JP2014056973A - Connection structure of circuit board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure of a circuit board capable of obtaining stable ground connection.SOLUTION: A first circuit board 20 or 60 has a first ground pattern 23 or 63. A second circuit board 40 or 80 has a second ground pattern 43 or 83. The first circuit board 20 has a concave-convex portion 25 provided on a side end surface. The second circuit board 40 has a second concave-convex portion 45 fitting to the first concave-convex portion 25. The first ground pattern 23 or 63 or the second ground pattern 43 or 83 formed on at least one side end surface of the first circuit board 20 or 60 or the second circuit board 40 or 80 is connected to the second ground pattern 43 or 83 of the second circuit board 40 or 80 or the first ground pattern 23 or 63 of the first circuit board 20 or 60.

Description

  The present invention relates to a circuit board connection structure for electrically connecting a plurality of circuit boards.

  Conventionally, various connection structures for circuit boards have been proposed, and for example, disclosed in Patent Document 1. Such a circuit board connection structure is an electronic circuit board connector that is electrically connected to an electronic circuit board, and includes a connector main body having an insertion port into which the electronic circuit board is inserted, and an inner wall of the connector main body. The pin is provided up to the outer wall of the connector main body through the insertion opening and is electrically connected to the circuit board.

Japanese Patent No. 2699948

However, the connection structure of the circuit board disclosed in Patent Document 1 is a connection structure of only the connectors mounted on the electronic circuit board, and the ground connection between the boards is the connection of only the ground terminal assigned to the connector. Therefore, there is a problem that the ground connection is not always stable.
The present invention has been made in view of this problem, and provides a circuit board connection structure capable of obtaining a stable ground connection.

  The present invention includes first circuit boards 20 and 60 having first ground patterns 23 and 63, and second circuit boards 40 and 80 having second ground patterns 43 and 83, respectively. The first ground patterns 23, 63 or the second ground patterns 43, 83 formed on at least one side end surface of the circuit boards 20, 60 and the second circuit boards 40, 80 Are connected to the second ground patterns 43 and 83 of the circuit boards 40 and 80 or the first ground patterns 23 and 63 of the first circuit boards 20 and 60.

  Further, according to the present invention, the first circuit board 20 includes a first uneven portion 25 provided on a side end surface, and the second circuit board 40 is fitted to the first uneven portion 25. It has the second uneven portion 45.

  In the present invention, at least one of the first circuit boards 20 and 60 or the second circuit boards 40 and 80 is the second ground patterns 43 and 83 of the second circuit boards 40 and 80 or The first circuit boards 20 and 60 have elastic contact portions 47 and 67 that are in contact with the first ground patterns 23 and 63.

  The present invention also includes a first connector 30 mounted on the first circuit boards 20 and 60 and a second connector mounted on the second circuit boards 40 and 80 and connected to the first connector 30. The connector 50 is provided.

  Since the ground pattern formed on the side end surface of the circuit board is connected to the ground pattern of the other circuit board, a stable ground connection can be obtained.

The side view which shows 1st embodiment of this invention. The front view which shows embodiment same as the above. The principal part expanded sectional view which shows embodiment same as the above. The principal part expansion perspective view which shows embodiment same as the above. The principal part expanded sectional view which shows embodiment same as the above. The side view which shows 2nd embodiment of this invention. The front view which shows embodiment same as the above. The principal part expanded sectional view which shows embodiment same as the above. The principal part expansion perspective view which shows embodiment same as the above. The principal part expanded sectional view which shows embodiment same as the above. The principal part expansion perspective view which shows 3rd embodiment of this invention. The principal part expansion perspective view which shows 4th embodiment of this invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. 1 to 5 show a first embodiment.

Reference numeral 10 denotes an electronic component, and the electronic component 10 is mounted on the front surface of the circuit board 20. The electronic component 10 is QFP (Quad
Flat package) or BGA (Ball Grid Array). The electronic component 10 is connected to a wiring pattern (not shown) of the circuit board 20.

  The circuit board 20 is made of a hard multilayer circuit board and has a substantially rectangular shape when viewed from the front. On one side of the circuit board 20, a comb-like uneven portion 25 is formed. The other three sides of the circuit board 20 are linear. The uneven portion 25 is formed by forming a plurality of rectangular cut portions 25 a at equal intervals on one side of the circuit board 25. A connector 30 is mounted on the front surface of the circuit board 20.

  The circuit board 20 includes two insulating boards 21 and 22 and a ground pattern 23 formed on the insulating boards 21 and 22. The ground pattern 23 of the circuit board 20 includes an inner layer 23 a sandwiched between two insulating substrates 21 and 22, an end surface metal layer 23 b formed on the end surfaces of the insulating substrates 21 and 22, and a part of the front surface of the insulating substrate 21. And a rear metal layer 23d formed on a part of the rear surface of the insulating substrate 22. The front metal layer 23 c and the rear metal layer 23 d are formed in the vicinity of the concavo-convex portion 25. The ground terminal of the electronic component 10 is connected to the inner layer 23a through a via (VIA) 21a.

  The circuit board 40 is made of a hard multilayer circuit board and has a substantially rectangular shape when viewed from the front. On one side of the circuit board 40, a comb-like uneven portion 45 is formed. The other three sides of the circuit board 40 are linear. The concavo-convex portion 45 is formed by forming a plurality of rectangular cut portions 25 a at equal intervals on one side of the circuit board 45.

  The circuit board 40 includes two insulating boards 41 and 42 and a ground pattern 43 formed on the insulating boards 41 and 42. The ground pattern 43 of the circuit board 40 includes an inner layer 43 a sandwiched between two insulating substrates 41 and 42, an end surface metal layer 43 b formed on the end surfaces of the insulating substrates 41 and 42, and a part of the front surface of the insulating substrate 41. And a rear metal layer 43d formed on a part of the rear surface of the insulating substrate 42. The front metal layer 43 c and the rear metal layer 43 d are formed in the vicinity of the uneven portion 45.

  The connector 50 is mounted on the circuit board 40. The uneven portion 45 of the circuit board 40 is fitted into the uneven portion 25 of the circuit board 20, and the connector 50 is connected to the connector 30 mounted on the circuit board 20. The ground terminal of the connector 50 is connected to the ground terminal of the connector 30.

  6 to 10 show a second embodiment. In the second embodiment, the same portions as those in the first embodiment are denoted by the same reference numerals.

  The circuit board 60 is made of a hard multilayer circuit board and has a rectangular shape when viewed from the front. An electronic component 10 and a connector 30 are mounted on the front surface of the circuit board 60. The circuit board 60 includes two insulating substrates 61 and 62 and a ground pattern 63 formed on the insulating substrates 61 and 62.

  The ground pattern 63 of the circuit board 60 includes an inner layer 63 a sandwiched between two insulating substrates 61 and 62, a front metal layer 63 c formed on a part of the front surface of the insulating substrate 61, and a rear surface of the insulating substrate 62. A rear metal layer 63d formed in the portion and a through-hole portion 63f. The through hole 63f electrically connects the inner layer 63a, the front metal layer 63c, and the rear metal layer 63d. The ground terminal of the electronic component 10 is connected to the inner layer 63a through a via (VIA) 61a.

  The circuit board 80 is made of a hard multilayer circuit board and has a rectangular shape when viewed from the front. The circuit board 80 includes two insulating substrates 81 and 82 and a ground pattern 83 formed on the insulating substrates 81 and 82. The ground pattern 83 of the circuit board 80 includes an inner layer 83 a sandwiched between the two insulating substrates 81 and 82, an end metal layer 83 b formed on the end surfaces of the insulating substrates 81 and 82, and a part of the front surface of the insulating substrate 81. And a rear metal layer 83d formed on a part of the rear surface of the insulating substrate 82.

  The connector 50 is mounted on the circuit board 80. The connector 80 is connected to the connector 30 mounted on the circuit board 60.

  According to the first and second embodiments, not only the connectors 30 and 50 but also the ground patterns 43 and 83 formed on the side end surfaces of the circuit boards 40 and 80, and the ground patterns 23 of the other circuit boards 20 and 60. , 63, a stable ground connection can be obtained.

  The present invention is not limited to each embodiment, and various modifications are possible. For example, an elastic contact portion 47 made of a metal spring may be provided on the rear metal layer 43d of the circuit board 40 as in the third embodiment shown in FIG. Moreover, you may provide the elastic contact part 67 in the front metal layer 63c of the circuit board 60 like 4th embodiment shown in FIG.

20 Circuit board (first circuit board)
23 Ground pattern (first ground pattern)
25 Irregularities (first irregularities)
30 connector (first connector)
40 Circuit board (second circuit board)
43 Ground pattern (second ground pattern)
45 Irregularities (second irregularities)
47 Elastic contact part 50 Connector (second connector)
60 Circuit board (first circuit board)
63 Ground pattern (first ground pattern)
67 Elastic contact portion 80 Circuit board (second circuit board)
83 Ground pattern (second ground pattern)

Claims (4)

A first circuit board having a first ground pattern, and a second circuit board having a second ground pattern,
The first ground pattern or the second ground pattern formed on at least one side end surface of the first circuit board and the second circuit board is the second ground of the second circuit board. A circuit board connection structure, wherein the circuit board is connected to a pattern or the first ground pattern of the first circuit board.   The first circuit board has a first uneven portion provided on a side end surface, and the second circuit board has a second uneven portion fitted to the first uneven portion. The circuit board connection structure according to claim 1.   At least one of the first circuit board or the second circuit board is elastically in contact with the second ground pattern of the second circuit board or the first ground pattern of the first circuit board. The circuit board connection structure according to claim 1, further comprising a contact portion.   The first connector mounted on the first circuit board and the second connector mounted on the second circuit board and connected to the first connector. 2. A circuit board connection structure according to 1.

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