A - Insulating silicone gasket and its preparation method and equipment - Google Patents
Insulating silicone gasket and its preparation method and equipment Download PDFInfo
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- CN108859324A CN108859324A CN201810383249.3A CN201810383249A CN108859324A CN 108859324 A CN108859324 A CN 108859324A CN 201810383249 A CN201810383249 A CN 201810383249A CN 108859324 A CN108859324 A CN 108859324A
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- silica gel
- glass fiber
- coating
- heat
- alkali
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- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 229920001296 polysiloxane Polymers 0.000 title description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 75
- 239000000741 silica gel Substances 0.000 claims abstract description 69
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 69
- 239000011248 coating agent Substances 0.000 claims abstract description 67
- 238000000576 coating method Methods 0.000 claims abstract description 67
- 239000003365 glass fiber Substances 0.000 claims abstract description 57
- 239000004744 fabric Substances 0.000 claims abstract description 55
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 26
- 229910052582 BN Inorganic materials 0.000 claims abstract description 23
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000012752 auxiliary agent Substances 0.000 claims abstract 3
- 238000000465 moulding Methods 0.000 claims description 36
- 238000001035 drying Methods 0.000 claims description 26
- -1 polytetrafluoroethylene Polymers 0.000 claims description 20
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 20
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 20
- 239000004945 silicone rubber Substances 0.000 claims description 20
- 239000011265 semifinished product Substances 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 238000005520 cutting process Methods 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 10
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 9
- 239000011737 fluorine Substances 0.000 claims description 9
- 229910052731 fluorine Inorganic materials 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 7
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 6
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229920002545 silicone oil Polymers 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229920005560 fluorosilicone rubber Polymers 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- LAQFLZHBVPULPL-UHFFFAOYSA-N methyl(phenyl)silicon Chemical compound C[Si]C1=CC=CC=C1 LAQFLZHBVPULPL-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000003054 catalyst Substances 0.000 claims description 2
- 150000002632 lipids Chemical class 0.000 claims description 2
- 150000001451 organic peroxides Chemical group 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 8
- 239000003292 glue Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 2
- 229910017083 AlN Inorganic materials 0.000 claims 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 34
- 230000015556 catabolic process Effects 0.000 abstract description 13
- 239000012790 adhesive layer Substances 0.000 abstract description 12
- 239000000945 filler Substances 0.000 abstract description 8
- 230000017525 heat dissipation Effects 0.000 abstract description 8
- 238000013329 compounding Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000007731 hot pressing Methods 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 239000003513 alkali Substances 0.000 description 21
- 238000003756 stirring Methods 0.000 description 8
- 239000011152 fibreglass Substances 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 239000008096 xylene Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- BOOBDAVNHSOIDB-UHFFFAOYSA-N (2,3-dichlorobenzoyl) 2,3-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC=CC(C(=O)OOC(=O)C=2C(=C(Cl)C=CC=2)Cl)=C1Cl BOOBDAVNHSOIDB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005573 silicon-containing polymer Polymers 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
- 229960000520 diphenhydramine Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
- B29C69/02—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore of moulding techniques only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/067—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of fibres or filaments
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08K2003/385—Binary compounds of nitrogen with boron
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【技术领域】【Technical field】
本发明涉及一种绝缘硅胶材料,特别是涉及一种散热效率高、易成型,且可用于电子设备热界面材料的绝缘硅胶垫片及其制备方法和设备。The invention relates to an insulating silica gel material, in particular to an insulating silica gel gasket which has high heat dissipation efficiency, is easy to form, and can be used as a thermal interface material of electronic equipment, and a preparation method and equipment thereof.
【背景技术】【Background technique】
随着电子信息技术的发展,电子设备越来越微型化,而电子设备在使用过程中或多或少会产生热量,多余的热量如不能及时散出去,则不仅影响电子设备的产品性能,而且其使用寿命也受到严重的威胁。绝缘硅胶垫片作为电子设备的组成部分,其不仅起到绝缘作用,还要求有良好的散热效果。而现有的绝缘硅胶垫片导热材料通常以氧化铝为导热填料,当其厚度小于0.5毫米,击穿电压大于3KV时,导热系数通常会低于2W/m*K,无法满足电子设备的散热需求。为了实现高导热效果,必须添加大量的氮化硼高热填料,而这种导热材料对有机硅高分子材料结构破坏非常厉害,无法成型。因此,如何提供一种散热效率高,且易成型的绝缘硅胶垫片,使其可用于电子设备热界面材料就成为一种客观需求。With the development of electronic information technology, electronic equipment is becoming more and more miniaturized, and electronic equipment will generate heat more or less during use. If the excess heat cannot be dissipated in time, it will not only affect the product performance of electronic equipment, but also Its service life is also seriously threatened. As an integral part of electronic equipment, insulating silicone gasket not only plays an insulating role, but also requires a good heat dissipation effect. The existing insulating silicone gasket heat conduction materials usually use alumina as heat conduction filler. When the thickness is less than 0.5 mm and the breakdown voltage is greater than 3KV, the thermal conductivity is usually lower than 2W/m*K, which cannot meet the heat dissipation requirements of electronic equipment. need. In order to achieve high thermal conductivity, a large amount of boron nitride high-heat filler must be added, and this thermal conductivity material can severely damage the structure of silicone polymer materials and cannot be molded. Therefore, how to provide an insulating silicone gasket with high heat dissipation efficiency and easy molding, so that it can be used as a thermal interface material of electronic equipment has become an objective demand.
【发明内容】【Content of invention】
本发明旨在解决上述问题,而提供一种散热效率高、易成型,且可用于电子设备的热界面材料的绝缘硅胶垫片。The present invention aims to solve the above problems, and provides an insulating silicone gasket with high heat dissipation efficiency, easy molding, and can be used as thermal interface material of electronic equipment.
本发明还提供了一种绝缘硅胶垫片的制备方法。The invention also provides a preparation method of the insulating silica gel gasket.
本发明还提供了一种制备绝缘硅胶垫片的设备。The invention also provides a device for preparing the insulating silica gel gasket.
为实现本发明的目的,本发明提供了一种绝缘硅胶垫片,该垫片由上导热胶层、中间无碱玻纤布层及下导热胶层复合而成,所述上、下导热胶层由硅橡胶和氮化硼及助剂复合而成,其厚度分别为0.02~0.4毫米,所述中间无碱玻纤布层的厚度为0.01~0.2毫米。In order to achieve the purpose of the present invention, the present invention provides an insulating silica gel gasket, which is composed of an upper thermally conductive adhesive layer, a middle alkali-free glass fiber cloth layer and a lower thermally conductive adhesive layer. The layer is compounded by silicon rubber, boron nitride and additives, and its thickness is 0.02-0.4 mm, and the thickness of the middle non-alkali glass fiber cloth layer is 0.01-0.2 mm.
所述上、下导热胶层包含以重量份数计的如下组分:The upper and lower thermally conductive adhesive layers include the following components in parts by weight:
所述硅橡胶为甲基乙烯基硅橡胶、甲基苯基硅橡胶、氟硅橡胶或二甲基硅橡胶中的一种或几种的组合。The silicone rubber is one or a combination of methyl vinyl silicone rubber, methylphenyl silicone rubber, fluorosilicone rubber or dimethyl silicone rubber.
所述硅橡胶与氮化硼的重量比小于等于1:1,所述氮化硼粒度为0.01~100微米,杂质含量低于0.1%。The weight ratio of the silicone rubber to boron nitride is less than or equal to 1:1, the particle size of the boron nitride is 0.01-100 microns, and the impurity content is less than 0.1%.
所述溶剂为甲苯、二甲苯、乙酸乙酯、脂类有机溶剂或苯基有机溶剂中的一种或几种的组合,所述偶联剂为硅烷偶联剂或钛酸酯偶联剂中的一种或及其组合,所述有机硅硫化剂为有机过氧化物或含氢硅油和含铂催化剂的混合物,所述其他导热粉体为氮化铝、氧化铝、氧化镁、氧化锌、氮化硅、二氧化硅或氢氧化铝中的一种或几种混合物。The solvent is one or a combination of toluene, xylene, ethyl acetate, lipid organic solvents or phenyl organic solvents, and the coupling agent is a silane coupling agent or titanate coupling agent One or a combination thereof, the silicone vulcanizing agent is a mixture of organic peroxide or hydrogen-containing silicone oil and a platinum-containing catalyst, and the other heat-conducting powders are aluminum nitride, aluminum oxide, magnesium oxide, zinc oxide, One or more mixtures of silicon nitride, silicon dioxide or aluminum hydroxide.
本发明还提供了一种绝缘硅胶垫片的制备方法,该方法包括如下步骤:The present invention also provides a method for preparing an insulating silica gel gasket, the method comprising the steps of:
a、将硅橡胶溶解后加入氮化硼及助剂,搅拌均匀后静置1~3小时,得到导热硅胶;a. Add boron nitride and additives after dissolving the silicone rubber, stir evenly and let stand for 1 to 3 hours to obtain thermally conductive silica gel;
b、将导热硅胶通过涂布装置涂布在离型膜上,然后将导热硅胶与中间无碱玻璃纤维布复合,置于温度为60~80℃下烘干3~8分钟,再在无碱玻璃纤维布上涂布导热硅胶,置于温度为60~80℃下烘干3~8分钟后成型,得到半成品;b. Coat the heat-conducting silica gel on the release film through a coating device, then compound the heat-conducting silica gel with the middle non-alkali glass fiber cloth, dry it at a temperature of 60-80°C for 3-8 minutes, and then dry it in an alkali-free Coat heat-conducting silica gel on the glass fiber cloth, dry it at 60-80°C for 3-8 minutes, and then form it to obtain a semi-finished product;
c、将步骤b中得到的半成品裁切成片材,然后在表面覆盖离型膜,再在模压装置中热压成型,撕掉离型膜后得到所述的绝缘硅胶垫片。c. Cutting the semi-finished product obtained in step b into sheets, then covering the surface with a release film, and then hot-pressing in a molding device, and tearing off the release film to obtain the insulating silicone gasket.
步骤b及步骤c中,所述离型膜为聚四氟乙烯玻纤布、氟素PET离型膜或含氟的离型材料。In step b and step c, the release film is polytetrafluoroethylene glass fiber cloth, fluorine PET release film or fluorine-containing release material.
本发明还提供了一种制备绝缘硅胶垫片的设备,该设备包括涂布装置及模压装置,所述涂布装置为两段式双涂布头涂布装置,其依次设有第一放卷机、第一涂布头、第二放卷机、复合辊、第一烘干设备、第二涂布头、第二烘干设备及定长裁切装置,所述第一放卷机放卷离型膜,所述第二放卷机放卷无碱玻纤布,所述第一涂布头、第二涂布头涂布导热硅胶,且所述第一涂布头、第二放卷机及复合辊分别设于离型膜上方,所述第二涂布头设于无碱玻纤布上方。The present invention also provides a kind of equipment for preparing insulating silica gel gasket, the equipment includes a coating device and a molding device, the coating device is a two-stage double-coating head coating device, which is sequentially provided with a first unwinding machine, the first coating head, the second unwinding machine, composite rolls, the first drying equipment, the second coating head, the second drying equipment and the fixed-length cutting device, the first unwinding machine unwinds release film, the second unwinding machine unwinds the alkali-free glass fiber cloth, the first coating head and the second coating head are coated with heat-conducting silica gel, and the first coating head and the second unwinding The machine and the composite roll are respectively set above the release film, and the second coating head is set above the alkali-free glass fiber cloth.
所述模压装置为平板状模压机,其设有底座、液压柱及可加热加压的上模头、下模头,所述液压柱一端固定于底座上,另一端驱动下模头上下运动,在所述上模头、下模头的接触端分别设有缓存层。The molding device is a flat molding machine, which is provided with a base, a hydraulic column, and an upper die head and a lower die head that can be heated and pressurized. One end of the hydraulic column is fixed on the base, and the other end drives the lower die head to move up and down. Buffer layers are respectively provided at the contact ends of the upper die head and the lower die head.
所述上模头、下模头的模压合压强大于等于10MPa。The molding pressure of the upper die head and the lower die head is greater than or equal to 10 MPa.
本发明的贡献在于,其有效解决了现有电子设备的热界面材料导热系数低,无法成型的问题。本发明的绝缘硅胶垫片通过以氮化硼为主要填料,且中间复合无碱玻纤层,得到的厚度为0.1~0.5mm的绝缘硅胶垫片,其在击穿电压大于3KV时,导热效果好,散热效率高,且无需添加大量的高导热填料,有机硅高分子结构不被破坏,加工成型方便。此外,本发明通过两段式双涂布头涂布装置可直接制备出绝缘硅胶垫片,通过模压机热压成型,设备结构简单、生产效率高。The contribution of the present invention is that it effectively solves the problem that the thermal interface material of the existing electronic equipment has low thermal conductivity and cannot be molded. The insulating silica gel gasket of the present invention uses boron nitride as the main filler and is compounded with an alkali-free glass fiber layer in the middle to obtain an insulating silica gel gasket with a thickness of 0.1-0.5mm. When the breakdown voltage is greater than 3KV, the thermal conductivity Good, the heat dissipation efficiency is high, and there is no need to add a large amount of high thermal conductivity filler, the structure of the silicone polymer is not damaged, and the processing and molding are convenient. In addition, the present invention can directly prepare insulating silicone gaskets through a two-stage double-coating head coating device, and heat-press molding by a molding machine, with simple equipment structure and high production efficiency.
【附图说明】【Description of drawings】
图1是本发明的结构示意图。Fig. 1 is a structural schematic diagram of the present invention.
图2是本发明的涂布装置的结构示意图。Fig. 2 is a schematic structural view of the coating device of the present invention.
图3是本发明的模压装置的结构示意图。Fig. 3 is a schematic structural view of the molding device of the present invention.
【具体实施方式】【Detailed ways】
参阅图1,本发明的绝缘硅胶垫片由上、下层导热硅胶层10A,10B及中间无碱玻纤布层20通过涂布装置30及模压装置40复合而成,其中,上、下层导热硅胶层10A,10B由硅橡胶、氮化硼及助剂复合而成,且硅橡胶与氮化硼的重量比小于等于1:1,氮化硼粒度为0.01~100微米,杂质含量低于0.1%,助剂包括溶剂、偶联剂、硫化剂及其他导热粉体,如氮化铝、氧化铝、氧化镁、氧化锌、氮化硅、二氧化硅或氢氧化铝中的一种或几种的混合物,其厚度为0.02~0.4毫米,中间无碱玻纤布层20的厚度为0.01~0.2毫米,得到的绝缘硅胶垫片的总厚度为0.1~0.5毫米。Referring to Fig. 1, the insulating silica gel gasket of the present invention is composed of upper and lower heat-conducting silica gel layers 10A, 10B and the middle alkali-free glass fiber cloth layer 20 through a coating device 30 and a molding device 40, wherein the upper and lower layers of heat-conducting silica gel Layers 10A and 10B are compounded by silicone rubber, boron nitride and additives, and the weight ratio of silicone rubber to boron nitride is less than or equal to 1:1, the particle size of boron nitride is 0.01-100 microns, and the impurity content is less than 0.1% , additives include solvents, coupling agents, vulcanizing agents and other thermally conductive powders, such as one or more of aluminum nitride, aluminum oxide, magnesium oxide, zinc oxide, silicon nitride, silicon dioxide or aluminum hydroxide The thickness of the mixture is 0.02-0.4 millimeters, the thickness of the middle non-alkali glass fiber cloth layer 20 is 0.01-0.2 millimeters, and the total thickness of the obtained insulating silicone gasket is 0.1-0.5 millimeters.
该绝缘硅胶垫片的制备方法为:首先将有机硅橡胶溶解在溶剂中,搅拌均匀后加入氮化硼和其他导热粉体、硫化剂及偶联剂,搅拌均匀后静置1~3小时,得到导热硅胶。再将搅拌好的导热硅胶通过涂布装置30涂布在离型膜上,其中,涂布的导热硅胶的厚度通过刮刀控制。然后将导热硅胶与中间无碱玻璃纤维布复合,置于温度为60~80℃下烘干3~8分钟,再在无碱玻璃纤维布上涂布导热硅胶,置于温度为60~80℃下烘干3~8分钟后成型,得到半成品。将半成品裁切成片材,然后在表面覆盖离型膜,再在模压装置40中热压成型,撕掉离型膜后得到绝缘硅胶垫片。其中,离型膜为聚四氟乙烯玻纤布、氟素PET离型膜或含氟的离型材料。The preparation method of the insulating silicone gasket is as follows: firstly dissolve the silicone rubber in a solvent, stir evenly, add boron nitride and other heat-conducting powder, vulcanizing agent and coupling agent, stir evenly, and let it stand for 1 to 3 hours. Get thermal silicone. Then, the stirred thermally conductive silica gel is coated on the release film through the coating device 30, wherein the thickness of the coated thermally conductive silica gel is controlled by a scraper. Then compound the heat-conducting silica gel with the middle non-alkali glass fiber cloth, and dry it at a temperature of 60-80°C for 3-8 minutes, then coat the heat-conducting silica gel on the non-alkali glass fiber cloth, and place it at a temperature of 60-80°C After drying for 3 to 8 minutes, it is molded to obtain a semi-finished product. The semi-finished product is cut into sheets, and then the surface is covered with a release film, and then hot-pressed in the molding device 40, and the insulating silicone gasket is obtained after the release film is torn off. Wherein, the release film is polytetrafluoroethylene glass fiber cloth, fluorine PET release film or fluorine-containing release material.
如图2所示,涂布装置30为两段式双涂布头涂布装置,其依次设有第一放卷机31、第一涂布头32、第二放卷机33、复合辊34、第一烘干设备35、第二涂布头36、第二烘干设备37及定长裁切装置38,其中,第一放卷机31用于放卷离型膜,第二放卷机33用于放卷无碱玻纤布,第一涂布头32用于将导热硅胶涂布于离型膜上,第二涂布头33用于将导热硅胶涂布于无碱玻纤布上,复合辊34用于将无碱玻纤布与导热硅胶复合,且第一涂布头32、第二放卷机33及复合辊34分别设于离型膜上方,第二涂布头设于无碱玻纤布上方。第一烘干设备35及第二烘干设备37为烤箱,定长裁切装置38为裁断机。具体工作过程为:将离型膜置于第一放卷机31上,无碱玻纤布置于第二放卷机33上,启动第一放卷机31,使离型膜展开于第一涂布头32下方,第一涂布头32将导热硅胶涂布于离型膜上,得到下导热胶层10B,再启动第二放卷机33,使无碱玻纤布经复合辊34与下导热胶层复合,得到中间无碱玻纤层20,将复合后的下导热胶层10B和中间无碱玻纤层20置于温度为60~80℃的第一烘干设备35中烘干3~8分钟,然后第二涂布头36将导热硅胶涂布于无碱玻纤布上,得到上导热硅胶层10A,再将上导热硅胶层10A、中间无碱玻纤层20及下导热胶层10B置于温度为60~80℃的第二烘干设备37中烘干3~8分钟,最后用定长裁切装置38裁成所需长度,即得到绝缘硅胶垫片半成品。As shown in Figure 2, the coating device 30 is a two-stage double-coating head coating device, which is successively provided with a first unwinder 31, a first coating head 32, a second unwinder 33, and a compound roll 34 , the first drying equipment 35, the second coating head 36, the second drying equipment 37 and the fixed-length cutting device 38, wherein, the first unwinding machine 31 is used for unwinding the release film, and the second unwinding machine 33 is used to unwind the non-alkali glass fiber cloth, the first coating head 32 is used to coat the thermally conductive silica gel on the release film, and the second coating head 33 is used to coat the thermally conductive silica gel on the non-alkali glass fiber cloth , the composite roller 34 is used to compound the alkali-free glass fiber cloth and the heat-conducting silica gel, and the first coating head 32, the second unwinding machine 33 and the composite roller 34 are respectively arranged above the release film, and the second coating head is located at Above the alkali-free glass fiber cloth. The first drying equipment 35 and the second drying equipment 37 are ovens, and the cut-to-length device 38 is a cutting machine. The specific working process is: the release film is placed on the first unwinder 31, the alkali-free glass fiber is arranged on the second unwinder 33, the first unwinder 31 is started, and the release film is unfolded on the first coating Below the cloth head 32, the first coating head 32 coats the thermally conductive silica gel on the release film to obtain the lower thermally conductive adhesive layer 10B, and then starts the second unwinding machine 33, so that the alkali-free glass fiber cloth passes through the compound roller 34 and the lower layer. The thermally conductive adhesive layer is compounded to obtain the middle non-alkali glass fiber layer 20, and the compounded lower thermally conductive adhesive layer 10B and the middle non-alkali glass fiber layer 20 are placed in the first drying device 35 at a temperature of 60-80°C and dried for 3 ~ 8 minutes, then the second coating head 36 coats the thermally conductive silica gel on the non-alkali glass fiber cloth to obtain the upper thermally conductive silica gel layer 10A, then the upper thermally conductive silica gel layer 10A, the middle non-alkali glass fiber layer 20 and the lower thermally conductive adhesive The layer 10B is dried in the second drying equipment 37 at a temperature of 60-80° C. for 3-8 minutes, and finally cut to the required length by the cut-to-length cutting device 38 to obtain a semi-finished insulating silicone gasket.
如图3所示,模压装置40用于绝缘硅胶垫片半成品的热压成型,其为平板状模压机。该模压机40设有底座41、液压柱42、上模头43及下模头44,其中,液压柱42的一端固定于底座41上,另一端驱动下模头44上下运动,上模头43和下模头44可加热加压,且上模头43、下模头44的模压合压强大于等于10MPa,在上模头43和下模头44的接触端分别设有缓存层45,可使置于上模头43与下模头44之间的绝缘硅胶垫片受热、受压均匀,保障绝缘硅胶垫片的厚度均匀及导热性能。工作时,将绝缘硅胶垫片半成品覆盖上一层离型膜后,置于上模头43与下模头44之间,设置好模压机的温度和压力,使绝缘硅胶垫片半成品热压成型,再撕掉上下层的离型膜,即得到绝缘硅胶垫片。As shown in FIG. 3 , the molding device 40 is used for thermoforming the semi-finished insulating silicone gasket, which is a flat molding machine. The molding machine 40 is provided with a base 41, a hydraulic column 42, an upper die 43 and a lower die 44, wherein one end of the hydraulic column 42 is fixed on the base 41, and the other end drives the lower die 44 to move up and down, and the upper die 43 and the lower die head 44 can be heated and pressurized, and the molding pressure of the upper die head 43 and the lower die head 44 is greater than or equal to 10MPa, and the contact ends of the upper die head 43 and the lower die head 44 are respectively provided with a buffer layer 45, which can make The insulating silicone gasket placed between the upper die head 43 and the lower die head 44 is evenly heated and pressed to ensure uniform thickness and thermal conductivity of the insulating silicone gasket. When working, cover the semi-finished insulating silicone gasket with a layer of release film, place it between the upper die head 43 and the lower die head 44, set the temperature and pressure of the molding machine, and heat-press the semi-finished insulating silicone gasket , and then tear off the release film on the upper and lower layers to obtain an insulating silicone gasket.
将制得的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,其中,厚度测试标准为ASTM D374,击穿电压测试标准为ASTM D149,导热系数测试标准为ASTMD5470,拉伸强度测试标准为:ASTM D412。The prepared insulating silicone gasket was tested for thickness, breakdown voltage, thermal conductivity and tensile strength. Among them, the thickness test standard was ASTM D374, the breakdown voltage test standard was ASTM D149, the thermal conductivity test standard was ASTMD5470, and the tensile strength test standard was ASTM D374. The strength test standard is: ASTM D412.
下列实施例是对本发明的进一步解释和补充,对本发明不构成任何限制。The following examples are further explanations and supplements to the present invention, and do not constitute any limitation to the present invention.
实施例1Example 1
将重量为5千克的甲基乙烯基硅橡胶置于10千克的二甲苯溶剂中搅拌2小时,使硅橡胶充分溶解,然后加入0.1千克硅烷偶联剂A-151、12千克氮化硼、2千克氧化铝及0.1千克二四二氯过氧化苯甲酰(商品名为双二四),搅拌1小时后,使其均匀,再搅拌15分钟,得到导热硅胶。将导热硅胶静置1小时,在涂布装置30上将导热硅胶在第一涂布头32处涂布在宽度为300毫米的聚四氟乙烯玻纤布上,并控制涂布宽度为200毫米,厚度为0.2毫米,然后通过复合辊34复合厚度为0.1毫米的无碱玻纤布(商品型号为1080),将复合后的无碱玻纤布置于温度为70℃的第一烘干设备35中烘干5分钟。再通过第二涂布头36将导热硅胶涂布在烘干的无碱玻纤布上,并控制涂布宽度为200毫米,总厚度为0.5毫米,并置于温度为70℃的第二烘干设备37中烘干5分钟。然后用定长裁切装置38将其裁成定长为300毫米,得到半成品。再在半成品表面上覆盖一层聚四氟乙烯玻纤布,然后设置好模压机的压力为50MPa,上模头43、下模头44的温度为150℃,将覆盖有聚四氟乙烯玻纤布置于模压机的上模头43、下模头44之间压合5分钟。然后撕掉上、下层聚四氟乙烯玻纤布,得到绝缘硅胶垫片。Place 5 kg of methyl vinyl silicone rubber in 10 kg of xylene solvent and stir for 2 hours to fully dissolve the silicone rubber, then add 0.1 kg of silane coupling agent A-151, 12 kg of boron nitride, 2 One kilogram of aluminum oxide and 0.1 kilogram of dichlorobenzoyl peroxide (trade name: double two four) were stirred for 1 hour to make them uniform, and then stirred for 15 minutes to obtain thermally conductive silica gel. The thermally conductive silica gel is left to stand for 1 hour, and the thermally conductive silica gel is coated on the polytetrafluoroethylene glass fiber cloth with a width of 300 mm at the first coating head 32 on the coating device 30, and the coating width is controlled to be 200 mm. , the thickness is 0.2 mm, and then the non-alkali glass fiber cloth (commodity model is 1080) with a thickness of 0.1 mm is compounded by the compounding roller 34, and the compounded non-alkali glass fiber is arranged in the first drying equipment 35 with a temperature of 70 ° C. Dry in medium for 5 minutes. Then, the thermally conductive silica gel is coated on the dried alkali-free glass fiber cloth by the second coating head 36, and the control coating width is 200 millimeters, and the total thickness is 0.5 millimeters, and placed in the second drying oven at 70 ° C. Dry 5 minutes in drying equipment 37. It is then cut into a fixed length of 300 millimeters with a fixed-length cutting device 38 to obtain a semi-finished product. Then cover a layer of polytetrafluoroethylene glass fiber cloth on the surface of the semi-finished product, and then set the pressure of the molding machine to 50MPa, and the temperature of the upper die head 43 and the lower die head 44 to be 150°C, which will be covered with polytetrafluoroethylene glass fiber cloth. Arranged between the upper die head 43 and the lower die head 44 of the molding press for pressing for 5 minutes. Then tear off the upper and lower layers of polytetrafluoroethylene fiberglass cloth to obtain insulating silicone gaskets.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
实施例2Example 2
将重量为5千克的甲基乙烯基硅橡胶置于10千克的二甲苯溶剂中搅拌2小时,使硅橡胶充分溶解,然后加入0.1千克硅烷偶联剂A-151、15千克氮化硼、2千克氧化镁及0.1千克二四二氯过氧化苯甲酰(商品名为双二四),搅拌1小时后,使其均匀,再搅拌15分钟,得到导热硅胶。将导热硅胶静置1小时,在涂布装置30上将导热硅胶在第一涂布头32处涂布在宽度为400毫米的聚四氟乙烯玻纤布上,并控制涂布宽度为300毫米,厚度为0.3毫米,然后通过复合辊34复合厚度为0.05毫米的无碱玻纤布(商品型号为104),将复合后的无碱玻纤布置于温度为70℃的第一烘干设备35中烘干5分钟。再通过第二涂布头36将导热硅胶涂布在烘干的无碱玻纤布上,并控制涂布宽度为300毫米,总厚度为0.6毫米,并置于温度为70℃的第二烘干设备37中烘干5分钟。然后用定长裁切装置38将其裁成定长为300毫米,得到半成品。再在半成品表面上覆盖一层聚四氟乙烯玻纤布,然后设置好模压机的压力为60MPa,上模头43、下模头44的温度为140℃,将覆盖有聚四氟乙烯玻纤布置于模压机的上模头43、下模头44之间压合5分钟。然后撕掉上、下层聚四氟乙烯玻纤布,得到绝缘硅胶垫片。Place 5 kg of methyl vinyl silicone rubber in 10 kg of xylene solvent and stir for 2 hours to fully dissolve the silicone rubber, then add 0.1 kg of silane coupling agent A-151, 15 kg of boron nitride, 2 One kilogram of magnesia and 0.1 kilogram of dichlorobenzoyl peroxide (trade name: double two four) were stirred for 1 hour to make them uniform, and then stirred for 15 minutes to obtain thermally conductive silica gel. The thermally conductive silica gel was left to stand for 1 hour, and the thermally conductive silica gel was coated on the polytetrafluoroethylene fiberglass cloth with a width of 400 mm at the first coating head 32 on the coating device 30, and the coating width was controlled to be 300 mm. , the thickness is 0.3 mm, and then the non-alkali glass fiber cloth (commercial model is 104) with a thickness of 0.05 mm is compounded by the composite roller 34, and the composite non-alkali glass fiber is arranged in the first drying equipment 35 with a temperature of 70 ° C. Dry in medium for 5 minutes. Then by the second coating head 36, the heat-conducting silica gel is coated on the dried alkali-free glass fiber cloth, and the control coating width is 300 millimeters, and the total thickness is 0.6 millimeters, and placed in the second drying oven with a temperature of 70 ° C. Dry 5 minutes in drying equipment 37. It is then cut into a fixed length of 300 millimeters with a fixed-length cutting device 38 to obtain a semi-finished product. Then cover a layer of polytetrafluoroethylene glass fiber cloth on the surface of the semi-finished product, and then set the pressure of the molding machine to 60MPa, and the temperature of the upper die head 43 and the lower die head 44 to be 140°C, which will be covered with polytetrafluoroethylene glass fiber cloth. Arranged between the upper die head 43 and the lower die head 44 of the molding press for pressing for 5 minutes. Then tear off the upper and lower layers of polytetrafluoroethylene fiberglass cloth to obtain insulating silicone gaskets.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
实施例3Example 3
将重量为5千克的氟硅橡胶置于10千克的二甲苯溶剂中搅拌2小时,使硅橡胶充分溶解,然后加入0.1千克硅烷偶联剂A-151、25千克氮化硼及0.1千克二四二氯过氧化苯甲酰(商品名为双二四),搅拌1小时后,使其均匀,再搅拌15分钟,得到导热硅胶。将导热硅胶静置1小时,在涂布装置30上将导热硅胶在第一涂布头32处涂布在宽度为400毫米的聚四氟乙烯玻纤布上,并控制涂布宽度为300毫米,厚度为0.3毫米,然后通过复合辊34复合厚度为0.1毫米的无碱玻纤布(商品型号为104),将复合后的无碱玻纤布置于温度为70℃的第一烘干设备35中烘干5分钟。再通过第二涂布头36将导热硅胶涂布在烘干的无碱玻纤布上,并控制涂布宽度为300毫米,总厚度为0.5毫米,并置于温度为70℃的第二烘干设备37中烘干5分钟。然后用定长裁切装置38将其裁成定长为300毫米,得到半成品。再在半成品表面上覆盖一层聚四氟乙烯玻纤布,然后设置好模压机的压力为60MPa,上模头43、下模头44的温度为140℃,将覆盖有聚四氟乙烯玻纤布置于模压机的上模头43、下模头44之间压合5分钟。然后撕掉上、下层聚四氟乙烯玻纤布,得到绝缘硅胶垫片。Put 5 kg of fluorosilicone rubber in 10 kg of xylene solvent and stir for 2 hours to fully dissolve the silicone rubber, then add 0.1 kg of silane coupling agent A-151, 25 kg of boron nitride and 0.1 kg of diphenhydramine Dichlorobenzoyl peroxide (trade name: Shuang24) was stirred for 1 hour to make it uniform, and then stirred for 15 minutes to obtain thermally conductive silica gel. The thermally conductive silica gel was left to stand for 1 hour, and the thermally conductive silica gel was coated on the polytetrafluoroethylene fiberglass cloth with a width of 400 mm at the first coating head 32 on the coating device 30, and the coating width was controlled to be 300 mm. , the thickness is 0.3 mm, and then the non-alkali glass fiber cloth (product model is 104) with a thickness of 0.1 mm is compounded by the compounding roller 34, and the compounded non-alkali glass fiber is arranged in the first drying equipment 35 with a temperature of 70 ° C. Dry in medium for 5 minutes. Then by the second coating head 36, the heat-conducting silica gel is coated on the dried alkali-free glass fiber cloth, and the control coating width is 300 millimeters, and the total thickness is 0.5 millimeters, and placed in the second drying oven at 70 ° C. Dry 5 minutes in drying equipment 37. It is then cut into a fixed length of 300 millimeters with a fixed-length cutting device 38 to obtain a semi-finished product. Then cover a layer of polytetrafluoroethylene glass fiber cloth on the surface of the semi-finished product, and then set the pressure of the molding machine to 60MPa, and the temperature of the upper die head 43 and the lower die head 44 to be 140°C, which will be covered with polytetrafluoroethylene glass fiber cloth. Arranged between the upper die head 43 and the lower die head 44 of the molding press for pressing for 5 minutes. Then tear off the upper and lower layers of polytetrafluoroethylene fiberglass cloth to obtain insulating silicone gaskets.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
实施例4Example 4
将重量为5千克的甲基乙烯基硅橡胶置于15千克的甲苯溶剂中搅拌2小时,使硅橡胶充分溶解,然后加入0.05千克钛酸酯偶联剂、30千克氮化硼及0.5千克含氢硅油和氯铂酸的混合物,搅拌1小时后,使其均匀,再搅拌15分钟,得到导热硅胶。将导热硅胶静置2小时,在涂布装置30上将导热硅胶在第一涂布头32处涂布在宽度为400毫米的氟素PET离型膜上,并控制涂布宽度为300毫米,厚度为0.15毫米,然后通过复合辊34复合厚度为0.02毫米的无碱玻纤布(商品型号为104),将复合后的无碱玻纤布置于温度为60℃的第一烘干设备35中烘干8分钟。再通过第二涂布头36将导热硅胶涂布在烘干的无碱玻纤布上,并控制涂布宽度为300毫米,总厚度为0.4毫米,并置于温度为60℃的第二烘干设备37中烘干8分钟。然后用定长裁切装置38将其裁成定长为300毫米,得到半成品。再在半成品表面上覆盖一层氟素PET离型膜,然后设置好模压机的压力为60MPa,上模头43、下模头44的温度为140℃,将覆盖有聚四氟乙烯玻纤布置于模压机的上模头43、下模头44之间压合5分钟。然后撕掉上、下层氟素PET离型膜,得到绝缘硅胶垫片。Place 5 kg of methyl vinyl silicone rubber in 15 kg of toluene solvent and stir for 2 hours to fully dissolve the silicone rubber, then add 0.05 kg of titanate coupling agent, 30 kg of boron nitride and 0.5 kg of The mixture of hydrogen silicone oil and chloroplatinic acid was stirred for 1 hour to make it uniform, and then stirred for 15 minutes to obtain thermally conductive silica gel. The thermally conductive silica gel was left to stand for 2 hours, and the thermally conductive silica gel was coated on the fluorine PET release film with a width of 400 mm at the first coating head 32 on the coating device 30, and the coating width was controlled to be 300 mm. The thickness is 0.15 mm, and then the non-alkali glass fiber cloth (the product model is 104) with a thickness of 0.02 mm is compounded by the compounding roller 34, and the compounded non-alkali glass fiber is arranged in the first drying device 35 with a temperature of 60 ° C. Let dry for 8 minutes. Then by the second coating head 36, the heat-conducting silica gel is coated on the dried alkali-free glass fiber cloth, and the control coating width is 300 millimeters, and the total thickness is 0.4 millimeters, and placed in the second drying oven at 60 ° C. Dry in the drying equipment 37 for 8 minutes. It is then cut into a fixed length of 300 millimeters with a fixed-length cutting device 38 to obtain a semi-finished product. Then cover a layer of fluorine PET release film on the surface of the semi-finished product, and then set the pressure of the molding machine to 60MPa, and the temperature of the upper die head 43 and the lower die head 44 to be 140°C. Press between the upper die head 43 and the lower die head 44 of the molding press for 5 minutes. Then tear off the upper and lower layers of fluorine PET release film to obtain insulating silicone gaskets.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
实施例5Example 5
将重量为5千克的甲基苯基硅橡胶置于12.5千克的二甲苯溶剂中搅拌2小时,使硅橡胶充分溶解,然后加入0.625千克硅烷偶联剂A-151、11.25千克氮化硼、6.25千克氢氧化铝及0.625千克含氢硅油和氯铂酸的混合物,搅拌1小时后,使其均匀,再搅拌15分钟,得到导热硅胶。将导热硅胶静置3小时,在涂布装置30上将导热硅胶在第一涂布头32处涂布在宽度为400毫米的聚四氟乙烯玻纤布上,并控制涂布宽度为300毫米,厚度为0.4毫米,然后通过复合辊34复合厚度为0.02毫米的无碱玻纤布(商品型号为104),将复合后的无碱玻纤布置于温度为80℃的第一烘干设备35中烘干3分钟。再通过第二涂布头36将导热硅胶涂布在烘干的无碱玻纤布上,并控制涂布宽度为300毫米,总厚度为0.44毫米,并置于温度为80℃的第二烘干设备37中烘干3分钟。然后用定长裁切装置38将其裁成定长为300毫米,得到半成品。再在半成品表面上覆盖一层聚四氟乙烯玻纤布,然后设置好模压机的压力为60MPa,上模头43、下模头44的温度为140℃,将覆盖有聚四氟乙烯玻纤布置于模压机的上模头43、下模头44之间压合5分钟。然后撕掉上、下层聚四氟乙烯玻纤布,得到绝缘硅胶垫片。Place 5 kg of methylphenyl silicone rubber in 12.5 kg of xylene solvent and stir for 2 hours to fully dissolve the silicone rubber, then add 0.625 kg of silane coupling agent A-151, 11.25 kg of boron nitride, 6.25 A mixture of 1 kg of aluminum hydroxide and 0.625 kg of hydrogen-containing silicone oil and chloroplatinic acid was stirred for 1 hour to make it uniform, and then stirred for 15 minutes to obtain thermally conductive silica gel. The thermally conductive silica gel was left to stand for 3 hours, and the thermally conductive silica gel was coated on the polytetrafluoroethylene fiberglass cloth with a width of 400 mm at the first coating head 32 on the coating device 30, and the coating width was controlled to be 300 mm. , the thickness is 0.4 mm, and then the non-alkali glass fiber cloth (commercial model is 104) with a thickness of 0.02 mm is compounded by the composite roller 34, and the composite non-alkali glass fiber is arranged in the first drying equipment 35 with a temperature of 80 ° C. Dry on medium for 3 minutes. Then by the second coating head 36, the heat-conducting silica gel is coated on the dried alkali-free glass fiber cloth, and the control coating width is 300 millimeters, and the total thickness is 0.44 millimeters, and placed in a second drying oven with a temperature of 80 ° C. Dry 3 minutes in drying equipment 37. It is then cut into a fixed length of 300 millimeters with a fixed-length cutting device 38 to obtain a semi-finished product. Then cover a layer of polytetrafluoroethylene glass fiber cloth on the surface of the semi-finished product, and then set the pressure of the molding machine to 60MPa, and the temperature of the upper die head 43 and the lower die head 44 to be 140°C, which will be covered with polytetrafluoroethylene glass fiber cloth. Arranged between the upper die head 43 and the lower die head 44 of the molding press for pressing for 5 minutes. Then tear off the upper and lower layers of polytetrafluoroethylene fiberglass cloth to obtain insulating silicone gaskets.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
将得到的绝缘硅胶垫片进行厚度、击穿电压、导热系数及拉伸强度测试,测试结果如表1所示。The thickness, breakdown voltage, thermal conductivity and tensile strength of the obtained insulating silicone gasket were tested, and the test results are shown in Table 1.
对比例comparative example
将10千克的甲基乙烯基,30千克平均粒径为45微米的氧化铝及15千克平均粒径为5微米的氧化铝在捏合机中搅拌均匀。待物料冷却4小时后,再在双辊开炼机中加入300克的双二四固化剂(阿克苏商品名OPC-IP-50S-PS),开炼30分钟。将此胶料使用三辊压延机压延在0.02毫米无碱玻纤布(商品型号为104)上下两面,得到绝缘硅胶垫片。10 kilograms of methyl vinyl, 30 kilograms of aluminum oxide with an average particle diameter of 45 microns and 15 kilograms of aluminum oxide with an average particle diameter of 5 microns were stirred uniformly in a kneader. After the material is cooled for 4 hours, add 300 grams of double-two-four solidifying agent (Aksu trade name OPC-IP-50S-PS) in the two-roller mill, and start refining for 30 minutes. The rubber material was calendered on the upper and lower sides of 0.02 mm alkali-free glass fiber cloth (commercial model 104) using a three-roller calender to obtain an insulating silicone gasket.
籍此,本发明的绝缘硅胶垫片通过以氮化硼为主要填料,且中间复合无碱玻纤层,得到的厚度为0.1~0.5mm的绝缘硅胶垫片,其在击穿电压大于3KV时,导热效果好,散热效率高,且无需添加大量的高导热填料,有机硅高分子结构不被破坏,加工成型方便。此外,本发明通过两段式双涂布头涂布装置可直接制备出绝缘硅胶垫片,通过模压机热压成型,设备结构简单、生产效率高。Accordingly, the insulating silica gel gasket of the present invention uses boron nitride as the main filler and is compounded with an alkali-free glass fiber layer in the middle to obtain an insulating silica gel gasket with a thickness of 0.1-0.5 mm. When the breakdown voltage is greater than 3KV , good thermal conductivity, high heat dissipation efficiency, and no need to add a large amount of high thermal conductivity fillers, the silicone polymer structure is not damaged, and the processing and molding is convenient. In addition, the present invention can directly prepare insulating silicone gaskets through a two-stage double-coating head coating device, and heat-press molding by a molding machine, with simple equipment structure and high production efficiency.
尽管通过以上实施例对本发明进行了揭示,但本发明的保护范围并不局限于此,在不偏离本发明构思的条件下,对以上各构件所做的变形、替换等均将落入本发明的权利要求范围内。Although the present invention has been disclosed through the above embodiments, the protection scope of the present invention is not limited thereto. Under the condition of not departing from the concept of the present invention, the deformation, replacement, etc. of the above components will fall into the scope of the present invention. within the scope of the claims.
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| CN112622368B (en) * | 2020-12-17 | 2023-05-26 | 杭州兆科电子材料有限公司 | Low-stress heat conduction pad, preparation method thereof and electronic product |
| CN114758851A (en) * | 2022-04-25 | 2022-07-15 | 江苏中迪新材料技术有限公司 | A kind of super thermal conductive insulating sheet and its manufacturing method |
| CN115915724A (en) * | 2022-11-25 | 2023-04-04 | 深圳市傲川科技有限公司 | A high-performance heat-conducting insulating sheet and its preparation method |
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