IN2014KN01179A - - Google Patents

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Publication number
IN2014KN01179A
IN2014KN01179A IN1179KON2014A IN2014KN01179A IN 2014KN01179 A IN2014KN01179 A IN 2014KN01179A IN 1179KON2014 A IN1179KON2014 A IN 1179KON2014A IN 2014KN01179 A IN2014KN01179 A IN 2014KN01179A
Authority
IN
India
Prior art keywords
substrates
producing
structures
relates
metals
Prior art date
Application number
Inventor
Michael Berkei
Tobias Tinthoff
Original Assignee
Byk Chemie Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Byk Chemie Gmbh filed Critical Byk Chemie Gmbh
Publication of IN2014KN01179A publication Critical patent/IN2014KN01179A/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Nanotechnology (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Chemically Coating (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The method relates to a method for producing electrically conductive structures on electrically non conductive substrates and to a method for the electrochemical deposition of metals on substrates which is suitable in particular for producing metallic structures and/or electroplated plastics. The invention further relates to products obtainable in this way and to the use thereof.
IN1179KON2014 2011-12-02 2012-11-30 IN2014KN01179A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11009542 2011-12-02
PCT/EP2012/004965 WO2013079219A1 (en) 2011-12-02 2012-11-30 Method for producing electrically conductive structures on non-conductive substrates and structures made in this manner

Publications (1)

Publication Number Publication Date
IN2014KN01179A true IN2014KN01179A (en) 2015-10-16

Family

ID=47326051

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1179KON2014 IN2014KN01179A (en) 2011-12-02 2012-11-30

Country Status (7)

Country Link
US (1) US20140339092A1 (en)
EP (1) EP2785896B1 (en)
JP (1) JP2014533780A (en)
KR (1) KR20140098229A (en)
CN (1) CN104080956A (en)
IN (1) IN2014KN01179A (en)
WO (1) WO2013079219A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116216701A (en) * 2023-03-06 2023-06-06 大连交通大学 Method for preparing graphene oxide film with high reduction rate in situ

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CN103849904B (en) * 2014-04-01 2016-05-04 山东理工大学 Directly gone out the method on bionical replica surface by the reverse electroforming of crisp fritter type biological surface
WO2017034292A1 (en) * 2015-08-26 2017-03-02 김형락 Method of manufacturing pattern of dispersed particles using electric field on nonconductive substrate
GB201604342D0 (en) * 2016-03-14 2016-04-27 Aurubis Belgium Nv Sa Substrate
DE102016124682A1 (en) 2016-12-16 2018-06-21 Technische Universität Chemnitz Method for printing on a liquid surface
CN107187143B (en) * 2017-05-11 2019-12-17 歌尔股份有限公司 Metal and plastic composite and preparation method thereof
KR102036607B1 (en) * 2017-07-06 2019-10-28 김혜연 Electroplating method of nonconductive objects and ornaments produced thereby
DE102017121228A1 (en) * 2017-09-13 2019-03-14 Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh A method of surface treating a sample having at least one surface of a metal oxide and treated surface metal oxide
CN107620095A (en) * 2017-09-29 2018-01-23 佛山市春暖花开科技有限公司 A kind of composite-layer metal electroplating process
KR102492733B1 (en) 2017-09-29 2023-01-27 삼성디스플레이 주식회사 Copper plasma etching method and manufacturing method of display panel
CN107620096A (en) * 2017-09-29 2018-01-23 佛山市春暖花开科技有限公司 One kind layering electroplating process
CN110158132A (en) * 2018-02-13 2019-08-23 华瑞墨石丹阳有限公司 A kind of electro-plating method of insulating materials
CN109285635A (en) * 2018-08-09 2019-01-29 苏州千层茧农业科技有限公司 A kind of single-faced conductive film roller press type and preparation method thereof
LU100919B1 (en) * 2018-08-27 2020-02-27 Luxembourg Inst Science & Tech List Metal-CNT composite, production method and materials therefor
CN108834309B (en) * 2018-08-30 2020-07-31 陈伟元 Graphene metallization solution and preparation method and application thereof
CN109440155A (en) * 2018-10-30 2019-03-08 厦门建霖健康家居股份有限公司 A kind of method of pair of non-metallic substrate surface metalation processing
CN110596986A (en) * 2019-09-03 2019-12-20 深圳市华星光电技术有限公司 Preparation method of color film substrate, color film substrate and liquid crystal display panel
CN112791225A (en) * 2019-11-14 2021-05-14 美国发现集团有限公司 Nano robot for tumor treatment and preparation method thereof
CN112500741B (en) * 2020-10-29 2024-04-19 宁波石墨烯创新中心有限公司 Graphene composite conductive ink and preparation method and application thereof
CN113179592A (en) * 2021-04-27 2021-07-27 江门市德众泰工程塑胶科技有限公司 Circuit board and manufacturing method thereof

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US4619741A (en) 1985-04-11 1986-10-28 Olin Hunt Specialty Products Inc. Process for preparing a non-conductive substrate for electroplating
DE4141416A1 (en) 1991-12-11 1993-06-17 Schering Ag METHOD FOR COATING SURFACES WITH FINE-PARTICLE SOLID PARTICLES
US5476580A (en) 1993-05-17 1995-12-19 Electrochemicals Inc. Processes for preparing a non-conductive substrate for electroplating
US5389270A (en) 1993-05-17 1995-02-14 Electrochemicals, Inc. Composition and process for preparing a non-conductive substrate for electroplating
US5667662A (en) * 1996-04-01 1997-09-16 Shipley Company, L.L.C. Electroplating process and composition
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116216701A (en) * 2023-03-06 2023-06-06 大连交通大学 Method for preparing graphene oxide film with high reduction rate in situ

Also Published As

Publication number Publication date
KR20140098229A (en) 2014-08-07
US20140339092A1 (en) 2014-11-20
JP2014533780A (en) 2014-12-15
EP2785896B1 (en) 2015-09-23
WO2013079219A1 (en) 2013-06-06
CN104080956A (en) 2014-10-01
EP2785896A1 (en) 2014-10-08

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