TW202112006A - Expansion circuit board - Google Patents

Abstract

An expansion circuit board configured to be electrically connected to a base circuit board includes a plate and an electrically conductive part. The plate has a top surface, a bottom surface, a side surface, an opening and a through hole. The top surface is opposite to the bottom surface. The side surface is connected to the top surface and the bottom surface. The opening is located on the side surface and penetrates through the top surface and the bottom surface. The through hole penetrates through the top surface and the bottom surface and is spaced apart from the side surface. The electrically conductive part includes a pad. The pad includes a first part, a second part and a third part. The first part is located on a first surface of the plate forming the opening. The third part is located on a second surface of the plate forming the through hole. The second part is located on the top surface and connected between the first part and the third part. The expansion circuit board is configured to be electrically connected to the base circuit board via the first part, the second part or the third part.

Description

Expansion circuit board

The invention relates to a circuit board, in particular to an expansion circuit board for electrically connecting a circuit carrier board.

Generally speaking, the board body of the circuit board is provided with pads, and surface-mount technology (SMT) or electrical connectors are used to electrically connect the circuit boards to each other through the pads.

Due to space constraints, circuit boards in different electronic devices need to be electrically connected to each other in different ways. However, the traditional pad can only electrically connect the circuit board to other circuit boards in a single way, so that the circuit board provided with the traditional pad cannot be electrically connected to another circuit board in many different ways. In addition, when the surface mount technology is used, the expansion circuit board stacked on the main circuit board occupies the installation space on the main circuit board, thereby compressing the space on the main circuit board for other electronic components.

The present invention is to provide an expansion circuit board, so that the expansion circuit board can be electrically connected to the circuit carrier board in a variety of different ways.

The expansion circuit board disclosed in an embodiment of the present invention is used for electrically connecting to a circuit carrier board, and includes a board body and at least one signal transmission part. The board has a top surface, a bottom surface, at least one side surface, at least one conducting groove and at least one conducting hole. The top surface and the bottom surface are opposite to each other. At least one side surface is connected to the top surface and the bottom surface. At least one conducting groove is located on at least one side surface and penetrates the top surface and the bottom surface. At least one via hole penetrates the bottom surface and the top surface and is separated from at least one side surface. The at least one signal transmission part includes at least one electrical connection pad. At least one electrical connection pad includes a first part, a second part, and a third part. The first part is located on at least one first wall surface of at least one conducting groove formed in the plate body. The third part is located on at least one second wall surface where at least one via hole is formed in the board. The second part is located on the top surface and connects the first part and the third part. The expansion circuit board is used for electrically connecting to the circuit carrier through the first part, the second part or the third part.

The expansion circuit board disclosed in another embodiment of the present invention is used for electrically connecting to a circuit carrier board, and includes a board body and at least one signal transmission part. The board has a top surface, a bottom surface, at least one side surface and a plurality of conducting grooves. The top surface and the bottom surface are opposite to each other. At least one side surface is connected to the top surface and the bottom surface. The conduction groove is located on at least one side surface and penetrates the top surface and the bottom surface. The at least one signal transmission part includes a plurality of electrical connection pads. Each electrical connection board includes a first part and a second part that are connected. The first part is respectively located on a plurality of wall surfaces of the plate body forming a conducting groove. The second part is located on the top surface, and each has two wide sections and one narrow section. In each electrical connection plate, the opposite sides of the narrow section are respectively connected to two wide sections, one of the wide section is connected to the first part, and in an arrangement direction of the electrical connection plate, the minimum width of the two wide sections is larger than the narrow section The minimum width. The expansion circuit board is used for electrically connecting to the circuit carrier through the first part or the second part.

According to the expansion circuit board disclosed in the above embodiment, since the first part of the electrical connection plate is located on the wall surface of the board where the through groove is formed, and the second part of the electrical connection plate is connected to the first part and is located on the top surface, Therefore, the expansion circuit board can be electrically connected to the circuit carrier in a horizontal or vertical manner through the first part and the second part, respectively. In this way, the expansion circuit board can be electrically connected to the circuit carrier board in a variety of different ways.

In addition, since the electrical connection pad further includes a third part on the wall surface of the board where the through hole is formed, the expansion circuit board can be electrically connected to the circuit carrier through the third part through the additional electrical connector, and then The way to electrically connect the expansion circuit board to the circuit carrier is more diverse.

The above description of the content of the present invention and the description of the following embodiments are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

The detailed features and advantages of the present invention will be described in detail in the following embodiments. The content is sufficient to enable anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and in accordance with the content disclosed in this specification, the scope of patent application and the drawings. Anyone who is familiar with relevant skills can easily understand the purpose and advantages of the present invention. The following examples further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention by any viewpoint.

Please refer to Figure 1 to Figure 4. FIG. 1 is a three-dimensional schematic diagram of a circuit carrier board and an expansion circuit board according to the first embodiment of the present invention. FIG. 2 is a three-dimensional view of the expansion circuit board in FIG. 1. FIG. FIG. 3 is a partial enlarged view of the three-dimensional view of the expansion circuit board in FIG. 2.

An expansion circuit board 10 of this embodiment is used to electrically connect to a circuit carrier 20, and includes a board body 100 and a plurality of signal transmission parts 200, 200x, and 200y.

The board body 100 has a top surface 101, a bottom surface 102, a plurality of side surfaces 103, 103 x, 103 y, a plurality of conductive grooves 104, 104 x, 104 y, a plurality of conductive holes 105, 105 x, 105 y, and a plurality of recesses 108. The top surface 101 and the bottom surface 102 are opposite to each other. The side surfaces 103, 103x, and 103y are connected to the top surface 101 and the bottom surface 102. The conductive groove 104 is located on the side surface 103 and penetrates the top surface 101 and the bottom surface 102. The conductive groove 104x is located on the side surface 103x and penetrates the top surface 101 and the bottom surface 102. The conductive groove 104y is located on the side surface 103y and penetrates the top surface 101 and the bottom surface 102. The through groove 104 and the through hole 105 are located on the same side of the board 100, and the through hole 105 penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103. The via groove 104x and the via hole 105x are located on the same side of the board 100, and the via hole 105x penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103x. The through groove 104y and the through hole 105y are located on the same side of the board 100, and the through hole 105y penetrates the bottom surface 102 and the top surface 101 and is separated from the side surface 103y.

It should be noted that, in order to facilitate the description and clearly present the features of the present invention, only the side 103 is shown in some of the drawings.

As shown in FIG. 3, the two recessed portions 108 are respectively located on opposite sides of the side surface 103, so that the board 100 has two bearing surfaces 109, wherein the two bearing surfaces 109 are respectively located in the two recessed portions 108 and have a protruding distance. D1 is spaced from the side 103.

Please refer to Figure 3, Figure 4 and Figure 5. FIG. 4 is a partial enlarged view of the top view of the expansion circuit board in FIG. 2. FIG. FIG. 5 is a partial enlarged view of an exploded view of the expansion circuit board in FIG. 2. FIG.

Since the signal transmission part 200 is similar in structure to the signal transmission parts 200x and 200y in FIG. 2, for the convenience of description and clearly present the characteristics of the present invention, only the structure of the signal transmission part 200 will be described in detail below, and the details of FIG. 2 will not be repeated. The structure of the signal transmission part 200x, 200y in the.

The signal transmission parts 200 each include a plurality of electrical connection pads 201. The electrical connection pads 201 each include a first part 202, a second part 203, and a third part 204. The first portions 202 are respectively located on the first wall surfaces 106 of the board 100 where the conductive grooves 104 are respectively formed. The third portion 204 is respectively located on a plurality of second wall surfaces 107 in the board body 100 where the through holes 105 are respectively formed. The second part 203 is located on the top surface 101, and in each electrical connection plate 201, the second part 203 connects the first part 202 and the third part 204.

In addition, as shown in FIG. 5, the second part 203 each has two wide sections 2030 and a narrow section 2031. In each electrical connection plate 201, opposite sides of the narrow section 2031 are respectively connected to two wide sections 2030 and two wide sections 2030. The segment 2030 is connected to the first part 202 and the third part 204 respectively. In an arrangement direction A1 of the electrical connection pads 201, the minimum width W1 of the wide section 2030 is greater than the minimum width W2 of the narrow section 2031.

In addition, the second part 203 has two parallel sides 2032 each. In each second part 203, the two oblique sides 2032 each have a first side 2033 and a second side 2034 opposite to each other, wherein the two first sides 2033 are located on the side surface 103, and the distance between the two oblique sides 2032 is from the second side The one side 2033 to the two second sides 2034 remain the same.

In this embodiment, the second part of the electrical connection pad 201 is formed on the top surface 101 of the board body 100, for example, by electroplating, but the invention is not limited to this. In other embodiments, if the board includes a conductive layer and an insulating layer covering the conductive layer, the second part of the electrical connection pad may also be exposed to the conductive layer of the board due to the removal of the insulating layer. Outside part.

Please refer to Figure 1, Figure 6, and Figure 7. 6 is a partial enlarged view showing the front cross-sectional view of the board body of the expansion circuit board inserted into the circuit carrier. FIG. 7 is a schematic side view of the expansion circuit board and the circuit carrier board in FIG. 6.

As shown in FIGS. 6 and 7, when the board 100 is inserted into a slot 21 of the circuit carrier 20, the two bearing surfaces 109 will bear against the circuit carrier 20, and the additional board 100 is inserted in the circuit The stability of the carrier board 20, and part of the second part 203 will be located in the slot 21. Then, for example, wave soldering is performed to electrically connect the expansion circuit board 10 and the circuit carrier 20 through the second part 203 and the electrical connection pad 22 on the circuit carrier 20. After the wave soldering is completed, the expansion circuit board 10 can be electrically connected to the circuit carrier board 20 in a vertical manner.

As shown in FIG. 6, since the protruding distance D1 between the side surface 103 and the two supporting surfaces 109 is greater than a thickness T of the circuit carrier board 20, a part of the second part 203 will be exposed to the outside. In this way, during the wave soldering process, the second part 203 can have a larger surface area for solder attachment, thereby increasing the stability of the expansion circuit board 10 fixed to the circuit carrier 20.

Of course, the protrusion distance D1 between the side surface 103 and the two supporting surfaces 109 is not limited to be greater than the thickness T of the circuit carrier board 20; in other embodiments, the protrusion distance may not be greater than the thickness of the circuit carrier board, in this case In this way, an adhesive can be further filled between the expansion circuit board and the circuit carrier to increase the stability of the expansion circuit board fixed on the circuit carrier.

In addition, please refer to FIG. 5 additionally, because the narrow section 2031 is located in the slot 21, and the minimum width W2 of the narrow section 2031 is smaller than the minimum width W1 of the wide section 2030; that is, for the adjacent two electrical connection pads 201 , The distance between two adjacent narrow sections 2031 is greater than the distance between two adjacent wide sections 2030. In this way, during the wave soldering process, the solder attached to the circuit carrier 20 and located in the socket 21 is less likely to spread to the two adjacent narrow sections 2031, thereby preventing the two adjacent narrow sections 2031 from contacting each other. Form a short circuit.

Of course, the board body 100 is not limited to having a plurality of recesses 108; in other embodiments, the board body may not have recesses, and a support provided on the board body is used instead to support or be inserted into the circuit carrier. Increase the stability of the expansion circuit board inserted into the circuit carrier board.

In addition, the second part 203 is not limited to the wide section 2030 and the narrow section 2031 having different minimum widths in the arrangement direction A1. In other embodiments, the second part may also have a fixed width in the arrangement direction. In addition, the distance between the adjacent electrical connection pads is increased to prevent the solder attached to the adjacent electrical connection pads from contacting each other and forming a short circuit.

In addition, please refer to FIG. 8. FIG. 8 is a partial enlarged view of a three-dimensional view showing that the expansion circuit board is electrically connected to the circuit carrier through the surface mount technology. The expansion circuit board 10 can also be horizontally and electrically connected to the electrical connection pad 22a on the circuit carrier board 20a through the first part 202 by surface mounting technology.

Furthermore, please refer to FIG. 9. FIG. 9 is a partial enlarged view of a three-dimensional exploded view showing that the expansion circuit board is electrically connected to the circuit carrier through the electrical connector. The expansion circuit board 10 can also be electrically connected to the circuit carrier board 20b through the electrical connector 30, wherein the electrical connector 30 contacts the third portion 204 and the wall surface 24b of the circuit carrier board 20b where the through hole 23b is formed.

Please refer to FIGS. 1 and 2 again. These signal transmission parts 200, 200x, and 200y can be electrically connected to additional expansion circuit boards or circuit carrier boards in different ways according to actual needs. However, the expansion circuit board 10 is not limited to It includes a plurality of signal transmission portions 200, and each signal transmission portion 200 is not limited to include a plurality of electrical connection pads 201, and the board body 100 is not limited to include a plurality of conductive grooves 104, a plurality of conductive holes 105, and a plurality of recessed portions 109; In other embodiments, the expansion circuit board may only include a signal transmission part, and the signal transmission part may only include an electrical connection pad. Furthermore, in an embodiment in which the expansion circuit board only includes a signal transmission portion, and the signal transmission portion only includes an electrical connection pad, the board body may only have a conductive groove, a conductive hole and a recessed portion.

Please refer to Figure 10 and Figure 11. 10 is a partial enlarged view of a perspective view of an expansion circuit board according to a second embodiment of the present invention. FIG. 11 is a schematic side sectional view of the expansion circuit board in FIG. 10. Since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the second embodiment, only the parts of the second embodiment that are different from the first embodiment will be described below, and the same parts will not be repeated. Part.

The expansion circuit board 10a of this embodiment further has two slits 110a. The two cut grooves 110a are respectively recessed from the top surface 101a and the bottom surface 102a, and are, for example, v-cut grooves. A cutting plane P is defined. The cutting plane P is perpendicular to the bottom surface 102a and the top surface 101a of the board 100a, and passes through the two cut grooves 110a and the via 105a.

Please refer to FIG. 12. FIG. 12 is a partial enlarged view of the three-dimensional view of the expansion circuit board in FIG. 10 after being cut along the notch.

After the board 100a in FIG. 10 is cut along the cutting plane P, the expansion circuit board 10b can still be horizontally electrically connected to the circuit carrier through the surface mount technology through the third part 204b that is not completely cut off. Therefore, if the expansion circuit board 10a in FIG. 10 and the circuit carrier board only need to be electrically connected in a horizontal manner, the above-mentioned cutting operation can be performed to obtain a smaller expansion circuit board 10b. As a result, compared with the expansion circuit board 10a in FIG. 10, the expansion circuit board 10b occupies a smaller space in the electronic device.

Please refer to FIG. 13, which is a partial enlarged view of the top view of the expansion circuit board according to the third embodiment of the present invention. It should be noted that since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the third embodiment, only the parts of the third embodiment that are different from the first embodiment will be described below. Do not repeat the same parts.

In this embodiment, the second part 203c each has two oblique sides 2032c. In each second part 203c, the two oblique sides 2032c each have a first side 2033c and a second side 2034c opposite to each other, wherein the two first sides 2033c are located on the side 103c, and the distance between the two oblique sides 2032c is from the second side One side 2033c to the second side 2034c gradually increase. In this way, since the distance between the two first sides 2033c of each second part 203c is smaller than the distance between the two second sides 2034c of each second part 203c, the first part 202c is electrically connected horizontally. When the circuit board 10c and the circuit carrier board are expanded, the oblique edge 2032c can prevent the solder attached to the adjacent second portion 203c from contacting each other and forming a short length.

In addition, the board is not limited to have through holes, and each electrical connection pad is not limited to include the third part. Please refer to FIG. 14, which is a partial enlarged view of the exploded view of the expansion circuit board according to the fourth embodiment of the present invention. Figure. It should be noted that since the expansion circuit board of the first embodiment is similar in structure to the expansion circuit board of the fourth embodiment, only the parts of the fourth embodiment that are different from the first embodiment will be described below. Do not repeat the same parts.

In this embodiment, the board body 100d of the expansion circuit board 10d does not have the through holes 105 in FIG. 5, and the electrical connection pad 201d does not include the third part 204 in FIG. 5, that is, the electrical connection pad 201d only It has a connected first part 202d and a second part 203d, wherein the first part 202d is located in the plate body 100d on the wall 106d forming the conducting groove 104d.

The expansion circuit board 10d of this embodiment can be electrically connected to the circuit carrier in a vertical manner through the second part 203d, or electrically connected to the circuit carrier in a horizontal manner through the first part 202d.

According to the expansion circuit board disclosed in the above embodiment, since the first part of the electrical connection plate is located on the wall surface of the board where the through groove is formed, and the second part of the electrical connection plate is connected to the first part and is located on the top surface, Therefore, the expansion circuit board can be electrically connected to the circuit carrier in a horizontal or vertical manner through the first part and the second part, respectively. In this way, the expansion circuit board can be electrically connected to the circuit carrier board in a variety of different ways.

In addition, since the electrical connection pad further includes a third part on the wall surface of the board where the through hole is formed, the expansion circuit board can be electrically connected to the circuit carrier through the third part through the additional electrical connector, and then The way to electrically connect the expansion circuit board to the circuit carrier is more diverse.

Although the present invention is disclosed in the foregoing embodiments as above, it is not intended to limit the present invention. Anyone familiar with similar art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of patent protection for inventions shall be determined by the scope of patent applications attached to this specification.

10, 10a, 10b, 10c, 10d: expansion circuit board 100, 100a, 100d: plate body 101, 101a: top surface 102, 102a: bottom surface 103, 103x, 103y: side 104, 104d, 104x, 104y: conduction slot 105, 105a, 105x, 105y: vias 106: The first wall 106d: wall surface 107: The second wall 108: Depressed part 109: bearing surface 110a: grooving 200, 200x, 200y: Signal transmission section 201, 201d: electrical connection plate 202, 202c, 202d: Part One 203, 203c, 203d: part two 2030: wide section 2031: narrow section 2032: Parallel edges 2032c: Hypotenuse 2033, 2033c: first side 2034, 2034c: second side 204, 204b: Part Three 20, 20a, 20b: circuit carrier board 21: Slot 22, 22a: electrical connection plate 24b: wall surface 30: electrical connector D1: Projection distance P: cutting plane A1: Arrangement direction W1, W2: minimum width T: thickness

FIG. 1 is a three-dimensional schematic diagram of a circuit carrier board and an expansion circuit board according to the first embodiment of the present invention. FIG. 2 is a three-dimensional view of the expansion circuit board in FIG. 1. FIG. FIG. 3 is a partial enlarged view of the three-dimensional view of the expansion circuit board in FIG. 2. FIG. 4 is a partial enlarged view of the top view of the expansion circuit board in FIG. 2. FIG. FIG. 5 is a partial enlarged view of an exploded view of the expansion circuit board in FIG. 2. FIG. 6 is a partial enlarged view showing the front cross-sectional view of the board body of the expansion circuit board inserted into the circuit carrier. FIG. 7 is a schematic side view of the expansion circuit board and the circuit carrier board in FIG. 6. FIG. 8 is a partial enlarged view showing a perspective view of the expansion circuit board being electrically connected to the circuit carrier through the surface mount technology. FIG. 9 is a partial enlarged view of a three-dimensional exploded view showing that the expansion circuit board is electrically connected to the circuit carrier through an electrical connector. 10 is a partial enlarged view of a perspective view of an expansion circuit board according to a second embodiment of the present invention. FIG. 11 is a schematic side sectional view of the expansion circuit board in FIG. 10. FIG. 12 is a partial enlarged view of a perspective view of the expansion circuit board in FIG. 10 after being cut along the notch. FIG. 13 is a partial enlarged view of the top view of the expansion circuit board according to the third embodiment of the present invention. Fig. 14 is a partial enlarged view of an exploded view of an expansion circuit board according to a fourth embodiment of the present invention.

10: Expansion circuit board

100: Board body

200, 200x, 200y: Signal transmission section

20: Circuit carrier board

21: Slot

22: Electrical connection plate

Claims (10)

An expansion circuit board for electrically connecting to a circuit carrier board, the expansion circuit board comprising: A board has a top surface, a bottom surface, at least one side surface, at least one conduction groove, and at least one through hole. The top surface and the bottom surface are opposite to each other. The at least one side surface is connected to the top surface and the bottom surface. A conductive groove is located on the at least one side surface and penetrates the top surface and the bottom surface, the at least one conductive hole penetrates the bottom surface and the top surface and is separated from the at least one side surface; and at least one signal transmission portion includes at least one electrical connection Plate, the at least one electrical connection plate includes a first part, a second part and a third part, and the first part is located on at least one first wall surface of the at least one conducting groove in the plate body, The third part is located on at least one second wall surface of the board where the at least one via hole is formed, the second part is located on the top surface, and connects the first part and the third part, the expansion circuit The board is used for electrically connecting to the circuit carrier through the first part, the second part or the third part. For example, the expansion circuit board described in claim 1, wherein the number of the at least one electrical connection pad, the number of the at least one conduction groove, and the number of the at least one through hole are multiple, and the conduction grooves are located in the On at least one side, the second parts of the electrical connection plates each have two wide sections and a narrow section. In each of the electrical connection plates, opposite sides of the narrow section are connected to the two wide sections, respectively. Two wide sections are respectively connected to the first part and the third part, and in an arrangement direction of the electrical connection plates, the minimum width of the two wide sections is greater than the minimum width of the narrow section. The expansion circuit board as described in claim 1, wherein the number of the at least one signal transmission portion, the number of the at least one via groove, the number of the at least one via hole, and the number of the at least one side surface are all multiple , And the conductive grooves are respectively located on the side surfaces. The expansion circuit board according to the first item of the scope of patent application, wherein the board body has a recessed portion, and the recessed portion is located on one side of the at least one side surface, so that the board body has a bearing surface, and the bearing surface Located in the recessed portion and spaced apart from the at least one side surface, when the board body is inserted into a slot of the circuit carrier board, the bearing surface is used for supporting the circuit carrier board. The expansion circuit board according to item 4 of the scope of patent application, wherein a protrusion distance between the at least one side surface and the supporting surface is greater than a thickness of the circuit carrier board. As for the expansion circuit board described in claim 1, wherein the second part has two oblique sides, and each of the two oblique sides has a first side and a second side opposite to each other, and the two first sides are located at The distance between the at least one side and the two oblique sides gradually increases from the two first sides to the two second sides. The expansion circuit board described in item 1 of the scope of patent application, wherein the board body has two slits to define a cutting plane, and the cutting plane is perpendicular to the bottom surface and the top surface of the board body and passes through the two slits And the via hole. An expansion circuit board for electrically connecting to a circuit carrier board, the expansion circuit board comprising: A plate body has a top surface, a bottom surface, at least one side surface and a plurality of conduction grooves, the top surface and the bottom surface are opposite to each other, the at least one side surface is connected to the top surface and the bottom surface, and the conduction grooves are located at the at least A side surface penetrates the top surface and the bottom surface; and at least one signal transmission portion includes a plurality of electrical connection pads, each of the electrical connection pads includes a first part and a second part connected to each other, the first Parts are respectively located on the wall surfaces forming the conduction grooves in the board body, the second parts are located on the top surface, and each has two wide sections and one narrow section. In each of the electrical connection plates, the narrow The opposite sides of the section are respectively connected to the two wide sections, one of the wide section is connected to the first part, and in an arrangement direction of the electrical connection plates, the minimum width of the two wide sections is larger than the narrow section The expansion circuit board is used to electrically connect to the circuit carrier through the first part or the second part. For the expansion circuit board described in item 8 of the scope of patent application, the number of the at least one signal transmission portion and the number of the at least one side surface are both multiple, and the conduction grooves are respectively located on the side surfaces. For the expansion circuit board described in item 8 of the scope of patent application, one side of at least one side surface has a recessed portion, so that the board has a bearing surface, and the bearing surface is located in the recessed portion and is connected to the at least one The side surfaces are spaced apart from each other, and when the board body is inserted into a slot of the circuit carrier board, the bearing surface is used for supporting the circuit carrier board.

Images