JPS61144339A - Manufacture of metallic core epoxy-resin copper lined laminated board - Google Patents
Manufacture of metallic core epoxy-resin copper lined laminated boardInfo
- Publication number
- JPS61144339A JPS61144339A JP59267749A JP26774984A JPS61144339A JP S61144339 A JPS61144339 A JP S61144339A JP 59267749 A JP59267749 A JP 59267749A JP 26774984 A JP26774984 A JP 26774984A JP S61144339 A JPS61144339 A JP S61144339A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- plate
- copper
- metal core
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、プリント配線板、ノ九イブリッドＩＣ基板、
ＬＳＩ実装用基板に用いら几るｌ放熱性の良好な金属コ
アエポキシ樹脂銅張積層板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to printed wiring boards, hybrid IC boards,
The present invention relates to a metal core epoxy resin copper-clad laminate with good heat dissipation properties that is used for LSI mounting substrates.
従来、アルミニウム板、アルマイト板、鋼板等の金属コ
アの上にエポキシ樹脂、ガラス布基材エポキシ樹脂プリ
プレグ、ポリイミド樹脂、ガラス布基材ポリイミド樹脂
プリプレグ、両面接着剤付ポリイミドフィルム等の絶縁
樹脂層を介して鋼箔を接着させることにより金網コア銅
張積層板が製造されている。Conventionally, an insulating resin layer such as epoxy resin, glass cloth-based epoxy resin prepreg, polyimide resin, glass cloth-based polyimide resin prepreg, polyimide film with double-sided adhesive is applied on a metal core such as an aluminum plate, anodized plate, or steel plate. Wire mesh core copper clad laminates are manufactured by bonding steel foil through the wire.
金属コアと絶縁層の接着力を向上させるため、梗々の検
討がなさｎている。例えば、’ｌｉ”４公社電気通信研
究所研究笑用化報告Ｖｏ１．１８ Ｎｏ １２（１９６
９）にはアルミニウム板な機械的研摩後、クロム酸系処
理を施すことにエリ、アルミニウム表面と＃！！縁樹脂
層との接着力を高めることが記載さｎている。又実公昭
４５−２５８２６においてはアルミニウム板をアルマイ
ト処理する方法が提案さｎ、％公昭５５−１２７５４に
おいてはアルミニウム板をアルカリでエツチングあるい
は銅板を酢酸系処理する方法が提案され、特公昭５６−
１７２２７においては金属板を機械的粗化する方法が提
案さｎて（・る。Many efforts have been made to improve the adhesive strength between the metal core and the insulating layer. For example, 'li'4 Public Corporation Telecommunications Research Institute Research Application Report Vol. 1.18 No. 12 (196
9) After mechanical polishing of the aluminum plate, chromic acid treatment is applied to improve the aluminum surface. ! It is described that the adhesive force with the edge resin layer is increased. In addition, Japanese Utility Model Publication No. 45-25826 proposed a method of alumite treatment of aluminum plates, and Japanese Utility Model Publication No. 55-12754 proposed a method of etching aluminum plates with alkali or treating copper plates with acetic acid.
No. 17227 proposed a method for mechanically roughening a metal plate.
こｎらの金属コアエポキシ樹脂銅張積層板には、種々の
処理を施した後の耐熱特性が要求さｎでいる。例えば、
吸湿処理後の半田耐熱性等である。前述の金属板の処理
のみでは、常態での金属板とエポキシ樹脂との接着力は
良好であるが、苛酷な吸湿処理後の半田耐熱性試験では
、金属とエポキシ樹脂との間に剥離を生じる場合がある
。These metal core epoxy resin copper clad laminates are required to have heat resistance properties after being subjected to various treatments. for example,
These include soldering heat resistance after moisture absorption treatment. When the metal plate is treated as described above, the adhesion between the metal plate and the epoxy resin is good under normal conditions, but in the solder heat resistance test after the severe moisture absorption treatment, separation occurs between the metal and the epoxy resin. There are cases.
本発明者らは絶縁層としてエポキシ樹脂層を用い九場合
、吸湿処理後の半田耐熱性試験において、金属板とエポ
キシ樹脂との間に剥離が生じない様に、接澹トカを向上
させることを目的とし、金属板の表面処理を種々検討し
５本発明にいたった。When using an epoxy resin layer as an insulating layer, the present inventors aimed to improve the contact strength so that no peeling occurs between the metal plate and the epoxy resin in the solder heat resistance test after moisture absorption treatment. For this purpose, various surface treatments of metal plates were studied and the present invention was developed.
本発明の金属コアエポキシ樹脂銅張積層板の製造方法は
金属板を機械的に研摩した後、アミノ系シランカップリ
ング剤溶液を塗布し、溶剤を乾燥処理後、その処理面の
上にエポキシ樹脂層な介して鋼箔ＶＸね、加熱加圧硬化
することを特徴とするものである。The method for producing a metal core epoxy resin copper-clad laminate of the present invention is to mechanically polish a metal plate, apply an amino-based silane coupling agent solution, dry the solvent, and then apply epoxy resin on the treated surface. The steel foil VX is characterized by being hardened under heat and pressure through the layers.
次に本発明について更に具体的に説明する。Next, the present invention will be explained in more detail.
本発明において使用する金属板としＣは、アルミニウム
板、アルマイト２：！ｉ、銅板、ケイ素鋼板、亜鉛鋼板
、鉄ニツケル４２１０イ板、アンバー板又はこれらの金
属板同志を貼り合わせたクラツド板等がらり、放熱性、
易加工性の点で優ｎているアルミニウム板が好ましい。The metal plate C used in the present invention is an aluminum plate, alumite 2:! i. Copper plates, silicon steel plates, zinc steel plates, iron-nickel 4210 plates, amber plates, or clad plates made by laminating these metal plates together, etc., heat dissipation,
An aluminum plate is preferred because it is easy to work with.
金属板を機械的に研摩する方法としては、研摩紙、研摩
布等によるテンディング、ブラシ研＊、ボール研摩、サ
ンドブラスト、液体ホーニング、ショツトブラスト等の
方法がある。Methods for mechanically polishing a metal plate include methods such as tending with abrasive paper, abrasive cloth, etc., brush polishing*, ball polishing, sandblasting, liquid honing, and shot blasting.
この様な方法で金属板の接着表面を機械的に粗化した後
、残っている研摩削粉、金属粉を元号に洗浄する。After mechanically roughening the adhesion surface of the metal plate in this manner, the remaining abrasive powder and metal powder are thoroughly cleaned.
本発明において使用するアミノ系シランカップリング剤
としてはγ−アミノプロピルトリエトキシシラン、γ−
アミノプロピルトリメトキシシラン、Ｎ−β（アミノエ
チル）γ−アミツブＯピルトリメトキシシラン、Ｎ−β
（アミノエチル）γ−アミノプロピルメチルジメトキシ
シラン、ｐ−アミノフェニルトリメトキシシラン、Ｎ−
フェニル−γ−アミノプロピルトリメトΦジシラン等が
ある。好ましくハ、γ−アミノプロピルトリエトキシシ
ランである。The amino-based silane coupling agents used in the present invention include γ-aminopropyltriethoxysilane, γ-
Aminopropyltrimethoxysilane, N-β (aminoethyl)γ-amitube O-pyltrimethoxysilane, N-β
(aminoethyl)γ-aminopropylmethyldimethoxysilane, p-aminophenyltrimethoxysilane, N-
Examples include phenyl-γ-aminopropyltrimethΦdisilane. Preferred is γ-aminopropyltriethoxysilane.
こｎらのアミノ系シランカップリング剤を。These amino-based silane coupling agents.
その濃度が００１から５．０重′に％、好ましくはα１
から１．０重量％になる様に、水、メタノール、エタノ
ール、トルエン、キシレン等の単独、あるいは混合溶剤
中に溶かし、その溶液を前述の研摩された金属板に塗布
する。塗布法としてはスプレー［よる塗布、浸漬による
塗布等が用いらｎる。その後、溶剤を加熱乾燥除去する
。Its concentration is from 001 to 5.0% by weight, preferably α1
to 1.0% by weight in a single or mixed solvent such as water, methanol, ethanol, toluene, xylene, etc., and the solution is applied to the polished metal plate described above. As the coating method, spray coating, dipping coating, etc. are used. Thereafter, the solvent is removed by heating and drying.
この時の温度は５０℃から２５０℃の範囲が好ましく、
更に好ましくは８０℃から２００℃である。又、減圧に
することにより、常温める７（・は常温に近い温度で溶
剤な乾燥することも可能である。The temperature at this time is preferably in the range of 50°C to 250°C,
More preferably, the temperature is from 80°C to 200°C. In addition, by applying reduced pressure, it is also possible to dry the product using a solvent at a temperature close to room temperature.
本発明に用いらｎるエポキシ樹脂は１分子あたり平均で
２個以上のエポキシ基な有していｎば工く、特に制限は
ないが、例えば、ビスフェノールへのジグリシジルエー
テル型エポキシ樹脂、ブタジェンジェポキシサイド、４
．４’−ジ（１，２−エポキシエチル）ジフェニルエー
テル、４．４′−ジ（エポキシエチル）ジフェニル、レ
ゾルシンのジグリシジルエーテル、フロログリシンのジ
グリシジルエーテル、ｐ−アミノフェノールのトリグリ
シジルエーテル、１．４５−）す（１，２−エポキシエ
チル）ベンゼン、２．２’４．４’−テトラグリシドキ
シベンゾフェノン、テトラグリシドキシテトラフェニル
エタン、フェノールノボラックのポリグリシジルエーテ
ル、トリ′メチロールプロパンのトリグリシジルエーテ
ル、クレゾールノボラックのポリグリシジルエーテル、
グリセリンのトリグリシジルエーテル、ノ１０ゲン化ビ
スフェノールへのジグリシジルエーテル型エポキシ樹脂
、ハロゲン化フェノールノボラックのポリグリシジルエ
ーテル、トリグリシジルイソシアヌレート、ビニルシク
ロヘキセンジオキサイド、瓜４−エポキシシクロヘキシ
ルメチル−４４−エポキシシクロヘキサンカルボキシレ
ート等の脂環式エポキシ樹脂、ヒダントインエポキシ樹
脂等がある。The epoxy resin used in the present invention has an average of two or more epoxy groups per molecule, and is not particularly limited. For example, diglycidyl ether type epoxy resin for bisphenol, butadiene Jepoxyside, 4
．． 4'-di(1,2-epoxyethyl)diphenyl ether, 4.4'-di(epoxyethyl)diphenyl, diglycidyl ether of resorcinol, diglycidyl ether of phloroglycin, triglycidyl ether of p-aminophenol, 1. 45-) Su(1,2-epoxyethyl)benzene, 2.2'4.4'-tetraglycidoxybenzophenone, tetraglycidoxytetraphenylethane, polyglycidyl ether of phenol novolac, tri'methylolpropane Glycidyl ether, polyglycidyl ether of cresol novolak,
Triglycidyl ether of glycerin, diglycidyl ether type epoxy resin to 10-genated bisphenol, polyglycidyl ether of halogenated phenol novolac, triglycidyl isocyanurate, vinyl cyclohexene dioxide, melon 4-epoxycyclohexylmethyl-44-epoxycyclohexane Examples include alicyclic epoxy resins such as carboxylates, hydantoin epoxy resins, and the like.
とｎらのエポキシ便脂は、コＩ常、硬化剤、硬化促進剤
等を配合り、たエポキシ樹脂組成物の形テ用いらｎ１溶
剤ｒコ溶かしても無溶剤系で使用してもよい。硬化剤と
しては、アミン系硬化剤、酸無水物系硬化剤、フェノー
ル系硬化剤、ポリアミド相脂硬化剤、イミダゾール系硬
化剤等が用いうｎ、、特にジシアンジアミドが好ｌしい
。The epoxy stool oil of et al. is usually formulated with a curing agent, a curing accelerator, etc., and can be used in the form of an epoxy resin composition, either dissolved in a solvent or in a solvent-free system. . As the curing agent, amine curing agents, acid anhydride curing agents, phenol curing agents, polyamide phase resin curing agents, imidazole curing agents, etc. are used, and dicyandiamide is particularly preferred.
本発明におけるエポキシ樹脂層と１−Ｃは、基材にエポ
キシ樹脂ワニスを含浸させ、浴剤を乾燥除去したプリプ
レグを用いても工く、あるいは、エポキシ樹脂組成物に
充填剤等ｖ株加したものを用いてもよく、あるいζ基材
、充填剤を含まないでエポキシ樹脂組Ｍ、物のみを用い
又もよい。基材としては、ガラスクロス、ガラスペーパ
ー、紙、石英繊維クロス、芳８族ポリアミド繊維クロス
等が使用可能である。The epoxy resin layer and 1-C in the present invention can be formed using a prepreg obtained by impregnating the base material with an epoxy resin varnish and drying off the bath agent, or by adding a filler or the like to the epoxy resin composition. Alternatively, only the epoxy resin group M may be used without including the ζ base material or filler. As the base material, glass cloth, glass paper, paper, quartz fiber cloth, aromatic octagroup polyamide fiber cloth, etc. can be used.
又、充填剤としてはべりリア、窒化ホウ素。In addition, Berria and boron nitride are used as fillers.
マグネシア、アルミナ、シリカ等の粉末を使用すること
が可能である。It is possible to use powders such as magnesia, alumina, silica, etc.
本発明に使用する銅箔は、一般的ＶＣは電解鋼箔である
が、圧延銅箔を使用することも可能である。The copper foil used in the present invention is generally an electrolytic steel foil for VC, but it is also possible to use a rolled copper foil.
エポキシ樹脂層がプリプレグの場合ハ、アミノ系シラン
カップリング剤処理さｔした金属板の片面あるいは両面
にプリプレグを必要枚数重ね、更にその外側に銅箔ケｌ
ね、加熱加圧硬化することにエリ、金城コアエポキシ相
脂相伝積層板が得らｎる。If the epoxy resin layer is prepreg, layer the required number of prepregs on one or both sides of the metal plate treated with an amino-based silane coupling agent, and then add a copper foil layer on the outside.
Well, by curing under heat and pressure, a Kinjo core epoxy phase transfer laminate is obtained.
エポキシ樹脂層がエポキシ樹脂組成物単独、あるいは充
填剤入りエポキシ蘭脂組成物の場合は、こｎらのワニス
を、銅箔の接着面に、あるいはアミノ系シランカップリ
ング剤処理された金属板の接着面に、あるー・はその両
方に塗布し、その後乾燥し、そｎらす重ね合わせ℃加熱
加圧硬化することにより金属コアエポキシ樹脂相伝積層
板か得らｎる。If the epoxy resin layer is an epoxy resin composition alone or an epoxy orchid resin composition containing a filler, apply these varnishes to the adhesive surface of the copper foil or to the metal plate treated with an amino-based silane coupling agent. A metal core epoxy resin phase laminate is obtained by coating both the adhesive surfaces, drying, and then stacking them together and curing under heating and pressure at °C.
本発明にエリ得らｎた金属コアエポキシ樹省銅張積層板
は、常態での金属板とエポキシ樹脂との１ｓｙＩＩ力の
みならず、吸湿処理後の半田耐熱性に優几ている。The metal core epoxy resin-saving copper-clad laminate obtained by the present invention has excellent not only the 1syII strength between the metal plate and the epoxy resin under normal conditions, but also the soldering heat resistance after moisture absorption treatment.
以下本発明について実施例をもりて詳細に説明する。但
し１本発明は以下の実施例に限定さｎるもので汀ない。The present invention will be described in detail below with reference to Examples. However, the present invention is not limited to the following examples.
（実施例１）
本実施例はエポキシ樹脂層にエポキシ樹脂プリプレグを
用いたアルミコア片面銅張槓層板に関するものである。(Example 1) This example relates to an aluminum core single-sided copper-clad laminated board using an epoxy resin prepreg for the epoxy resin layer.
厚さ１． Ｑ ａ＋ｍのアルミニウム板の接着面側を、
１２００番の研摩紙を用いて、縦方向と横方向に研摩し
た後、充分水洗し次。このアルミニウム板を、γ−アミ
ツブａピルトリエトキシシランの０．３％水溶液に１分
間＆漬後、１２０℃で３０分間乾燥を行なった。Thickness 1. Q The adhesive side of the aluminum plate of a + m,
After sanding both vertically and horizontally using 1200 grit abrasive paper, rinse thoroughly with water. This aluminum plate was immersed in a 0.3% aqueous solution of γ-amitube a-pyrutriethoxysilane for 1 minute and then dried at 120° C. for 30 minutes.
油化シェル社製ビスフェノールＡ型エポキシ樹脂、商品
名エピコート１００１（軟化点７０℃エポキシ当ｔ４９
０ｇ／ｅｑ、）１００ｍ量部をメチルエチルケトン２４
．ｆｎ部に均一に溶解させた溶液に、ジシアンジアミド
５０重量部をエチレンクリコールモノメチルエーテル４
５ｘ量部に溶解させた溶液を加え、更に硬化促進剤とし
てベンジルジメチルアミンを［Ｌ２ｍ：ｉｌｉ部添加し
、ＩＩ脂分６０重量％のエポキシ樹脂ワニスＡを作製し
た。このエポキシ樹脂ワニスＡを日東紡裂ガラスｌａス
Ｇ −７０Ｉ Ｑ−ＢＺ−２（厚さ１１ｍ−）に含浸さ
せた後、塗工温度１６０℃、塗工速度３ｍ／ｍｉｎで溶
剤除去するため乾燥塗工を行ない、樹脂分４５重１％の
プリプレグを得た。Bisphenol A type epoxy resin manufactured by Yuka Shell Co., Ltd., trade name Epicote 1001 (softening point 70℃ epoxy equivalent T49
0g/eq,) 100m parts of methyl ethyl ketone 24
．． Add 50 parts by weight of dicyandiamide to a solution uniformly dissolved in part fn and add 4 parts by weight of ethylene glycol monomethyl ether.
A solution dissolved in 5x parts was added thereto, and 2m:ili parts of benzyldimethylamine was added as a curing accelerator to prepare an epoxy resin varnish A having a II fat content of 60% by weight. After impregnating Nitto Bose Glass LAS G-70I Q-BZ-2 (thickness 11 m) with this epoxy resin varnish A, it was dried to remove the solvent at a coating temperature of 160°C and a coating speed of 3 m/min. Coating was performed to obtain a prepreg with a resin content of 45% by weight.
このプリプレグ２枚な、前述の研摩後アミノシランカッ
プリング剤処坤したアルミニウム板の上に重ね、更にそ
の上に、古河ナーキブトフォイル社製電解銅箔（ＴＡＩ
処理、犀さ３５重ｍ）を重ね、４０ｋｇｆ／ｃｍ’の圧
力で１７０℃２時間加熱加圧硬化し、アルミニウムコア
エポキシ樹脂銅張積層板を得た。Two sheets of this prepreg were stacked on top of the aluminum plate coated with an aminosilane coupling agent after the aforementioned polishing, and on top of that, electrolytic copper foil (TAI) made by Furukawa Nakibutfoil Co., Ltd.
After treatment, 35 weight meters of rhinoceros was piled up and cured under heat and pressure at 170° C. for 2 hours at a pressure of 40 kgf/cm' to obtain an aluminum core epoxy resin copper-clad laminate.
この積層板の特性の測定結果を表１１Ｃ示すが。The measurement results of the properties of this laminate are shown in Table 11C.
常態及び吸湿処理後（煮沸１時間）の２６０℃半田耐熱
性試験で５分フロート後も異常はなく、又、アルミニウ
ム板と樹脂の接着性に優ｎ１銅箔引きはがし彊さの値が
高かった。In the 260℃ soldering heat resistance test under normal conditions and after moisture absorption treatment (boiling for 1 hour), there were no abnormalities even after floating for 5 minutes, and the adhesiveness between the aluminum plate and the resin was excellent, and the peelability value of the copper foil was high. .
図面は本発明の製造方法による金属コアエポキシ樹脂片
面銅張積層板の断面図で１１ｒｉ銅箔、２はエポキシ樹
脂層、３は研摩後アミノ系シランカップリング剤処理し
念金属板処理面、４は金属板である。The drawing is a cross-sectional view of a metal core epoxy resin single-sided copper-clad laminate produced by the manufacturing method of the present invention, with 11ri copper foil, 2 an epoxy resin layer, 3 a metal plate treated with an amino-based silane coupling agent after polishing, and 4 is a metal plate.
（実施例２）
本実施例はエポキシ樹脂層にエポキシ樹脂組成物を単独
使用したアルミニウムコア片面ｖＡ張積層板に関するも
のである。(Example 2) This example relates to an aluminum core single-sided vA-clad laminate in which an epoxy resin composition was used alone in the epoxy resin layer.
実施例１で作製したエポキシ樹脂ワニスＡを電解鋼箔（
ＴＡＩ処理、厚さ３５μｍ）の粗化処理面上にアプリケ
ータを用いて塗布し、１６０”０１０分間乾燥した。乾
燥後の樹脂厚は５０μｍであった。Epoxy resin varnish A produced in Example 1 was coated with electrolytic steel foil (
It was applied using an applicator onto the roughened surface of TAI treated (35 μm thick) and dried for 160”010 minutes. The resin thickness after drying was 50 μm.
このエポキシ樹脂付銅箔を、実施例１と同様に研摩後、
アミノシランカップリング剤処坤したアルミニウム板の
上に重ね、４０ｋｇｆ／ａｎ”の圧力で、１７０℃２時
間加熱加圧硬化な行ない、アルミニウムコアエポキシ樹
脂片面銅張積層板を得た。After polishing this epoxy resin coated copper foil in the same manner as in Example 1,
This was stacked on an aluminum plate treated with an aminosilane coupling agent and cured under heat and pressure at 170°C for 2 hours at a pressure of 40 kgf/an'' to obtain an aluminum core epoxy resin single-sided copper-clad laminate.
この積層板の特性の沖」定結果を表１に示すが、常態及
び吸湿処理後（煮沸１時間）の２６０℃半田耐熱性試験
で５分フロート後も異常はなく、又、アルミニウム板と
樹脂の接着性に優ｎ１銅箔引きはがし箇さの値が高かっ
た。Table 1 shows the results of the characteristics of this laminate. In the soldering heat resistance test at 260°C under normal conditions and after moisture absorption treatment (boiling for 1 hour), there was no abnormality after floating for 5 minutes. The adhesiveness of the n1 copper foil was excellent, and the peeling distance of the copper foil was high.
（比較例１）
アルミニウム板を無処理のまま使用する以外は実施例１
と同様にしてアルミニウムコアエポキシ樹脂銅張積層板
な作製した。特性を表１に示すが、常態及び吸湿処理後
（煮沸１時間）の半田耐熱性試験においていずｎも１分
フΩ−ト後アルミニウム板とエポキシ樹脂との界面で剥
離が生じ℃いた。(Comparative Example 1) Example 1 except that the aluminum plate was used without treatment.
An aluminum core epoxy resin copper-clad laminate was fabricated in the same manner as above. The properties are shown in Table 1. In the soldering heat resistance test under normal conditions and after moisture absorption treatment (boiling for 1 hour), peeling occurred at the interface between the aluminum plate and the epoxy resin after 1 minute of heating.
（比較例２）
アルミニウム板に研摩処理のみ行なっ−Ｃ（シランカッ
プリング剤処理は行なわな（・で）使用する以外は実施
例１と同様にしてアルミニウムコアエポキシ樹脂銅張積
層板を作製した。特性を表１＃Ｃ示すが、常態の半田耐
熱性試験では３分フロート後アルミニウム板とエポキシ
樹脂の界面で剥離が生じ、吸湿処理後（煮沸１時間）の
半田耐熱性試験においては１分フロート佐。(Comparative Example 2) An aluminum core epoxy resin copper-clad laminate was produced in the same manner as in Example 1, except that the aluminum plate was only subjected to polishing treatment and -C (silane coupling agent treatment was not performed (.)). The characteristics are shown in Table 1#C, but in the normal soldering heat resistance test, peeling occurred at the interface between the aluminum plate and the epoxy resin after 3 minutes of floating, and in the soldering heat resistance test after moisture absorption treatment (boiling for 1 hour), there was no separation after 1 minute of floating. S.
アルミニウム板とエポキシ樹脂との界面で剥離が生じて
いた。Peeling occurred at the interface between the aluminum plate and the epoxy resin.
（比較例５） アルミニウム板に研摩処理は行なわないで。(Comparative example 5) Do not polish the aluminum plate.
シランカップリング剤処理のみ行なって、使用する以外
は実施例１と同様にしてアルミニウムコアエポキシ樹脂
銅張積層板を作製した。特１王を表１に示すが、常態及
び吸湿処理後（煮ｓ１時間）”の半田耐熱性試験におい
て、いすｎも１分フロート後、アルミニウムとエポキシ
樹脂の界面で剥離が生じていた。An aluminum core epoxy resin copper-clad laminate was produced in the same manner as in Example 1 except that only the silane coupling agent treatment was performed and used. Table 1 shows Special 1 King, and in the solder heat resistance test under normal conditions and after moisture absorption treatment (boiling for 1 hour), peeling occurred at the interface between aluminum and epoxy resin after floating for 1 minute.
以上、説明してきた様に１本発明の製造方法によると、
常態及び吸湿処理後の半田耐熱性に優ｎ、金属板とエポ
キシ樹脂との接着性に優ｎ、銅箔引きはがし強さの値が
高い金属コアエポキシ樹脂銅張積層板が製造でさ、その
工業的価値は大である。As explained above, according to the manufacturing method of the present invention,
We manufacture metal core epoxy resin copper-clad laminates that have excellent soldering heat resistance under normal conditions and after moisture absorption treatment, excellent adhesion between metal plates and epoxy resin, and high copper foil peel strength. The industrial value is great.
図面は本発明の製造方法による金禎コアエポキシ樹脂片
面銅張＃ｌ［層板の断面図である。
符号の説明The drawing is a cross-sectional view of a single-sided copper-clad #1 layered plate made of Kinteki core epoxy resin according to the manufacturing method of the present invention. Explanation of symbols
Claims (1)
プリング剤溶液を塗布し、浴剤を乾燥処理後、その処理
面の上にエポキシ樹脂層を介して銅箔を重ね、加熱加圧
硬化することを特徴とする金属コアエポキシ樹脂銅張積
層板の製造方法。 ２、アミノ系シランカップリング剤が、γ−アミノプロ
ピルトリエトキシシラン、γ−アミノプロピルトリメト
キシシラン、Ｎ−β（アミノエチル）γ−アミノプロピ
ルトリメトキシシラン、Ｎ−β（アミノエチル）γ−ア
ミノプロピルメチルジメトキシシラン、ｐ−アミノフェ
ニルトリメトキシシラン、Ｎ−フェニル−γ−アミノプ
ロピルトリメトキシシラン、又はこれらの混合物である
ことを特徴とする特許請求の範囲第１項に記載された金
属コアエポキシ樹脂銅張積層板の製造方法。 ３、エポキシ樹脂が、ガラス布基材エポキシ樹脂プリプ
レグであることを特徴とする特許請求の範囲第１項に記
載された金属コアエポキシ樹脂銅張積層板の製造方法。 ４、エポキシ樹脂層がエポキシ樹脂のみであることを特
徴とする特許請求の範囲第１項に記載された金属コアエ
ポキシ樹脂銅張積層板の製造方法。 ５、金属板が、アルミニウム板、アルマイト板、銅板、
ケイ素鋼板、亜鉛鋼板、鉄−ニッケル４２アロイ板、ア
ンバー板、又はこれらのクラッド板であることを特徴と
する特許請求の範囲第１項に記載された金属コアエポキ
シ樹脂銅張積層板の製造方法。[Claims] 1. After mechanically polishing the metal plate, apply an amino-based silane coupling agent solution, dry the bath agent, and then apply a copper foil over the treated surface via an epoxy resin layer. A method for producing a metal core epoxy resin copper-clad laminate, which comprises stacking and curing under heat and pressure. 2. The amino-based silane coupling agent is γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ- The metal core according to claim 1, characterized in that it is aminopropylmethyldimethoxysilane, p-aminophenyltrimethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, or a mixture thereof. A method for manufacturing epoxy resin copper-clad laminates. 3. The method for manufacturing a metal core epoxy resin copper-clad laminate as set forth in claim 1, wherein the epoxy resin is a glass cloth base epoxy resin prepreg. 4. The method for manufacturing a metal core epoxy resin copper-clad laminate according to claim 1, wherein the epoxy resin layer is made of only epoxy resin. 5. The metal plate is an aluminum plate, an alumite plate, a copper plate,
A method for manufacturing a metal core epoxy resin copper-clad laminate according to claim 1, which is a silicon steel plate, a zinc steel plate, an iron-nickel 42 alloy plate, an amber plate, or a clad plate thereof. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59267749A JPS61144339A (en) | 1984-12-19 | 1984-12-19 | Manufacture of metallic core epoxy-resin copper lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59267749A JPS61144339A (en) | 1984-12-19 | 1984-12-19 | Manufacture of metallic core epoxy-resin copper lined laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144339A true JPS61144339A (en) | 1986-07-02 |
| JPH0454577B2 JPH0454577B2 (en) | 1992-08-31 |
Family
ID=17449039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59267749A Granted JPS61144339A (en) | 1984-12-19 | 1984-12-19 | Manufacture of metallic core epoxy-resin copper lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61144339A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147636A (en) * | 1986-12-11 | 1988-06-20 | 日立化成工業株式会社 | Manufacture of silicon steel-plate base copper-clad laminated plate |
| US5662776A (en) * | 1993-08-24 | 1997-09-02 | Shin-Kobe Electric Machinery Co. | Glass fiber non-woven fabric, a method of producing glass fiber non-woven fabric and a method of producing a laminate |
| WO2011045895A1 (en) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | Composite molded article |
| US9186641B2 (en) | 2011-08-05 | 2015-11-17 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9283514B2 (en) | 2011-01-21 | 2016-03-15 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US9303047B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Flame retardant filler |
| US9307693B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| KR20210074036A (en) * | 2019-12-11 | 2021-06-21 | 주식회사 포스코 | Metal-plastic composite material and method for manufacturing the same |
| CN114423612A (en) * | 2019-10-02 | 2022-04-29 | 东洋纺株式会社 | Laminate manufacturing device and laminate manufacturing method |
| US11621210B2 (en) | 2012-06-13 | 2023-04-04 | International Business Machines Corporation | Thermal interface material (TIM) with thermally conductive integrated release layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884488A (en) * | 1981-11-13 | 1983-05-20 | 日本電解株式会社 | Copper-coated laminated board for printed circuit |
| JPS5896660A (en) * | 1981-12-03 | 1983-06-08 | Mitsubishi Chem Ind Ltd | Powder coating compound composition of epoxy resin for insulating metal core circuit base |
-
1984
- 1984-12-19 JP JP59267749A patent/JPS61144339A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884488A (en) * | 1981-11-13 | 1983-05-20 | 日本電解株式会社 | Copper-coated laminated board for printed circuit |
| JPS5896660A (en) * | 1981-12-03 | 1983-06-08 | Mitsubishi Chem Ind Ltd | Powder coating compound composition of epoxy resin for insulating metal core circuit base |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63147636A (en) * | 1986-12-11 | 1988-06-20 | 日立化成工業株式会社 | Manufacture of silicon steel-plate base copper-clad laminated plate |
| US5662776A (en) * | 1993-08-24 | 1997-09-02 | Shin-Kobe Electric Machinery Co. | Glass fiber non-woven fabric, a method of producing glass fiber non-woven fabric and a method of producing a laminate |
| WO2011045895A1 (en) * | 2009-10-16 | 2011-04-21 | アイシン精機株式会社 | Composite molded article |
| JP4993039B2 (en) * | 2009-10-16 | 2012-08-08 | アイシン精機株式会社 | Composite molded product |
| US8518521B2 (en) | 2009-10-16 | 2013-08-27 | Aisin Seiki Kabushiki Kaisha | Composite molded article |
| US9283514B2 (en) | 2011-01-21 | 2016-03-15 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US10124302B2 (en) | 2011-01-21 | 2018-11-13 | International Business Machines Corporation | Removing sulfur contaminants from water using a silicone-based chemical filter |
| US10112155B2 (en) | 2011-01-21 | 2018-10-30 | International Business Machines Corporation | Removing sulfur contaminants from a fluid using a silicone-based chemical filter |
| US9333454B2 (en) | 2011-01-21 | 2016-05-10 | International Business Machines Corporation | Silicone-based chemical filter and silicone-based chemical bath for removing sulfur contaminants |
| US9908902B2 (en) | 2011-05-06 | 2018-03-06 | International Business Machines Corporation | Flame retardant filler |
| US9303047B2 (en) | 2011-05-06 | 2016-04-05 | International Business Machines Corporation | Flame retardant filler |
| US10059727B2 (en) | 2011-05-06 | 2018-08-28 | International Business Machines Corporation | Flame retardant filler |
| US10053473B2 (en) | 2011-05-06 | 2018-08-21 | International Business Machines Corporation | Flame retardant filler |
| US10040807B2 (en) | 2011-05-06 | 2018-08-07 | International Business Machines Corporation | Flame retardant filler |
| US9186641B2 (en) | 2011-08-05 | 2015-11-17 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9694337B2 (en) | 2011-08-05 | 2017-07-04 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9434133B2 (en) | 2011-08-05 | 2016-09-06 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability |
| US9313946B2 (en) | 2011-10-28 | 2016-04-19 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US9307692B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US9307693B2 (en) | 2011-10-28 | 2016-04-12 | International Business Machines Corporation | Microcapsules adapted to rupture in a magnetic field |
| US11621210B2 (en) | 2012-06-13 | 2023-04-04 | International Business Machines Corporation | Thermal interface material (TIM) with thermally conductive integrated release layer |
| CN114423612A (en) * | 2019-10-02 | 2022-04-29 | 东洋纺株式会社 | Laminate manufacturing device and laminate manufacturing method |
| KR20210074036A (en) * | 2019-12-11 | 2021-06-21 | 주식회사 포스코 | Metal-plastic composite material and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0454577B2 (en) | 1992-08-31 |
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