MY169065A - Surface-treated copper foil - Google Patents

Surface-treated copper foil

Info

Publication number
MY169065A
MY169065A MYPI2014702857A MYPI2014702857A MY169065A MY 169065 A MY169065 A MY 169065A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY PI2014702857 A MYPI2014702857 A MY PI2014702857A MY 169065 A MY169065 A MY 169065A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated copper
concentration
treated
lcp
Prior art date
Application number
MYPI2014702857A
Inventor
Ryo Fukuchi
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY169065A publication Critical patent/MY169065A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/24—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing hexavalent chromium compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82—After-treatment
    • C23C22/83—Chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2222/00—Aspects relating to chemical surface treatment of metallic material by reaction of the surface with a reactive medium
    • C23C2222/20—Use of solutions containing silanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrochemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Chemical Treatment Of Metals (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

This surface-treated copper foil is characterized in that, in an XPS survey measurement of the copper foil surface, the Si concentration is 2.0% or greater and the N concentration is 2.0% or greater. The objective of the present invention is to obtain a copper foil having improved peel strength in providing a copper foil for a flexible printed substrate (FPC), in which a copper foil is laminated to a liquid crystal polymer (LCP) suitable for high-frequency applications.
MYPI2014702857A 2012-03-29 2013-03-29 Surface-treated copper foil MY169065A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012076711 2012-03-29

Publications (1)

Publication Number Publication Date
MY169065A true MY169065A (en) 2019-02-12

Family

ID=49260358

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2014702857A MY169065A (en) 2012-03-29 2013-03-29 Surface-treated copper foil

Country Status (6)

Country Link
JP (3) JP5886417B2 (en)
KR (2) KR101658722B1 (en)
CN (1) CN104246013B (en)
MY (1) MY169065A (en)
TW (1) TWI565833B (en)
WO (1) WO2013147116A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013147115A1 (en) 2012-03-29 2013-10-03 Jx日鉱日石金属株式会社 Surface-treated copper foil
TWI565833B (en) * 2012-03-29 2017-01-11 Jx Nippon Mining & Metals Corp Surface treatment copper foil, copper laminated board, printed wiring board, printed circuit boards, and electronic equipment
JP6854114B2 (en) * 2016-01-04 2021-04-07 Ｊｘ金属株式会社 Surface-treated copper foil
US10383222B2 (en) 2016-01-04 2019-08-13 Jx Nippon Mining & Metals Corporation Surface-treated copper foil
JP6697759B2 (en) 2016-02-05 2020-05-27 パナソニックＩｐマネジメント株式会社 Metal-clad laminate, method of manufacturing metal-clad laminate, metal member with resin, method of manufacturing metal member with resin, wiring board, and method of manufacturing wiring board
JP7193915B2 (en) * 2017-02-03 2022-12-21 Ｊｘ金属株式会社 Surface-treated copper foil and current collector, electrode and battery using the same
US10529992B2 (en) 2017-02-03 2020-01-07 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, and current collector, electrode, and battery cell using the surface-treated copper foil
US10337115B1 (en) * 2018-01-05 2019-07-02 Chang Chun Petrochemical Co., Ltd. Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making
JP6413039B1 (en) * 2018-03-29 2018-10-24 Ｊｘ金属株式会社 Surface treated copper foil and copper clad laminate
EP3786317A4 (en) * 2018-04-27 2022-04-20 JX Nippon Mining & Metals Corporation Surface-treated copper foil, copper clad laminate, and printed wiring board
CN109467722B (en) * 2018-09-29 2022-04-08 苏州市新广益电子有限公司 LCP film for FPC industry and preparation method thereof
KR20220006035A (en) * 2019-05-09 2022-01-14 나믹스 가부시끼가이샤 Composite copper member
JP7352939B2 (en) * 2019-05-09 2023-09-29 ナミックス株式会社 composite copper parts
US10697082B1 (en) * 2019-08-12 2020-06-30 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil
JP7421208B2 (en) * 2019-12-24 2024-01-24 日本電解株式会社 Surface treated copper foil and its manufacturing method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6015654B2 (en) * 1980-11-18 1985-04-20 日本電解株式会社 Adhesion method for chromate treated layer of copper foil and resin base material
JPS6154592A (en) 1984-08-24 1986-03-18 株式会社日立製作所 Automatic cash transactor
JPH0334679A (en) 1989-06-30 1991-02-14 Canon Inc Picture processing device
JPH0555746A (en) 1991-08-29 1993-03-05 Hitachi Chem Co Ltd High frequency copper clad laminated board and printed circuit board
JP3135098B2 (en) 1993-06-21 2001-02-13 キヤノン株式会社 Optical element molding equipment
JP3300160B2 (en) * 1994-06-06 2002-07-08 株式会社ジャパンエナジー Copper foil processing method
JP2003193211A (en) 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd Rolled copper foil for copper-clad laminate
JP4295800B2 (en) * 2002-05-13 2009-07-15 三井金属鉱業株式会社 Electrolytic copper foil
CN1316066C (en) * 2002-06-04 2007-05-16 三井金属矿业株式会社 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board
JP4961023B2 (en) * 2007-12-21 2012-06-27 Ｊｘ日鉱日石金属株式会社 Copper foil for printed wiring boards
CN102150479B (en) * 2009-06-30 2013-03-27 Jx日矿日石金属株式会社 Copper foil for printed wiring boards
JP5463117B2 (en) * 2009-10-20 2014-04-09 株式会社日立製作所 Low loss wiring board, multilayer wiring board, copper foil and laminated board used therefor
JP5242710B2 (en) 2010-01-22 2013-07-24 古河電気工業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
EP2557204A1 (en) 2010-05-07 2013-02-13 JX Nippon Mining & Metals Corp. Copper foil for printed circuit
TWI565833B (en) * 2012-03-29 2017-01-11 Jx Nippon Mining & Metals Corp Surface treatment copper foil, copper laminated board, printed wiring board, printed circuit boards, and electronic equipment

Also Published As

Publication number Publication date
CN104246013B (en) 2018-01-23
CN104246013A (en) 2014-12-24
KR101658722B1 (en) 2016-09-21
JP2016033261A (en) 2016-03-10
WO2013147116A1 (en) 2013-10-03
JP6149066B2 (en) 2017-06-14
TW201404935A (en) 2014-02-01
KR101824827B1 (en) 2018-02-01
JPWO2013147116A1 (en) 2015-12-14
KR20160075865A (en) 2016-06-29
KR20140142341A (en) 2014-12-11
TWI565833B (en) 2017-01-11
JP2015206119A (en) 2015-11-19
JP5886417B2 (en) 2016-03-16

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