JPH02307294A - Copper foil for printed circuit - Google Patents
Copper foil for printed circuitInfo
- Publication number
- JPH02307294A JPH02307294A JP12793289A JP12793289A JPH02307294A JP H02307294 A JPH02307294 A JP H02307294A JP 12793289 A JP12793289 A JP 12793289A JP 12793289 A JP12793289 A JP 12793289A JP H02307294 A JPH02307294 A JP H02307294A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- polysiloxane
- film
- copper
- followed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 50
- 239000011889 copper foil Substances 0.000 title claims abstract description 48
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 24
- -1 polysiloxane Polymers 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 14
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910000077 silane Inorganic materials 0.000 claims abstract description 12
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000011282 treatment Methods 0.000 abstract description 19
- 238000000034 method Methods 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 230000004888 barrier function Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 4
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 12
- 239000007864 aqueous solution Substances 0.000 description 11
- 239000000126 substance Substances 0.000 description 7
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 4
- 238000007654 immersion Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- XCHNQZBXQRQTIG-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane;n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN.CO[Si](OC)(OC)CCCOCC1CO1 XCHNQZBXQRQTIG-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、銅箔を基板に接着積層した銅張り積層板の高
温加熱後の剥離強度を保持するよう改善した印刷回路用
銅箔及び銅張り積層板に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a copper foil for printed circuits and a copper clad laminate, which is made by adhering and laminating a copper foil to a substrate, and which is improved to maintain the peel strength after high temperature heating. Regarding tension laminates.
（従来の技術）
印刷回路用銅箔は、例えば紙−フェノール樹脂含浸基材
又はガラスエポキシ樹脂基板とを重ねて、加熱加圧して
張り合せ、銅張り積層板を製作し、これより回路形成不
要部をエツチング除去し、所望の印刷回路を形成する。(Prior art) Copper foil for printed circuits is produced by laminating, for example, a paper-phenolic resin-impregnated base material or a glass epoxy resin substrate and bonding them together under heat and pressure to produce a copper-clad laminate, which eliminates the need for circuit formation. The portions are etched away to form the desired printed circuit.
印刷回路の緻密化に伴い、使用する銅箔の剥離強度とそ
の耐熱性は極めて重要である。As printed circuits become more dense, the peel strength and heat resistance of the copper foil used are extremely important.
剥離強度を向上させる方法としては、例えば特公昭４０
−１５３２７に示されているような、粗化鋼を電着して
粗面を得る方法がある。耐熱性を向上させる方法として
は、例えば特公昭５１−３５７１１に示されているよう
な、黄銅や亜鉛めっきをして銅箔と樹脂基板との化学反
応のバーリヤとする方法がある。As a method for improving peel strength, for example,
There is a method of electrodepositing roughened steel to obtain a rough surface, as shown in No. 15327. As a method for improving heat resistance, there is a method of plating brass or zinc to serve as a barrier for the chemical reaction between the copper foil and the resin substrate, as shown in Japanese Patent Publication No. 51-35711.
（発明が解決しようとする課題）
最近特に剥離強度の耐熱性が求められ、例えば１７７°
Ｃ・１０日間加熱後も接着力を保持することが求められ
、従来の処理では応じられなくなっている。(Problem to be solved by the invention) Recently, heat resistance, especially peel strength, is required, for example, 177°
C. It is required to maintain adhesive strength even after heating for 10 days, and conventional processing is no longer sufficient.
本発明は、銅箔を基材と組み合わせた銅張り積層板にお
ける上記の問題点を解消し、剥離強度の耐熱性が大きい
印刷回路用銅箔及びその銅張り積層板を提供するもので
ある。The present invention solves the above-mentioned problems in copper-clad laminates in which copper foil is combined with a base material, and provides a copper foil for printed circuits that has high peel strength and heat resistance, and a copper-clad laminate thereof.
（課題を解決するための手段）
本発明の印刷回路用銅箔は、銅箔の基材との被接合面を
ポリシロキサン膜で被覆し、あるいは更にその上をシラ
ン膜又はクロメート膜で被覆したことを特徴とする。(Means for Solving the Problems) The copper foil for printed circuits of the present invention has the surface of the copper foil to be bonded to the base material coated with a polysiloxane film, or further coated with a silane film or a chromate film. It is characterized by
本発明の印刷回路用銅箔に用いられる銅箔は、電解銅箔
、圧延銅箔のいずれであっても良い。銅箔は、予め表面
を粗化処理しであるものが好ましく、更に亜鉛、黄銅、
ニッケルなどで耐熱性バーリヤを施しであるものが最適
である。更に、それらの表面が化学的クロメート処理又
は陰極クロメート処理してあってもよい。The copper foil used for the printed circuit copper foil of the present invention may be either an electrolytic copper foil or a rolled copper foil. The copper foil is preferably one whose surface has been roughened in advance, and is further made of zinc, brass,
The best choice is one with a heat-resistant barrier made of nickel or the like. Furthermore, their surfaces may be chemically chromated or cathodic chromated.
使用するポリシロキサンはシロキサン結合を有する分子
量数百〜数千程度のもので、直鎖状、環状、網状構造を
もついずれでも使用できる。有機基を有せず、置換基の
ＯＨのＨの一部がＮａで置換しており、水に分散（粒子
径０．２〜１ｍμ）して溶液としたときのｐＨが１０．
５〜１１．２、と（に１０８〜１１．０であるものがヱ
同箔表面との結合力が適当である。ポリシロキサンは銅
箔表面と次のようにメタシロキサン結合してセラミック
ス皮膜を形成するものと考えられる。The polysiloxane used has a molecular weight of several hundred to several thousand and has a siloxane bond, and can have a linear, cyclic, or network structure. It does not have an organic group, some of the H of the OH substituent is replaced with Na, and when dispersed in water (particle size 0.2 to 1 mμ) and made into a solution, the pH is 10.
5 to 11.2 and (108 to 11.0) is suitable for bonding strength with the surface of the foil.Polysiloxane is bonded with metasiloxane to the copper foil surface as follows to form a ceramic film. It is thought that it forms.
−Ｍ−Ｍ□〜１−
ＨＨ
ｌｌ
−Ｍ−Ｍ−Ｍ−銅箔表面
処理方法は、ポリシロキサン２〜３７０ｇ／Ｑ、好まし
くは８〜１９０ｇ／Ｉ２．の水溶液に、常温〜８０°Ｃ
で、１〜６０秒間銅箔を漫し、取り出して、水洗するこ
となく熱風乾燥する。ポリシロキサン水溶液の濃度が余
り薄いと耐熱性の効果がなく、濃すぎると粗面がなだら
かになり基板との密着性が低下する。また、浸漬時間が
余り短いと銅箔が十分に濡れない恐れがあり、余り長く
しても効果に影響がない。約４０ ｍｇ／ ｄｍ２の厚
さが好ましい。-M-M□~1-HH ll -M-M-M- The copper foil surface treatment method uses polysiloxane of 2 to 370 g/Q, preferably 8 to 190 g/I2. to an aqueous solution of at room temperature to 80°C.
Then, spread the copper foil for 1 to 60 seconds, take it out, and dry it with hot air without washing with water. If the concentration of the polysiloxane aqueous solution is too low, there will be no heat resistance effect, and if it is too high, the rough surface will become smooth and the adhesion to the substrate will decrease. Moreover, if the immersion time is too short, the copper foil may not be sufficiently wetted, and if the immersion time is too long, the effect will not be affected. A thickness of about 40 mg/dm2 is preferred.
シランカップリング処理には、−１ｉ１Ｕに次の化学構
造のシランラップリング剤が用いられる。In the silane coupling treatment, a silane wrapping agent having the following chemical structure is used for -1i1U.
ＯＲ
Ｘ〜５ｉ−ＯＲ
ＯＲ
ここにＯＲは金属等と結合する官能基であって、例えば
メトキシ、エトキシのようなアルコキシ基を表し、Ｘは
有機ポリマーと結合しつる有機官能基で、例えばビニル
基、メタクリル基、エポキシ基、アミノ基又はメルカプ
ト基を表す。OR , represents a methacrylic group, an epoxy group, an amino group or a mercapto group.
代表的化合物としては次のものがあげられる。Representative compounds include the following.
γ−アミノブロビルトリエトシキシシランγ−グリシド
オキシプロビルトリメトキシシラン
Ｎ−β−アミノエチル−γ−アミノプロピルトリメトキ
シシラン
シランカップリング処理方法は、既知の方法で行うこと
ができ、シランカップリング剤０１〜５０ ｇ／ｆ２）
水溶液に、常温〜６０°Ｃで１〜６０秒間銅箔を浸漬し
、取り出して、水洗することな（熱風乾燥する。シラン
カップリング剤溶液が余り薄いと密着性の効果がなく、
濃すぎても効果に影響がない。また、浸漬時間が短すぎ
ると銅箔が十分に濡れない恐れがあり、長すぎても効果
に影響がない。ポリシロキンサン処理少シランカップリ
ング処理をすると若干膜厚が減少するが、これはポリシ
ロキサン層がシランカップリングの液に溶けるためであ
る。γ-aminobrobyltriethoxysilane γ-glycidoxypropyltrimethoxysilane N-β-aminoethyl-γ-aminopropyltrimethoxysilane The silane coupling treatment method can be performed by a known method. Coupling agent 01-50 g/f2)
Immerse the copper foil in the aqueous solution for 1 to 60 seconds at room temperature to 60°C, take it out, and do not wash it with water (dry it with hot air. If the silane coupling agent solution is too thin, it will have no adhesive effect.
Even if it is too thick, the effect will not be affected. Moreover, if the immersion time is too short, the copper foil may not be sufficiently wetted, and if the immersion time is too long, the effect will not be affected. When polysiloxane treatment and low silane coupling treatment are performed, the film thickness decreases slightly, but this is because the polysiloxane layer dissolves in the silane coupling liquid.
クロメート処理は、既知の方法で行うことができ、酸化
クロム、クロム酸塩又は重クロム酸塩の０．０５〜５０
ｇ／ｊ２、好ましくは０．１〜２０ｇ／１２の水溶液に
、常温〜８０°Ｃで１〜６０秒間銅箔を浸漬する。化学
クロメート処理、あるいは銅箔を陰極として上記クロム
酸塩の水溶液に浸し電解する陰極クロメート処理を行い
、取り出して熱風乾燥する。Chromate treatment can be carried out by known methods, with 0.05 to 50% of chromium oxide, chromate or dichromate.
The copper foil is immersed in an aqueous solution of g/j2, preferably 0.1 to 20 g/12, for 1 to 60 seconds at room temperature to 80°C. Chemical chromate treatment or cathodic chromate treatment is performed in which a copper foil is immersed in an aqueous solution of chromate as a cathode and electrolyzed, and then taken out and dried with hot air.
これらシランカップリング処理及びクロメート処理はポ
リシロキサン処理後の接着力を回復するのに効果的であ
る。とくにシランカップリング剤のＯＲ基が加水分解を
うけて無機質とオキサン結合を作り、一方有磯官能基が
有機質と反応するので、無機質と有機質の橋かけを行う
。These silane coupling treatments and chromate treatments are effective in restoring adhesive strength after polysiloxane treatment. In particular, the OR group of the silane coupling agent undergoes hydrolysis to form an oxane bond with an inorganic substance, while the aliiso functional group reacts with an organic substance, thereby creating a bridge between the inorganic substance and the organic substance.
このようにして得られた処理銅箔は、従来の方法と同様
に樹脂基板に重ねて加熱加圧して張り合せ、銅張り積層
板とする。The treated copper foil thus obtained is stacked on a resin substrate and bonded together under heat and pressure in the same manner as in the conventional method to form a copper-clad laminate.
（発明の実施例）
実施例１゜
予め表面粗面化処理を施した厚さ３！５ｐｍの電解銅箔
を、平均分子量８００のポリシロキサン（日本表面化学
■製ストロンコーｈＪ）水溶液２５０ｉ／℃に６０’Ｃ
で５秒間浸した後、取り出して、１００°Ｃの熱風で乾
燥した。次にγ−アミノプロピルトリエトキシシラン５
ｇ／！２水溶液に、室温で５秒間浸漬した後、水洗する
ことなく、１００°Ｃの熱風で乾燥した。ポリシロキサ
ン膜の厚さは４０ ｍｇ／ ６ｍ２．シラン処理後の膜
の合計厚みは３９ ｍｇ／ ｄｍ”であった。得られた
銅箔の粗面をエポキシ樹脂基板プリプレグに重ね、常法
により加熱加圧して銅張り積層板を得た。この積層板を
１７７°Ｃで１０日間加熱前後の剥離強度を測定した結
果を表１に示す。(Embodiments of the Invention) Example 1 Electrolytic copper foil with a thickness of 3 to 5 pm, which had been subjected to surface roughening treatment in advance, was heated in an aqueous solution of polysiloxane (Stronko hJ, manufactured by Nippon Surface Chemical) with an average molecular weight of 800 at 250 i/°C. 60'C
After immersing it in water for 5 seconds, it was taken out and dried with hot air at 100°C. Next, γ-aminopropyltriethoxysilane 5
g/! 2 aqueous solution at room temperature for 5 seconds, and then dried with hot air at 100°C without washing with water. The thickness of the polysiloxane film is 40 mg/6m2. The total thickness of the film after the silane treatment was 39 mg/dm''. The rough surface of the obtained copper foil was placed on an epoxy resin substrate prepreg and heated and pressed in a conventional manner to obtain a copper-clad laminate. Table 1 shows the results of measuring the peel strength of the laminate before and after heating it at 177°C for 10 days.
実施例２
シランカップリング剤１として、γ−グリシドオキシフ
”ロビルトリメトキシシランＬｏｇ／ｆ２水ン容液を使
用した以外は、実施例１と同様に処理して銅張り積層板
を得た。このシランカップリング処理後の膜の合計厚み
は４０ｍｇ／ｄｍ２であった。その加熱前後の剥離強度
を表１に示す。Example 2 A copper-clad laminate was obtained in the same manner as in Example 1, except that γ-glycidoxyphrobyltrimethoxysilane Log/f2 water solution was used as the silane coupling agent 1. The total thickness of the film after the silane coupling treatment was 40 mg/dm2.Table 1 shows the peel strength before and after heating.
実施例３
銀箔として、予め粗面化し、粗面に銅７０、亜鉛３０の
黄銅を２０ ｍｇ／ ｄｍ”の厚みにめっきしたものを
使用した以外は、実施例２と同様に処理し、得られた銅
張り積層板の加熱前後の剥離強度を表１に示す。Example 3 A silver foil was processed in the same manner as in Example 2, except that a silver foil whose surface had been roughened in advance and whose rough surface was plated with brass of 70% copper and 30% zinc to a thickness of 20 mg/dm'' was used. Table 1 shows the peel strength of the copper-clad laminate before and after heating.
実施例４゜
実施例１と同様にして、２５０Ｊ／９．の水溶液でポリ
シロキサン処理のみを行った銅箔を銅張り積層板とし、
その加熱前後の剥離強度を表１に示す。Example 4゜Same as Example 1, 250J/9. A copper-clad laminate is made of copper foil treated only with polysiloxane using an aqueous solution of
Table 1 shows the peel strength before and after heating.
実施例５゜
ポリシロキサン水溶液の濃度を５０ｄ／ｆｆにした以外
は実施例４と同様にして、ポリシロキサン処理のみを行
った銅箔を銅張り積層板とし、その加熱前後の剥離強度
を表１に示した。Example 5 The copper foil treated with polysiloxane only was made into a copper-clad laminate in the same manner as in Example 4 except that the concentration of the polysiloxane aqueous solution was 50 d/ff, and the peel strength before and after heating is shown in Table 1. It was shown to.
実施例６゜
実施例１と同様にして、ポリシロキサン処理した後、Ｃ
ｒＯ２０，４ｇ／（ｌ水溶液に常温で１０秒間浸漬した
。１００″Ｃの熱風で乾燥し、得られた銅箔を実施例１
と同様にして銅張り積層板を得た。その加熱前後の剥離
強度を表１に示す。Example 6 After polysiloxane treatment in the same manner as in Example 1, C
Example 1 The copper foil obtained was immersed in rO20.4g/(l aqueous solution for 10 seconds at room temperature. It was dried with hot air at 100"C.
A copper-clad laminate was obtained in the same manner as above. Table 1 shows the peel strength before and after heating.
実施例７゜
Ｃｒｙ３水溶液の濃度をｌ ｇ／ｆ２とした以外は、実
施例６と同様に処理し、得られた銅張り積層板の加熱前
後の剥離強度を表１に示す。Example 7 The process was carried out in the same manner as in Example 6, except that the concentration of the Cry3 aqueous solution was changed to 1 g/f2. Table 1 shows the peel strength before and after heating of the obtained copper-clad laminate.
比較例
上記各実施例に用いた処理前の銅箔（比較例１）、黄銅
めっきをした処理前の銅箔（比較例２）、実施例１のポ
リシロキサン処理を省いた銅箔（比較例３）、について
銅張り積層板を得、その加熱前後の剥離強度を表１に併
記した。Comparative Examples Copper foil before treatment used in each of the above examples (Comparative Example 1), brass-plated copper foil before treatment (Comparative Example 2), copper foil without the polysiloxane treatment of Example 1 (Comparative Example 3), copper-clad laminates were obtained, and the peel strengths before and after heating are also listed in Table 1.
試験法：試料銅箔中１ｍｍのものについて、１７７°Ｃ
・１０日間加熱前後の剥離強度なＪＩＳＣ−６４８１に
準拠して測定した。Test method: 1mm copper foil sample at 177°C
- Peel strength before and after heating for 10 days was measured according to JISC-6481.
表 １
（発明の効果）
上記の試験結果から明らかなように、本発明の印刷回路
用銅箔は、加熱後の剥離強度が特に優れていることがわ
かる。本発明のポリシロキサン膜は銅箔面と良く密着し
、かつ銅箔と樹脂基板との高温における反応のバーリヤ
として優れた効果を発揮し、一方シラン膜及びクロメー
ト膜で被覆したもの（実施例１．２．３．６．７）は、
上記ポリシロキサン膜と樹脂基板との密着性を改善して
いる。Table 1 (Effects of the Invention) As is clear from the above test results, it can be seen that the copper foil for printed circuits of the present invention has particularly excellent peel strength after heating. The polysiloxane film of the present invention adheres well to the copper foil surface and exhibits an excellent effect as a barrier to the reaction between the copper foil and the resin substrate at high temperatures. .2.3.6.7) is
The adhesion between the polysiloxane film and the resin substrate is improved.
Claims (3)
されていることを特徴とする印刷回路用銅箔。1. A copper foil for printed circuits, characterized in that a surface of the copper foil to be bonded to a substrate is coated with a polysiloxane film.
ロメート膜で被覆されていることを特徴とする印刷回路
用銅箔。2. A copper foil for printed circuits, characterized in that the polysiloxane film according to claim 1 is coated with a silane film or a chromate film.
用銅張り積層板。3. A copper-clad laminate for printed circuits comprising the copper foil of claim 1 or 2 laminated to a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12793289A JPH02307294A (en) | 1989-05-23 | 1989-05-23 | Copper foil for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12793289A JPH02307294A (en) | 1989-05-23 | 1989-05-23 | Copper foil for printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02307294A true JPH02307294A (en) | 1990-12-20 |
Family
ID=14972205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12793289A Pending JPH02307294A (en) | 1989-05-23 | 1989-05-23 | Copper foil for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02307294A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07147482A (en) * | 1993-11-24 | 1995-06-06 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| US5622782A (en) * | 1993-04-27 | 1997-04-22 | Gould Inc. | Foil with adhesion promoting layer derived from silane mixture |
| JPH11262975A (en) * | 1998-03-17 | 1999-09-28 | Hitachi Chem Co Ltd | Production of copper-clad laminated sheet and printed wiring board and multilayered printed wiring board using the same |
| JP2008044377A (en) * | 2007-09-25 | 2008-02-28 | Hitachi Chem Co Ltd | Copper foil for printed wiring board |
| JP2008111188A (en) * | 2007-09-25 | 2008-05-15 | Hitachi Chem Co Ltd | Copper foil for printed circuit board |
| US7651783B2 (en) | 2001-10-30 | 2010-01-26 | Nikko Materials Co., Ltd. | Surface treated copper film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621269A (en) * | 1979-07-30 | 1981-02-27 | Fujitsu Ltd | Pari-mutuel ticket issuing unit |
| JPS5821893A (en) * | 1981-07-31 | 1983-02-08 | 住友ベークライト株式会社 | Method of producing flexible printed circuit board |
| JPS6015654A (en) * | 1983-07-08 | 1985-01-26 | Fuji Xerox Co Ltd | Developing device for electrophotographic copying machine |
-
1989
- 1989-05-23 JP JP12793289A patent/JPH02307294A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5621269A (en) * | 1979-07-30 | 1981-02-27 | Fujitsu Ltd | Pari-mutuel ticket issuing unit |
| JPS5821893A (en) * | 1981-07-31 | 1983-02-08 | 住友ベークライト株式会社 | Method of producing flexible printed circuit board |
| JPS6015654A (en) * | 1983-07-08 | 1985-01-26 | Fuji Xerox Co Ltd | Developing device for electrophotographic copying machine |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5622782A (en) * | 1993-04-27 | 1997-04-22 | Gould Inc. | Foil with adhesion promoting layer derived from silane mixture |
| JPH07147482A (en) * | 1993-11-24 | 1995-06-06 | Matsushita Electric Works Ltd | Manufacture of multilayer printed wiring board |
| JPH11262975A (en) * | 1998-03-17 | 1999-09-28 | Hitachi Chem Co Ltd | Production of copper-clad laminated sheet and printed wiring board and multilayered printed wiring board using the same |
| JP4572423B2 (en) * | 1998-03-17 | 2010-11-04 | 日立化成工業株式会社 | Method for producing copper-clad laminate, printed wiring board using the same, and multilayer printed wiring board |
| US7651783B2 (en) | 2001-10-30 | 2010-01-26 | Nikko Materials Co., Ltd. | Surface treated copper film |
| JP2008044377A (en) * | 2007-09-25 | 2008-02-28 | Hitachi Chem Co Ltd | Copper foil for printed wiring board |
| JP2008111188A (en) * | 2007-09-25 | 2008-05-15 | Hitachi Chem Co Ltd | Copper foil for printed circuit board |
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