TWI509111B - Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment - Google Patents

Description

Surface treatment of electrolytic copper foil, laminated board, and printed wiring board, electronic equipment

The present invention relates to a surface treated electrolytic copper foil, a laminated board, and a printed wiring board.

Printed wiring boards have made great strides since this half century and are now used in almost all electronic machines. With the increase in the miniaturization and high performance of the electronic equipment in recent years, the mounted components are being mounted at a high density or the signal is becoming high-frequency. The printed wiring board is required to be finer (fine pitch) or high in response to the conductor pattern. Frequency and so on.

The lower the roughness of the roughened surface of the copper foil, the better the fine pitch of the conductor pattern with respect to the printed wiring board is formed. Therefore, with the fine pitch of the conductor pattern in recent years, the demand for the low roughness of the roughened surface of the copper foil is increased.

On the other hand, the copper foil and the resin are then laminated to form a laminated board. However, in terms of the reliability of the adhesion to the resin at this time, the greater the roughness of the rough surface of the copper foil, the higher the fixing effect on the rough surface. The better the connection reliability. This adhesion reliability is an important management item in terms of forming fine pitch, and it is only required that the 90° peel strength is a fixed value (0.6 kg/cm) or more. In addition, as a method for evaluating the adhesion reliability, there is a method of measuring the number of protrusions generated on the surface by immersing the laminate with the resin substrate in a high temperature bath at 260 ° C, and the number of projections is 0 to 1 / m. ^{2 is} the benchmark for the reliability of the connection.

There are various techniques for developing a copper foil that can achieve fine pitch and improve adhesion to a resin. For example, Patent Document 1 discloses a surface-treated copper foil which is provided with a contact surface with an insulating resin substrate, and has a surface roughness (Rzjis) of 2.5 μm or less, which is measured by a laser method. surface area is the surface area (area D: Aμm ²⁾ when the two-dimensional area of 6550μm ² ratio of the two-dimensional area of [(A) / (6550)] was calculated as the ratio of surface area (B) value of 1.25 to 2.50, two The amount of chromium per unit area of the dimension region is 2.0 mg/m ² or more.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-105286

As disclosed in Patent Document 1, the prior art is mainly a technique of controlling the Rz of the roughened surface of the copper foil in order to improve the adhesion reliability with the resin, and to control it. However, according to the study by the inventors and the like, the following results were obtained: even if the Rz of the roughened surface of the copper foil was controlled to be the same value, and other conditions were also the same, the above-mentioned interface with the resin substrate was The number of protrusions is also different. Therefore, it can be understood that if it is a copper foil which controls only the Rz of the roughened surface of a copper foil, it is not enough to obtain favorable adhesion reliability.

The present invention provides a surface-treated electrodeposited copper foil, a laminated board, and a printed wiring board. The surface-treated electrodeposited copper foil is finely pitched and excellent in adhesion to a resin.

When the Rz of the roughened surface is lowered to make the conductor pattern of the copper foil finely pitched, air is accumulated in the fine unevenness formed on the surface of the copper foil at the interface between the surface of the copper foil and the resin substrate. Since it is difficult to remove the air, if it is set to a high temperature state, the air accumulated in the fine concavities and convexities expands to generate protrusions. Therefore, the inventors and the like have repeatedly worked hard to study and the results It has been found that the surface of the copper foil is provided with a structure in which air is less likely to accumulate on the surface of the copper foil even if a low-roughened copper foil for micro-pitching is used, whereby generation of the above-mentioned protrusions can be suppressed, whereby a resin substrate can be obtained. Good connection reliability.

An aspect of the present invention which is completed based on the above findings is a surface-treated electrolytic copper foil having a roughness Rz of a roughness of a copper foil measured by a stylus type roughness meter of 2.0 μm or less, and the rough surface The kurtosis number Sku of the roughness curve is 2 to 4.

In an embodiment of the surface-treated electrodeposited copper foil of the present invention, the roughness Rz is 0.8 to 1.8 μm.

In another embodiment of the surface-treated electrodeposited copper foil of the present invention, the kurtosis number Sku is 2.5 to 3.5.

In still another embodiment of the surface-treated electrodeposited copper foil of the present invention, the ratio A/B of the surface area A of the rough surface to the area B obtained by observing the rough surface is 1.2 to 2.0.

In still another embodiment of the surface-treated electrodeposited copper foil of the present invention, the ratio A/B is from 1.3 to 1.9.

In still another embodiment of the surface-treated electrodeposited copper foil of the present invention, the normal peel strength is 0.8 kg/cm or more.

Another aspect of the present invention is a laminate comprising a surface-treated electrodeposited copper foil of the present invention and a resin substrate.

Still another aspect of the present invention is a printed wiring board using the laminate of the present invention as a material.

According to the present invention, a surface treated electrolytic copper foil, a laminate, and In the printed wiring board, the surface-treated electrolytic copper foil can be finely pitched and excellent in adhesion to a resin.

Fig. 1 is a SEM observation photograph of the roughened surface of the sample of Example 1.

Fig. 2 is a SEM observation photograph of the roughened surface of the sample of Comparative Example 1.

The electrolytic copper foil used in the present invention is useful for producing an electrolytic copper foil which is formed by laminating a resin substrate and then removing it by etching.

The electrolytic copper foil used in the present invention is intended for the purpose of improving the peel strength (adhesion reliability) of the copper foil after the copper foil is bonded to the surface of the resin substrate, that is, the roughened surface, and the copper is pretreated. The surface of the foil is roughened by plating. Although the electrolytic copper foil has irregularities at the time of manufacture, the convex portion of the electrolytic copper foil is reinforced by the roughening treatment to make the unevenness larger.

[roughness Rz]

The surface-treated electrolytic copper foil of the present invention has a roughness Rz of a rough surface of the copper foil measured by a stylus type roughness meter according to JIS B0601-1994 of 2.0 μm or less. When the roughness Rz exceeds 2.0 μm, air is likely to accumulate on the fine unevenness formed on the surface of the copper foil at the interface between the surface of the copper foil and the resin substrate, and it is difficult to remove the air. Therefore, when the temperature is set to a high temperature state, the air accumulated in the fine concavities and convexities expands to generate protrusions. The roughness Rz of the roughened surface measured by a stylus type roughness meter is preferably 0.8 to 1.8 μm, more preferably 1.0 to 1.7 μm. The roughness Rz can be optimized by processing the shiny surface (S surface) of the copper foil and using the smoothed foil on both sides. Take control.

[Hawness Sku]

In the surface-treated electrolytic copper foil of the present invention, the roughness of the rough surface is controlled, and the kurtosis of the rough surface is controlled by the kurtosis Sku of the roughness of the resin substrate. It is 2~4. The kurtosis number Sku of the roughness curve indicates the sharpness of the unevenness on the rough surface of the copper foil (smooth condition), and the smaller the kurtosis number Sku, the more the curvature becomes a curve with a curvature, the larger the kurtosis number Sku, the sharper the ridge The curve. The kurtosis of the roughness curve Sku is an index of the degree of sharpness of the unevenness in the measurement of the three-dimensional surface roughness by the non-contact type roughness meter according to ISO 25178, and the Z-axis direction of the three-dimensional surface roughness is expressed by the following formula The height of the (bump) is the following four roots of the height Z(x) of the protrusion of the reference length 1 r divided by the fourth power of the root mean square roughness Rq described below.

The fourth root of the height of the protrusion of the reference length 1 r: {(1/1 r) × ∫ Z ⁴ (x)dx (wherein the integral is the cumulative value of 0 to 1 r)}

Root mean square roughness Rq: Rq: √ {(1/1 r) × ∫ Z ² (x) dx (where the integral is the cumulative value of 0 to 1 r)}

The kurtosis of the roughness curve Sku: Sku = (1/Rq ⁴ ) × {(1/1 r) × ∫ Z ⁴ (x) dx (wherein the integral is the cumulative value of 0 to 1 r)}

As described above, the sharpness of the unevenness of the rough surface of the copper foil and the steeper the sharp form, the larger the kurtosis Sku of the roughness curve. Further, the sharpness of the unevenness and the steeper the sharp form, the greater the variation in the size of the unevenness of the rough surface of the copper foil. Therefore, if the kurtosis number Sku indicating the roughness curve of the control uneven shape is controlled, the copper foil thick can be further controlled. The larger the deviation of the roughness of the rough surface. By suppressing the variation in the size of the irregularities existing on the rough surface of the copper foil, even if the pitch is finely divided, air is less likely to accumulate on the surface of the copper foil. Therefore, generation of protrusions due to expansion of the air accumulated in the unevenness in a high temperature state is suppressed, whereby good adhesion reliability to the resin substrate can be obtained. If the kurtosis Sku of the roughness curve of the rough surface is less than 2, it becomes impossible to maintain sufficient adhesion with the resin, and if it exceeds 4, as described above, there is a problem that protrusions are generated after heating. Further, the kurtosis number Sku of the roughness curve is preferably from 2.5 to 3.7, more preferably from 2.5 to 3.5, still more preferably from 2.4 to 3.4. The kurtosis number Sku can be controlled by optimizing the roughening treatment conditions of the copper foil.

[surface area ratio A/B]

The surface-treated electrodeposited copper foil of the present invention preferably has a surface area A of a rough surface (a roughened surface) and a ratio A/B of an area B obtained when the rough surface is viewed from a surface of 1.2 to 2.0. Here, the surface area A is a surface area (three-dimensional area) when a two-dimensional region of a predetermined range is measured by a laser method, and an area B obtained by looking at a rough surface is an area of the two-dimensional area. If the surface area ratio A/B is less than 1.2, the surface area ratio A/B is less than 1.2, and the adhesion to the resin cannot be sufficiently ensured. As described above, there is a problem that a protrusion is generated after heating. The surface area is preferably from 1.3 to 1.9 in comparison with A/B. The surface area ratio A/B can be controlled by optimizing the roughening treatment conditions of the copper foil. For example, when W is added to the copper roughening treatment liquid, the surface area ratio A/B becomes large. Moreover, when the current density is increased in the copper roughening treatment, the surface area ratio A/B becomes large, and when the current density is lowered, the surface area ratio becomes small. The surface area ratio A/B can be controlled to 1.2 to 2.0 in this manner.

[Normal peel strength]

The surface-treated electrodeposited copper foil of the present invention has a good normal peel strength as described above. detailed In the surface-treated electrodeposited copper foil of the present invention, the normal peel strength measured in accordance with JIS C5016 is preferably 0.8 kg/cm or more. Further, the normal peel strength is more preferably 0.9 kg/cm or more.

[High temperature bath protrusion]

The surface-treated electrodeposited copper foil of the present invention can satisfactorily suppress high-temperature bath protrusions as described above. Specifically, in the surface-treated electrodeposited copper foil of the present invention, after forming the micro-pitch circuit as a conductor pattern, when the roughened surface is followed by the resin substrate, the number of protrusions after immersion in a high-temperature bath at 260 ° C for 1 minute is 0~1/m ² .

As a method of producing the surface-treated electrodeposited copper foil of the present invention, first, an electrolytic copper foil (raw foil) is produced. The electrolytic copper foil used in the present invention has an electrolytic copper foil which is a useful property of the green foil, that is, a high temperature elongation of the pinhole.

The electrolytic copper foil used in the present invention can be produced by electrolysis using a sulfuric acid acidic copper sulfate electrolyte. By adjusting the concentration of the glue in the electrolyte to 0.5 ppm or less, preferably to 0.01 to less than 0.2 ppm, and preferably by adding a adjusted amount of chloride ions, Further, other electrolytic conditions such as electrolyte temperature and sulfuric acid concentration are adjusted to produce an electrolytic copper foil having no pinholes and having a high elongation at a high temperature. The amount of the glue added to the electrolytic copper foil produced by using the electrolytic solution is reduced, and annealing (recrystallization) of the crystal is promoted at the time of high temperature treatment, and as a result, the elongation at high temperature is increased.

The composition and electrolytic conditions of the electrolytic solution used in the present invention in the case of adding chlorine ions are as follows.

(A) electrolyte composition:

Cu: 50~120g/l

H ₂ SO ₄ : 20~200g/l, preferably 40~120g/l

Chloride ion (Cl ^- ): 20~100ppm (mg/l)

Glue: 0.5ppm (mg / l) or less, preferably 0.01 ~ less than 0.2ppm (mg / l)

(B) Electrolysis conditions:

Electrolyte temperature: 20~70°C, preferably 40~60°C

Current density: 20~150A/dm ²

Anode: Pb

If the concentration of the glue exceeds 0.5 ppm, the elongation at high temperature hardly increases. Further, in order to prevent pinholes and the like, it is necessary to add a minimum amount of glue. It is preferred to add 0.01 to a dose of less than 0.2 ppm (mg/l).

It is preferred to set the sulfuric acid concentration to 20 to 200 g/l, preferably 40 to 120 g/l. If it is less than 20 g/l, the electrical conductivity of the electrolyte is lowered and the cell voltage is increased. If it exceeds 200 g/l, the production of a copper foil having a high elongation at high temperature becomes more and more difficult, and corrosion of equipment is likely to occur.

It is preferably added in an amount of from 20 to 100 ppm (mg/l) of chloride ions. Outside of this range, the basic characteristics (tensile strength, roughness, etc.) of the electrolytic copper foil cannot be fixed. Chloride ions are added in the form of hydrochloric acid, common salt, potassium chloride or the like.

Preferably, the electrolyte temperature is set to 20 to 70 ° C, preferably 40 to 60 ° C. When the temperature of the electrolyte is lowered, a copper foil having a high elongation at a high temperature can be produced even if the concentration of the solution is high. If it is less than 20 ° C, the conductivity of the electrolyte is lowered and the cell voltage is increased. If it exceeds 70 ° C, the production of a copper foil having a high elongation at high temperature becomes more and more difficult, and the energy cost also increases.

In order to produce an electrolytic copper foil stably and practically, the current density ranges from 20 to 150 A/dm ² .

Hereinafter, an example of a method of controlling the kurtosis number Sku in the raw foil foil is shown:

<raw foil foiling conditions>

In the electrolyte solution for foil production, the concentration of the glue is set to 1 to 10 ppm, SPS [sodium polydithiodipropane sulfonate] is set to 1 to 50 ppm, and the amine compound [tribasic amine compound] is set to 1 ~50 ppm, whereby the surface of the green foil is smoothed (the unevenness becomes not sharp). Thereby, in the subsequent roughening treatment, the shape of the roughened particles on the surface after the copper plating is rounded. In this manner, the kurtosis number Sku can be made smaller than a conventional electrolytic copper foil (for example, a case where a green foil is produced by using an electrolyte containing copper, sulfuric acid, Cl, or a glue liquid).

Further, the following compounds were used as the tertiary amine compound.

(In the above chemical formula, R ₁ and R ₂ are selected from the group consisting of a hydroxyalkyl group, an ether group, an aryl group, a substituted aromatic alkyl group, an unsaturated hydrocarbon group, and an alkyl group; in the following examples, R ₁ and R ₂ are both set to methyl)

Further, the above-mentioned compound used in the following examples can be obtained by mixing a predetermined amount of, for example, Denacol Ex-314 manufactured by Nagase ChemteX Co., Ltd. with dimethylamine, and reacting at 60 ° C for 3 hours.

Next, the surface of the electrolytic copper foil is roughened. As the roughening treatment, for example, the conditions shown below can be employed. In the present invention, the roughened surface of the surface of the electrolytic copper foil which has been subjected to the roughening treatment is referred to as a rough surface.

When the raw foil is a normal electrolytic copper foil (for example, a raw foil is produced by using an electrolyte containing copper, sulfuric acid, Cl, or glue)

[Copper roughening treatment conditions]

Cu: 5~50g/l

H ₂ SO ₄ : 10~100g/l

. Other added elements (any of conditions 1 to 4)

(Condition 1)

As: 0.01~20mg/l (ppm) and W: 0.01~10mg/l (ppm)

(Condition 2)

Mo: 0.01~5mg/l (ppm)

(Condition 3)

Mo: 0.01~5mg/l (ppm) And As: 0.01~5mg/l (ppm) and/or W: 0.01~5mg/l (ppm) and/or Co: 0.01~0.5mg/l (ppm)

(Condition 4)

As: 0.01~20mg/l (ppm) and W: 0.01~10mg/l (ppm) and Co: 0.01~0.5mg/l (ppm)

Liquid temperature: room temperature (20 ° C) ~ 50 ° C

Current density: 5~120A/dm ²

Time: 1~30 seconds

The raw foil is a smooth (flat) foil on both sides (because the leveling agent is added to the electrolyte, so the copper precipitation surface is smoother than the usual electrolytic copper foil) (for example, by adding copper, sulfuric acid, Cl, The case of making a foil with an electrolyte of a glue, SPS or an amine compound)

[Copper roughening treatment conditions]

Cu: 5~50g/l

H ₂ SO ₄ : 10~100g/l

. Other added elements (any of conditions 1 to 4)

(Condition 1)

As: 0.01~5mg/l (ppm) and W: 0.01~5mg/l (ppm)

(Condition 2)

Mo: 0.01~3mg/l (ppm)

(Condition 3)

Mo: 0.01~3mg/l (ppm) And As: 0.01~5mg/l (ppm) and/or W: 0.01~5mg/l (ppm) and/or Co: 0.01~1mg/l (ppm)

(Condition 4)

W: 0.01~5mg/l (ppm) and/or Co: 0.01~1mg/l (ppm)

Liquid temperature: room temperature (20 ° C) ~ 50 ° C

Current density: 5~130A/dm ²

Time: 1~30 seconds

Hereinafter, an example of a method of controlling the kurtosis number Sku in the copper roughening treatment will be described:

<copper roughening treatment conditions>

The shape of the roughened particles is rounded by adding both As and W or adding Mo to the copper roughening treatment liquid. In this way, the kurtosis number Sku can be made small.

Further, by adding Co to the copper roughening treatment liquid or separately adding W (without As), the shape of the roughened particles can be sharpened (the tip of the particles is sharp). In this way, the kurtosis number Sku can be made larger.

Further, the shape of the roughened particles can be sharpened (the tip of the particles is sharp) by lowering the liquid temperature (for example, 20 ° C or more and less than 25 ° C). In this way, the kurtosis number Sku can be made larger.

After the roughening treatment, a thin copper plating is performed as a coating for preventing the particles from falling off. For example, the following conditions can be employed.

[Copper plating conditions]

Cu: 30~100g/l

H ₂ SO ₄ : 10~200g/l

Liquid temperature: room temperature ~ 75 ° C

Current density: 5~65A/dm ²

Time: 1~30 seconds

Hereinafter, an example of a method of controlling the kurtosis number Sku in the copper plating process:

<Copper plating conditions>

The shape of the roughened particles can be sharpened by making the current density high (for example, greater than 60 A/dm ² ) (the tip of the particles is sharp). In this way, the kurtosis number Sku can be made larger.

Preferably, the roughened surface is formed to be selected from the group consisting of Cu, Cr, Ni, Fe, Co, and Processing of one or more single metal layers or alloy layers of Zn. Examples of the alloy plating include Cu-Ni, Cu-Co, Cu-Ni-Co, Cu-Zn, and others. Such processing functions as a function of determining the final characteristics of the copper foil and acting as a barrier.

Further, a single layer or alloy of nickel, cobalt, copper or zinc may be used to form a heat-resistant layer or a rust-proof layer equal to the roughened surface, and the surface may be subjected to a treatment such as chromate treatment or decane coupling treatment. Alternatively, the heat-resistant layer or the rust-preventive layer may be formed of a monomer, an alloy or the like of nickel, cobalt, copper or zinc, and the surface may be subjected to a treatment such as chromate treatment or decane coupling treatment. In other words, one or more layers selected from the group consisting of a heat-resistant layer, a rust-preventing layer, a chromate-treated layer, and a decane coupling treatment layer may be formed on the surface (roughened surface) of the roughened layer. The surface of the electrolytic copper foil is formed into one or more layers selected from the group consisting of a heat-resistant layer, a rust-preventing layer, a chromate-treated layer, and a decane coupling treatment layer. Further, the heat-resistant layer, the rust-preventing layer, the chromate-treated layer, and the decane coupling treatment layer may be formed of a plurality of layers (for example, two or more layers, three or more layers, or the like).

The surface-treated electrodeposited copper foil of the present invention can be bonded to the resin substrate from the side of the roughened surface to produce a laminate. The resin substrate is not particularly limited as long as it has characteristics suitable for use in a printed wiring board or the like. For example, a paper substrate phenol resin, a paper substrate epoxy resin, or a synthetic fiber can be used for a rigid PWB (printed wiring board). Cloth substrate epoxy resin, glass cloth-paper composite substrate epoxy resin, glass cloth-glass non-woven composite substrate epoxy resin and glass cloth substrate epoxy resin, etc., used in FPC (flexible wiring board) An ester film or a polyimide film, a liquid crystal polymer (LCP) film, or the like.

In the case of the rigid PWB, the method of bonding is prepared by impregnating a resin with a base material such as a glass cloth, and curing the resin to a semi-cured state. The copper foil can be attached by superimposing the surface of the copper foil on the opposite side of the coating layer on the prepreg and heating and pressing it. Hehe. In the case of FPC, a substrate such as a polyimide film can be laminated under high temperature and high pressure via an adhesive or without an adhesive, followed by coating on a copper foil, or coating, drying, and hardening the polyimide precursor. A laminate is produced by the object or the like.

The laminate of the present invention can be used for various printed wiring boards (PWB), and is not particularly limited. For example, from the viewpoint of the number of layers of the conductor pattern, it can be applied to single-sided PWB, double-sided PWB, and multilayer PWB (three or more layers). From the viewpoint of the kind of the insulating substrate material, it can be used for rigid PWB, flexible PWB (FPC), and rigid-flexible PWB.

[Examples]

As Examples 1 to 6 and Comparative Examples 1 to 5, raw foils were produced by the production conditions shown in Table 1, and then roughened by the production conditions shown in Table 2, and further, by Table 3 The roughened surface was subjected to copper plating plating to form rough surfaces, respectively, under the manufacturing conditions shown. In Tables 1-3, the treatment surface M represents a matte surface (precipitation surface of copper), and the treatment surface S represents a glossy surface.

Each of the samples of the examples and the comparative examples produced as described above was subjected to various evaluations as described below.

Stylus roughness; The measurement was carried out using a contact roughness meter Surfcorder SE-3C stylus type roughness meter manufactured by Otaru Research Co., Ltd.

Surface area ratio (A/B); The surface area of the rough surface is determined by a laser microscope. The three-dimensional surface area A corresponding to the area B of 257.9 × 257.9 μm (66524 μm ^{2 in the} actual data) corresponding to the roughened surface was measured by using LEXT OLS 4000 manufactured by Olympus, and the three-dimensional surface area A ÷ two-dimensional surface area B = area Set according to the method of the form of (A/B). The measurement ambient temperature was set to 23 to 25 °C.

Kurtosis number Sku; Using a LEXT OLS 4000 three-dimensional surface shape measuring apparatus manufactured by Olympus, a region of 257.9 × 257.9 μm of the roughened surface of the test material was measured at a resolution of 0.12 μm in plane and 0.01 μm in height. The measurement ambient temperature was set to 23 to 25 °C.

Normal peel strength The normal peel strength was measured by a tensile tester Autograph 100 in accordance with JIS C5016 (8.1.6 Measurement (1) Method A (90° direction peeling method)).

The high temperature bath is protruded; the copper foil is laminated on the glass cloth substrate epoxy resin sheet, and a micro-pitch circuit is formed on the copper foil by etching (aqueous solution of ferric chloride) to form a laminate. Then, the laminate was immersed in a high temperature bath at 260 ° C for 1 minute, and the number of protrusions generated on the surface was measured and converted into the number per 1 m ² .

The evaluation results are shown in Table 4.

(Evaluation results)

Each of Examples 1 to 6 had good adhesion reliability, and no protrusion was generated even when immersed in a high-temperature bath.

In Comparative Examples 1 to 5, although the roughness Rz is 2.0 μm or less, since the kurtosis number Sku of the roughness curve of the rough surface is outside the range of 2 to 4, the adhesion reliability is poor, or a large amount is generated when immersed in the high temperature bath. Protrusion.

Fig. 1 shows a SEM observation photograph of the roughened surface of the sample of Example 1. Fig. 2 shows an SEM observation photograph of the roughened surface of the sample of Comparative Example 1.

Claims (11)

A surface-treated electrodeposited copper foil having a roughness Rz of a roughness of a copper foil measured by a stylus type roughness meter of 2.0 μm or less, and a kurtosis number Sku of a roughness curve of the rough surface of 2 to 4. The surface-treated electrolytic copper foil according to claim 1, wherein the roughness Rz is 0.8 to 1.8 μm. The surface treated electrolytic copper foil according to claim 1, wherein the kurtosis number Sku is 2.5 to 3.5. The surface-treated electrodeposited copper foil according to the first aspect of the invention, wherein the ratio A/B of the surface area A of the rough surface to the area B obtained by observing the rough surface is 1.2 to 2.0. The surface-treated electrodeposited copper foil according to claim 3, wherein a ratio A/B of the surface area A of the rough surface to the area B obtained when the rough surface is viewed from above is 1.2 to 2.0. The surface treated electrolytic copper foil of claim 4, wherein the ratio A/B is 1.3 to 1.9. The surface treated electrolytic copper foil according to claim 5, wherein the ratio A/B is 1.3 to 1.9. The surface-treated electrolytic copper foil according to the first aspect of the patent application has a normal peel strength of 0.8 kg/cm or more. A laminated board comprising a surface-treated electrodeposited copper foil and a resin substrate according to any one of claims 1 to 8. A printed wiring board which is made of a laminate of the ninth application patent. An electronic machine using the printed wiring board of claim 10 of the patent application.