WO2012129190A9 - Process for copper plating of polyamide articles - Google Patents

Process for copper plating of polyamide articles Download PDF

Info

Publication number
WO2012129190A9
WO2012129190A9 PCT/US2012/029721 US2012029721W WO2012129190A9 WO 2012129190 A9 WO2012129190 A9 WO 2012129190A9 US 2012029721 W US2012029721 W US 2012029721W WO 2012129190 A9 WO2012129190 A9 WO 2012129190A9
Authority
WO
WIPO (PCT)
Prior art keywords
copper plating
polyamide articles
polyamide
articles
plating
Prior art date
Application number
PCT/US2012/029721
Other languages
French (fr)
Other versions
WO2012129190A2 (en
Inventor
Charles J. Dubois
Andri E. Elia
Juan Carlos Figueroa
Original Assignee
E. I. Du Pont De Nemours And Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by E. I. Du Pont De Nemours And Company filed Critical E. I. Du Pont De Nemours And Company
Publication of WO2012129190A2 publication Critical patent/WO2012129190A2/en
Publication of WO2012129190A9 publication Critical patent/WO2012129190A9/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
PCT/US2012/029721 2011-03-18 2012-03-19 Process for copper plating of polyamide articles WO2012129190A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161453980P 2011-03-18 2011-03-18
US61/453,980 2011-03-18

Publications (2)

Publication Number Publication Date
WO2012129190A2 WO2012129190A2 (en) 2012-09-27
WO2012129190A9 true WO2012129190A9 (en) 2013-10-10

Family

ID=45922833

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2012/029721 WO2012129190A2 (en) 2011-03-18 2012-03-19 Process for copper plating of polyamide articles

Country Status (2)

Country Link
US (1) US20120234682A1 (en)
WO (1) WO2012129190A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3031862B1 (en) * 2014-12-11 2018-08-29 Ems-Patent Ag Multilayer structure having at least one metal layer and at least one polyamide layer
CN107057344A (en) * 2017-01-20 2017-08-18 金发科技股份有限公司 A kind of Semi-aromatic polyamide resin and preparation method thereof and the polyamide moulding composition being made from it
CN107057345A (en) * 2017-01-20 2017-08-18 金发科技股份有限公司 A kind of Semi-aromatic polyamide resin and preparation method thereof and the polyamide moulding composition being made from it
CA3211607A1 (en) * 2021-03-29 2022-10-06 Almedina FETAHOVIC Pickle for polyamide

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4349421A (en) * 1979-09-17 1982-09-14 Allied Corporation Preparation of metal plated polyamide thermoplastic articles having mirror-like metal finish
US4552626A (en) 1984-11-19 1985-11-12 Michael Landney, Jr. Metal plating of polyamide thermoplastics
JP3123119B2 (en) 1991-06-17 2001-01-09 三菱化学株式会社 Polyamide resin plated products
US6491806B1 (en) 2000-04-27 2002-12-10 Intel Corporation Electroplating bath composition
US7438794B2 (en) 2004-09-30 2008-10-21 Intel Corporation Method of copper electroplating to improve gapfill
RU2009107274A (en) * 2006-08-03 2010-09-10 Басф Се (De) METHOD FOR APPLYING A METAL COVERING ON THE BASIS
US20090038947A1 (en) 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
US20090143520A1 (en) 2007-11-30 2009-06-04 E.I. Du Pont De Nemours And Company Partially aromatic polyamide compositions for metal plated articles
JP5650899B2 (en) * 2009-09-08 2015-01-07 上村工業株式会社 Electroplating equipment

Also Published As

Publication number Publication date
WO2012129190A2 (en) 2012-09-27
US20120234682A1 (en) 2012-09-20

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