SG10201805388PA - Insulating layer for printed circuit board and printed circuit board - Google Patents

Insulating layer for printed circuit board and printed circuit board

Info

Publication number
SG10201805388PA
SG10201805388PA SG10201805388PA SG10201805388PA SG10201805388PA SG 10201805388P A SG10201805388P A SG 10201805388PA SG 10201805388P A SG10201805388P A SG 10201805388PA SG 10201805388P A SG10201805388P A SG 10201805388PA SG 10201805388P A SG10201805388P A SG 10201805388PA
Authority
SG
Singapore
Prior art keywords
printed circuit
circuit board
insulating layer
flexural modulus
difference
Prior art date
Application number
SG10201805388PA
Inventor
Katsuya Tomizawa
Tomo Chiba
Meguru ITO
Eisuke Shiga
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of SG10201805388PA publication Critical patent/SG10201805388PA/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2465/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09136—Means for correcting warpage

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Insulating Bodies (AREA)

Abstract

INSULATING LAYER FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25 C and the flexural modulus under heat at 250 C. No suitable figure
SG10201805388PA 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board SG10201805388PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014001046 2014-01-07
JP2014010653 2014-01-23

Publications (1)

Publication Number Publication Date
SG10201805388PA true SG10201805388PA (en) 2018-07-30

Family

ID=53523934

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201604511UA SG11201604511UA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board
SG10201805388PA SG10201805388PA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG11201604511UA SG11201604511UA (en) 2014-01-07 2015-01-06 Insulating layer for printed circuit board and printed circuit board

Country Status (8)

Country Link
US (1) US10292260B2 (en)
EP (1) EP3094162B1 (en)
JP (1) JP6504462B2 (en)
KR (2) KR102278716B1 (en)
CN (1) CN105900535B (en)
SG (2) SG11201604511UA (en)
TW (1) TWI642718B (en)
WO (1) WO2015105109A1 (en)

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WO2017006887A1 (en) * 2015-07-06 2017-01-12 三菱瓦斯化学株式会社 Resin composition; prepreg or resin sheet using said resin composition; laminate plate using said prepreg or resin sheet; and printed wiring board
CN107849334B (en) * 2015-07-06 2020-06-05 三菱瓦斯化学株式会社 Resin composition, prepreg using same, resin sheet, laminate, and printed wiring board
CN107709468B (en) * 2015-07-06 2020-06-16 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, and printed wiring board
EP3321289B1 (en) * 2015-07-06 2022-09-07 Mitsubishi Gas Chemical Company, Inc. Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
JP6819921B2 (en) * 2016-03-15 2021-01-27 三菱瓦斯化学株式会社 Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed wiring board
JP6850548B2 (en) * 2016-04-22 2021-03-31 三菱瓦斯化学株式会社 Resin composition for printed wiring board, prepreg, resin sheet, laminated board, metal foil-clad laminated board, and printed wiring board
WO2018124164A1 (en) * 2016-12-28 2018-07-05 三菱瓦斯化学株式会社 Resin composition, prepreg, laminate, metal foil clad laminate, printed wiring board, and multilayer printed wiring board
JP7025729B2 (en) * 2016-12-28 2022-02-25 三菱瓦斯化学株式会社 Resin composition for printed wiring boards, prepregs, resin sheets, laminated boards, metal foil-clad laminated boards, printed wiring boards, and multilayer printed wiring boards.
KR102058827B1 (en) * 2016-12-28 2019-12-24 미츠비시 가스 가가쿠 가부시키가이샤 Resin composition, prepreg, laminated board, metal foil clad laminated board, printed wiring board, and multilayer printed wiring board
CN110139893B (en) * 2016-12-28 2021-11-19 三菱瓦斯化学株式会社 Prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
EP3713380A4 (en) * 2017-11-16 2020-12-16 Mitsubishi Gas Chemical Company, Inc. Method for producing laminate with patterned metal foil, and laminate with patterned metal foil
JPWO2019111416A1 (en) * 2017-12-08 2020-12-10 昭和電工マテリアルズ株式会社 Prepregs, laminates, and their manufacturing methods, as well as printed wiring boards and semiconductor packages.
KR102258616B1 (en) * 2018-01-10 2021-05-28 주식회사 엘지화학 Method of manufacturing insulating film for semiconductor package and insulating film for semiconductor package using the same

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JP3173332B2 (en) 1995-03-13 2001-06-04 新神戸電機株式会社 Manufacturing method of metal foil-clad laminate
JPH1072752A (en) 1996-05-15 1998-03-17 Matsushita Electric Ind Co Ltd Nonwoven fabric base material for printed circuit board and prepreg using the same
JP2004335661A (en) 2003-05-06 2004-11-25 Risho Kogyo Co Ltd Pre-preg for printed wiring, and plate stack
TWI391424B (en) * 2005-01-12 2013-04-01 Taiyo Holdings Co Ltd A hardened resin composition for inkjet and a hardened product thereof, and a printed circuit board using the same
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Also Published As

Publication number Publication date
TWI642718B (en) 2018-12-01
KR20160105782A (en) 2016-09-07
SG11201604511UA (en) 2016-07-28
US20160309582A1 (en) 2016-10-20
EP3094162B1 (en) 2023-08-09
TW201533137A (en) 2015-09-01
EP3094162A4 (en) 2017-09-06
KR102075195B1 (en) 2020-02-07
CN105900535A (en) 2016-08-24
JPWO2015105109A1 (en) 2017-03-23
CN105900535B (en) 2019-06-07
EP3094162A1 (en) 2016-11-16
US10292260B2 (en) 2019-05-14
KR102278716B1 (en) 2021-07-16
KR20200014946A (en) 2020-02-11
JP6504462B2 (en) 2019-04-24
WO2015105109A1 (en) 2015-07-16

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