CN1635824A - Highly radiating multi-layer circuit board and manufacturing method thereof - Google Patents
Highly radiating multi-layer circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN1635824A CN1635824A CNA2003101160955A CN200310116095A CN1635824A CN 1635824 A CN1635824 A CN 1635824A CN A2003101160955 A CNA2003101160955 A CN A2003101160955A CN 200310116095 A CN200310116095 A CN 200310116095A CN 1635824 A CN1635824 A CN 1635824A
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- China
- Prior art keywords
- substrate
- multilayer circuit
- conduction hole
- circuit board
- heat conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
This invention refers to multi-layer circuit board with high radiation function and method for making the same, which contains substrate, multi-layer circuit structure and an electronic assembly, wherein the multi-layer structure containing plurality of insulation layer and circuit layer assembly stacked on substrate surface, a heat conductive hole filled with heat conductive glue and penetrated through multi-layer structure to contact with substrate, the electronic assembly connected with the open of heat conductive hole in top of circuit layer surface and contacted with the heat conductive hole.
Description
Technical field
The present invention relates to a kind of multilayer circuit board and manufacture method thereof, particularly a kind of multilayer circuit board of high heat radiation and manufacture method thereof.
Background technology
Along with electronic product develops toward high performance, high frequencyization, high speed and lightening direction gradually, under the design concept of " light, thin, short, little, multi-functional ", various electronic correlation major parts such as central processing unit (CPU), chipset (Chipset) etc. are all towards high-speed, multi-functional, high power, direction research and development that volume is little.Therefore, cause the unit volume caloric value in the spare part constantly to improve, and the heat dissipation problem of spare part also become the key of electronic building brick performance boost.
Multilayer circuit board is for improving the good solution of electronic building brick and line density, general multilayer circuit plate structure and manufacturing process, normally with plane substrate as substrate, form adhesion coating or insulating barrier in the single or double of substrate again, and then cover the metallic circuit layer.Or form on the substrate ground floor metallic circuit layer after, by a gummed processing procedure, with several circuit layers and adhesion coating laminationization in addition, after processed is finished the making of multilayer board.And improving the relative not good problem of radiating efficiency of also deriving of assembly with line density, it is heat-conduction medium that the assembly on the circuit board needs with the air.Yet dispel the heat in the air transmitted mode, the heat that assembly is accumulated effectively can't be distributed rapidly, and make the usefulness of assembly reduce, even reduce the life-span of assembly, this situation is even more serious at multilayer circuit board.
In the development trend of package design, only, must strengthen heat sinking function by the design of circuit board by the package design of the assembly enough heat that can't leave.Thereby for preventing the accumulation of heat of multilayer circuit board, then produced with the practice of heat-conducting glue as the adhesion coating of metallic circuit layer, but the coating heat-conducting glue is with bonded assemblies, each metallic circuit layer and substrate, and use amount is quite big, thereby has also increased the manufacturing cost of multilayer circuit board.
Summary of the invention
The object of the present invention is to provide a kind of multilayer circuit board and manufacture method thereof of high heat radiation, to solve the problem of conventional art, radiator structure design by multilayer circuit board effectively promotes its heat dissipating and can reduce the use of heat-conducting glue, reduces manufacturing cost.
The multilayer circuit board of high heat radiation of the present invention, it comprises substrate, multilayer circuit structure and an electronic building brick.Multilayer circuit structure comprises several insulating barriers that are stacked over substrate surface and the combination of circuit layer, the circuit series of strata are attached to surface of insulating layer, and in its multilayer circuit structure, comprise a heat conduction hole, run through multilayer circuit structure until with substrate contacts, heat conduction is inserted heat-conducting glue in the hole.Electronic building brick then be linked to top the circuit layer surface heat conduction hole opening part and contact with the heat conduction hole, the heat that electronic building brick is dispersed when operation can conduct to substrate by the heat conduction hole, the surface area that heat is distributed increases.
Cooperate said structure, another object of the present invention is the manufacture method of multilayer circuit board that high heat radiation is provided, several insulating barriers of first storehouse and circuit layer be combined in substrate surface; In predetermined electronic building brick joint, form the heat conduction hole again with laser or other perforation means; Then, insert heat-conducting glue in the heat conduction hole; Again electronic building brick is connected in top the circuit layer surface heat conduction hole opening part and contact with the heat conduction hole.Or a substrate and several circuit layers are provided earlier, each circuit layer keeps via in advance; Again each circuit layer is followed on substrate with the insulation adhesion coating, and made the mutual conducting of via of each circuit layer form the heat conduction hole; Then, insert heat-conducting glue in the heat conduction hole; Again electronic building brick is connected in the via opening part on the circuit layer surface of top, it is contacted with the heat conduction hole.
Description of drawings
Fig. 1 is the structural profile schematic diagram of the embodiment of the invention; And
Fig. 2 to Fig. 4 is the making schematic flow sheet of the embodiment of the invention.
Description of reference numerals
10 aluminum metal substrates, 20 multilayer circuit structures
21 insulating barriers, 22 circuit layers
23 heat conduction holes, 24 heat-conducting glues
30 integrated circuit (IC) chip
Embodiment
For making purpose of the present invention, structural feature and function thereof are had further understanding, conjunction with figs. is described in detail as follows:
The multilayer circuit board of high heat radiation disclosed in this invention, the structural design by substrate accelerates the cooling rate of multilayer circuit board, and reduces the use of heat-conducting glue.
The design of the multilayer circuit board respective outer side edges board structure of its high heat radiation, combination in several insulating barriers of substrate surface storehouse and circuit layer, utilize the heat conduction hole that connects substrate and electronic building brick to promote radiating efficiency, the heat that is produced when only operating at electronic building brick provides transmission, and does not need to use heat-conducting glue to come then substrate, insulating barrier and circuit layer comprehensively.Its characteristic is: the heat that electronic building brick is produced conducts to whole base plate, and the surface area that heat is distributed increases.The embodiment of board structure design discloses as follows:
Please refer to Fig. 1, it is the structural profile schematic diagram of the embodiment of the invention, with integrated circuit (IC) chip as electronic building brick.Mainly comprise aluminum metal substrate 10, multilayer circuit structure 20 and integrated circuit (IC) chip 30.Multilayer circuit structure 20 comprises the combination of three-layer insulated layer 21/ circuit layer 22 that is stacked over aluminum metal substrate 10 surfaces, circuit layer 22 is attached to insulating barrier 21 surfaces, and in its multilayer circuit structure, comprise a heat conduction hole 23, run through multilayer circuit structure 20 until contacting with aluminum metal substrate 10, system inserts heat-conducting glue 24 in the heat conduction hole 23.Integrated circuit (IC) chip 30 then be linked to top circuit layer 22 surfaces heat conduction hole 23 opening parts and contact heat conduction hole 23, based on above-mentioned radiator structure design, the heat that integrated circuit (IC) chip 30 is distributed when operation directly conducts to aluminum metal substrate 10 via heat conduction hole 23.The surface area that heat is distributed increases, and the use amount of having saved heat-conducting glue.
Please refer to Fig. 2 to Fig. 4, it is the making schematic flow sheet of the embodiment of the invention.
As shown in Figure 2, at first, provide an aluminum metal substrate 10, the formed multilayer circuit structure 20 of combination of several insulating barriers 21 of first storehouse and circuit layer 22 is in aluminum metal substrate 10 surfaces.
As shown in Figure 3, in predetermined integrated circuit (IC) chip joint, form the heat conduction hole 23 of running through multilayer circuit structure 20 with laser mode.
As shown in Figure 4, insert heat-conducting glue, make heat conduction hole 23 connect the circuit layer 22 and aluminum metal substrate 10 of top in the heat conduction hole.At last, again integrated circuit (IC) chip 30 is connected in top circuit layer 22 surfaces heat conduction hole 23 opening parts and fit in heat conduction hole 23, promptly form structure as Fig. 1.
In addition, the present invention also can reserve via earlier prior to each circuit layer and be connected to become the thermo-contact hole again, carry out follow-up manufacturing process again, circuit layer is hardened by gummed processing procedure generation insulation adhesion coating and aluminum metal-matrix to be closed, after the thermo-contact hole of each circuit layer aim at engaged, insert heat-conducting glue equally in the thermo-contact hole and engage step such as integrated circuit (IC) chip.
Though preferred embodiment of the present invention openly as mentioned above; right its is not in order to limit the present invention; any those of ordinary skill; without departing from the spirit and scope of the present invention; therefore when the change that can do some and modification, scope of patent protection of the present invention must be looked this specification claim person of defining and is as the criterion.
Claims (11)
1. the multilayer circuit board of a high heat radiation is characterized in that, comprising:
One substrate;
One multilayer circuit structure, contain the combination of several insulating barriers and circuit layer, each this circuit layer is attached to respectively this surface of insulating layer, the combination of this insulating barrier and circuit layer and then be stacked on this substrate, in this multilayer circuit structure, comprise a heat conduction hole, run through this multilayer circuit structure until with this substrate contacts, be filled with a heat-conducting glue in this heat conduction hole; And
One electronic building brick, be linked to top this circuit layer surface this heat conduction hole opening part and contact with this heat conduction hole, the heat that this electronic building brick is dispersed when operation conducts to this substrate by this heat conduction hole.
2. the multilayer circuit board of high heat radiation as claimed in claim 1 is characterized in that this substrate is the aluminum metal substrate.
3. the multilayer circuit board of high heat radiation as claimed in claim 1 is characterized in that this electronic building brick is an integrated circuit (IC) chip.
4. the manufacture method of the multilayer circuit board of a high heat radiation is characterized in that, its step comprises:
One substrate is provided;
Storehouse one multilayer circuit structure is in this substrate surface, and this multilayer circuit structure comprises the combination of several insulating barriers and circuit layer, and each this circuit layer is attached to respectively this surface of insulating layer;
Formation runs through a heat conduction hole of this multilayer circuit structure, certainly a predetermined electronic building brick joint on this circuit layer surface of this multilayer circuit structure top;
Insert a heat-conducting glue in this heat conduction hole; And
This electronic building brick is connected in this electronic building brick joint, this electronic building brick is contacted with this heat conduction hole.
5. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this substrate is the aluminum metal substrate.
6. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this electronic building brick is an integrated circuit (IC) chip.
7. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 4 is characterized in that this formation runs through the step in a heat conduction hole of this multilayer circuit structure, forms this heat conduction hole in the laser beam perforation mode.
8. the manufacture method of the multilayer circuit board of a high heat radiation is characterized in that, its step comprises:
One substrate is provided;
Several circuit layers are provided, and each circuit layer contains a via;
Each this circuit layer is followed on this substrate with an insulation adhesion coating, and made the mutual conducting of this via of each this circuit layer;
Insert a heat-conducting glue in this heat conduction hole; And
One electronic building brick is connected in the via opening part on this circuit layer surface of top, this electronic building brick is contacted with this heat conduction hole.
9. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that this substrate is the aluminum metal substrate.
10. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that this electronic building brick is an integrated circuit (IC) chip.
11. the manufacture method of the multilayer circuit board of high heat radiation as claimed in claim 8 is characterized in that, this with the then step on this substrate of an insulation adhesion coating, follows this circuit layer and this substrate by a gummed processing procedure with each this circuit layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101160955A CN1635824A (en) | 2003-12-31 | 2003-12-31 | Highly radiating multi-layer circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101160955A CN1635824A (en) | 2003-12-31 | 2003-12-31 | Highly radiating multi-layer circuit board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1635824A true CN1635824A (en) | 2005-07-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101160955A Pending CN1635824A (en) | 2003-12-31 | 2003-12-31 | Highly radiating multi-layer circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1635824A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466895C (en) * | 2005-12-15 | 2009-03-04 | 英业达股份有限公司 | Radiating structure |
| WO2009049453A1 (en) * | 2007-10-15 | 2009-04-23 | Foshan Nationstar Optoelectronics Limited Liability Company | A power led encapsulation structure |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| CN102263066A (en) * | 2010-05-24 | 2011-11-30 | 建准电机工业股份有限公司 | Combined structure for radiating module |
| US8391009B2 (en) | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN103199068A (en) * | 2013-04-11 | 2013-07-10 | 余原生 | Integration circuit integrated structure |
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| CN106559952A (en) * | 2016-10-31 | 2017-04-05 | 努比亚技术有限公司 | A kind of substrate and circuit board |
| CN106572589A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Multi-layer substrate and multi-layer circuit board |
| CN107731774A (en) * | 2017-09-05 | 2018-02-23 | 横店集团东磁有限公司 | A kind of heat radiating type camera module chip-packaging structure |
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
-
2003
- 2003-12-31 CN CNA2003101160955A patent/CN1635824A/en active Pending
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466895C (en) * | 2005-12-15 | 2009-03-04 | 英业达股份有限公司 | Radiating structure |
| WO2009049453A1 (en) * | 2007-10-15 | 2009-04-23 | Foshan Nationstar Optoelectronics Limited Liability Company | A power led encapsulation structure |
| CN102263066B (en) * | 2010-05-24 | 2015-03-25 | 建准电机工业股份有限公司 | Combined structure for radiating module |
| CN102263066A (en) * | 2010-05-24 | 2011-11-30 | 建准电机工业股份有限公司 | Combined structure for radiating module |
| US8391009B2 (en) | 2010-06-18 | 2013-03-05 | Sunonwealth Electric Machine Industry Co., Ltd. | Heat dissipating assembly |
| CN102098870A (en) * | 2011-03-10 | 2011-06-15 | 沈李豪 | Composite printed circuit board (PCB) and manufacturing method thereof |
| CN103079364A (en) * | 2012-12-27 | 2013-05-01 | 深圳市五株科技股份有限公司 | Manufacturing process of partial laminating copper block high-heat-dissipation metal-base circuit board |
| CN103079364B (en) * | 2012-12-27 | 2015-09-16 | 深圳市五株科技股份有限公司 | A kind of manufacture craft of local pressing copper billet height heat radiating metal base circuit board |
| CN103199068A (en) * | 2013-04-11 | 2013-07-10 | 余原生 | Integration circuit integrated structure |
| CN103199068B (en) * | 2013-04-11 | 2016-06-08 | 余原生 | The integrated structure of integrated circuit |
| CN104244581A (en) * | 2013-06-06 | 2014-12-24 | 致茂电子(苏州)有限公司 | High heat conduction apparatus for multilayer circuit |
| CN104654247A (en) * | 2013-11-25 | 2015-05-27 | 海洋王（东莞）照明科技有限公司 | Heat dissipation structure of LED lamp, manufacturing method thereof, and LED lamp |
| CN104582250A (en) * | 2015-01-29 | 2015-04-29 | 高德(苏州)电子有限公司 | Heat-conduction PCB (printed circuit board) glue combination aluminum-based circuit board and manufacturing method thereof |
| CN106559952A (en) * | 2016-10-31 | 2017-04-05 | 努比亚技术有限公司 | A kind of substrate and circuit board |
| CN106572589A (en) * | 2016-10-31 | 2017-04-19 | 努比亚技术有限公司 | Multi-layer substrate and multi-layer circuit board |
| CN107731774A (en) * | 2017-09-05 | 2018-02-23 | 横店集团东磁有限公司 | A kind of heat radiating type camera module chip-packaging structure |
| CN109587934A (en) * | 2018-12-11 | 2019-04-05 | 温岭市霍德电子科技有限公司 | A kind of circuit board |
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