CN107620095A - A kind of composite-layer metal electroplating process - Google Patents
A kind of composite-layer metal electroplating process Download PDFInfo
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- CN107620095A CN107620095A CN201710905008.6A CN201710905008A CN107620095A CN 107620095 A CN107620095 A CN 107620095A CN 201710905008 A CN201710905008 A CN 201710905008A CN 107620095 A CN107620095 A CN 107620095A
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Abstract
The present invention discloses a kind of composite-layer metal electroplating technique method, comprises the following steps：（1）Alkali cleaning, electrolytic degreasing, washing and acid activation processing are carried out to plating piece；（2）The plating piece is placed in the decoction containing the first metal ion and electroplated, then imprinted pattern；（3）In the localised application insulating materials of patterned surfaces, and expose and need to electroplate bimetallic part；（4）Micro- roughening treatment is done to exposed part, then the plating piece is placed in the decoction containing the second metal ion and electroplated；（5）Remove insulating materials and repeat step（3）With（4）；（6）Removing surface, washing and drying are carried out to plating piece, complete composite-layer metal plating.Present invention process method is simple to operate, efficiency high, effect are good；The adhesion property of metal surface is strong, effectively avoids metal liftoff.
Description
Technical field
The present invention relates to electroplating process, more particularly to composite-layer metal electroplating technique method.
Background technology
Plating（Electroplating）Refer in the salt decoction containing metal to be plated, using plated base material as negative electrode,
By electrolysis, the cation of metal to be plated in decoction is deposited in base metal surface, form a kind of table of coating
Method for processing surface, i.e., the process of the other metal or alloy of a thin layer is plated on some substrate surfaces using electrolysis principle, be profit
The technique for making the surface attachment layer of metal film of metal or other materials product with electrolysis, there is function so as to obtain some
Property or ornamental metal film.Protective coating, decorative coating and other functional coatings are divided into according to the function of coating.
At present, electroplating technology applies more and more extensive, such as ornaments, medal, souvenir badge, still, base in furnishing fields
More numerous and diverse in the pattern of their surface imprints and Color Scheme, the metal species of plating are more, therefore, electroplating technology step compared with
Complexity, efficiency is low, does not reach expected effect, moreover, after various metals are electroplated, the metallic film bond properties in composite bed
Low, a certain metal level on its surface easily comes off.
The content of the invention
Goal of the invention：The invention provides a kind of composite-layer metal electroplating technique method, and it is more to this method solve plating
The problem of processing step is complicated during kind of metal, efficiency is low, effect is poor, while it is low to solve metal level cohesive, it is caducous to ask
Topic.
Technical scheme：A kind of composite-layer metal electroplating technique method of the present invention, comprises the following steps：
（1）Alkali cleaning, electrolytic degreasing, washing and acid activation processing are carried out to plating piece；
（2）The plating piece is placed in the decoction containing the first metal ion and electroplated, and imprinted pattern；
（3）In the localised application insulating materials of patterned surfaces, and expose and need to electroplate bimetallic part；
（4）Micro- roughening treatment is done to exposed part, then the plating piece is placed in the decoction containing the second metal ion and electroplated；
（5）Remove insulating materials and repeat step（3）With（4）；
（6）Removing surface, washing and drying are carried out to plating piece, complete composite-layer metal plating.
Surface through micro- roughening can significantly improve the real table area of metal surface, and then improve the adhesiveness of metal surface
Energy.
To ensure that the metal of basic unit is unaffected, step when electroplating the second metal process（2）In, first metal
For silver or copper.
Step（3）In, second metal is the one or more in zinc, nickel, gold, chromium and lead.
Step（3）In, the insulating materials is the one or more in cerate, ink, coating.
Step（4）In, micro- roughening treatment is by the way of mechanical wear or chemical attack.According to opening for its product
Shape, material, the size of roughness, sandblasting or chemical etching granulation can be used to handle, chemical etching granulation processing can use fluoride or alkalescence
The mode of texture etching is carried out.
To reach the effect more preferably cleaned, and it can avoid injuring plating thin metal layers, the washing is using ultrasound washing.
To ensure the cleaning of decoction, the thin metal layer of plating is avoided to contain impurity, the filtered processing of decoction.
Beneficial effect：1st, present invention process method is simple to operate, efficiency high；2nd, the effect for electroplating various metals is good；3rd, it is golden
The adhesion property of metal surface is strong, effectively avoids metallic film from coming off；4th, it is applied widely.
Embodiment
Embodiment 1
A kind of electroplating process to medal composite-layer metal, comprise the following steps：
The plating piece of medal is round iron plate, and carrying out NaOH solution cleaning, electrolytic degreasing, washing and acid activation to plating piece is handled；Will
The plating piece, is then placed in the decoction of copper ions and electroplates, after having electroplated copper, on surface by the electroplate liquid filtering of copper ions
Imprinted pattern；In the localised application ink of patterned surfaces, and expose the part for needing to electroplate gold；Machine is used to exposed part
Tool abrasive manner does micro- roughening treatment, and the electroplate liquid containing gold ion is filtered, and the plating piece after plating copper ion is placed in containing gold
Electroplated in the electroplate liquid of ion；After having electroplated gold ion, with aqueous slkali remove surface ink, to plating piece carry out removing surface,
Washing and dry, completion composite-layer metal plating.
Embodiment 2
A kind of electroplating process that layer metal is closed to souvenir badge, comprises the following steps：
The plating piece of souvenir badge is round iron plate, and carrying out NaOH solution cleaning, electrolytic degreasing, washing and acid activation to iron plate is handled；
The electroplate liquid of silver ion is filtered, then iron plate is placed in the electroplate liquid of silver ion and electroplated, after having electroplated silver ion,
Surface imprint pattern；In the localised application ink of patterned surfaces, and expose the part for needing electronickelling；Exposed part is adopted
Micro- roughening treatment is done with mechanical wear mode, the electroplate liquid containing nickel ion is filtered, and the iron plate after plating silver ion is placed in
Electroplated in electroplate liquid containing nickel ion；After having electroplated nickel ion, the ink on surface is removed with aqueous slkali, and is coated with ink again,
And the part that need to electroplate gold is exposed, micro- roughening treatment is done using chemical bases etching mode to exposed part, gold ion will be contained
Electroplate liquid filtering, and be placed in the iron plate after nickel ion is electroplated in the electroplate liquid containing gold ion and electroplate；After the completion of plating, to recording
Zhang Jinhang removing surfaces, washing and drying are read, completes the composite-layer metal plating of souvenir badge.
Claims (7)
- A kind of 1. composite-layer metal electroplating technique method, it is characterised in that comprise the following steps：（1）Alkali cleaning, electrolytic degreasing, washing and acid activation processing are carried out to plating piece；（2）The plating piece is placed in the decoction containing the first metal ion and electroplated, then imprinted pattern；（3）In the localised application insulating materials of patterned surfaces, and expose and need to electroplate bimetallic part；（4）Micro- roughening treatment is done to exposed part, then the plating piece is placed in the decoction containing the second metal ion and electroplated；（5）Remove insulating materials and repeat step（3）With（4）；（6）Removing surface, washing and drying are carried out to plating piece, complete composite-layer metal plating.
- 2. process according to claim 1, it is characterised in that：Step（2）In, first metal is silver or copper.
- 3. process according to claim 1, it is characterised in that：Step（3）In, second metal be zinc, nickel, One or more in gold, chromium and lead.
- 4. process according to claim 1, it is characterised in that：Step（3）In, the insulating materials is cerate, oil One or more in ink, coating.
- 5. process according to claim 1, it is characterised in that：Step（4）In, micro- roughening treatment is using machinery Abrasion or the mode of chemical attack.
- 6. process according to claim 1, it is characterised in that：The washing is using ultrasound washing.
- 7. process according to claim 1, it is characterised in that：The filtered processing of decoction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710905008.6A CN107620095A (en) | 2017-09-29 | 2017-09-29 | A kind of composite-layer metal electroplating process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710905008.6A CN107620095A (en) | 2017-09-29 | 2017-09-29 | A kind of composite-layer metal electroplating process |
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| CN107620095A true CN107620095A (en) | 2018-01-23 |
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| CN201710905008.6A Pending CN107620095A (en) | 2017-09-29 | 2017-09-29 | A kind of composite-layer metal electroplating process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108441905A (en) * | 2018-04-23 | 2018-08-24 | 苏州普瑞得电子有限公司 | A kind of composite-layer metal electroplating technique |
Citations (5)
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|---|---|---|---|---|
| CN1523138A (en) * | 2003-02-19 | 2004-08-25 | 宏达国际电子股份有限公司 | Process for making plastic surface by electroplating |
| CN101255509A (en) * | 2008-04-02 | 2008-09-03 | 深圳市粤豪珠宝有限公司 | Production technique of chromatic gold ornaments |
| CN102618898A (en) * | 2011-01-26 | 2012-08-01 | 上海造币有限公司 | Local gilding technology for commemorative coin (badge) |
| WO2013079219A1 (en) * | 2011-12-02 | 2013-06-06 | Byk-Chemie Gmbh | Method for producing electrically conductive structures on non-conductive substrates and structures made in this manner |
| CN104451794A (en) * | 2013-09-16 | 2015-03-25 | 绿点高新科技股份有限公司 | Electroplating method with uniform coating thickness and product thereof |
-
2017
- 2017-09-29 CN CN201710905008.6A patent/CN107620095A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1523138A (en) * | 2003-02-19 | 2004-08-25 | 宏达国际电子股份有限公司 | Process for making plastic surface by electroplating |
| CN101255509A (en) * | 2008-04-02 | 2008-09-03 | 深圳市粤豪珠宝有限公司 | Production technique of chromatic gold ornaments |
| CN102618898A (en) * | 2011-01-26 | 2012-08-01 | 上海造币有限公司 | Local gilding technology for commemorative coin (badge) |
| WO2013079219A1 (en) * | 2011-12-02 | 2013-06-06 | Byk-Chemie Gmbh | Method for producing electrically conductive structures on non-conductive substrates and structures made in this manner |
| CN104451794A (en) * | 2013-09-16 | 2015-03-25 | 绿点高新科技股份有限公司 | Electroplating method with uniform coating thickness and product thereof |
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| 钱苗根等: "《现代表面工程》", 30 September 2012 * |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108441905A (en) * | 2018-04-23 | 2018-08-24 | 苏州普瑞得电子有限公司 | A kind of composite-layer metal electroplating technique |
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Application publication date: 20180123 |
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| RJ01 | Rejection of invention patent application after publication |