JPH0226097A - Copper foil for printed board and its manufacture - Google Patents
Copper foil for printed board and its manufactureInfo
- Publication number
- JPH0226097A JPH0226097A JP17525888A JP17525888A JPH0226097A JP H0226097 A JPH0226097 A JP H0226097A JP 17525888 A JP17525888 A JP 17525888A JP 17525888 A JP17525888 A JP 17525888A JP H0226097 A JPH0226097 A JP H0226097A
- Authority
- JP
- Japan
- Prior art keywords
- zinc
- copper foil
- coupling agent
- silane coupling
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 239000011889 copper foil Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 229910001369 Brass Inorganic materials 0.000 claims abstract description 8
- 239000010951 brass Substances 0.000 claims abstract description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract 6
- 239000011701 zinc Substances 0.000 claims abstract 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract 6
- 239000011787 zinc oxide Substances 0.000 claims abstract 5
- 238000000034 method Methods 0.000 claims abstract 2
- DQIPXGFHRRCVHY-UHFFFAOYSA-N chromium zinc Chemical compound [Cr].[Zn] DQIPXGFHRRCVHY-UHFFFAOYSA-N 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 5
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 claims description 2
- 239000011247 coating layer Substances 0.000 claims 5
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims 3
- 229910000423 chromium oxide Inorganic materials 0.000 claims 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 2
- 239000010410 layer Substances 0.000 claims 2
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 150000003751 zinc Chemical class 0.000 claims 1
- 238000002845 discoloration Methods 0.000 abstract description 10
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000012545 processing Methods 0.000 abstract 6
- NDKWCCLKSWNDBG-UHFFFAOYSA-N zinc;dioxido(dioxo)chromium Chemical compound [Zn+2].[O-][Cr]([O-])(=O)=O NDKWCCLKSWNDBG-UHFFFAOYSA-N 0.000 abstract 4
- 230000003647 oxidation Effects 0.000 abstract 3
- 238000007254 oxidation reaction Methods 0.000 abstract 3
- 238000012993 chemical processing Methods 0.000 abstract 1
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 230000007774 longterm Effects 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 4
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 239000008280 blood Substances 0.000 description 2
- 210000004369 blood Anatomy 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 1
- 229940090961 chromium dioxide Drugs 0.000 description 1
- IAQWMWUKBQPOIY-UHFFFAOYSA-N chromium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Cr+4] IAQWMWUKBQPOIY-UHFFFAOYSA-N 0.000 description 1
- AYTAKQFHWFYBMA-UHFFFAOYSA-N chromium(IV) oxide Inorganic materials O=[Cr]=O AYTAKQFHWFYBMA-UHFFFAOYSA-N 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 description 1
- RZLVQBNCHSJZPX-UHFFFAOYSA-L zinc sulfate heptahydrate Chemical compound O.O.O.O.O.O.O.[Zn+2].[O-]S([O-])(=O)=O RZLVQBNCHSJZPX-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
Abstract
Description
【発明の詳細な説明】
面のみが粗化面である場合について説明したが、両面と
も粗化面の銅箔についても本発明を好適に適用できるこ
とは勿論である。DETAILED DESCRIPTION OF THE INVENTION Although the case where only one surface is a roughened surface has been described, it goes without saying that the present invention can be suitably applied to a copper foil having roughened surfaces on both sides.
以下、実施例及び比較例を示す・
Ｋ血旦ユ
回転ドラムを陰極として電気分解反応により連続的に銅
を電着させて１８μｍの銅箔を製造し、更にその上に銅
の微細粒子を形成せしめて粗化面を形成した。Examples and comparative examples are shown below. 18 μm copper foil was manufactured by continuously electrodepositing copper using a K blood tank rotating drum as a cathode by electrolysis reaction, and fine copper particles were further formed on it. At least a roughened surface was formed.
次いで、二酸化クロム５ｇ／ｆ２、硫酸亜鉛（７水塩）
５ｇ／Ｊ２及び水酸化ナトリウム２０ｇ／ｆ２を含有し
モして浴温６０℃のめっき浴を用いて粗化面及び光沢面
両方に亜鉛−クロム基混合物を被覆する陰極防錆処理を
行なった。Next, chromium dioxide 5g/f2, zinc sulfate (heptahydrate)
A cathodic anticorrosive treatment was carried out in which both the roughened surface and the bright surface were coated with a zinc-chromium group mixture using a plating bath containing 5 g/J2 and 20 g/f2 of sodium hydroxide at a bath temperature of 60 DEG C.
引き続きただちに、γ−グリシドオキシプロビルトリメ
トキシシランの濃度０．１重量％の水溶液をスプレーで
粗化面に塗布した後、乾燥して試料を作成した。Immediately thereafter, an aqueous solution of γ-glycidoxypropyltrimethoxysilane having a concentration of 0.1% by weight was sprayed onto the roughened surface and dried to prepare a sample.
この試料に対して下記の評価を行・なった、結果を表１
に示す。The following evaluation was performed on this sample, and the results are shown in Table 1.
Shown below.
左沢皿辺又進
温度１８０℃のオーブン中に１５分間銅箔を保持した後
、光沢面の変色を目視により観察し、変色の程度をｏ、
Ｏ１×の三段階で判定した。After keeping the copper foil in an oven at a temperature of 180°C for 15 minutes, the discoloration of the glossy surface was visually observed, and the degree of discoloration was determined as o,
Judgment was made in three stages: O1x.
批±皿Ωヌ進
加速試験として、８０℃の温度及び７ｏ％の相対湿度の
恒温恒湿器に２４時間銅箔を保持した後粗化面の変色を
目視により観察し、変色の程度をｏ、Ｏ１×の三段階で
判定した。As a plate acceleration test, the copper foil was held in a constant temperature and humidity chamber at a temperature of 80°C and a relative humidity of 70% for 24 hours, and then the discoloration of the roughened surface was visually observed, and the degree of discoloration was evaluated. , O1x.
化１忽旦羞１
試料をガラスクロス基材エポキシ樹脂板に積層接着し、
常態（室温）引き剥し強さ及び１８０℃×４８時間加熱
後の引き剥し強さを１０ｍｍ巾の回路で測定した。1 The sample was laminated and bonded to a glass cloth base epoxy resin plate.
The normal (room temperature) peel strength and the peel strength after heating at 180° C. for 48 hours were measured using a 10 mm wide circuit.
声 ′の′
１８％塩酸に１時間浸漬した後の引き剥し強さを０．２
ｍｍ巾の回路で測定し、劣化率（％）として示した。Voice 'No' Peel strength after immersed in 18% hydrochloric acid for 1 hour is 0.2
Measurements were made using a mm-wide circuit and shown as a deterioration rate (%).
実ｆｆｉ
実施例１の亜鉛−クロム基混合物被覆防錆処理に先立っ
て、銅箔の粗化面にシアン化ナトリウム１１０ｇ／ｎ、
水酸化ナトリウム６ｏｇ／Ｉ２、シアン化銅９０ｇ／β
及びシアン化亜鉛５．３ｇ／βを含有しそして浴温８０
℃のめっき浴を用いて、該銅箔を陰極とし、電流密度６
Ａ／ｄｍ２で４秒間黄銅めっきを行なった以外は、実
施例１と同一条件にて試料を作成し、同じく評価を行な
った。結果を表１に示す。Actual ffi Prior to the zinc-chromium group mixture coating rust prevention treatment of Example 1, 110 g/n of sodium cyanide was applied to the roughened surface of the copper foil.
Sodium hydroxide 6og/I2, copper cyanide 90g/β
and zinc cyanide 5.3g/β and bath temperature 80
Using a plating bath at ℃, the copper foil was used as a cathode, and the current density was 6.
A sample was prepared under the same conditions as in Example 1, except that brass plating was performed at A/dm2 for 4 seconds, and evaluated in the same manner. The results are shown in Table 1.
夫亘■ニ
シランカップリング剤処理においてγ−グリシドオキシ
プロビルトリメトキシシランの濃度０．５重量％の水溶
液を用いた以外は実施例２と同様にして試料を作成し、
評価を行なった。結果を同じく表１に示す。A sample was prepared in the same manner as in Example 2, except that an aqueous solution of γ-glycidoxypropyltrimethoxysilane with a concentration of 0.5% by weight was used in the treatment with the silane coupling agent.
We conducted an evaluation. The results are also shown in Table 1.
Ｋ血皿Ａ
シランカップリング剤処理においてγ−アミノプロピル
トリエトキシシランの濃度０．１重量％の水溶液を用い
た以外は実施例２と同様にして試料を作成し、評価を行
なった。結果を同じく表１に示す。K Blood Dish A A sample was prepared and evaluated in the same manner as in Example 2, except that an aqueous solution of γ-aminopropyltriethoxysilane having a concentration of 0.1% by weight was used in the silane coupling agent treatment. The results are also shown in Table 1.
実１１述旦
シランカップリング剤処理においてγ−アミノプロピル
トリエトキシシランの濃度０．３重量％の水溶液を用い
た以外は実施例２と同様にして試料を作成し、評価を行
なった。結果を同じく表１に示す。EXAMPLE 11 A sample was prepared and evaluated in the same manner as in Example 2, except that an aqueous solution of γ-aminopropyltriethoxysilane having a concentration of 0.3% by weight was used in the silane coupling agent treatment. The results are also shown in Table 1.
比ｍ上
シランカップリング剤処理を行なわないこと以外は実施
例１と同様にして試料を作成し、評価を行なった。結果
を同じく表１に示す。Samples were prepared and evaluated in the same manner as in Example 1, except that the specific silane coupling agent treatment was not performed. The results are also shown in Table 1.
匿絞且孟
シランカップリング剤処理を行なわないこと以外は実施
例２と同様にして試料を作成し、評価を行なった。結果
を同じく表１に示す。A sample was prepared and evaluated in the same manner as in Example 2, except that the sample was dry-drawn and the silane coupling agent treatment was not performed. The results are also shown in Table 1.
之蚊五ユ
防錆処理を重クロム酸カリウム５ ｇ／ｆｌを含有し、
ｐＨ＝３．５及び浴温＝５５℃のクロメートめっき液を
用いて電流密度０．４ Ａ／ｄｍ”で２秒間行なった以
外は、実施例２と同様にして試料を作成し、評価を行な
った。結果を同じく表１に示す。This anti-rust treatment contains potassium dichromate 5 g/fl,
Samples were prepared and evaluated in the same manner as in Example 2, except that a chromate plating solution with pH = 3.5 and bath temperature = 55°C was used for 2 seconds at a current density of 0.4 A/dm. The results are also shown in Table 1.
表１
！立 ！シ −旦ｇ／姪り一 丸北岸
実施例１０ ０ １．７ １０ ２％実施例２
０ ０ １６ １．２ ３％実施例３０ ０
１．７ １．２ ２％実施例４０ ０ １
．６ １１．３ ４％実施例５０ ０ １．６
１．３ ３％比較例１０ ０ １．６ １．
０ ５％比較例２０ ０ １．６１．２ ６％
比較例３××１．６１２４％
比較例１及び２が塩酸処理後の劣化率が大きく、そして
比較例３が光沢面及び粗化面ともに著しい変色を示すの
とは対照的に、本発明は、そうした欠点を全く呈するこ
となく、プリント配線板用銅箔として総合的に満足し得
る性能を有している。Table 1! Stand! Sea-tang/Nieri Ichi Maru north bank Example 10 0 1.7 10 2% Example 2
0 0 16 1.2 3% Example 30 0
1.7 1.2 2% Example 40 0 1
．． 6 11.3 4% Example 50 0 1.6
1.3 3% Comparative Example 10 0 1.6 1.
0 5% Comparative example 20 0 1.61.2 6%
Comparative Example 3 × × 1.6124% In contrast to Comparative Examples 1 and 2, which had a large deterioration rate after hydrochloric acid treatment, and Comparative Example 3, which showed significant discoloration on both the glossy and roughened surfaces, the present invention , it exhibits no such drawbacks and has overall satisfactory performance as a copper foil for printed wiring boards.
ｌ豆立力課
本発明は、近時の半導体デバイスの急激な発展に伴なう
プリント配線板の高密度及び高多層化に対応し得る銅箔
及びその連続的製造方法を提供する。亜鉛−クロム基混
合物被覆とシランカップリング剤被覆との組合わせ更に
は予備処理として黄銅被覆との組合わせは、保存時の酸
化変色及び高温加熱時の光沢面の酸化変色を防止し、併
せて塩酸処理後や水洗・乾燥処理後の剥離強度の低下を
抑制し、その他のプリント配線板への要求特性を含めて
総合的に優れた銅箔を与える。The present invention provides a copper foil and a continuous manufacturing method thereof that can accommodate the high density and high multilayer printed wiring boards that accompany the recent rapid development of semiconductor devices. The combination of a zinc-chromium group mixture coating and a silane coupling agent coating, as well as a brass coating as a pretreatment, prevents oxidative discoloration during storage and oxidative discoloration of glossy surfaces during high-temperature heating. It suppresses the decrease in peel strength after hydrochloric acid treatment, water washing and drying treatment, and provides a copper foil that has excellent overall properties including other characteristics required for printed wiring boards.
手続補正書 平成元年９月２９日 特許庁長官 吉 １）文 毅 殿 事件の表示 昭和６３年特許願第１７５２５８号− 発明の名称 プリント配線板用銅箔及びその製造方法補正をする者 事件との関係 名称Procedural amendment September 29, 1989 Yoshi, Commissioner of the Patent Office 1) Takeshi Moon Display of incidents Patent Application No. 175258 of 1988- name of invention Person who corrects copper foil for printed wiring boards and its manufacturing method Relationship with the incident name
Claims (1)
成される、亜鉛または酸化亜鉛とクロム酸化物とより成
る亜鉛−クロム基混合物被覆層と、該亜鉛−クロム基混
合物被覆銅箔の少なくとも粗化面に形成されるシランカ
ップリング剤被覆層とを具備するプリント配線板用銅箔
。 ２）その片面又は両面に粗化面を設けた銅箔の少なくと
も粗化面に形成される黄銅層と、該黄銅層被覆銅箔の両
面に形成される、亜鉛または酸化亜鉛とクロム酸化物と
より成る亜鉛−クロム基混合物被覆層と、該亜鉛−クロ
ム基混合物被覆銅箔の少なくとも粗化面に形成されるシ
ランカップリング剤被覆層とを具備するプリント配線板
用銅箔。 ３）その片面又は両面に粗化面を設けた銅箔の両面に亜
鉛塩または酸化亜鉛とクロム酸塩とを含むめっき液を用
いて電気めっきにより亜鉛または酸化亜鉛とクロム酸化
物とより成る亜鉛−クロム基混合物を被覆する段階と、
次いで該亜鉛−クロム基混合物被覆銅箔の少なくとも粗
化面にシランカップリング剤溶液を塗布してシランカッ
プリング剤被覆層を形成する段階とを包含するプリント
配線板用銅箔製造方法。 ４）亜鉛−クロム基混合物を被覆する前に、銅箔の少な
くとも粗化面に黄銅を電着させる段階を含む特許請求の
範囲第３項記載のプリント配線板用銅箔製造方法。[Claims] 1) A zinc-chromium base mixture coating layer consisting of zinc or zinc oxide and chromium oxide, formed on both sides of a copper foil with a roughened surface on one or both sides, and the zinc - A copper foil for a printed wiring board, comprising a silane coupling agent coating layer formed on at least the roughened surface of the chromium-based mixture-coated copper foil. 2) A brass layer formed on at least the roughened surface of a copper foil provided with a roughened surface on one or both sides, and zinc or zinc oxide and chromium oxide formed on both sides of the brass layer-coated copper foil. A copper foil for a printed wiring board, comprising: a zinc-chromium base mixture coating layer; and a silane coupling agent coating layer formed on at least the roughened surface of the zinc-chromium base mixture coated copper foil. 3) Zinc made of zinc or zinc oxide and chromium oxide by electroplating on both sides of a copper foil with a roughened surface on one or both sides using a plating solution containing zinc salt or zinc oxide and chromate. - coating a chromium group mixture;
A method for producing a copper foil for a printed wiring board, the method comprising: then applying a silane coupling agent solution to at least the roughened surface of the copper foil coated with the zinc-chromium group mixture to form a silane coupling agent coating layer. 4) The method for producing a copper foil for a printed wiring board according to claim 3, which includes the step of electrodepositing brass on at least the roughened surface of the copper foil before coating the zinc-chromium based mixture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17525888A JPH0226097A (en) | 1988-07-15 | 1988-07-15 | Copper foil for printed board and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17525888A JPH0226097A (en) | 1988-07-15 | 1988-07-15 | Copper foil for printed board and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226097A true JPH0226097A (en) | 1990-01-29 |
Family
ID=15993017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17525888A Pending JPH0226097A (en) | 1988-07-15 | 1988-07-15 | Copper foil for printed board and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226097A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05308191A (en) * | 1991-10-24 | 1993-11-19 | Risho Kogyo Co Ltd | Surface treatment method of inner-layer circuit board for multilayer printed wiring board |
| EP0637902A1 (en) * | 1993-08-06 | 1995-02-08 | Gould Electronics Inc. | Metallic foil with adhesion promoting layer |
| FR2716329A1 (en) * | 1994-02-15 | 1995-08-18 | Mitsui Mining & Smelting Co | Copper foil for PCB and its process |
| WO1996025838A1 (en) * | 1995-02-16 | 1996-08-22 | Mitsui Mining & Smelting Co., Ltd. | Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| JP2007273679A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper or copper alloy foil for printed wiring board |
| JP2010093281A (en) * | 2002-12-05 | 2010-04-22 | Olin Corp | Improvement in peel strength of copper laminate |
-
1988
- 1988-07-15 JP JP17525888A patent/JPH0226097A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05308191A (en) * | 1991-10-24 | 1993-11-19 | Risho Kogyo Co Ltd | Surface treatment method of inner-layer circuit board for multilayer printed wiring board |
| EP0637902A1 (en) * | 1993-08-06 | 1995-02-08 | Gould Electronics Inc. | Metallic foil with adhesion promoting layer |
| FR2716329A1 (en) * | 1994-02-15 | 1995-08-18 | Mitsui Mining & Smelting Co | Copper foil for PCB and its process |
| WO1996025838A1 (en) * | 1995-02-16 | 1996-08-22 | Mitsui Mining & Smelting Co., Ltd. | Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| JP2010093281A (en) * | 2002-12-05 | 2010-04-22 | Olin Corp | Improvement in peel strength of copper laminate |
| JP2012039126A (en) * | 2002-12-05 | 2012-02-23 | Olin Corp | Peel strength enhancement of copper laminate |
| JP2007273679A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper or copper alloy foil for printed wiring board |
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