SG10201808518RA - Bonding electronic components to patterned nanowire transparent conductors - Google Patents
Bonding electronic components to patterned nanowire transparent conductorsInfo
- Publication number
- SG10201808518RA SG10201808518RA SG10201808518RA SG10201808518RA SG10201808518RA SG 10201808518R A SG10201808518R A SG 10201808518RA SG 10201808518R A SG10201808518R A SG 10201808518RA SG 10201808518R A SG10201808518R A SG 10201808518RA SG 10201808518R A SG10201808518R A SG 10201808518RA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic components
- transparent conductors
- patterned
- nanowire transparent
- bonding electronic
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/047—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using sets of wires, e.g. crossed wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
- H05K3/048—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer using a lift-off resist pattern or a release layer pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/026—Nanotubes or nanowires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Dispersion Chemistry (AREA)
- Laminated Bodies (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
BONDING ELECTRONIC COMPONENTS TO PATTERNED NANOWIRE TRANSPARENT CONDUCTORS A method for making an electronic assembly includes applying a conductive adhesive to a resist layer overlying a patterned conductive nanowire layer on a substrate and engaging an electrical contact of an electronic component with the conductive adhesive to provide an electrical connection between the electronic component and the conductive nanowire layer. Fig. 5
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361860841P | 2013-07-31 | 2013-07-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201808518RA true SG10201808518RA (en) | 2018-10-30 |
Family
ID=52432333
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600591VA SG11201600591VA (en) | 2013-07-31 | 2014-07-18 | Bonding electronic components to patterned nanowire transparent conductors |
SG10201808518RA SG10201808518RA (en) | 2013-07-31 | 2014-07-18 | Bonding electronic components to patterned nanowire transparent conductors |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201600591VA SG11201600591VA (en) | 2013-07-31 | 2014-07-18 | Bonding electronic components to patterned nanowire transparent conductors |
Country Status (8)
Country | Link |
---|---|
US (1) | US9980394B2 (en) |
EP (1) | EP3028126B1 (en) |
JP (1) | JP6426737B2 (en) |
KR (1) | KR102254683B1 (en) |
CN (1) | CN105453001B (en) |
BR (1) | BR112016002093A2 (en) |
SG (2) | SG11201600591VA (en) |
WO (1) | WO2015017143A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6480428B2 (en) * | 2013-09-30 | 2019-03-13 | スリーエム イノベイティブ プロパティズ カンパニー | Protective coating for printed conductive patterns on patterned nanowire transparent conductors |
US20150108632A1 (en) * | 2013-10-23 | 2015-04-23 | Nano And Advanced Materials Institute Limited | Thin film with negative temperature coefficient behavior and method of making thereof |
JP6592246B2 (en) * | 2015-01-27 | 2019-10-16 | 株式会社コムラテック | Electronic circuit board and manufacturing method thereof |
US10298152B2 (en) * | 2015-04-20 | 2019-05-21 | Lawrence Livermore National Security, Llc | Harvesting mechanical and thermal energy by combining nanowires and phase change materials |
JP6498766B2 (en) * | 2015-07-08 | 2019-04-10 | シャープ株式会社 | Touch panel device |
JP6654954B2 (en) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | Anisotropic conductive connection structure |
CN108885515A (en) * | 2016-04-05 | 2018-11-23 | 3M创新有限公司 | There is the Nanowire contacts pad of enhancing adhesiveness to metal interconnection structure |
TWI732892B (en) * | 2016-07-26 | 2021-07-11 | 日商松下知識產權經營股份有限公司 | Laminate board for see-through electrode, see-through electrode material, component, and method for manufacturing laminate board for see-through electrode |
WO2019032846A1 (en) * | 2017-08-10 | 2019-02-14 | Molex, Llc | Method and apparatus for forming an electrical circuit including aluminum and one or more dissimilar metals |
CA2985254A1 (en) | 2017-11-14 | 2019-05-14 | Vuereal Inc | Integration and bonding of micro-devices into system substrate |
DE102018106959A1 (en) * | 2018-03-23 | 2019-09-26 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT |
WO2020150902A1 (en) * | 2019-01-22 | 2020-07-30 | 深圳市柔宇科技有限公司 | Flexible display panel and manufacturing method therefor |
US11387202B2 (en) * | 2019-03-01 | 2022-07-12 | Invensas Llc | Nanowire bonding interconnect for fine-pitch microelectronics |
WO2020212336A1 (en) | 2019-04-15 | 2020-10-22 | Wika Alexander Wiegand Se & Co. Kg | Sensor for detecting pressure, filling level, density, temperature, mass and/or flow rate |
DE112020001959A5 (en) | 2019-04-17 | 2021-12-30 | Wika Alexander Wiegand Se & Co. Kg | Sensor for detecting pressure and / or fill level and / or flow rate and / or density and / or mass and / or temperature |
CN112860130A (en) * | 2019-11-26 | 2021-05-28 | 英属维尔京群岛商天材创新材料科技股份有限公司 | Touch panel and manufacturing method thereof |
US11261529B2 (en) * | 2020-03-31 | 2022-03-01 | Futuretech Capital, Inc. | Reduced visibility conductive micro mesh touch sensor |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6037005A (en) * | 1998-05-12 | 2000-03-14 | 3M Innovative Properties Company | Display substrate electrodes with auxiliary metal layers for enhanced conductivity |
US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
WO2006110634A2 (en) | 2005-04-11 | 2006-10-19 | 3M Innovative Properties Company | Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method |
CA2618794A1 (en) | 2005-08-12 | 2007-02-22 | Cambrios Technologies Corporation | Nanowires-based transparent conductors |
SG151667A1 (en) | 2006-10-12 | 2009-05-29 | Cambrios Technologies Corp | Nanowire-based transparent conductors and applications thereof |
WO2009108306A1 (en) * | 2008-02-26 | 2009-09-03 | Cambrios Technologies Corporation | Method and composition for screen printing of conductive features |
JP5397376B2 (en) * | 2008-08-11 | 2014-01-22 | コニカミノルタ株式会社 | Transparent electrode, organic electroluminescence element, and method for producing transparent electrode |
KR101938011B1 (en) * | 2009-11-20 | 2019-01-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Surface-modified adhesives |
KR101219139B1 (en) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | Anisotropic conductive paste and film, circuit connecting structure body comprising the same |
CN103069502A (en) * | 2010-03-23 | 2013-04-24 | 凯博瑞奥斯技术公司 | Etch patterning of nanostructure transparent conductors |
JP4870836B1 (en) * | 2010-11-19 | 2012-02-08 | 日本写真印刷株式会社 | Narrow frame touch input sheet manufacturing method |
WO2012005205A1 (en) | 2010-07-05 | 2012-01-12 | Dic株式会社 | Substrate with a transparent conductive layer, manufacturing method for said substrate, transparent conductive film laminate for use in a touch panel, and touch panel |
US20120247527A1 (en) | 2010-12-21 | 2012-10-04 | Alphabet Energy, Inc. | Electrode structures for arrays of nanostructures and methods thereof |
US9482693B2 (en) * | 2011-02-04 | 2016-11-01 | Shin-Etsu Polymer Co., Ltd. | Capacitive sensor sheet and production method thereof |
US9835913B2 (en) | 2011-04-15 | 2017-12-05 | 3M Innovative Properties Company | Transparent electrode for electronic displays |
JP2013077435A (en) * | 2011-09-30 | 2013-04-25 | Oji Holdings Corp | Conductive transfer sheet and conductive laminate |
KR20130071863A (en) | 2011-12-21 | 2013-07-01 | 삼성전기주식회사 | Touch panel |
KR101714286B1 (en) * | 2012-11-08 | 2017-03-08 | 알프스 덴키 가부시키가이샤 | Conductor and method for producing same |
CN104838342B (en) | 2012-12-07 | 2018-03-13 | 3M创新有限公司 | The method that transparent conductor is made on substrate |
JP6322188B2 (en) * | 2013-03-26 | 2018-05-09 | 株式会社カネカ | Conductive film substrate, transparent conductive film and method for producing the same, and touch panel |
-
2014
- 2014-07-18 EP EP14832317.3A patent/EP3028126B1/en active Active
- 2014-07-18 SG SG11201600591VA patent/SG11201600591VA/en unknown
- 2014-07-18 CN CN201480042647.9A patent/CN105453001B/en not_active Expired - Fee Related
- 2014-07-18 KR KR1020167003895A patent/KR102254683B1/en active IP Right Grant
- 2014-07-18 JP JP2016531742A patent/JP6426737B2/en active Active
- 2014-07-18 WO PCT/US2014/047212 patent/WO2015017143A1/en active Application Filing
- 2014-07-18 BR BR112016002093A patent/BR112016002093A2/en not_active IP Right Cessation
- 2014-07-18 US US14/897,521 patent/US9980394B2/en active Active
- 2014-07-18 SG SG10201808518RA patent/SG10201808518RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
BR112016002093A2 (en) | 2017-08-01 |
WO2015017143A1 (en) | 2015-02-05 |
US20160143153A1 (en) | 2016-05-19 |
US9980394B2 (en) | 2018-05-22 |
KR20160036571A (en) | 2016-04-04 |
SG11201600591VA (en) | 2016-02-26 |
EP3028126A4 (en) | 2017-01-25 |
EP3028126B1 (en) | 2020-10-07 |
JP6426737B2 (en) | 2018-11-21 |
CN105453001A (en) | 2016-03-30 |
EP3028126A1 (en) | 2016-06-08 |
CN105453001B (en) | 2018-10-16 |
JP2016530622A (en) | 2016-09-29 |
KR102254683B1 (en) | 2021-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG10201808518RA (en) | Bonding electronic components to patterned nanowire transparent conductors | |
GB201213442D0 (en) | Security wrap with breakable conductors | |
JP2015233164A5 (en) | ||
MX2018006611A (en) | Film and method for producing a film. | |
ATE439683T1 (en) | CIRCUIT ARRANGEMENT WITH CONNECTION DEVICE AND PRODUCTION METHOD THEREOF | |
ATE530443T1 (en) | LARGE AREA CIRCUIT WITH APPLICATIONS | |
GB201213447D0 (en) | Multilayer security wrap | |
GB2499162A (en) | Circuit for applying heat and electrical stimulation | |
JP2014239186A5 (en) | ||
TW200644297A (en) | Semiconductor apparatus and manufacturing method thereof | |
WO2007005617A3 (en) | Electrically conducting polymer glue, devices made therewith and methods of manufacture | |
WO2014112954A8 (en) | Substrate for semiconductor packaging and method of forming same | |
MX351312B (en) | Electronic control apparatus and method for connecting substrate of electronic control apparatus. | |
WO2014158856A3 (en) | Low-profile lighting systems | |
SG10201401166YA (en) | Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof | |
BR112016006975A2 (en) | conductive pattern backing printed on transparent nanowire conductors with a | |
WO2012150817A3 (en) | Printed circuit board and method for manufacturing the same | |
EP3586358A4 (en) | Electrical device including a substrate and a transparent conductive layer and a process of forming the same | |
EP2782138A3 (en) | Semiconductor device and method for manufacturing the same | |
MX2015011661A (en) | Adhesion of fluoropolymer to metal. | |
EP2752880A3 (en) | Graphene electronic devices and methods of manufacturing the same | |
WO2013143708A3 (en) | Switching elements with overlapping strip conductors, and method for designing a circuit configuration | |
MY195079A (en) | A Circuit Layer For An Integrated Circuit Card | |
WO2013156568A3 (en) | Circuit arrangement for thermally conductive chip assembly and production method | |
WO2017100752A3 (en) | Electronic device having a plated antenna and/or trace, and methods of making and using the same |