CN103079364A - Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board - Google Patents
Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board Download PDFInfo
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- CN103079364A CN103079364A CN2012105762924A CN201210576292A CN103079364A CN 103079364 A CN103079364 A CN 103079364A CN 2012105762924 A CN2012105762924 A CN 2012105762924A CN 201210576292 A CN201210576292 A CN 201210576292A CN 103079364 A CN103079364 A CN 103079364A
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Abstract
The invention provides a manufacturing process of a partial laminating copper block high-heat-dissipation metal-base circuit board. The high-heat-dissipation metal-base circuit board comprises at least two daughter boards. The manufacturing process comprises the following steps: folding the daughter boards into multiple layers of core board bodies; hollowing out the multiple layers of core board bodies to form through holes; depositing copper and electroplating in the through holes and the side walls of the multiple layers of core board bodies; providing a metal heat conducting body which is inserted into the through hole; pasting colloid on the bottom surface of the multiple layers of core board bodies; providing a heat dissipation plate which is bonded on the bottom of the multiple layers of the core board bodies; and laminating the multiple layers of core board bodies, the heat dissipation plate and the metal heat conducting body to form multiple layers of printed circuit boards. With the adoption of the manufacturing process, the heat of electronic parts and components in and on the surface of the multiple layers of printed circuit boards are rapidly transmitted outside by utilizing the metal heat conducting body, so that the reliability of electronic elements is improved; the whole working stability of the multiple layers of printed circuit boards is improved; and the service life of the multiple layers of printed circuit boards is prolonged.
Description
Technical field
The present invention relates to a kind of manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet.
Background technology
Along with the development of science and technology, people are more and more higher to the integrated level requirement of surface-mounted integrated circuit, in order to satisfy such requirement, multilayer board just occurred.At present electronic product is to light, thin, little, high density and multifunction development, and electronic component packaging density and integrated level are more and more higher on the multilayer board, and power consumption is increasing, also requires more and more higher to the thermal diffusivity of multilayer board.
Seeing also Fig. 1, is a kind of multilayer board side structure of prior art schematic diagram.Take three daughter boards as example, described multilayer board 1 comprises the daughter board 11,12 that is cascading, 13 and the electronic component (not shown).Be adhesively fixed with colloid 15 between the described daughter board 11,12 and 13.Described daughter board 11,12 and 13 surfaces are provided with a plurality of described electronic components.
When described electronic component work, described electronic component produces heat and is delivered to described daughter board 11,12 and 13, and described daughter board 11,12 and 13 outwards distributes heat by outer surface again.
In said structure, described daughter board 11,12,13 and colloid 15 all be the non-conductor of heat, can not be in time the heat of electronic component generation be in time distributed.Therefore, cause the heat accumulation of multilayer board 1, heat accumulation causes multilayer board 1 local temperature too high, high temperature then brings aging, short circuit and burning the defective such as to melt to being arranged at multilayer board 1 surface and inner electronic component, so that multilayer board 1 stability reduces, reduce useful life.
Summary of the invention
, poor stability low for prior art multilayer board radiating efficiency and short technical problem of life-span, the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet of the invention provides that a kind of radiating efficiency is high, good stability and life-span are long.
The manufacture craft of the high heat radiating metal base circuit board of a kind of local pressing copper billet, described high heat radiating metal Quito layer printed circuit board comprises at least two daughter boards, comprises the steps:
Each daughter board is built up the multilayer core plate body of tool sidewall;
Described multilayer core body plate hollow out is formed through hole;
Through-hole inner surface and the heavy copper of sidewall of described multilayer core plate body are electroplated;
One metal guide hot body is provided, described metal guide hot body is inserted described through hole;
At described multilayer core plate body bottom surface viscose glue body;
One heating panel is provided, described heating panel is bonded in described multilayer core plate body bottom surface;
Described multilayer core plate body, described heating panel and described metal guide hot body pressing are formed multilayer board.
In a preferred embodiment of the present invention, the through-hole diameter of described multilayer core plate body is greater than described metal guide hot body diameter 0.1mm.
In a preferred embodiment of the present invention, described colloid is polyimides.
In a preferred embodiment of the present invention, described heating panel is copper coin.
In a preferred embodiment of the present invention, described metal guide hot body is the copper post.
In a preferred embodiment of the present invention, described metal guide hot body and described heating panel Surface Contact arrange.
Compared to prior art, in the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet of the present invention, form through hole at the multilayer core plate body, in preferably metal guide hot body insertion of thermal conductivity through hole, and paste heating panel in multilayer core plate body one side, simultaneously with the side-wall metallic formation copper layer of multilayer core plate body.The heat that produces in the described multilayer board course of work conducts to metal guide hot body and sidewall copper layer, the metal guide hot body conducts to heating panel with heat, in time conduct heat to the outside by heating panel and sidewall copper layer, and expansion heat removal surface area, effectively avoid heat in the inner gathering of multilayer board, improve the too high defective of local temperature.On the other hand, because being arranged on described multilayer board surface electronic element works in the controlled environment of temperature, improve the reliability of element, avoid the defective that the impaired stability of bringing is not good and the life-span is limited of electronic component, improve the job stability of multilayer board integral body, prolong its useful life.
Description of drawings
Fig. 1 is prior art multilayer board side structure schematic diagram.
Fig. 2 is the manufacture craft organigram of the high heat radiating metal base circuit board of a kind of local pressing copper billet of the present invention.
Fig. 3 is the schematic flow sheet of the manufacture craft of the high heat radiating metal base circuit board of a kind of local pressing copper billet of the present invention.
Embodiment
Describe the specific embodiment of the present invention in detail below in conjunction with accompanying drawing.
Fig. 2 and Fig. 3 have disclosed a kind of better embodiment of multilayer board structure of the present invention and manufacture craft.
Multilayer board of the present invention comprises at least two daughter boards, and more specifically, daughter board can be two-layer or multilayer.Seeing also Fig. 2, is the processing organigram of the high heat radiating metal of a kind of local pressing copper billet of the present invention Quito layer printed circuit board.In embodiments of the present invention, the manufacture craft of this multilayer board 2 is made elaboration take three daughter boards 21,22 and 23 as example.
Described multilayer board 2 comprises multilayer core plate body (not indicating), heating panel 28, metal guide hot body 27, sidewall copper layer 26, colloid 25 and electronic component (not shown).
Described multilayer core plate body comprises the daughter board 21,22 and 23 that is cascading.Described multilayer core plate body also comprises a through hole (not indicating), and described metal guide hot body 27 is housed in the described through hole.Described multi-layer coreboard surface and inside are provided with a plurality of electronic components.
The daughter board 23 of the described multilayer core plate body of described heating panel 28 butts.Described copper layer 26 is arranged at described multi-layer coreboard body sidewall.Described metal guide hot body 27 and described heating panel 28 Surface Contact settings.
Described daughter board 21,22,23 and described heating panel 28 between be adhesively fixed the polyimides (PP pure glue) of described colloid 25 for having insulation property by described colloid 25.
Described heating panel 28 and metal guide hot body 27 are the better metal material of thermal conductivity.In the present embodiment, described heating panel 28 is copper coin or aluminium sheet, and described metal guide hot body 27 is copper post or aluminium post.Certainly, can also form for the better materials processing of other heat conductivities.The through hole of described multilayer core plate body is consistent with the outline of described metal guide hot body 27.
Fig. 3 is the schematic flow sheet of the manufacture craft of the high heat radiating metal base circuit board of a kind of local pressing copper billet of the present invention, and described manufacture craft may further comprise the steps:
Step S1 is with each son 21,22, the folded multilayer core plate body that forms the tool sidewall of 23 plates.
Step S2 forms through hole to described multilayer core body plate hollow out.
Step S3 electroplates through-hole inner surface and the heavy copper of sidewall of described multilayer core plate body.
Step S4, the through hole that provides a metal guide hot body 27 to insert on the described multilayer core plate body.
Step S5 is at described multilayer core plate body bottom surface viscose glue body 25.
Step S6 forms multilayer board 2 with described multilayer core plate body, described heating panel and described metal guide hot body pressing.
More specifically, the upper end face of described metal guide hot body 27 and described multilayer core plate body upper surface at grade, the rear surface of described metal guide hot body 27 and described heating panel 28 butts are bonding.
Compared to prior art, the manufacture craft of multilayer board 2 of the present invention is to paste heating panel 28 on multilayer core body plate one surface.Simultaneously, in the multilayer core plate body, insert metal guide plume 27, and with its side-wall metallic, form copper layer 26.
The heat that electronic component produces in multilayer board 2 courses of work of the present invention conducts to metal guide hot body 27 and sidewall copper layer 26, metal guide hot body 27 conducts to heating panel 28 with heat, in time conduct heat to the outside by heating panel 28 and sidewall copper layer 26, and expansion heat removal surface area, effectively avoid heat in 2 inner gatherings of multilayer board, improve the too high defective of local temperature.
On the other hand, because being arranged on described multilayer board surface 2 electronic components works in the controlled environment of temperature, improve the reliability of element, avoid the defective that the impaired stability of bringing is not good and the life-span is limited of electronic component, improve the job stability of multilayer board 2 integral body, prolong its useful life.
The above only is embodiments of the invention; be not so limit claim of the present invention; every equivalent structure or equivalent flow process conversion that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical field, all in like manner be included in the scope of patent protection of the present invention.
Claims (6)
1. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet, described high heat radiating metal multilayer board comprises at least two daughter boards, comprises the steps:
Each daughter board is built up the multilayer core plate body of tool sidewall;
Described multilayer core body plate hollow out is formed through hole;
Through-hole inner surface and the heavy copper of sidewall of described multilayer core plate body are electroplated;
One metal guide hot body is provided, described metal guide hot body is accommodated to described through hole;
At described multilayer core plate body bottom surface viscose glue body;
One heating panel is provided, described heating panel is bonded in described multilayer core plate body bottom surface;
Described multilayer core plate body, described heating panel and described metal guide hot body pressing are formed multilayer board.
2. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet according to claim 1 is characterized in that, the through-hole diameter of described multilayer core plate body is greater than described metal guide hot body diameter 0.1mm.
3. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet according to claim 1 is characterized in that, described colloid is the polyimides with insulation property.
4. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet according to claim 1 is characterized in that, described heating panel is copper coin.
5. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet according to claim 1 is characterized in that, described metal guide hot body is the copper post.
6. the manufacture craft of the high heat radiating metal base circuit board of local pressing copper billet according to claim 1 is characterized in that, described metal guide hot body and described heating panel Surface Contact arrange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210576292.4A CN103079364B (en) | 2012-12-27 | 2012-12-27 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210576292.4A CN103079364B (en) | 2012-12-27 | 2012-12-27 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
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| CN103079364A true CN103079364A (en) | 2013-05-01 |
| CN103079364B CN103079364B (en) | 2015-09-16 |
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| CN201210576292.4A Active CN103079364B (en) | 2012-12-27 | 2012-12-27 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687278A (en) * | 2013-11-26 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Boss-type metal-based sandwich rigid-flex plate and production method thereof |
| CN104994706A (en) * | 2015-06-30 | 2015-10-21 | 苏州旭创科技有限公司 | Printed circuit board (PCB) and optical module with PCB |
| CN106163081A (en) * | 2015-04-24 | 2016-11-23 | 深南电路股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106488648A (en) * | 2016-09-26 | 2017-03-08 | 广东小天才科技有限公司 | Circuit board heat radiation structure and electronic equipment |
| CN106604529A (en) * | 2016-12-26 | 2017-04-26 | 长沙牧泰莱电路技术有限公司 | Nested composite circuit board and manufacturing method thereof |
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| CN108235602A (en) * | 2017-12-29 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The processing method that second order buries copper billet circuit board |
| CN110611993A (en) * | 2019-09-02 | 2019-12-24 | 临安盛浙电子有限公司 | PCB manufacturing process for heat dissipation of high-power electronic component |
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| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| CN101784160A (en) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | Method for manufacturing press in type printed circuit board with high thermal conductivity |
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Patent Citations (4)
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| JPH1197852A (en) * | 1997-09-16 | 1999-04-09 | Kyocera Corp | Multilayered wiring board |
| CN1635824A (en) * | 2003-12-31 | 2005-07-06 | 技嘉科技股份有限公司 | Highly radiating multi-layer circuit board and manufacturing method thereof |
| CN101784160A (en) * | 2010-01-22 | 2010-07-21 | 东莞生益电子有限公司 | Method for manufacturing press in type printed circuit board with high thermal conductivity |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103687278A (en) * | 2013-11-26 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Boss-type metal-based sandwich rigid-flex plate and production method thereof |
| US9942976B2 (en) | 2013-11-26 | 2018-04-10 | Guangzhou Fastprint Circuit Tech Co., Ltd. | Preparation method of a boss-type metal-based sandwich rigid-flex circuit board |
| CN106163081A (en) * | 2015-04-24 | 2016-11-23 | 深南电路股份有限公司 | The manufacture method of a kind of PCB and PCB |
| CN106163081B (en) * | 2015-04-24 | 2019-06-28 | 深南电路股份有限公司 | A kind of production method and PCB of PCB |
| CN104994706A (en) * | 2015-06-30 | 2015-10-21 | 苏州旭创科技有限公司 | Printed circuit board (PCB) and optical module with PCB |
| CN104994706B (en) * | 2015-06-30 | 2017-11-28 | 苏州旭创科技有限公司 | PCB substrate and there is its optical module |
| CN107343353A (en) * | 2016-05-03 | 2017-11-10 | 无锡深南电路有限公司 | A kind of thick copper pcb board and its radiating processing method |
| CN106488648A (en) * | 2016-09-26 | 2017-03-08 | 广东小天才科技有限公司 | Circuit board heat radiation structure and electronic equipment |
| CN106604529A (en) * | 2016-12-26 | 2017-04-26 | 长沙牧泰莱电路技术有限公司 | Nested composite circuit board and manufacturing method thereof |
| CN108235602A (en) * | 2017-12-29 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | The processing method that second order buries copper billet circuit board |
| CN110611993A (en) * | 2019-09-02 | 2019-12-24 | 临安盛浙电子有限公司 | PCB manufacturing process for heat dissipation of high-power electronic component |
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| CN103079364B (en) | 2015-09-16 |
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