JPS6015654B2 - Adhesion method for chromate treated layer of copper foil and resin base material - Google Patents

Adhesion method for chromate treated layer of copper foil and resin base material

Info

Publication number
JPS6015654B2
JPS6015654B2 JP16236780A JP16236780A JPS6015654B2 JP S6015654 B2 JPS6015654 B2 JP S6015654B2 JP 16236780 A JP16236780 A JP 16236780A JP 16236780 A JP16236780 A JP 16236780A JP S6015654 B2 JPS6015654 B2 JP S6015654B2
Authority
JP
Japan
Prior art keywords
copper foil
base material
resin base
chromate
silane coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16236780A
Other languages
Japanese (ja)
Other versions
JPS5787324A (en
Inventor
武 山岸
和義 阿曾
和夫 谷島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP16236780A priority Critical patent/JPS6015654B2/en
Publication of JPS5787324A publication Critical patent/JPS5787324A/en
Publication of JPS6015654B2 publication Critical patent/JPS6015654B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal

Description

【発明の詳細な説明】 この発明は、銅箔のクロメート処理層と樹脂基材とを、
強固に接着させるための新規な方法に関するものである
[Detailed Description of the Invention] This invention provides a method for combining a chromate-treated layer of copper foil and a resin base material.
This invention relates to a new method for achieving strong adhesion.

詳言すれば、銅箔の粗面側に形成したクロメ−ト処理層
を、一般式YRSiX3(ここにYは高分子物と反応す
る官能基、Rは、Yとケイ素原子とを連結する鎖状また
は環状の炭化水素を含む結合基、×はケイ素原子に結合
する有機または無機の加水分解性の基を表わすものであ
る。
Specifically, the chromate treatment layer formed on the rough surface side of the copper foil is formed using the general formula YRSiX3 (where Y is a functional group that reacts with a polymer, and R is a chain connecting Y and a silicon atom). A bonding group containing a cyclic or cyclic hydrocarbon; x represents an organic or inorganic hydrolyzable group bonded to a silicon atom.

)で示されるシランカップリング剤溶液で処理後、これ
を樹脂基村と接着させるか、または該銅箔の粗面側に形
成させたクロメート処理層に、前記一般式のシランカッ
プリング剤を添加した接着剤層を形成後、これと樹脂基
材とを接着させる鋼箔のクロメート処理層と樹脂基材と
の接着方法に関するものである。さて、従釆プリント回
路用の銅張積層板は、銅箔と樹脂基材との接着力を増加
させるため、電解または圧延法で得た銅箔の接合面を電
解により粗化処理を行い、その表面に多数の樹枝状突起
を形成させた後、これと樹脂基材とを接着する方法によ
って行なわれてきた。
) After treatment with a silane coupling agent solution represented by the above formula, the silane coupling agent of the above general formula is added to the chromate treatment layer formed on the rough side of the copper foil, or by adhering this to the resin base layer. The present invention relates to a method of bonding a chromate-treated layer of steel foil and a resin base material, in which the adhesive layer is formed and then bonded to the resin base material. Now, in order to increase the adhesion between the copper foil and the resin base material, copper-clad laminates for printed circuits are made by roughening the bonding surface of the copper foil obtained by electrolysis or rolling, using electrolysis. This has been carried out by forming a large number of dendrites on the surface and then bonding the dendrites to a resin base material.

さらに詳しくいうと、ガラスーェポキシ樹脂基村を用い
る場合は、前記のように処理した銅箔粗面と前記基材と
を重ねて加熱、加圧して積層し、またフェノール樹脂基
材を用いる場合は、フェノール樹脂系接着剤を粗化鋼箔
面に塗布し、基村と重ねて加熱、加圧して横層してし、
た。そして、このような方法で接着する場合の銅箔と基
材との接着力は、鋼箔表面を粗くする程向上することが
知られている。しかし、銅簿面をあまり粗くすると積層
板製作後のエッチングの際に、露出した基材面に鋼箔粗
化面の一部が残留し、積層汚点いわゆるスティンが発生
するという大きな欠点があった。そして上記欠点は、前
記樹枝状組織のメッキ鋼箔上に金属亜鉛を被覆させる煩
雑な工程を行うとか、電解格、電解方法に関して各種の
管理、調整を行うなどによって防止していた。この発明
は、前記従釆法にみられるステインの発生や煩雑な工程
を解消し、銅箔のクロメート処理層と樹脂基村とを強固
に接着する方法を提供するものである。
More specifically, when using a glass-epoxy resin base material, the copper foil rough surface treated as described above and the base material are laminated by heating and pressurizing, and when using a phenolic resin base material, Phenol resin adhesive is applied to the roughened steel foil surface, layered with Motomura, heated and pressed to form horizontal layers.
Ta. It is known that the adhesive force between the copper foil and the base material when bonded by such a method improves as the surface of the steel foil becomes rougher. However, if the copper surface is made too rough, a part of the roughened surface of the steel foil will remain on the exposed base material surface during etching after the laminate is manufactured, resulting in the formation of laminate stains, which is a major drawback. . The above drawbacks have been prevented by performing a complicated process of coating metallic zinc on the plated steel foil having the dendritic structure, and by performing various controls and adjustments regarding the electrolytic rating and electrolytic method. The present invention provides a method for firmly adhering a chromate-treated layer of copper foil and a resin base layer by eliminating the staining and complicated steps found in the above-mentioned secondary method.

本発明者等は、従来の銅箔と樹脂基材との接着方法は、
単に銅箔面に樹枝状突起を設ける物理的手段であったこ
とに着目し、これに代えて化学的手段、すなわち鋼箔と
樹脂との間に化学的勢守海の役目を果すような薬剤を介
在させて接着を行えば接着力を著しく改善できるのでは
ないかと考え、使用する薬剤について検討を重ねてきた
。その結果、前記一般式YRSiX3の公知のシランカ
ップリング剤を銅箔のクロメート処理層と樹脂基材との
間に介在せしめると、この種の目的に対し極めて有効で
あることを多数の実験により確認できた。ここに式中の
Yは、高分子物と反応する官能基、例えば、ピニル、ア
ミノ、ジアミノ、クロル、エポキシ、メルカプト、メタ
クリルオキシなどの基であり、Yと反応が可能な高分子
物としては、フェノール、ェポキシ、アクリル、アルキ
ツド、塩化ビニル、ポリエステル、ポリウレタンなどの
各樹脂と、プチルラバー、ニトリルラバー、ニトロセル
ローズなどを掲げ得る。またRは、Yとケイ素原子とを
連結する銭状または環状の炭化水素を含む結合基、Xは
、ケイ素原子と結合する加水分解性の基、例えばクロル
、メトキシ、メトキシェトキシなどの基である。上記一
運のシランカップリング剤が、銅箔のクロメート処理層
と樹脂基材との接着力を向上する機構については未だ十
分検討してはいないが、上記−般式中のYが有機質に対
する濡れの改善、表面粗さの向上、相溶性の改善、共有
結合の形成などの作用により、接着性の向上に寄与する
もののように考えられ、また加水分解性の基である×は
、加水分解を受けた場合、、次式に示すように、シラノ
ールおよびHXを形成し、この反応生成物が銅箔のクロ
メート処理層に対して接着力を付与するもののように考
えられる。
The present inventors have discovered that the conventional bonding method between copper foil and resin base material is
Focusing on the physical means of simply creating dendrites on the copper foil surface, we developed a chemical method instead, that is, a chemical agent that acts as a chemical barrier between the steel foil and the resin. We thought that adhesion could be significantly improved by intervening adhesive agents, and we have been studying the chemicals to be used. As a result, it was confirmed through numerous experiments that interposing the known silane coupling agent with the general formula YRSiX3 between the chromate treatment layer of copper foil and the resin base material is extremely effective for this type of purpose. did it. Here, Y in the formula is a functional group that reacts with a polymer, such as pinyl, amino, diamino, chloro, epoxy, mercapto, methacryloxy, etc. As a polymer that can react with Y, , phenol, epoxy, acrylic, alkyd, vinyl chloride, polyester, polyurethane, and butyl rubber, nitrile rubber, nitrocellulose, etc. Further, R is a bonding group containing a circular or cyclic hydrocarbon that connects Y and a silicon atom, and X is a hydrolyzable group that bonds to a silicon atom, such as chloro, methoxy, methoxyshetoxy, etc. be. The mechanism by which the above-mentioned lucky silane coupling agent improves the adhesion between the chromate-treated layer of copper foil and the resin base material has not yet been fully investigated, but Y in the general formula It is thought that it contributes to the improvement of adhesion through actions such as improvement of surface roughness, improvement of compatibility, and formation of covalent bonds. When subjected to the reaction, silanol and HX are formed as shown in the following formula, and this reaction product is thought to provide adhesive strength to the chromate-treated layer of the copper foil.

YRSiX3十粕夕→YRSi(OH)3十×戊従って
、上記シランカップリング剤を用いて接着力を高めるた
めには、次のような方法を採用するのが、有効であると
の考えに到達した。
YRSi did.

【1} 鋼箔の粗面側に形成させたクロメート処理層を
、該シランカップリング剤で処理し、その表面にYRS
iX3の薄膜を形成させる。
[1} The chromate treatment layer formed on the rough side of the steel foil is treated with the silane coupling agent, and YRS is applied to the surface.
A thin film of iX3 is formed.

‘21銅箔の粕面側に形成させたクロメート層に該シラ
ンカツプリング剤を含有する接着剤層を形成させる。
An adhesive layer containing the silane coupling agent is formed on the chromate layer formed on the dregs side of the '21 copper foil.

そして、上記方法により各種の実験を繰返し、その効果
を認め得たので、これら実験結果に基いてここに本発明
を完成した。
Then, various experiments were repeated using the above method, and the effects were recognized, so the present invention was completed based on the results of these experiments.

本発明の方法を、銅箔のクロメート処理層と樹脂基材と
の接着に実施すれば、銅箔に対し従来のように苛酷な粗
化処理を行う必要がなく、電解により陰極面に析出した
鋼箔面またはこれにスティンの発生しない程度の粗化を
行ったのち、これら鋼箔の粗面側にクロメート処理を行
ない、該面を前記シランカツブリング剤で処理するか、
または該クロメート処理面にシランカップリング剤を含
浸した接着剤層を形成して樹脂基材と接着させれば、樹
脂基村との接着を強固にすることができる。
If the method of the present invention is applied to bonding the chromate-treated layer of copper foil and the resin base material, there is no need to perform harsh roughening treatment on the copper foil as in the past, and deposits on the cathode surface by electrolysis can be avoided. After roughening the surface of the steel foil or the surface to an extent that no staining occurs, chromate treatment is performed on the rough side of the steel foil, and the surface is treated with the silane cobbling agent, or
Alternatively, by forming an adhesive layer impregnated with a silane coupling agent on the chromate-treated surface and adhering it to the resin base material, the adhesion to the resin base material can be strengthened.

従って、本発明は、プリント回路などの製作に有効な接
着方法を提供する発明と言い得る。つぎに本発明に使用
可能なシランカップリング剤の代表例と、その特性など
を取纏めて表1に示す。表1 本発明は、上記のようなシランカツプリング剤を用いて
、鋼箔粗面側に形成したクロメート処理層を処理したの
ち、これを樹脂基材と接着させるか、または前記鋼箔粗
面側のクロメート処理層に対し、シランカップリング剤
を添加した接着剤層を形成後、樹脂基材と接着するもの
である。
Therefore, the present invention can be said to provide an adhesive method that is effective for manufacturing printed circuits and the like. Next, Table 1 summarizes typical examples of silane coupling agents that can be used in the present invention and their characteristics. Table 1 The present invention involves treating a chromate treatment layer formed on the rough surface side of a steel foil using the above-mentioned silane coupling agent, and then bonding this to a resin base material, or After forming an adhesive layer containing a silane coupling agent on the chromate-treated layer on the side, it is bonded to the resin base material.

そして上記銅箔のクロメート層処理のためのシランカッ
プリング剤の濃度は0.001〜5重量%、好適には0
.1〜3重量%の溶液である。また接着層を設ける場合
には、接着剤中の固形分の重量に対し、0.001〜5
重量%、好適には0.1〜3重量%のシランカップリソ
グ剤を添加または含浸させて接着を行うものである。こ
のように使用するシランカップリング剤の量に限定を設
けたのは、この範囲以下の量を使用しても、またそれ以
上の量を用いても接着の際、接着力の低下が認められた
からである。
The concentration of the silane coupling agent for the chromate layer treatment of the copper foil is 0.001 to 5% by weight, preferably 0.
.. It is a 1-3% by weight solution. In addition, when providing an adhesive layer, 0.001 to 5
Adhesion is performed by adding or impregnating a silane coupling agent in an amount of 0.1 to 3% by weight, preferably 0.1 to 3% by weight. The reason for setting a limit on the amount of silane coupling agent to be used is that even if an amount is used below this range, or even if it is used in an amount above this range, a decrease in adhesive strength is observed during adhesion. This is because the.

以下、実施例を掲げ、本発明をさらに具体的に説明する
EXAMPLES Hereinafter, the present invention will be described in more detail with reference to Examples.

実施例 1 公知の酸性硫酸鋼〆ッキ浴を用い、チタン製の陰極面に
32仏厚みの銅箔を露析ごせた後、これを陰極から剥離
し、水洗を行った後、その粗面側をPH3〜5に調整し
たNa2Cr207・が20の5タ′々溶液中で格温2
ぴ0、陰極電流密度IA/dでにおいて1分間処理し、
水洗乾燥して銅箔粗面にクロメート層を形成させた。
Example 1 After exposing a copper foil with a thickness of 32 mm on the surface of a titanium cathode using a known acidic sulfuric acid steel plating bath, it was peeled off from the cathode, washed with water, and its roughness was removed. Na2Cr207. whose surface side was adjusted to pH 3-5 was heated to a temperature of 2 in a solution of 20.
0, treated for 1 minute at a cathodic current density IA/d,
A chromate layer was formed on the rough surface of the copper foil by washing with water and drying.

つぎにこの試料を、yーグリシドキシプoピルトリメト
キシシランのエチルアルコール溶液に水を加えて希釈し
、酢酸によりそのPHを4.5〜5.0となし、かつそ
の濃度を0.01重量%、0.1重量%および3.の重
量%に調整した3種類の溶液中に、それぞれ常温におい
て1分間浸潰し、引上げて室温乾燥を行い、引続きこれ
を110〜12ぴCに保持した乾燥器中で3分間乾燥後
、各試片のクロメート処理面を、ガラス〜ェポキシ樹脂
基材と重ね合わせて1590、圧力100k9′のにお
いて30分間乾燥し、250×250×2肋の銅張積層
板を試作した。これと同時に比較のためシランカップリ
ング剤処理を行わない銅箔(ブランク)からも同一条件
で同一寸法の鋼張積層板謎片を作製し、これらの試片に
つき、その剥離強度、耐シアン劣化率(銅張積層板試片
を、KCNの10%水溶液中において70℃で3企分間
浸債後の剥離強度の劣化率である。)および耐塩酸性(
銅張積層板試片を試薬塩酸:水=1:1の水溶液中に、
常温で1時間浸薄後の剥離強度の劣化率である。)を測
定してみた。結果は、表2に示す通りである。表2表2
から銅箔粗面側に公知のクロメート処理を施した後、シ
ランカップリング剤で処理を行ったものは、ブランクの
ものに較べて銅箔の剥離強度、耐シアン劣化率および耐
塩酸性が、いずれの場合も薯しくすぐれ、その効果が顕
著であることがわかる。
Next, this sample was diluted by adding water to an ethyl alcohol solution of y-glycidoxypropyltrimethoxysilane, and its pH was adjusted to 4.5 to 5.0 with acetic acid, and the concentration was adjusted to 0.01% by weight. 0.1% by weight and 3. Each sample was immersed in three types of solutions adjusted to a weight percent of The chromate-treated surface of the piece was laminated with a glass-epoxy resin base material and dried for 30 minutes at 1590° C. and 100 k9' pressure to produce a 250 x 250 x 2-wall copper-clad laminate. At the same time, for comparison, steel clad laminate pieces with the same dimensions were prepared under the same conditions from a copper foil (blank) that was not treated with a silane coupling agent, and the peel strength and resistance to cyanide deterioration of these test pieces were investigated. rate (deterioration rate of peel strength after soaking a copper-clad laminate specimen in a 10% KCN aqueous solution at 70°C for 3 minutes) and hydrochloric acid resistance (
A copper-clad laminate specimen was placed in an aqueous solution of reagent hydrochloric acid:water = 1:1.
This is the deterioration rate of peel strength after dipping for 1 hour at room temperature. ) was measured. The results are shown in Table 2. Table 2Table 2
After applying a known chromate treatment to the rough side of the copper foil and then treating it with a silane coupling agent, the peel strength, cyanide deterioration rate, and hydrochloric acid resistance of the copper foil were significantly lower than that of a blank copper foil. It can be seen that the yam quality was also excellent in the case of , and the effect was remarkable.

またシランカツプリング剤の濃度を0.001重量%以
下とするか、5重量%以上にすれば、いずれの場合も剥
離強度が表記のものよりも0.3〜0.5k9/伽程度
低下することを実験的に認めた。従って、処理に用いる
シランカツプリング剤の濃度は0.001〜5重量%の
範囲が適当である。なお、参考として記載すると、実施
例1と同様、チタン製の陰極面に32y厚みの銅箔を鰭
析させた後、陰極から剥離して水洗し、該箔の粗面側に
クロメート処理を施すことなく実施例1で述べたと同一
条件においてシランカップリング剤液の処理を行ったの
ち、各試片の粗面側をガラスーヱポキシ樹脂基材と重ね
合わせ、155℃、圧力100k9/仇において処理し
て250×250×2肋の銅張積層板を試作した。これ
と同時にシランカツプリング剤処理を行なわない鋼張積
層板(ブランク)も試作し、これら試作鋼張積層板に対
し、実施例1で述べたと同様の試験を行った。結果は表
3に示す通りである。 表 3表3から銅箔の
粗面側にクロメート処理を施さないでシランカツプリン
グ剤処理しただけの場合でも、ブランクに較べれば剥離
強度等の特性が向上することがわかるが、銅箔の粗面側
にクロメート処理した前記実施例1のものにくらべると
、その特性が劣るものである。
In addition, if the concentration of the silane coupling agent is 0.001% by weight or less or 5% by weight or more, the peel strength will be reduced by 0.3 to 0.5 k9/ky compared to the listed one in either case. This was experimentally confirmed. Therefore, the concentration of the silane coupling agent used in the treatment is suitably in the range of 0.001 to 5% by weight. For reference, as in Example 1, a 32y thick copper foil was deposited on the titanium cathode surface, then peeled off from the cathode and washed with water, and the rough side of the foil was subjected to chromate treatment. After treating the silane coupling agent solution under the same conditions as described in Example 1, the rough side of each specimen was stacked on a glass-epoxy resin base material and treated at 155°C and a pressure of 100k9/cm. A 250 x 250 x 2-rib copper-clad laminate was prototyped. At the same time, steel-clad laminates (blanks) not treated with a silane coupling agent were also produced, and the same tests as described in Example 1 were conducted on these trial steel-clad laminates. The results are shown in Table 3. Table 3 From Table 3, it can be seen that even when the rough side of the copper foil is treated with a silane coupling agent without chromate treatment, properties such as peel strength are improved compared to a blank. The properties are inferior to those of Example 1, which was treated with chromate on the surface side.

すなわちクロメート処理を施すことにより銅箔粗面側と
樹脂基村との接着は、一段と強固に行なわれることがわ
かる。実施例 2実施例1と同様にして得た32仏の銅
箔の粗面側を、CuS04・9日20の100汐′〆と
日2S04の50夕/そとからなる銅〆ツキ裕中におい
て、格温20℃、陰極電流密度3〜5A′d〆の条件で
、スティンが発生しない範囲の粗化を行った後、実施例
1で述べたと同一の条件で該面にクロメート処理を行い
、さらに実施例1と同一条件でシランカップリング剤液
の処理を施した後、各試片のクロメート処理面をガラス
〜ェポキシ樹脂基材と重ね合わせ、155℃、圧力10
0kg′のにおいて処理し、250×250×2肌の銅
張積層板を試作した。
That is, it can be seen that by applying the chromate treatment, the adhesion between the rough surface side of the copper foil and the resin base layer is made even stronger. Example 2 The rough side of the 32-piece copper foil obtained in the same manner as in Example 1 was coated in a copper-plated coating consisting of CuS04, 9th, 20th, 100' and day 2, S04, 50'. After roughening to the extent that stain does not occur under the conditions of a maximum temperature of 20°C and a cathode current density of 3 to 5 A'd, the surface is subjected to chromate treatment under the same conditions as described in Example 1, After further treatment with a silane coupling agent solution under the same conditions as in Example 1, the chromate-treated surface of each specimen was placed on a glass to epoxy resin base material at 155°C and a pressure of 10°C.
A copper-clad laminate with a size of 250 x 250 x 2 was fabricated as a prototype.

これと同時にシランカップリング剤処理を行なわない銅
張積層板(ブランク)も試作し、これらの銅張積層板に
対し、実施例1で述べたと同様の試験を行ってみた。結
果は表4に示す通りである。表4 表4からシランカップリング剤液で処理を行えば、銅箔
の特性が著しく改善されることがわかる。
At the same time, copper-clad laminates (blanks) not treated with a silane coupling agent were also produced, and tests similar to those described in Example 1 were conducted on these copper-clad laminates. The results are shown in Table 4. Table 4 From Table 4, it can be seen that the properties of the copper foil are significantly improved by treatment with the silane coupling agent liquid.

すなわち鋼箔の粗化処理は、従釆のようにステインを生
じる恐れのある苛酪な処理は不要であることがわかった
。またシランカップリング剤液濃度が0.001重量%
以下と5重量%以上の場合には、剥離強度が表記のもの
よりも0.5【9′肌程度低下することを実験的に知り
得た。実施例 3 32仏厚みの銅箔粗面側に、実施例2で述べたと同様の
方法で粗化処理とクロメート処理を施した後、該銅箔の
クロメート処理面に、予じめ固形分18%のフェノール
樹脂系接着剤に、シランカツブリング剤であるyーメタ
クリルオキシプロピル・トリメトキシシランを該接着剤
の固形分に対し重量でそれぞれ0.01%、0.1%、
3%含有させた3種類の接着剤を、それぞれ塗布した後
、接着剤中の揮発分を乾燥除去し、厚さ30山の接着剤
層を形成させた。
In other words, it has been found that the roughening treatment of steel foil does not require harsh treatment that may cause staining, as is the case with secondary steel foils. In addition, the silane coupling agent liquid concentration is 0.001% by weight.
It has been experimentally found that when the amount is less than 5% by weight and more than 5% by weight, the peel strength is lowered by about 0.5 [9' skin] than the stated value. Example 3 After performing roughening treatment and chromate treatment on the rough side of a copper foil with a thickness of 32 cm in the same manner as described in Example 2, the chromate treatment side of the copper foil was preliminarily treated with a solid content of 18 % of phenolic resin adhesive, y-methacryloxypropyl trimethoxysilane, which is a silane cobbling agent, was added to 0.01% and 0.1% by weight of the solid content of the adhesive, respectively.
After each of three types of adhesive containing 3% was applied, the volatile matter in the adhesive was removed by drying to form an adhesive layer with a thickness of 30 peaks.

ついで該接着剤層をフェノール樹脂基材と重わ合わせ、
実施例1で述べたと同様の方法で積層を行い、250×
250×2胸の銅張積層板を試作した。この試作鋼張積
層板の特性を、実施例1に述べたと同様の方法で測定し
、シランカップリング剤処理を行なわないもの(ブラン
ク)と比較して表5に示す。表5 表5からシランカップリング剤を添加した接着剤を用い
れば、銅箔と樹脂基材との接着力を著しく向上できるこ
とは明白である。
The adhesive layer is then overlapped with a phenolic resin base material,
Lamination was carried out in the same manner as described in Example 1, and 250×
A 250x2 copper clad laminate was prototyped. The properties of this prototype steel clad laminate were measured in the same manner as described in Example 1, and are shown in Table 5 in comparison with those not treated with a silane coupling agent (blank). Table 5 It is clear from Table 5 that the adhesive strength between the copper foil and the resin base material can be significantly improved by using an adhesive containing a silane coupling agent.

Claims (1)

【特許請求の範囲】 1 銅箔のクロメート処理層と樹脂基材とを接着するに
当つて、銅箔の粗面側に形成させたクロメート処理層を
、一般式YRSiX_3(ここにYは高分子物と反応す
る官能基、RはYとケイ素原子とを連結する鎖状または
環状の炭化水素を含む結合基、Xはケイ素原子に結合す
る有機または無機の加水分解性の基を表わすものである
。 )で示されるシランカツプリング剤溶液で処理したのち
樹脂基材と接着させるか、または前記クロメート処理層
に、前記一般式で示したシランカツプリング剤を含浸さ
せた接着剤層を形成後、前記樹脂基材と接着させること
を特徴とする銅箔のクロメート処理層と樹脂基材との接
着方法。2 銅箔の粗面側に形成したクロメート処理層
を、前記一般式で示したシランカツプリング剤の0.0
01〜5重量%溶液で処理し、ついでこれを樹脂基材と
接着させる特許請求の範囲第1項記載の接着方法。 3 銅箔の粗面側に形成したクロメート処理層に、接着
剤の固形分に対し、前記一般式で示したシランカツプリ
ング剤を0.001〜5重量%添加した接着剤層を設け
た後、これを樹脂基材と接着させる特許請求の範囲第1
項記載の接着方法。
[Claims] 1. When adhering the chromate-treated layer of copper foil and the resin base material, the chromate-treated layer formed on the rough side of the copper foil is formed using the general formula YRSiX_3 (where Y is a polymer A functional group that reacts with a substance, R is a bonding group containing a chain or cyclic hydrocarbon that connects Y and a silicon atom, and X represents an organic or inorganic hydrolyzable group bonded to a silicon atom. ) After treatment with a silane coupling agent solution represented by the above formula and adhering it to a resin base material, or after forming an adhesive layer impregnated with the silane coupling agent represented by the above general formula on the chromate treatment layer, A method for adhering a chromate-treated layer of copper foil and a resin base material, the method comprising adhering the chromate-treated layer of copper foil to the resin base material. 2. The chromate treatment layer formed on the rough side of the copper foil is coated with 0.0% of the silane coupling agent represented by the general formula above.
2. The adhesive method according to claim 1, wherein the adhesive is treated with a 01 to 5% by weight solution and then adhered to a resin base material. 3 After providing an adhesive layer on the chromate treatment layer formed on the rough side of the copper foil, in which 0.001 to 5% by weight of the silane coupling agent represented by the above general formula is added to the solid content of the adhesive. , which is bonded to a resin base material.
Adhesion method described in section.
JP16236780A 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material Expired JPS6015654B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16236780A JPS6015654B2 (en) 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16236780A JPS6015654B2 (en) 1980-11-18 1980-11-18 Adhesion method for chromate treated layer of copper foil and resin base material

Publications (2)

Publication Number Publication Date
JPS5787324A JPS5787324A (en) 1982-05-31
JPS6015654B2 true JPS6015654B2 (en) 1985-04-20

Family

ID=15753213

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPS6015654B2 (en)

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