JPH0217950B2 - - Google Patents
Info
- Publication number
- JPH0217950B2 JPH0217950B2 JP18107281A JP18107281A JPH0217950B2 JP H0217950 B2 JPH0217950 B2 JP H0217950B2 JP 18107281 A JP18107281 A JP 18107281A JP 18107281 A JP18107281 A JP 18107281A JP H0217950 B2 JPH0217950 B2 JP H0217950B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- copper foil
- base material
- hydrochloric acid
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000011889 copper foil Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 23
- 239000003795 chemical substances by application Substances 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 150000004982 aromatic amines Chemical class 0.000 claims description 9
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 7
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims description 2
- 239000000243 solution Substances 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical group NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- 125000006267 biphenyl group Chemical group 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- ULRCHFVDUCOKTE-UHFFFAOYSA-N 3-[3-aminopropyl(diethoxy)silyl]oxybutan-1-amine Chemical compound NCCC[Si](OCC)(OCC)OC(C)CCN ULRCHFVDUCOKTE-UHFFFAOYSA-N 0.000 description 1
- XFZVQMVEKCAHDA-UHFFFAOYSA-N 3-phenylsulfanylbenzene-1,2-diamine Chemical compound NC1=CC=CC(SC=2C=CC=CC=2)=C1N XFZVQMVEKCAHDA-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 sulfane and 3 Chemical class 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
この発明は、芳香族アミン類を硬化剤に用いる
耐熱性エポキシ樹脂基材と銅箔とを積層してなる
耐塩酸性銅張積層板に関するものである。
さて、ガラスエポキシ樹脂基材と銅箔とからの
積層板の特性は、該基材と使用する硬化剤との組
合わせを変えることにより各種特性の積層板が得
られることは周知である。そして、耐熱性の要求
されない汎用材料の製造には、硬化剤としてジシ
アン・ジアミド（DICY）、硬化促進剤としては
ベンジル・ジメチルアミン（BDMA）、溶剤とし
てメチルオキシドール、メチルセロソルブなどを
配合したものが使われ、一方、耐熱性積層板を得
るには、ハロゲンを導入したハロゲン化ビスフエ
ニール系基材などが使われ、硬化剤としてはメタ
フエニレンジアミン（MPD）、ジアミノ・ジフエ
ニルメタン（DDM）、ジアミノ・ジフエニル・
スルフアン（DDS）、３，3′−ジクロル・ジアミ
ノ・ジフエニルメタンといつた一連の芳香族系ア
ミン類が使われている。さて上記エポキシ樹脂基
材に銅箔を接着させた銅張積層板を印刷回路に使
用するに当つては、基材に対する銅箔の密着性、
半田耐熱性、耐シアン性、耐塩酸性などの諸特性
が要求される。
ところでエポキシ樹脂基材を用い耐熱性銅張積
層板を製造するには、上記のように基材の硬化剤
として芳香族アミン類がしばしば使われている
が、これら硬化剤を用いた積層板の欠点は、その
耐塩酸性が著しく劣るということである。
１例を示すと、ジシアミン・ジアミドを硬化剤
にベンジル・ジメチルアミン、溶剤としてメチル
セロソルブを用いたガラスエポキシ樹脂基材と銅
箔粗面とを積層させた汎用銅張積層板の耐塩酸性
（回路巾0.8mmの試片を試薬塩酸：水＝１：１の中
に常温で１時間浸漬後、その剥離強度を測定し、
これを劣化率で表示したもの）は３〜５％であ
り、また耐熱性臭素化エポキシ樹脂基材にジアミ
ノ・ジフエニルスルフアンを硬化剤とし、三フツ
化ホウ素モノエチルアミンを促進剤に、メチルエ
チルケトンを溶剤として得た銅張積層板に対し上
記と同様にして求めた耐塩酸性は30％またはそれ
以上と大きいため、回路を緻密として小型化する
場合には、耐熱性エポキシ樹脂基材の適用は、著
しく制約されることになる。
この発明は、芳香族アミン類を硬化剤とする耐
熱性エポキシ樹脂基材と銅箔粗面または該面に公
知のクロメート処理した銅箔とから耐塩酸性の良
好な銅張積層板を提供できるようなしたものであ
る。
さて本発明者等は、すでに銅箔の粗面または公
知のクロメート処理を施した該粗面を、一般式
YRSiX3（ここにＹは高分子物と反応する官能基、
ＲはＹとケイ素原子とを連結する鎖状または環状
炭化水素を含む結合基、Ｘはケイ素原子に結合す
る有機または無機の加水分解性基を表わす。）で
示される公知のシランカツプリング剤ののいずれ
かの水溶液で処理後、これを樹脂基材と接着させ
れば、銅箔と基材とを強固に接着できるこことを
発明し、特願昭55−162367（特公昭60−15654号）
号として出願しているが、前記したように芳香族
アミン類を硬化剤とする耐熱性エポキシ樹脂基材
に、通常の粗化銅箔を接着させた場合の銅張積層
板の耐塩酸性の劣る原因は、或いは該基材と銅箔
との接着力が劣ることに基因しているのではない
かと考え、予じめ銅箔粗面または公知のクロメー
ト処理を施した該粗面を、前記いずれかのシラン
カツプリング剤で処理し、これを該基材とを接着
させてみた。すなわち銅箔粗面または該面に公知
のクロメート処理を施した銅箔を、各種シランカ
ツプリング剤水溶液で処理し、これを芳香族アミ
ン類を硬化剤として用いる耐熱性エポキシ樹脂基
材と接着させて多数の銅張積層板試片を作り、そ
の耐塩酸性を測定してみた。その結果、予想した
通り、γ−アミノプロピルトリエトキシシラン、
Ｎ−β−（アミノエチル）−γ−アミノプロピルト
リメトキシシラン、γ−グリコシドオキシプロピ
ル・メトキシシラン、β−（３，４エポキシシク
ロヘキシル）エチルトリメトキシシラン、ビニル
ートリス（β−メトキシ・エトキシ）シランなど
の公知のシランカツプリング剤で処理した銅箔を
使用すれば銅張積層板自体の耐塩酸性を顕著に向
上することを多数の実験により確認し得た。本発
明は上記実験に基いて、ここに完成をみたもので
ある。
さらに本発明の説明を続けると、本発明に使用
するシランカツプリング剤による処理は、銅箔粗
面または公知のクロメート処理を施した該粗面
を、該薬剤の液中に浸漬するか、またはスプレー
処理するか或いはローラーコーテイングするなど
の方法で薄膜を形成するだけでよく、簡単なのは
浸漬処理である。また本発明においては、使用す
る薬品の濃度を限定する必要はなく0.01〜１％の
液を用い、室温で短時間処理後、銅箔を乾燥させ
るだけで良い。また耐熱性エポキシ樹脂基材の硬
化剤としてはメタフエニレンジアミン、ジアミ
ノ・ジフエニルメタン、ジアミノ・ジフエニル・
スルフアン、３，3′−ジクロルジアミノ・ジフエ
ニルメタンなどの公知の芳香族アミン類を使用す
るものに適用することができる。
以下、本発明を実施例により、さらに具体的に
説明する。
実施例
銅箔試料として、
(A) 製箔ロールから剥離した銅箔の粗面を、公知
の硫酸銅浴で電解粗化した厚み32μの銅箔。
(B) 製箔ロールから剥離した銅箔の粗面に、公知
の方法でクロメート処理した厚み32μの銅箔の
２種類を使用し、試料(A)についてはＮ−β−
（アミノエチル）−γ−アミノプロピルトリエト
キシシランの濃度0.05％と0.1％の２種類の溶
液を用い、また試料(B)については、γ−アミノ
プロピル・トリエトキシシランの0.05％と0.1
％の溶液を用い、いずれの場合も、銅箔をその
溶液中に室温で１分間浸漬し、引上げて一旦室
温で乾燥し、さらに110〜120℃に保持した乾燥
機を用い、３分間乾燥を行つた。つぎに、この
ように処理した各銅箔の粗面側を、硬化剤とし
て３，3′−ジクロルアミノ・ジフエニルメタン
を使用するガラス・臭素化エポキシ樹脂基材と
重ね155℃、圧力100Kg／cm2、30分間の成形条件
を採用して250mm×250mm×２mmの銅張積層板を
試作した。
ついで該積層板の剥離強度、耐塩酸性（回路
巾0.8mmの銅張積層板試片を試薬塩酸：水＝
１：１中に常温で１時間浸漬後の剥離強度を求
め、これを劣化率で示したもの）および耐シア
ン劣化率（回路巾3.2mmの銅張積層板試片を、
10％のKCN水溶液中において70℃で30分間浸
漬したものの剥離強度を求め、それを劣化率で
示したものである。）を求め、別にブランク箔
からの試作銅張積層板についても上記と同様の
試験を行つてみた。結果は下表に示す通りであ
る。
The present invention relates to a hydrochloric acid-resistant copper-clad laminate formed by laminating a heat-resistant epoxy resin base material using aromatic amines as a curing agent and copper foil. Now, it is well known that the characteristics of a laminate made of a glass epoxy resin base material and copper foil can be obtained by changing the combination of the base material and the curing agent used. For the production of general-purpose materials that do not require heat resistance, products containing dicyan diamide (DICY) as a curing agent, benzyl dimethylamine (BDMA) as a curing accelerator, and methyl oxide or methyl cellosolve as a solvent are used. On the other hand, to obtain a heat-resistant laminate, a halogenated bisphenylic base material containing a halogen is used, and the curing agent is metaphenylene diamine (MPD), diamino diphenylmethane (DDM), diamino diphenyl methane, etc. Diphenyl
A series of aromatic amines have been used, including sulfane (DDS) and 3,3'-dichloro diamino diphenylmethane. Now, when using a copper-clad laminate in which copper foil is bonded to the epoxy resin base material for printed circuits, the adhesion of the copper foil to the base material,
Various properties such as soldering heat resistance, cyanide resistance, and hydrochloric acid resistance are required. By the way, in the production of heat-resistant copper-clad laminates using epoxy resin base materials, aromatic amines are often used as hardening agents for the base material, as described above. The disadvantage is that its resistance to hydrochloric acid is significantly poor. One example is the hydrochloric acid resistance (circuit A specimen with a width of 0.8 mm was immersed in a reagent hydrochloric acid: water = 1:1 for 1 hour at room temperature, and its peel strength was measured.
The deterioration rate (expressed as a deterioration rate) is 3 to 5%, and methyl ethyl ketone is The hydrochloric acid resistance obtained in the same manner as above for a copper-clad laminate obtained using a solvent is as high as 30% or more. Therefore, if the circuit is to be made denser and more compact, it is not recommended to use a heat-resistant epoxy resin base material. , will be severely restricted. The present invention makes it possible to provide a copper-clad laminate with good hydrochloric acid resistance from a heat-resistant epoxy resin base material using aromatic amines as a curing agent and a rough copper foil surface or a copper foil treated with known chromate on the surface. This is what was done. Now, the present inventors have already applied the general formula
YRSiX 3 (where Y is a functional group that reacts with a polymer,
R represents a bonding group containing a chain or cyclic hydrocarbon that connects Y and a silicon atom, and X represents an organic or inorganic hydrolyzable group bonded to the silicon atom. ) has invented a method that can firmly bond copper foil and a base material by adhering it to a resin base material after treatment with an aqueous solution of one of the known silane coupling agents shown in 1984-162367 (Special Publication No. 15654, 1983)
However, as mentioned above, when ordinary roughened copper foil is adhered to a heat-resistant epoxy resin base material using aromatic amines as a curing agent, the hydrochloric acid resistance of copper-clad laminates is poor. We suspect that the cause may be due to poor adhesion between the base material and the copper foil, and we tested the rough surface of the copper foil or the rough surface that had been previously subjected to a known chromate treatment. I treated it with the silane coupling agent and tried adhering it to the base material. That is, a copper foil rough surface or a copper foil whose surface has been subjected to a known chromate treatment is treated with an aqueous solution of various silane coupling agents, and this is bonded to a heat-resistant epoxy resin base material using an aromatic amine as a hardening agent. We made a large number of copper-clad laminate specimens and measured their hydrochloric acid resistance. As expected, γ-aminopropyltriethoxysilane,
N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, γ-glycosideoxypropyl methoxysilane, β-(3,4 epoxycyclohexyl)ethyltrimethoxysilane, vinyl lutris(β-methoxy ethoxy)silane, etc. It has been confirmed through numerous experiments that the hydrochloric acid resistance of the copper-clad laminate itself can be significantly improved by using copper foil treated with a known silane coupling agent. The present invention has now been completed based on the above experiments. To further explain the present invention, the treatment with the silane coupling agent used in the present invention can be carried out by immersing the rough surface of the copper foil or the rough surface that has been subjected to known chromate treatment in a solution of the agent, or It is sufficient to form a thin film by spraying or roller coating, and a simple method is dipping. Further, in the present invention, there is no need to limit the concentration of the chemicals used, and it is sufficient to use a solution of 0.01 to 1% and simply dry the copper foil after a short treatment at room temperature. In addition, as curing agents for heat-resistant epoxy resin base materials, metaphenylene diamine, diamino diphenylmethane, diamino diphenyl
It can be applied to those using known aromatic amines such as sulfane and 3,3'-dichlorodiamino diphenylmethane. EXAMPLES Hereinafter, the present invention will be explained in more detail with reference to Examples. Examples As a copper foil sample, (A) A copper foil with a thickness of 32 μm obtained by electrolytically roughening the rough surface of a copper foil peeled off from a foil-making roll in a known copper sulfate bath. (B) Two types of copper foils with a thickness of 32μ treated with chromate using a known method were used on the rough surface of the copper foil peeled off from the foil roll, and for sample (A), N-β-
Two types of solutions with concentrations of (aminoethyl)-γ-aminopropyltriethoxysilane of 0.05% and 0.1% were used, and for sample (B), γ-aminopropyltriethoxysilane of 0.05% and 0.1% was used.
% solution, and in each case, the copper foil was immersed in the solution for 1 minute at room temperature, pulled out and dried at room temperature, and then dried for 3 minutes using a dryer maintained at 110 to 120 °C. I went. Next, the rough side of each copper foil treated in this way was layered with a glass/brominated epoxy resin base material using 3,3'-dichloroamino diphenylmethane as a hardening agent at 155°C and a pressure of 100Kg/cm 2 . A 250 mm x 250 mm x 2 mm copper-clad laminate was prototyped using a 30-minute molding condition. Next, the peel strength and hydrochloric acid resistance of the laminate (a copper-clad laminate sample with a circuit width of 0.8 mm was tested with the reagent hydrochloric acid: water =
1:1, the peel strength was determined after immersion at room temperature for 1 hour, and this was expressed as the deterioration rate) and the cyanide deterioration resistance (a copper-clad laminate specimen with a circuit width of 3.2 mm was measured.
The peel strength of a sample immersed in a 10% KCN aqueous solution at 70°C for 30 minutes is determined and expressed as a deterioration rate. ), and conducted the same tests as above on a prototype copper-clad laminate made from blank foil. The results are shown in the table below.
【表】
表から銅箔の粗面またはクロメート処理した
該銅箔粗面を本発明のシランカツプリング剤溶
液で処理後、芳香族アミン類を硬化剤に用いる
ガラスエポキシ樹脂基材と接着した銅張積層板
は、その耐塩酸性について優れた効果を示し、
この種耐熱性エポキシ樹脂基材の適用範囲を著
しく拡げ得ることは明白である。
なお、表記しなかつたが、通常のガラス・エポ
キシ樹脂基材に、ジアミノジフエニル・スルフア
ンを硬化剤として銅箔粗面と接合しても、銅張積
層板としての耐塩酸性を向上することを知り得
た。[Table] From the table, after treating the rough surface of copper foil or the rough surface of the chromate-treated copper foil with the silane coupling agent solution of the present invention, copper bonded to a glass epoxy resin base material using aromatic amines as a hardening agent. Tensioned laminates exhibit excellent hydrochloric acid resistance,
It is clear that the range of applications of this type of heat-resistant epoxy resin base material can be significantly expanded. Although not stated, it has been shown that even when bonded to a rough surface of copper foil using diaminodiphenyl sulfan as a hardening agent on a regular glass epoxy resin base material, the hydrochloric acid resistance of the copper-clad laminate can be improved. I got to know.
Claims (1)
キシ樹脂基材面に、予じめその粗面または公知の
クロメート処理した該粗面に、一般式YRSiX3
（ここにＹは高分子物と反応する官能基、ＲはＹ
とケイ素原子とを連結する鎖状または環状の炭化
水素を含む結合基、またＸはケイ素原子に結合す
る有機または無機の加水分解性基を表わすもので
ある。）で示される公知のシランカツプリング剤
の薄膜を形成させた銅箔層を設けたことを特徴と
する耐塩酸性銅張積層板。1. On the surface of a heat-resistant epoxy resin base material using aromatic amines as a curing agent, the general formula YRSiX 3 is applied to the rough surface or the rough surface that has been subjected to known chromate treatment in advance.
(Here, Y is a functional group that reacts with a polymer, R is Y
and a silicon atom, and X represents an organic or inorganic hydrolyzable group bonded to the silicon atom. ) A hydrochloric acid-resistant copper-clad laminate comprising a copper foil layer formed with a thin film of a known silane coupling agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18107281A JPS5884488A (en) | 1981-11-13 | 1981-11-13 | Copper-coated laminated board for printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18107281A JPS5884488A (en) | 1981-11-13 | 1981-11-13 | Copper-coated laminated board for printed circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5884488A JPS5884488A (en) | 1983-05-20 |
| JPH0217950B2 true JPH0217950B2 (en) | 1990-04-24 |
Family
ID=16094305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18107281A Granted JPS5884488A (en) | 1981-11-13 | 1981-11-13 | Copper-coated laminated board for printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5884488A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61144339A (en) * | 1984-12-19 | 1986-07-02 | 日立化成工業株式会社 | Manufacture of metallic core epoxy-resin copper lined laminated board |
| JPS6392090A (en) * | 1986-10-06 | 1988-04-22 | 三井金属鉱業株式会社 | Manufacture of multilayer circuit board |
| JP4572423B2 (en) * | 1998-03-17 | 2010-11-04 | 日立化成工業株式会社 | Method for producing copper-clad laminate, printed wiring board using the same, and multilayer printed wiring board |
| JP4924326B2 (en) * | 2007-09-25 | 2012-04-25 | 日立化成工業株式会社 | Copper foil for printed wiring boards |
| JP2008111188A (en) * | 2007-09-25 | 2008-05-15 | Hitachi Chem Co Ltd | Copper foil for printed circuit board |
-
1981
- 1981-11-13 JP JP18107281A patent/JPS5884488A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5884488A (en) | 1983-05-20 |
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