JP2021002465A - Wafer clip and connector - Google Patents

Abstract

To provide a wafer clip that is applied to a connector having a structure in which wafers are laminated and a gap is provided between the wafers, and suppresses bending and breakage of the wafer at the time of mounting.SOLUTION: A wafer clip 30 is a member manufactured by punching a single metal plate. The wafer clip 30 has a plurality of plate portions 31 and one connecting portion 32. The plate portions 31 are arranged at a predetermined pitch. Further, the connecting portion 32 extends along the plurality of plate portions 31 and connects the plate portions 31 to each other. The wafer clip 30 is inserted into grooves 218 and 228. Then, the plate portion 31 is inserted into each gap V. As a result, bending and breakage of the wafer 20 can be suppressed even when the wafer 20 is pressed with strong force during mounting.SELECTED DRAWING: Figure 9

Description

The present invention relates to a connector in which a plurality of wafers having a wiring plate having a plurality of wirings having terminals inserted into through holes of a circuit board and a pair of shield plates sandwiching the wiring plates from both sides are laminated. Furthermore, the present invention relates to a wafer clip that holds a laminated wafer in a laminated state.

Conventionally, there has been known a connector in which a plurality of wafers (chiclets) having a wiring board and a pair of shield plates sandwiching the wiring board from both sides are laminated. Each wafer has a plate shape with press-fit terminals protruding from the lower end. Then, a plurality of these wafers are laminated to form a connector having a large number of wirings and a large number of press-fit type terminals (see, for example, Patent Documents 1 and 2).

Japanese Unexamined Patent Publication No. 2005-527068 Japanese Unexamined Patent Publication No. 2008-535185

When inserting a large number of press-fit type terminals that make up a connector with the above structure into the through holes of a circuit board, the number of terminals is enormous, so some connectors need to be pressed with a force of 1 ton or more. Exists. Since it is necessary to withstand this large force, the wafer has a plate shape having the same thickness as the pitch of the through holes of the circuit board and in contact with each other. Then, when the wafers are laminated, the wafers support each other and can withstand a large force. The connectors of Patent Documents 1 and 2 described above follow this.

Here, the wafer itself can be made into a thinner shape. In the case of a thin wafer, less material is required, which is advantageous in terms of cost. However, considering the electrical characteristics, it is difficult to set the pitch of the through holes of the circuit board to a small pitch corresponding to the thin shape. Moreover, the pitch that has been followed so far is a pitch larger than the minimum pitch that can be tolerated from the viewpoint of electrical characteristics. Therefore, when thin wafers are arranged at this pitch, it becomes necessary to arrange the wafers apart from each other.

Therefore, it is considered to form a contact portion on the wafer, which basically acts as a spacer that abuts on the adjacent wafer and maintains a predetermined pitch while maintaining a thin shape. Alternatively, a housing is prepared in which a plurality of wafers are held in a state where the wafers are arranged at a distance from each other without providing a contact portion on the wafer.

However, not only in the case of a wafer having no contact portion, but also in the case of a wafer having a contact portion, in the case of a connector in which the wafers are laminated, a gap is provided between adjacent wafers except for the contact portion. Is formed. In order to mount this connector on the circuit board, a strong force as described above is applied to this connector. Then, in the case of a connector having this structure, it is difficult for a force to support each other between adjacent wafers to work, and the wafers may bend without being able to withstand the force and may be damaged.

An object of the present invention is to provide a wafer clip that is applied to a connector having the above structure and suppresses bending and breakage of a wafer, and a connector having the wafer clip.

The wafer clip of the present invention that achieves the above object is
It has a plurality of plate portions arranged at a predetermined pitch and a connecting portion extending along the plurality of plate portions and connecting the plurality of plate portions to each other.
A plurality of wafers having a wiring board in which a plurality of wires having terminals to be inserted into through holes of a circuit board are insert-molded into resin and a pair of shield plates extending so as to sandwich the wiring boards from both sides are provided. It is characterized in that it is inserted into the gap in a state in which two wafers adjacent to each other are laminated so as to form a gap between two facing shield plates.

In one wafer clip of the present invention, a plurality of laminated wafers are integrally held by a connecting portion. Further, in the case of the wafer clip of the present invention, the plate portions are inserted into the gaps between the two shielding plates facing each other of the two wafers adjacent to each other. In that state, press the connector with a strong force. Then, the plate portion of the wafer clip serves as a support for the wafers on both sides, and deformation or breakage of the wafer is suppressed.

Here, in the wafer clip of the present invention, it is preferable that a plurality of plate portions and the entire connecting portion are made of one metal plate.

By manufacturing this wafer clip by processing one metal plate, it becomes a wafer clip that is inexpensive and strongly suppresses deformation and breakage of the wafer as compared with a resin having the same thickness.

The wafer clip produced by processing one metal plate may have a plurality of plate portions and the entire connecting portion made of one metal flat plate.

In this case, the bending process of the metal plate is not necessary and only the punching process is required. In addition, it is possible to stack a large number of sheets for storage in a space-saving manner.

Alternatively, in a wafer clip produced by processing one metal plate, a plurality of plate portions are arranged in two rows, and the two rows of plate portions share a connecting portion and are connected to each other at the connecting portion. You may be.

In this case, the wafer clip is made of a single metal flat plate, and the wafer is strongly suppressed from being deformed or broken as compared with the wafer clip.

Further, the connector of the present invention is
A plurality of wafers including a wiring board in which a plurality of wires having terminals to be inserted into through holes of a circuit board are insert-molded in resin and a pair of shield plates extending so as to sandwich the wiring boards from both sides. A plurality of wafers laminated so as to form a gap between two facing shield plates of two wafers adjacent to each other, and a plurality of plate portions arranged at a predetermined pitch and a plurality of plate portions. It is characterized by having a connecting portion extending along the above and connecting a plurality of plate portions to each other, and the plate portion provided with a wafer clip inserted into the gap.

The connector of the present invention includes a wafer clip having a plate portion inserted in a gap between two shielding plates facing each other of two adjacent wafers. When mounting on a circuit board, this connector is pressed with a strong force. Then, the plate portion of the wafer clip maintains the distance between the wafers on both sides, and the deformation and breakage of the wafer are suppressed.

Here, the connector of the present invention comprises two wiring boards in which the wiring boards are stacked so that the corresponding wirings face each other.
The pair of shield plates may be arranged so as to sandwich the wiring on the two wiring boards from both sides of the bundle of the two wiring boards.

Further, the connector of the present invention may also have a contact portion in which the wiring boards are in contact with each other adjacent to each other to separate two facing shield plates of two adjacent wafers at a predetermined interval. This is a preferred embodiment.

When the wiring board of the wafer has a contact portion, the wafer itself forms a laminated body separated at a predetermined interval without relying on another member, for example, a housing that supports a plurality of wafers.

According to the above invention, a wafer clip that suppresses bending and breakage of a wafer even when the connector is pushed with a strong force when the connector is mounted on a circuit board, and a connector provided with the wafer clip are realized.

It is a perspective view of the connector as one Embodiment of this invention. It is a perspective view of one wafer which comprises the connector of FIG. It is an exploded perspective view of the wafer shown in FIG. It is a perspective view which showed the cross section along the arrow XX shown in FIG. It is an enlarged view of the region of the ellipse R shown in FIG. It is a schematic diagram which showed the defect which may occur when the wafer clip is not inserted. It is a perspective view which showed the laminated wafer and the clip for the wafer before being inserted. It is a perspective view which showed the laminated wafer and the clip for the wafer in the inserted state. It is a perspective view which showed the cross section along the arrow YY shown in FIG. It is a perspective view which showed the state in which a plurality of wafer clips (4 in this case) were inserted. It is a perspective view which shows the clip for the wafer of the 2nd Embodiment of this invention. It is a perspective view which shows the laminated wafer (4 wafers in this case) and the wafer clip shown in FIG. 11 in the inserted state.

Hereinafter, embodiments of the present invention will be described.

FIG. 1 is a perspective view of a connector as an embodiment of the present invention.

The connector 10 is composed of a plurality of laminated wafers (8 in the case of the connector 10), a front cover 41, a rear cover 42, and a lower cover 43. The wafer 20 will be described in detail later. The front cover 41 integrally holds a plurality of wafers 20 and forms a fitting portion with a situation partner connector (not shown). Further, the rear cover 42 and the lower cover 43 integrally hold a plurality of wafers 20 together with the front cover 41.

FIG. 2 is a perspective view of one wafer constituting the connector of FIG.

Further, FIG. 3 is an exploded perspective view of the wafer shown in FIG.

As shown in FIG. 3, the wafer 20 is composed of two wiring boards 21 and 22 and two shield plates 23 and 24. The wiring board 21 is a plate-shaped component in which a metal wiring 21A composed of a plurality of arranged individual wirings 211 is insert-molded into a resin plate 21B. Similarly to this, the wiring board 22 is a plate-shaped component in which a metal wiring 22A composed of a plurality of arranged individual wirings 221 is insert-molded into a resin plate 22B.

When these two wiring boards 21 and 22 are overlapped with each other, the individual wirings 211 and 221 of the metal wiring 21A and the metal wiring 22A facing each other face each other. Further, a contact 212 in contact with a mating contact of a mating connector (not shown) is formed at a lateral end of each individual wiring 211 constituting the metal wiring 21A. Further, a press-fit type terminal 213 to be inserted into a through hole of a circuit board (not shown) is formed at a downward end of each of these individual wirings 211. Similarly, at the lateral end of each individual wiring 221 constituting the metal wiring 22A, a contact 222 in contact with the mating contact of the mating connector (not shown) is formed. Further, a terminal 223 to be inserted into a through hole of a circuit board (not shown) is formed at a downward end of each of these individual wirings 221. That is, the connector 10 provided with the wafer 20 is a connector that transmits and receives signals transmitted and received between the mating connector and the circuit board.

Further, the resin plate 21B of one of the two wiring boards 21 and 22 is provided with a plurality of protrusions 214 protruding toward the other wiring board 22. Correspondingly, the resin plate 22B of the other wiring board 22 is formed with a hole 224 for receiving the protrusions 214 at a position corresponding to each of the plurality of protrusions 214. By inserting the protrusion 214 formed in the above into the hole 224 formed in the resin plate 22B, the two wiring boards 21 and 22 are integrated in a state of being overlapped with each other.

The two shield plates 23 and 24 are arranged so as to sandwich the two wiring boards 21 and 22 in a state of being overlapped with each other from both sides. A plurality of ground contacts 231,241 connected to the ground contact of the mating connector are arranged on one side of these two shield plates 23, 24 in the lateral direction. A plurality of ground terminals 232 and 242 connected to the ground of the circuit board are arranged on the downward sides of these two shield plates 23 and 24. Further, a plurality of holes 243 are also formed in the shield plate 24 on the wiring plate 22 side. A part of these plurality of holes 243 is a hole into which the protrusion 214 of one wiring board 21 penetrates through the hole 224 of the other wiring board 22 and is inserted. Further, a plurality of protrusions 225 are also formed on the resin plate 22B of the adjacent wiring board 22. These plurality of protrusions 225 also penetrate the hole 243 of the shield plate 24. Further, the resin plate 22B is formed with an eaves 226 and a rear wall 227 protruding toward the shield plate 24 side.

As shown in FIG. 2, the shield plate 24 is covered with the eaves 226 and the rear wall 227 by inserting the plurality of protrusions 214 and 225 of the two wiring plates 21 and 22 into the plurality of holes 243. It is placed in the same position. Further, when comparing the protrusions 214 and 225 protruding from the holes 243 of the shield plate 24, the protrusions 225 of the wiring board 22 protrude greatly. The height of the tip of the protrusion 225 toward the wiring board 22 coincides with the height of the eaves 226 and the rear wall 227 in the protruding direction of the protrusion 225. That is, the dimensions of the wafer 20 on the shield plate 24 side in the thickness direction are defined by the eaves 226, the rear wall 227, and the protrusions 225.

Further, the resin plate 21B of the wiring plate 21 is also provided with the eaves 216 and the rear wall 217. Further, a plurality of protrusions (not shown here) are also formed on the surface of the resin plate 21B on the shield plate 23 side. A hole 233 is also formed in the shield plate 23 at a position symmetrical to the hole 243 of the other shield plate 24. When the protrusion of the wiring board 21 is inserted into the hole 233 of the shield plate 23, the shield plate 24 shown in FIG. 2 is formed on the surface of the shield plate 23 on the side through which the protrusion penetrates, which is not shown in FIG. Protrusions arranged in a pattern symmetrical with the protruding protrusions 214 and 225 appear. Further, the heights of these protrusions are also the same as the heights of the protrusions 214 and 225 protruding from the shield plate 24 shown in FIG. Further, the heights of the eaves 216 and the rear wall 217 of the wiring board 21 are also the same as the heights of the eaves 216 and the rear wall 217 of the wiring board 22. That is, the uneven pattern on the shield plate 23 side of the wafer 20 is symmetrical with the uneven pattern on the shield plate 24 side. In other words, the thickness dimension of the shield plate 23 in the thickness direction of the wafer 20 is defined by the eaves 216, the rear wall 217, and the protrusions protruding from the wiring plates 21 and 22. The shield plates 23 and 24 are arranged inside the thickness dimension of the wafer 20 defined by the eaves 216, 226 and the like.

FIG. 4 is a perspective view showing a cross section taken along the arrow XX shown in FIG.

Further, FIG. 5 is an enlarged view of the region of the ellipse R shown in FIG.

FIG. 5 shows that the corresponding individual wirings 211 and 221 constituting the two metal wirings 21A and 22A are arranged facing each other. Then, in FIG. 5, it is shown that the shield plates 23 and 24 are arranged on both sides of the individual wirings 211 and 221. Further, FIG. 5 shows a state in which the eaves 216 and 226 of two adjacent wafers 20 are in contact with each other. Similarly, the rear walls of the two wafers 20 are in contact with each other, and the protrusions of the two adjacent wafers 20 are in contact with each other. A gap V is formed between the shield plates 23 and 24 of the two adjacent wafers 20 facing each other. A wafer clip 30 (see FIG. 7), which will be described later, is inserted into this gap V. The eaves 216, 226, etc. that abut when these two wafers 20 are stacked correspond to an example of the contact portion referred to in the present invention.

FIG. 6 is a schematic view showing a defect that may occur when the wafer clip is not inserted.

Here, a force F is applied to the connector 10 to insert the terminals 213 and 223 and the ground terminals 232 and 242 (see FIG. 3) into through holes (not shown) of the circuit board. Since the total number of terminals 213 and 223 and ground terminals 232 and 242 is extremely large, it is necessary to apply a strong force F exceeding, for example, 1 ton. On the other hand, a gap V is formed between the wafers 20 except for contact portions such as eaves 216 and 226. Therefore, when a strong force F is applied, the wafer 20 may be distorted and damaged as shown by the alternate long and short dash line in the figure. By inserting the wafer clip 30 described below into the gap V, the risk of damage or the like can be suppressed.

FIG. 7 is a perspective view showing the laminated wafer and the wafer clip before being inserted.

Further, FIG. 8 is a perspective view showing the laminated wafer and the wafer clip in the inserted state.

Further, FIG. 9 is a perspective view showing a cross section taken along the arrow YY shown in FIG.

Further, FIG. 10 is a perspective view showing a state in which a plurality of (here, four) wafer clips are inserted.

These FIGS. 7 to 10 show a wafer clip 30 as the first embodiment of the present invention.

As shown in FIG. 1, for example, eight wafers 20 are laminated on the connector 10. On the other hand, in FIGS. 7 to 10, only half (4) wafers 20 are shown in order to show the wafer clips 30 after insertion. Further, with respect to the wafer 20 shown here, some points not necessary for the following description are omitted.

As shown in FIG. 7, the wafer clip 30 is a flat plate-shaped member having a comb-tooth shape as a whole, which is produced by punching a single metal plate. The wafer clip 30 has a plurality of plate portions 31 and one connecting plate portion 32. The plate portions 31 are unilaterally arranged at a predetermined pitch so that the plurality of plate portions 31 spread out in a flat plate shape as a whole. Further, the connecting plate portion 32 extends along the arrangement direction of the plurality of plate portions 31 and connects the plate portions 31 to each other. The plate portion 31 corresponds to an example of the plate portion in the present invention. Further, the connecting plate portion 32 corresponds to an example of the connecting portion 32 referred to in the present invention.

Here, grooves 218 and 228 are formed in each of the wafers 20 constituting the connector 10. These grooves 218 and 228 have a width sufficient to insert the wafer clip 30. Further, the depth of this groove is the dimension D shown in FIG. 5, and penetrates to the gap V between the adjacent shield plates 23 and 24 of the adjacent wafer 20. Further, this dimension D is the same as the height dimension D of the connecting plate portion 32 of the wafer clip 30. Further, the pitch of the arrangement of the plate portions 31 of the wafer clip 30 is the same as the thickness dimension of the wafer 20, that is, the pitch of the lamination of the wafer 20. Further, the width dimension W of one plate portion 31 is a dimension that just fits into the gap V between the adjacent shield plates 23 and 24.

As shown in FIG. 8, the wafer clip 30 is inserted into the grooves 218 and 228. Then, as shown in FIG. 9, one plate portion 31 is inserted into each gap V. The connector 10 of this embodiment is formed with four grooves 218 and 228. Therefore, in the case of this connector 10, as shown in FIG. 10, the same number of wafer clips 30 as the number of grooves 218 and 228 (4) are inserted into the grooves 218 and 228 one by one.

When the wafer clip 30 is inserted in this way, the plurality of wafers 20 are held in a laminated state until the front cover 41, the rear cover 42, and the lower cover 43 of the connector 10 are attached. Further, it is assumed that a strong force F (see FIG. 6) is applied when mounting the connector 10 into which the wafer clip 30 is inserted on a circuit board (not shown). In this case, even if a strong force F is applied, the distortion of the wafer 20 is suppressed as shown by the alternate long and short dash line in FIG. 6, and the necessary force F can be applied while suppressing damage.

Here, the height dimension T (see FIG. 7) of the plate portion 31 of the wafer clip 30 does not necessarily have to be the same as the height dimension of the gap V. In the case of this embodiment, the height dimension T is about ½ of the height dimension of the gap V. It is assumed that the size is 1/2, and that the wafer clip 30 suppresses the distortion of the wafer 20 in the upper half of the gap V. In that case, it can withstand four times the force F as compared with the case where the wafer clip 30 is not inserted. Considering only that it can withstand the force F, it is preferable that the height dimension T of the plate portion 31 is the same as the height dimension of the gap V so that it can withstand a stronger force F. However, on the other hand, if the plate portion 31 is long, the workability when inserting it into the grooves 218 and 228 is lowered. Therefore, the plate portion 31 is adjusted to a length corresponding to the force F that needs to be pressed at the time of mounting.

In this embodiment, four grooves 218 and 228 are formed in the wafer 20, and four wafer clips 30 are inserted. However, the number of grooves 218, 228 and the wafer clip 30 is not limited to 4, and may be any number depending on the force F that needs to be pressed at the time of mounting.

FIG. 11 is a perspective view showing a wafer clip according to a second embodiment of the present invention.

Further, FIG. 12 is a perspective view showing a plurality of laminated wafers (4 wafers in this case) and a wafer clip shown in FIG. 11 in a inserted state.

The wafer clip 50 has a plurality of arranged front plate portions 51 and a plurality of rear plate portions 52 arranged in parallel with the front plate portion 51. Since the wafer clip 50 has two rows of plate portions, a front plate portion 51 and a rear plate portion 52, the wafer clip 50 is referred to as a two-row integrated wafer clip 50 here. On the other hand, the wafer clips 30 shown in FIGS. 7 to 10 are referred to as single-row wafer clips 30 because the plate portions 31 are provided in only one row.

The two-row integrated wafer clip 50 shown in FIG. 11 further has a connecting plate portion 53 and an upper plate portion 54. The connecting plate portion 53 extends along a plurality of arranged front plate portions 51 and connects the front plate portions 51 to each other. Further, the upper plate portion 54 is directly connected to the connecting plate portion 53 on the front plate portion 551 side, and is directly connected to each of the plurality of arranged rear plate portions 52 on the rear plate portion 52 side. Here, the front plate portion 51 and the rear plate portion 52 in the wafer clip 50 of the second embodiment correspond to an example of the plate portion referred to in the present invention. Further, in the case of the wafer clip 50 of the second embodiment, the combination of the connecting plate portion 53 and the upper plate portion 54 corresponds to an example of the connecting portion referred to in the present invention.

Here, in the case of this second embodiment, the connecting plate portion 53 is provided on the front plate portion 51 side, and this is an example. That is, depending on the thickness dimensions D (see FIG. 5) of the eaves 216 and 226 of the wafer 20 and other conditions, the connecting plate portion 53 may not be provided on the front plate portion 51 side either. Alternatively, a connecting plate portion corresponding to the connecting plate portion 53 may be provided only on the rear plate portion 52 side on the front plate portion 51 side. However, in the case of the wafer clip 50 shown in FIG. 11, if it is rotated by 180 °, the wafer clip 50 is provided with the connecting plate portion 53 only on the rear plate portion 52 side. Further, connecting plate portions may be provided on both the front plate portion 51 side and the rear plate portion 52 side.

Further, in FIG. 12, only one two-row integrated wafer clip 50 is inserted, but the width of the upper plate portion 54 (the distance between the front plate portion 51 and the rear plate portion 52) is adjusted. Alternatively, a plurality of two-row integrated wafer clips 50 may be inserted. That is, for example, the two-row integrated wafer clip 50 is inserted into the two front grooves 218 and 228 of the four grooves 218 and 228 shown in FIGS. 7 and 8, and the two rear grooves. Another two-row integrated wafer clip 50 may be inserted into 218 and 228. Alternatively, the two-row integrated wafer clip 50 and the single-row wafer clip 30 may be used in combination.

10 Connector 20 Wafer 21,22 Wiring board 21A, 22A Metal wiring 21B, 22B Resin plate 211,221 Individual wiring 212,222 Contact 213,223 Terminal 214 Protrusion 224 Hole 225 Protrusion 216,226 Eaves 217,227 Rear wall 218,228 Grooves 23, 24 Shield plate 231,241 Ground contact 232,242 Ground terminal 233,243 Hole 30 Wafer clip 31 Plate 32 Connecting plate 41 Front cover 42 Rear cover 43 Bottom cover 50 Wafer clip 51 Front plate 52 Rear Plate 53 Connecting plate 54 Upper plate

Claims (7)

It has a plurality of plate portions arranged at a predetermined pitch, and a connecting portion extending along the plurality of plate portions and connecting the plurality of plate portions to each other.
A plurality of wafers including a wiring board in which a plurality of wirings having terminals to be inserted into through holes of a circuit board are insert-molded into resin and a pair of shield plates extending so as to sandwich the wiring boards from both sides. A wafer clip, which is inserted into the gap in a state where two wafers adjacent to each other are laminated so as to form a gap between two facing shield plates. The wafer clip according to claim 1, wherein the plurality of plate portions and the entire connecting portion are made of one metal plate. The wafer clip according to claim 1, wherein the plurality of plate portions and the entire connecting portion are made of one metal flat plate. The wafer according to claim 1 or 2, wherein the plurality of plate portions are arranged in two rows, and the two rows of plate portions share the connecting portion and are connected to each other at the connecting portion. Clip for. A plurality of wafers including a wiring board in which a plurality of wires having terminals to be inserted into through holes of a circuit board are insert-molded into a resin and a pair of shield plates extending so as to sandwich the wiring boards from both sides. A plurality of wafers laminated so as to form a gap between two shielding plates facing each other of two wafers adjacent to each other, a plurality of plate portions arranged at a predetermined pitch, and the plurality of plates. A connector having a connecting portion extending along a plate portion and connecting the plurality of plate portions to each other, and the plate portion provided with a wafer clip inserted into the gap. The wiring board is composed of two wiring boards in which the corresponding wirings are stacked so as to face each other.
The connector according to claim 5, wherein the pair of shield plates are arranged so as to sandwich the wiring on the two wiring boards from both sides of the bundle. 5. The wiring board is characterized by having a contact portion in which two adjacent wafers are in contact with each other and two facing shield plates of two adjacent wafers are separated from each other at a predetermined interval. 6. The connector according to 6.

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